SI1989740T2 - Postopek označevanja sončnih celic in sončna celica - Google Patents
Postopek označevanja sončnih celic in sončna celicaInfo
- Publication number
- SI1989740T2 SI1989740T2 SI200730137T SI200730137T SI1989740T2 SI 1989740 T2 SI1989740 T2 SI 1989740T2 SI 200730137 T SI200730137 T SI 200730137T SI 200730137 T SI200730137 T SI 200730137T SI 1989740 T2 SI1989740 T2 SI 1989740T2
- Authority
- SI
- Slovenia
- Prior art keywords
- solar cell
- marking
- solar
- cell
- wafer
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 4
- 238000007373 indentation Methods 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
- Hybrid Cells (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006009584 | 2006-02-28 | ||
| PCT/EP2007/051925 WO2007099138A1 (de) | 2006-02-28 | 2007-02-28 | Solarzellenmarkierverfahren und solarzelle |
| EP07726561.9A EP1989740B2 (de) | 2006-02-28 | 2007-02-28 | Solarzellenmarkierverfahren und solarzelle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SI1989740T1 SI1989740T1 (sl) | 2010-02-26 |
| SI1989740T2 true SI1989740T2 (sl) | 2019-10-30 |
Family
ID=38080852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SI200730137T SI1989740T2 (sl) | 2006-02-28 | 2007-02-28 | Postopek označevanja sončnih celic in sončna celica |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US8492240B2 (sl) |
| EP (1) | EP1989740B2 (sl) |
| JP (1) | JP5627855B2 (sl) |
| KR (1) | KR101110467B1 (sl) |
| CN (1) | CN101395724B (sl) |
| AT (1) | ATE445912T1 (sl) |
| DE (1) | DE502007001732D1 (sl) |
| DK (1) | DK1989740T4 (sl) |
| ES (1) | ES2335156T5 (sl) |
| PT (1) | PT1989740E (sl) |
| SI (1) | SI1989740T2 (sl) |
| WO (1) | WO2007099138A1 (sl) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8927051B2 (en) | 2007-09-12 | 2015-01-06 | Flisom Ag | Method for manufacturing a compound film |
| DE102008043750A1 (de) * | 2008-11-14 | 2010-05-20 | Q-Cells Se | Verfahren zur Makierung/Codierung einer Solarzelle und Solarzelle |
| WO2010072017A1 (zh) * | 2008-12-26 | 2010-07-01 | 致茂电子股份有限公司 | 太阳能电池及其辨识方法与相关的辨识标示制造系统 |
| KR101549620B1 (ko) * | 2009-01-30 | 2015-09-02 | 삼성전자주식회사 | ｐｎ 구조를 지닌 Ｚｎ 산화물 나노 와이어 및 그 제조 방법 |
| DE102009009499B4 (de) | 2009-02-18 | 2015-10-15 | Solarworld Industries Sachsen Gmbh | Markierungsverfahren, Halbleiterbauelement sowie Solar-Modul |
| DE102010015970B4 (de) | 2010-03-15 | 2013-09-26 | Solarworld Innovations Gmbh | Satz mehrerer Photovoltaikzellen, Photovoltaikzellenmodul, Anordnung zum Aufbringen einer vorgegebenen Information auf einen Satz von Photovoltaikzellen, Verfahren zum Ermitteln einer Information von einem Satz von Photovoltaikzellen, Anordnung zum Ermitteln einer Information von einem Satz von Photovoltaikzellen |
| DE102010014937B4 (de) | 2010-04-14 | 2013-10-17 | Ioss Intelligente Optische Sensoren & Systeme Gmbh | Verfahren zum Lesen eines Codes auf einem Substrat durch Zusammensetzen von Code-Fragmenten unter Verwendung eines bildgebenden Codelesers |
| CN103038890A (zh) * | 2010-06-07 | 2013-04-10 | 韩华Q.Cells有限公司 | 用于标记太阳能电池的方法及太阳能电池 |
| CN103109374A (zh) * | 2010-07-26 | 2013-05-15 | 韩华Q.Cells有限公司 | 用于标记太阳能电池的方法以及太阳能电池 |
