SU1438636A3 - Устройство дл изготовлени многослойных изделий - Google Patents
Устройство дл изготовлени многослойных изделий Download PDFInfo
- Publication number
- SU1438636A3 SU1438636A3 SU864027358A SU4027358A SU1438636A3 SU 1438636 A3 SU1438636 A3 SU 1438636A3 SU 864027358 A SU864027358 A SU 864027358A SU 4027358 A SU4027358 A SU 4027358A SU 1438636 A3 SU1438636 A3 SU 1438636A3
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- press
- copper
- tape
- drums
- strip
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 5
- 230000007246 mechanism Effects 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 39
- 229910052802 copper Inorganic materials 0.000 claims description 38
- 239000010949 copper Substances 0.000 claims description 38
- 239000003792 electrolyte Substances 0.000 claims description 17
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 239000011152 fibreglass Substances 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052753 mercury Inorganic materials 0.000 claims description 5
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical group [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 235000016936 Dendrocalamus strictus Nutrition 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011244 liquid electrolyte Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 230000012010 growth Effects 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/04—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band
- B30B5/06—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band co-operating with another endless band
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1027—Pressing using at least one press band
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/15—Combined or convertible surface bonding means and/or assembly means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/195—Delaminating roller means
- Y10T156/1956—Roller pair delaminating means
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19853515629 DE3515629A1 (de) | 1985-05-02 | 1985-05-02 | Verfahren und vorrichtung zur herstellung kupferkaschierter laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU1438636A3 true SU1438636A3 (ru) | 1988-11-15 |
Family
ID=6269529
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU864027358A SU1438636A3 (ru) | 1985-05-02 | 1986-04-28 | Устройство дл изготовлени многослойных изделий |
| SU874202615A SU1542430A3 (ru) | 1985-05-02 | 1987-03-22 | Устройство дл изготовлени многослойных изделий |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU874202615A SU1542430A3 (ru) | 1985-05-02 | 1987-03-22 | Устройство дл изготовлени многослойных изделий |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4687528A (https=) |
| EP (1) | EP0203368B1 (https=) |
| JP (1) | JPS61255858A (https=) |
| CN (1) | CN1019369B (https=) |
| DE (2) | DE3515629A1 (https=) |
| SU (2) | SU1438636A3 (https=) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136695A (ja) * | 1986-11-28 | 1988-06-08 | 三菱電機株式会社 | シ−ルド板の製造方法および装置 |
| GB8704828D0 (en) * | 1987-03-02 | 1987-04-08 | M & T Laminates Ltd | Copper-clad dielectric material |
| JPS63285997A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Electric Corp | 多層基板の製造方法および装置 |
| JPS63285998A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Electric Corp | 多層基板の製造方法および装置 |
| DE3811467A1 (de) * | 1988-04-06 | 1989-10-19 | Siempelkamp Gmbh & Co | Verfahren und anlage zur kontinuierlichen herstellung von bahnfoermigem basismaterial fuer leiterplatten |
| DE3834993A1 (de) * | 1988-10-14 | 1990-04-19 | Held Kurt | Verfahren und vorrichtung zur kontinuierlichen herstellung von laminaten |
| US5149394A (en) * | 1988-10-14 | 1992-09-22 | Kurt Held | Method and apparatus for continuously fabricating laminates |
| US5034087A (en) * | 1989-11-16 | 1991-07-23 | Doboy Packaging Machinery, Inc. | Self-adjusting heat seal bar |
| DE4118249C2 (de) * | 1991-06-04 | 1994-10-27 | Guenther Dr Schwarz | Verfahren und Vorrichtung zur Massenkonservierung von Archivalien |
| TW244340B (https=) * | 1992-07-21 | 1995-04-01 | Akzo Nv | |
| US5806177A (en) * | 1995-10-31 | 1998-09-15 | Sumitomo Bakelite Company Limited | Process for producing multilayer printed circuit board |
| DE19541406C1 (de) * | 1995-11-07 | 1996-10-17 | Held Kurt | Verfahren und Vorrichtung zur Herstellung von harzimprägnierten Schichtpreßstoffen |
| US7056403B2 (en) * | 1999-01-12 | 2006-06-06 | Hunter Douglas Inc. | Apparatus for producing non-woven fabric |
| US6883213B2 (en) * | 1999-01-12 | 2005-04-26 | Hunter Douglas Inc. | Apparatus for producing non-woven fabric |
| ATE311492T1 (de) | 1999-01-12 | 2005-12-15 | Hunter Douglas | Faservlies |
| US6926055B1 (en) | 1999-09-20 | 2005-08-09 | Hunter Douglas Inc. | Non-woven composite fabric and method and apparatus for manufacturing same |
| US7090743B2 (en) * | 1999-09-20 | 2006-08-15 | Hunter Douglas Inc. | Pressure laminator apparatus |
