SG71684A1 - Multilayer printed circuit board method of producing multilayer printed circut board and resin filler - Google Patents
Multilayer printed circuit board method of producing multilayer printed circut board and resin fillerInfo
- Publication number
- SG71684A1 SG71684A1 SG1996010945A SG1996010945A SG71684A1 SG 71684 A1 SG71684 A1 SG 71684A1 SG 1996010945 A SG1996010945 A SG 1996010945A SG 1996010945 A SG1996010945 A SG 1996010945A SG 71684 A1 SG71684 A1 SG 71684A1
- Authority
- SG
- Singapore
- Prior art keywords
- multilayer printed
- resin filler
- circuit board
- printed circuit
- board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27392895 | 1995-10-23 | ||
JP31746995 | 1995-11-10 | ||
JP16340296 | 1996-06-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG71684A1 true SG71684A1 (en) | 2000-04-18 |
Family
ID=27322157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996010945A SG71684A1 (en) | 1995-10-23 | 1996-10-23 | Multilayer printed circuit board method of producing multilayer printed circut board and resin filler |
Country Status (7)
Country | Link |
---|---|
EP (4) | EP0800336B1 (de) |
KR (1) | KR100272850B1 (de) |
CN (1) | CN1090891C (de) |
DE (3) | DE69633690T2 (de) |
MY (1) | MY116680A (de) |
SG (1) | SG71684A1 (de) |
WO (1) | WO1997016056A1 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6376049B1 (en) * | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
KR100855529B1 (ko) | 1998-09-03 | 2008-09-01 | 이비덴 가부시키가이샤 | 다층프린트배선판 및 그 제조방법 |
MY144503A (en) | 1998-09-14 | 2011-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
DE69942279D1 (de) | 1998-09-17 | 2010-06-02 | Ibiden Co Ltd | Vielschichtig aufgebaute leiterplatte |
SE9803670L (sv) * | 1998-10-26 | 2000-04-27 | Ericsson Telefon Ab L M | Förfarande vid framställning av kretskort |
JP2000261147A (ja) * | 1999-03-10 | 2000-09-22 | Shinko Electric Ind Co Ltd | 多層配線基板及びその製造方法 |
JP4442832B2 (ja) * | 1999-04-13 | 2010-03-31 | イビデン株式会社 | 多層プリント配線板 |
DE60031680T2 (de) | 1999-06-02 | 2007-09-06 | Ibiden Co., Ltd., Ogaki | Mehrschichtige, gedruckte leiterplatte und herstellungsmethode für eine mehrschichtige, gedruckte leiterplatte |
CN1199536C (zh) | 1999-10-26 | 2005-04-27 | 伊比登株式会社 | 多层印刷配线板及多层印刷配线板的制造方法 |
CN100413383C (zh) * | 2002-07-18 | 2008-08-20 | 日立化成工业株式会社 | 多层配线板及其制造方法、以及半导体装置及无线电子装置 |
ES2217952B1 (es) * | 2002-12-30 | 2006-03-16 | Lear Automotive (Eeds) Spain, S.L. | Procedimiento para la fabricacion de placas de circuito impreso con espacios entre pistas protegidos. |
DE10328857B3 (de) * | 2003-06-26 | 2005-03-17 | OCé PRINTING SYSTEMS GMBH | Hülse zum Transport eines Tonergemischs und Verfahren zum Herstellen einer solchen Hülse |
CN101014890B (zh) * | 2004-09-08 | 2011-01-19 | 东丽株式会社 | 光布线用树脂组合物和光电复合布线基板 |
JP5344394B2 (ja) | 2008-07-10 | 2013-11-20 | 山栄化学株式会社 | 硬化性樹脂組成物、並びにハロゲンフリー樹脂基板及びハロゲンフリービルドアッププリント配線板 |
TWI517268B (zh) * | 2009-08-07 | 2016-01-11 | 半導體能源研究所股份有限公司 | 端子構造的製造方法和電子裝置的製造方法 |
JP5077324B2 (ja) * | 2009-10-26 | 2012-11-21 | 株式会社デンソー | 配線基板 |
CN101720167B (zh) * | 2009-11-20 | 2012-06-06 | 深圳崇达多层线路板有限公司 | 内层芯板树脂塞孔的线路板制作方法 |
CN101854778B (zh) * | 2010-04-30 | 2011-10-26 | 深圳崇达多层线路板有限公司 | 一种对线路板导电孔进行树脂塞孔的制造工艺 |
CN102510668B (zh) * | 2011-11-08 | 2014-02-19 | 深圳市景旺电子股份有限公司 | 一种超厚铜pcb板制作方法及其电路板 |
CN102548199A (zh) * | 2011-12-29 | 2012-07-04 | 广东生益科技股份有限公司 | 电路基板及其制作方法 |
CN105704915A (zh) * | 2016-04-26 | 2016-06-22 | 浪潮电子信息产业股份有限公司 | 一种耐腐蚀的服务器pcb |
CN106304665A (zh) * | 2016-08-30 | 2017-01-04 | 江门全合精密电子有限公司 | 10安士铜印刷电路板的制作方法 |