| CN102145602A (zh) * | 2010-11-19 | 2011-08-10 | 山东力诺太阳能电力股份有限公司 | 一种晶体硅选择性发射极电池的印刷对位方法 |
| DE102010060695B4 (de) | 2010-11-22 | 2015-10-08 | Hanwha Q.CELLS GmbH | Verfahren zur Markierung von Halbleiterwafern |
| TWI431787B (zh) * | 2010-11-30 | 2014-03-21 | Inventec Solar Energy Corp | 印製識別碼於太陽能電池基板的方法及其應用 |
| DE102010060908A1 (de) | 2010-11-30 | 2012-05-31 | Q-Cells Se | Verfahren zur Kennzeichnung von Wafersolarzellen oder zur Kennzeichnung von Vorprodukten von Wafersolarzellen |
| DE102010062965A1 (de) | 2010-12-13 | 2012-06-14 | Solarworld Innovations Gmbh | Markierung eines Substrats einer Solarzelle |
| ITUD20110090A1 (it) * | 2011-06-14 | 2012-12-15 | Applied Materials Italia Srl | Cella fotovoltaica provvista di un codice identificativo e procedimento per realizzarla |
| CN103000723A (zh) * | 2011-09-08 | 2013-03-27 | 茂迪股份有限公司 | 太阳能电池 |
| DE102011083252B9 (de) * | 2011-09-23 | 2013-01-03 | Schaeffler Technologies AG & Co. KG | Handgeführtes Beschriftungssystem |
| US20130160832A1 (en) * | 2011-12-22 | 2013-06-27 | Andreas Krause | Marking of a substrate of a solar cell |
| JP2013211541A (ja) * | 2012-02-28 | 2013-10-10 | Kyocera Corp | 太陽電池素子および太陽電池素子の製造方法 |
| DE102012217539A1 (de) * | 2012-09-27 | 2014-05-15 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils |
| CN103258910B (zh) * | 2013-05-03 | 2015-09-30 | 天津英利新能源有限公司 | 一种实现碎片率自动化统计的方法 |
| WO2014204673A1 (en) * | 2013-06-18 | 2014-12-24 | Apple Inc. | Laser engraved reflective surface structures and method therefor |
| JP6098815B2 (ja) * | 2013-06-19 | 2017-03-22 | パナソニックＩｐマネジメント株式会社 | マーキングを有する太陽電池セルおよびその製造方法 |
| JP2015005140A (ja) * | 2013-06-20 | 2015-01-08 | 株式会社東芝 | 半導体記憶装置及び製造方法 |
| CN103434273B (zh) * | 2013-09-06 | 2016-08-17 | 常州天合光能有限公司 | 一种光伏组件边框打标方法及其光伏组件生产工艺 |
| CN104385795B (zh) * | 2014-10-24 | 2017-11-03 | 常熟阿特斯阳光电力科技有限公司 | 一种光伏组件条码信息的修正方法及系统 |
| KR101661839B1 (ko) | 2015-01-05 | 2016-09-30 | 금오공과대학교 산학협력단 | 솔라셀 제조 공정 관리 방법 |
| JP6629988B2 (ja) * | 2016-10-26 | 2020-01-15 | 株式会社カネカ | 光電変換素子 |
| CN107221509B (zh) * | 2017-06-20 | 2020-10-13 | 南京矽邦半导体有限公司 | 一种识别单颗产品在qfn框架上位置信息的方法 |
| DE102017131419A1 (de) | 2017-12-29 | 2019-07-04 | Hanwha Q Cells Gmbh | Ausleseverfahren und Auslesevorrichtung |
| PL3615261T3 (pl) | 2018-05-25 | 2022-05-09 | Laserax Inc | Metalowy przedmiot obrabiany ze znacznikami odpornymi na śrutowanie, sposób znakowania laserowego takich znaczników na metalowym przedmiocie obrabianym |
| JP7206660B2 (ja) | 2018-07-17 | 2023-01-18 | セイコーエプソン株式会社 | 光電変換素子、光電変換モジュールおよび電子機器 |
| FR3089349B1 (fr) * | 2018-11-29 | 2021-09-17 | Commissariat Energie Atomique | Cellule solaire photovoltaique presentant des fonctions de stockage d’information et d’affichage |
| CN113196503A (zh) * | 2018-11-29 | 2021-07-30 | 原子能和替代能源委员会 | 具有信息存储和显示功能的光伏太阳能电池 |
| FR3089350B1 (fr) * | 2018-11-29 | 2020-12-25 | Commissariat Energie Atomique | Tri et recyclage de modules photovoltaiques ou de cellules solaires presentant des fonnctions de stockage d’information et d’affichage |
