JP6629988B2 - 光電変換素子 - Google Patents
光電変換素子 Download PDFInfo
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- JP6629988B2 JP6629988B2 JP2018547535A JP2018547535A JP6629988B2 JP 6629988 B2 JP6629988 B2 JP 6629988B2 JP 2018547535 A JP2018547535 A JP 2018547535A JP 2018547535 A JP2018547535 A JP 2018547535A JP 6629988 B2 JP6629988 B2 JP 6629988B2
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- photoelectric conversion
- electrode
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- 238000006243 chemical reaction Methods 0.000 title claims description 25
- 230000003287 optical effect Effects 0.000 description 8
- 230000005611 electricity Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Description
Claims (6)
- 第1の方向に延伸し、前記第1の方向に直交する第2の方向に第1の間隔をあけて配列された複数のフィンガー電極と、
前記第2の方向において、前記複数のフィンガー電極と前記第1の間隔よりも大きい第2の間隔をあけて配置された識別マークと、
を含む光電変換素子。 - 前記識別マークは、略長方形の領域において反射率を異ならせる複数の窪みを有する、
請求項1に記載の光電変換素子。 - 前記第1の方向において、前記複数のフィンガー電極と前記識別マークとは、前記第1の間隔よりも大きい第3の間隔をあけて配置された、
請求項1又は2に記載の光電変換素子。 - 前記識別マークは、前記第1の方向に略平行な第1の辺、第2の辺と、前記第2の方向に略平行な第3の辺、第4の辺とを含む略長方形の領域に形成され、
前記複数のフィンガー電極の内、前記第1の辺と最も近接して並走するフィンガー電極は、前記第1の辺に対して前記第2の間隔をあけて配置され、
前記複数のフィンガー電極の内、前記第2の辺と最も近接して並走するフィンガー電極は、前記第2の辺に対して前記第1の間隔よりも大きい第4の間隔をあけて配置された、
請求項1乃至3のいずれか一つに記載の光電変換素子。 - 前記識別マークは、前記第1の方向に略平行な第1の辺、第2の辺と、前記第2の方向に略平行な第3の辺、第4の辺とを含む略長方形の領域に形成され、
前記複数のフィンガー電極の内、その端部が前記第3の辺と最も近接するフィンガー電極は、前記第3の辺に対して前記第1の間隔よりも大きい第3の間隔をあけて配置され、
前記複数のフィンガー電極の内、その端部が前記第4の辺と最も近接するフィンガー電極は、前記第4の辺に対して前記第1の間隔よりも大きい第5の間隔をあけて配置された、
請求項1、2、4の内のいずれか一つに記載の光電変換素子。 - 前記第2の間隔は、前記第1の間隔の2倍よりも小さい、
請求項1乃至5のいずれか一つに記載の光電変換素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016209846 | 2016-10-26 | ||
JP2016209846 | 2016-10-26 | ||
PCT/JP2017/036751 WO2018079257A1 (ja) | 2016-10-26 | 2017-10-11 | 光電変換素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018079257A1 JPWO2018079257A1 (ja) | 2019-04-11 |
JP6629988B2 true JP6629988B2 (ja) | 2020-01-15 |
Family
ID=62024883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018547535A Active JP6629988B2 (ja) | 2016-10-26 | 2017-10-11 | 光電変換素子 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10923606B2 (ja) |
JP (1) | JP6629988B2 (ja) |
WO (1) | WO2018079257A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220085457A (ko) * | 2020-12-15 | 2022-06-22 | 한화토탈에너지스 주식회사 | 위변조 방지용 태양전지 및 이의 제조방법 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109856930B (zh) * | 2017-11-30 | 2021-05-25 | 京东方科技集团股份有限公司 | 对准标记、基板及其制作方法、曝光对准方法 |
TWI848937B (zh) * | 2018-07-24 | 2024-07-21 | 日商拓自達電線股份有限公司 | 屏蔽封裝體及屏蔽封裝體之製造方法 |
CN112185937B (zh) * | 2020-09-29 | 2023-12-12 | 晶科能源(海宁)有限公司 | 用于制备太阳能电池的半导体片及其制备方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0726849Y2 (ja) * | 1990-08-31 | 1995-06-14 | 三洋電機株式会社 | 透光性薄膜太陽電池 |
JP3086507B2 (ja) * | 1991-10-02 | 2000-09-11 | 旭化成工業株式会社 | 熱可塑性合成樹脂成形品 |
JP2574984Y2 (ja) * | 1992-05-22 | 1998-06-18 | シャープ株式会社 | 太陽電池セル |
JPH0677509A (ja) * | 1992-08-25 | 1994-03-18 | Sanyo Electric Co Ltd | 太陽電池に於けるセル識別方式 |
EP1868249B1 (en) * | 1999-09-28 | 2011-07-13 | Kaneka Corporation | Method of controlling manufacturing process of photoelectric conversion apparatus |
JP2002064214A (ja) * | 2000-08-17 | 2002-02-28 | Honda Motor Co Ltd | 太陽電池の集電用電極およびその製造方法 |
JP4232597B2 (ja) | 2003-10-10 | 2009-03-04 | 株式会社日立製作所 | シリコン太陽電池セルとその製造方法 |
EP1989740B2 (de) | 2006-02-28 | 2019-05-22 | Hanwha Q CELLS GmbH | Solarzellenmarkierverfahren und solarzelle |
JP2007306041A (ja) * | 2007-08-29 | 2007-11-22 | Kyocera Corp | 太陽電池素子およびその製造方法、太陽電池モジュール |
CN103038890A (zh) * | 2010-06-07 | 2013-04-10 | 韩华Q.Cells有限公司 | 用于标记太阳能电池的方法及太阳能电池 |
US8860227B2 (en) * | 2011-06-22 | 2014-10-14 | Panasonic Corporation | Semiconductor substrate having dot marks and method of manufacturing the same |
US9082901B2 (en) * | 2012-04-11 | 2015-07-14 | E I Du Pont De Nemours And Company | Solar cell and manufacturing method of the same |
KR101542624B1 (ko) * | 2013-05-22 | 2015-08-06 | 제일모직주식회사 | 선택적 에미터를 갖는 태양전지의 제조방법 및 이로부터 제조된 태양전지 |
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2017
- 2017-10-11 JP JP2018547535A patent/JP6629988B2/ja active Active
- 2017-10-11 US US16/344,924 patent/US10923606B2/en active Active
- 2017-10-11 WO PCT/JP2017/036751 patent/WO2018079257A1/ja active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220085457A (ko) * | 2020-12-15 | 2022-06-22 | 한화토탈에너지스 주식회사 | 위변조 방지용 태양전지 및 이의 제조방법 |
KR102586065B1 (ko) * | 2020-12-15 | 2023-10-06 | 한화토탈에너지스 주식회사 | 위변조 방지용 태양전지 및 이의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
US20190259884A1 (en) | 2019-08-22 |
US10923606B2 (en) | 2021-02-16 |
JPWO2018079257A1 (ja) | 2019-04-11 |
WO2018079257A1 (ja) | 2018-05-03 |
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