| CA2384370C (en) * | 1999-09-20 | 2009-03-10 | Hunter Douglas Inc. | Pressure laminator apparatus and non-woven fabric formed thereby |
| US6805771B1 (en) | 1999-09-20 | 2004-10-19 | Hunter Douglas Industries B.V. | Pressure laminator apparatus and non woven fabric formed thereby |
| JP2001138437A (ja) * | 1999-11-17 | 2001-05-22 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
| JP3699447B2 (ja) * | 2000-07-14 | 2005-09-28 | 三菱レイヨン株式会社 | 炭素系材料シートの製造方法 |
| US7017244B2 (en) * | 2002-06-03 | 2006-03-28 | Hunter Douglas Inc. | Beam winding apparatus |
| US7695486B2 (en) * | 2002-10-02 | 2010-04-13 | Linda Dixon | Intradermal color introducing needle device, and apparatus and method involving the same |
| WO2005001166A1 (ja) * | 2003-06-27 | 2005-01-06 | Kyocera Corporation | 金属メッキ膜の形成方法、電子部品の製造方法及びメッキ膜形成装置 |
| US8246808B2 (en) * | 2008-08-08 | 2012-08-21 | GM Global Technology Operations LLC | Selective electrochemical deposition of conductive coatings on fuel cell bipolar plates |
| CA2748933C (en) * | 2009-01-07 | 2018-06-19 | Andrew Richard Russell Prewer | Dual mobile phase apparatus and method |
| KR20110128860A (ko) * | 2009-03-25 | 2011-11-30 | 듀폰-미츠이 폴리케미칼 가부시키가이샤 | 전자부품용 금속층 부착 필름, 그 제조 방법 및 용도 |
| CN104137657A (zh) * | 2012-06-22 | 2014-11-05 | 株式会社新克 | 印刷电路基板及其制造装置和制造方法 |
| CN103668374B (zh) * | 2013-12-19 | 2016-05-18 | 湖南永盛新材料股份有限公司 | 一种宽幅不锈钢带单面镀铜的方法及电镀槽 |
| CN108187965B (zh) * | 2018-02-11 | 2023-03-21 | 刘希文 | 一种输送带式面压力覆膜涂装工艺及装置 |
| US10960615B2 (en) * | 2018-11-13 | 2021-03-30 | The Boeing Company | System and method for laminating a composite laminate along a continuous loop lamination path |
| CN109591426B (zh) * | 2018-12-05 | 2019-09-13 | 广东嘉元科技股份有限公司 | 一种覆铜箔板的制备装置 |
| CN113696498B (zh) * | 2021-08-25 | 2023-03-31 | 开显工业自动化科技(苏州)有限公司 | 无限延续的带式复合材料挤压成型装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3043728A (en) * | 1958-03-17 | 1962-07-10 | Nat Res Corp | Apparatus and process for metallic vapor coating |
| GB1226199A (https=) * | 1967-12-30 | 1971-03-24 | ||
| DE1704785A1 (de) * | 1967-12-30 | 1971-05-27 | Kalle Ag | Verfahren zum Herstellen eines Verbundmaterials mit einer Metallschicht |
| US3857681A (en) * | 1971-08-03 | 1974-12-31 | Yates Industries | Copper foil treatment and products produced therefrom |
| US3984598A (en) * | 1974-02-08 | 1976-10-05 | Universal Oil Products Company | Metal-clad laminates |
| FR2390517A1 (fr) * | 1977-05-10 | 1978-12-08 | Coppertron Sa | Installation pour l'electro-production de cuivre en feuilles destinees a etre appliquees en particulier sur des materiaux dielectriques |
| DE2820196A1 (de) * | 1978-05-09 | 1979-11-15 | Califoil Inc | Verfahren zur herstellung einer duennen kupferfolie |
| US4399183A (en) * | 1979-12-27 | 1983-08-16 | E. I. Du Pont De Nemours And Company | Web-supported membrane |
| DE3023827C2 (de) * | 1980-06-25 | 1985-11-21 | Siemens AG, 1000 Berlin und 8000 München | Anlage zum galvanischen Abscheiden von Aluminium |
| DE3212152C2 (de) * | 1982-04-01 | 1985-01-17 | Doduco KG Dr. Eugen Dürrwächter, 7530 Pforzheim | Vorrichtung zum selektiven galvanischen Beschichten eines Bandes |
| US4587166A (en) * | 1983-02-16 | 1986-05-06 | Ampex Corporation | Plated magnetic recording material and process for making same |
| DE3307057C2 (de) * | 1983-03-01 | 1991-02-14 | Held, Kurt, 7218 Trossingen | Vorrichtung zur kontinuierlichen Herstellung kupferkaschierter Elektrolaminate |
| DE3342678C2 (de) * | 1983-11-25 | 1995-08-31 | Held Kurt | Verfahren und Vorrichtung zur kontinuierlichen Herstellung metallkaschierter Laminate |
| DE3413434A1 (de) * | 1984-04-10 | 1985-10-17 | Dielektra GmbH, 5000 Köln | Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten |
-
1985
- 1985-05-02 DE DE19853515629 patent/DE3515629A1/de not_active Withdrawn
-
1986
- 1986-04-23 DE DE8686105597T patent/DE3662240D1/de not_active Expired
- 1986-04-23 EP EP86105597A patent/EP0203368B1/de not_active Expired
- 1986-04-24 US US06/855,791 patent/US4687528A/en not_active Expired - Fee Related
- 1986-04-28 SU SU864027358A patent/SU1438636A3/ru active
- 1986-04-30 CN CN86103035A patent/CN1019369B/zh not_active Expired
- 1986-05-01 JP JP61099521A patent/JPS61255858A/ja active Granted
-
1987
- 1987-03-22 SU SU874202615A patent/SU1542430A3/ru active
Non-Patent Citations (1)
| Title |
|---|
| Патент DE № 3307057, кл. В 32 В 31/00, 1984. Патент DE № 2839481, кл. В 32 В 15/08, 1980.. * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0203368A1 (de) | 1986-12-03 |
| DE3515629A1 (de) | 1986-11-06 |
| CN86103035A (zh) | 1986-11-12 |
| DE3662240D1 (en) | 1989-04-13 |
| CN1019369B (zh) | 1992-12-09 |
| SU1542430A3 (ru) | 1990-02-07 |
| US4687528A (en) | 1987-08-18 |
| JPS61255858A (ja) | 1986-11-13 |
| JPH032661B2 (https=) | 1991-01-16 |
| EP0203368B1 (de) | 1989-03-08 |
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