| DE102019006090A1 (de) * | 2019-08-29 | 2021-03-04 | Azur Space Solar Power Gmbh | Markierungsverfahren |
| CN113814570A (zh) * | 2021-01-20 | 2021-12-21 | 宣城睿晖宣晟企业管理中心合伙企业(有限合伙) | 一种硅片的激光打标方法及异质结电池的制造方法 |
| WO2022186787A1 (en) * | 2021-03-01 | 2022-09-09 | Kalyon Gunes Teknolojileri Uretim Anonim Sirketi | A marking system and method for marking semiconductor substrates |
| CN114334911B (zh) * | 2022-03-03 | 2022-08-05 | 晶科能源(海宁)有限公司 | 光伏电池及其形成方法、光伏组件 |
| CN115020540B (zh) * | 2022-05-30 | 2023-03-24 | 晶科能源股份有限公司 | 一种硅片的制作方法及硅片 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2944185A1 (de) * | 1979-11-02 | 1981-05-07 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Solarzelle |
| US4568409A (en) * | 1983-11-17 | 1986-02-04 | Chronar Corp. | Precision marking of layers |
| US4626613A (en) | 1983-12-23 | 1986-12-02 | Unisearch Limited | Laser grooved solar cell |
| JPH0196920A (ja) | 1987-10-09 | 1989-04-14 | Fujitsu Ltd | ウエーハの識別方法 |
| US5024953A (en) | 1988-03-22 | 1991-06-18 | Hitachi, Ltd. | Method for producing opto-electric transducing element |
| DE3815512C2 (de) | 1988-05-06 | 1994-07-28 | Deutsche Aerospace | Solarzelle und Verfahren zu ihrer Herstellung |
| FR2681472B1 (fr) | 1991-09-18 | 1993-10-29 | Commissariat Energie Atomique | Procede de fabrication de films minces de materiau semiconducteur. |
| US5256578A (en) | 1991-12-23 | 1993-10-26 | Motorola, Inc. | Integral semiconductor wafer map recording |
| JP3098695B2 (ja) * | 1995-09-28 | 2000-10-16 | キヤノン株式会社 | 太陽電池モジュール |
| US5610104A (en) | 1996-05-21 | 1997-03-11 | Cypress Semiconductor Corporation | Method of providing a mark for identification on a silicon surface |
| JPH10256105A (ja) | 1997-03-11 | 1998-09-25 | Super Silicon Kenkyusho:Kk | レーザマークを付けたウェーハ |
| JP2000068537A (ja) * | 1998-06-12 | 2000-03-03 | Canon Inc | 太陽電池モジュ―ル、ストリングおよびシステムならびに管理方法 |
| US6303899B1 (en) | 1998-12-11 | 2001-10-16 | Lsi Logic Corporation | Method and apparatus for scribing a code in an inactive outer clear out area of a semiconductor wafer |
| US6112738A (en) | 1999-04-02 | 2000-09-05 | Memc Electronics Materials, Inc. | Method of slicing silicon wafers for laser marking |
| DE19933703B4 (de) | 1999-04-07 | 2005-07-28 | Shell Solar Gmbh | Vorrichtung und Verfahren zum Abtragen von Schichten auf einer Solarzelle |
| US6235637B1 (en) * | 1999-09-15 | 2001-05-22 | Taiwan Semiconductor Manufacturing Company | Method for marking a wafer without inducing flat edge particle problem |
| EP1868249B1 (en) | 1999-09-28 | 2011-07-13 | Kaneka Corporation | Method of controlling manufacturing process of photoelectric conversion apparatus |
| US20010038153A1 (en) | 2000-01-07 | 2001-11-08 | Kiyofumi Sakaguchi | Semiconductor substrate and process for its production |
| US7007855B1 (en) | 2000-03-17 | 2006-03-07 | International Business Machines Corporation | Wafer identification mark |
| US6489216B1 (en) * | 2000-09-29 | 2002-12-03 | Taiwan Semiconductor Manufacturing Co., Ltd | Chemical mechanical polish (CMP) planarizing method employing topographic mark preservation |
| JP3809353B2 (ja) | 2001-08-02 | 2006-08-16 | キヤノン株式会社 | Ｉｄ付き加工物の製造方法 |