TWI788471B (zh) * | 2018-01-16 | 2023-01-01 | 日商太陽油墨製造股份有限公司 | 熱硬化性樹脂組成物、其硬化物及印刷配線板 |
CN117690902B (zh) * | 2024-02-03 | 2024-04-12 | 江门市和美精艺电子有限公司 | 一种含改性胶膜的封装基板 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2042059A5 (de) * | 1969-04-02 | 1971-02-05 | Ibm | |
DE2451343C3 (de) * | 1973-10-26 | 1978-10-05 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka (Japan) | Gedruckte Schaltung |
US4555532A (en) * | 1983-10-14 | 1985-11-26 | Hitachi, Ltd. | Epoxy resin composition |
DE3913966B4 (de) * | 1988-04-28 | 2005-06-02 | Ibiden Co., Ltd., Ogaki | Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung |
US5120384A (en) * | 1989-05-25 | 1992-06-09 | Matsushita Electric Works, Ltd. | Method of manufacturing multilayer laminate |
EP0453785A1 (de) * | 1990-04-24 | 1991-10-30 | Oerlikon Contraves AG | Verfahren zur Herstellung von mehrlagigen Dünnschichtschaltungen mit integrierten Dünnschichtwiderständen |
JP3057766B2 (ja) * | 1990-12-18 | 2000-07-04 | 日本ケミコン株式会社 | 厚膜多層回路基板及びその製造方法 |
JPH04221886A (ja) * | 1990-12-21 | 1992-08-12 | Nippon Chemicon Corp | 厚膜多層回路基板及びその製造方法 |
JP2778323B2 (ja) * | 1992-01-23 | 1998-07-23 | 株式会社日立製作所 | プリント配線基板およびその製造方法 |
JP3053970B2 (ja) * | 1992-07-27 | 2000-06-19 | 住友ベークライト株式会社 | 多層印刷配線板の製造方法 |
US5766670A (en) * | 1993-11-17 | 1998-06-16 | Ibm | Via fill compositions for direct attach of devices and methods for applying same |
US5450290A (en) * | 1993-02-01 | 1995-09-12 | International Business Machines Corporation | Printed circuit board with aligned connections and method of making same |
JPH06275959A (ja) * | 1993-03-22 | 1994-09-30 | Hitachi Ltd | 多層配線基板とその製造方法および両面プリント配線板の製造方法 |
GB2283617A (en) * | 1993-11-02 | 1995-05-10 | Coates Brothers Plc | Blocking through-holes in laminar substrates |
-
1996
- 1996-10-23 CN CN96191555A patent/CN1090891C/zh not_active Expired - Lifetime
- 1996-10-23 SG SG1996010945A patent/SG71684A1/en unknown
- 1996-10-23 DE DE69633690T patent/DE69633690T2/de not_active Expired - Lifetime
- 1996-10-23 EP EP96935417A patent/EP0800336B1/de not_active Expired - Lifetime
- 1996-10-23 EP EP03004268A patent/EP1318708B1/de not_active Expired - Lifetime
- 1996-10-23 DE DE69633381T patent/DE69633381T2/de not_active Expired - Lifetime
- 1996-10-23 WO PCT/JP1996/003088 patent/WO1997016056A1/ja active IP Right Grant
- 1996-10-23 MY MYPI96004387A patent/MY116680A/en unknown
- 1996-10-23 DE DE69637655T patent/DE69637655D1/de not_active Expired - Lifetime
- 1996-10-23 EP EP06014607A patent/EP1705973B1/de not_active Expired - Lifetime
- 1996-10-23 EP EP04011285A patent/EP1445996B1/de not_active Expired - Lifetime
- 1996-10-23 KR KR1019970704312A patent/KR100272850B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69633690T2 (de) | 2005-03-10 |
WO1997016056A1 (fr) | 1997-05-01 |
EP1318708A2 (de) | 2003-06-11 |
EP1445996B1 (de) | 2008-08-20 |
DE69633690D1 (de) | 2004-11-25 |
EP0800336B1 (de) | 2004-09-15 |
EP0800336A1 (de) | 1997-10-08 |
EP1705973A2 (de) | 2006-09-27 |
EP1705973A3 (de) | 2009-01-21 |
KR987001202A (ko) | 1998-04-30 |
EP1445996A3 (de) | 2004-08-18 |
EP1318708A3 (de) | 2003-06-18 |
EP1705973B1 (de) | 2011-05-11 |
DE69633381D1 (de) | 2004-10-21 |
MY116680A (en) | 2004-03-31 |
DE69637655D1 (de) | 2008-10-02 |
CN1169234A (zh) | 1997-12-31 |
DE69633381T2 (de) | 2005-02-24 |
EP0800336A4 (de) | 1999-04-21 |
EP1445996A2 (de) | 2004-08-11 |
KR100272850B1 (ko) | 2001-01-15 |
EP1318708B1 (de) | 2004-10-20 |
CN1090891C (zh) | 2002-09-11 |
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