| JP4244549B2 (ja) * | 2001-11-13 | 2009-03-25 | トヨタ自動車株式会社 | 光電変換素子及びその製造方法 |
| JP2003258285A (ja) * | 2002-02-27 | 2003-09-12 | Sharp Corp | 表面凹凸構造の作製方法及び太陽電池 |
| JP4049329B2 (ja) * | 2002-06-06 | 2008-02-20 | 関西ティー・エル・オー株式会社 | 太陽電池用多結晶シリコン基板の製造方法 |
| US6954002B2 (en) * | 2002-08-29 | 2005-10-11 | Infineon Technologies North America Corp. | System and method of enhancing alignment marks |
| US6812477B2 (en) | 2002-12-04 | 2004-11-02 | Texas Instruments Incorporated | Integrated circuit identification |
| JP4035042B2 (ja) * | 2002-12-19 | 2008-01-16 | 京セラ株式会社 | 太陽電池素子の製造方法 |
| JP2004259790A (ja) | 2003-02-25 | 2004-09-16 | Canon Inc | マークを付与した基板の製造方法及びマークの読み取りプログラム及びマークの読み取り装置 |
| KR100543507B1 (ko) * | 2003-05-22 | 2006-01-20 | 준 신 이 | 황화아연 반사방지막을 갖는 실리콘 태양전지의 제조방법 |
| JP4328166B2 (ja) * | 2003-09-29 | 2009-09-09 | 有限会社松宮半導体研究所 | 太陽電池セルの製造方法 |
| KR100562789B1 (ko) * | 2003-11-10 | 2006-03-21 | 준 신 이 | 친산화성 금속박막을 이용한 낮은 접촉저항과 반사방지막실리콘 태양전지 및 그 제조방법 |
| JP2005183469A (ja) * | 2003-12-16 | 2005-07-07 | Sharp Corp | 太陽電池セル |
| DE102004021259B4 (de) | 2004-04-30 | 2010-09-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Bearbeiten eines Halbleitersubstrats |
| US20060065985A1 (en) * | 2004-09-30 | 2006-03-30 | Berman Michael J | Substrate edge scribe |
| US20070163634A1 (en) * | 2005-07-14 | 2007-07-19 | Kyocera Corporation | Solar cell, manufacturing method and manufacturing management system thereof, and solar cell module |
-
2007
- 2007-02-28 EP EP07726561.9A patent/EP1989740B2/de active Active
- 2007-02-28 DE DE502007001732T patent/DE502007001732D1/de active Active
- 2007-02-28 WO PCT/EP2007/051925 patent/WO2007099138A1/de active Application Filing
- 2007-02-28 CN CN2007800071310A patent/CN101395724B/zh active Active
- 2007-02-28 SI SI200730137T patent/SI1989740T2/sl unknown
- 2007-02-28 DK DK07726561.9T patent/DK1989740T4/da active
- 2007-02-28 KR KR1020087022418A patent/KR101110467B1/ko active IP Right Grant
- 2007-02-28 JP JP2008556782A patent/JP5627855B2/ja active Active
- 2007-02-28 US US12/224,403 patent/US8492240B2/en active Active
- 2007-02-28 ES ES07726561T patent/ES2335156T5/es active Active
- 2007-02-28 PT PT07726561T patent/PT1989740E/pt unknown
- 2007-02-28 AT AT07726561T patent/ATE445912T1/de active
Also Published As
| Publication number | Publication date |
|---|---|
| EP1989740B1 (de) | 2009-10-14 |
| ES2335156T3 (es) | 2010-03-22 |
| ATE445912T1 (de) | 2009-10-15 |
| DK1989740T3 (da) | 2010-02-15 |
| US20090050198A1 (en) | 2009-02-26 |
| CN101395724A (zh) | 2009-03-25 |
| KR20080098062A (ko) | 2008-11-06 |
| EP1989740B2 (de) | 2019-05-22 |
| JP2009528687A (ja) | 2009-08-06 |
| CN101395724B (zh) | 2010-10-27 |
| DE502007001732D1 (de) | 2009-11-26 |
| US8492240B2 (en) | 2013-07-23 |
| WO2007099138A1 (de) | 2007-09-07 |
| KR101110467B1 (ko) | 2012-01-31 |
| JP5627855B2 (ja) | 2014-11-19 |
| PT1989740E (pt) | 2010-01-11 |
| EP1989740A1 (de) | 2008-11-12 |
| DK1989740T4 (da) | 2019-08-26 |
| ES2335156T5 (es) | 2020-03-09 |
| SI1989740T1 (sl) | 2010-02-26 |
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