SG70999A1 - Electrodeposited copper foil for fine pattern and method for producing the same - Google Patents

Electrodeposited copper foil for fine pattern and method for producing the same

Info

Publication number
SG70999A1
SG70999A1 SG1996010645A SG1996010645A SG70999A1 SG 70999 A1 SG70999 A1 SG 70999A1 SG 1996010645 A SG1996010645 A SG 1996010645A SG 1996010645 A SG1996010645 A SG 1996010645A SG 70999 A1 SG70999 A1 SG 70999A1
Authority
SG
Singapore
Prior art keywords
copper foil
ppm
same
electrodeposited copper
producing
Prior art date
Application number
SG1996010645A
Other languages
English (en)
Inventor
Adam M Wolski
Michel Streel
Akitoshi Suzuki
Hideo Otsuka
Original Assignee
Circuit Foil Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Japan filed Critical Circuit Foil Japan
Publication of SG70999A1 publication Critical patent/SG70999A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemically Coating (AREA)
SG1996010645A 1995-09-22 1996-09-17 Electrodeposited copper foil for fine pattern and method for producing the same SG70999A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24426295 1995-09-22
JP10674396A JP3313277B2 (ja) 1995-09-22 1996-04-26 ファインパターン用電解銅箔とその製造方法

Publications (1)

Publication Number Publication Date
SG70999A1 true SG70999A1 (en) 2000-03-21

Family

ID=26446848

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996010645A SG70999A1 (en) 1995-09-22 1996-09-17 Electrodeposited copper foil for fine pattern and method for producing the same

Country Status (16)

Country Link
US (1) US5834140A (es)
EP (1) EP0851944B1 (es)
JP (1) JP3313277B2 (es)
KR (1) KR970070247A (es)
AT (1) ATE178954T1 (es)
BR (1) BR9610640A (es)
CA (1) CA2230256C (es)
CZ (1) CZ292666B6 (es)
DE (2) DE69602104T2 (es)
DK (1) DK0851944T3 (es)
ES (1) ES2131952T3 (es)
MY (1) MY114311A (es)
SG (1) SG70999A1 (es)
SK (1) SK282866B6 (es)
TW (1) TW332223B (es)
WO (1) WO1997011210A1 (es)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
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JP3742144B2 (ja) * 1996-05-08 2006-02-01 ソニー株式会社 非水電解液二次電池及び非水電解液二次電池用の平面状集電体
JPH10330983A (ja) * 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
US5989727A (en) * 1998-03-04 1999-11-23 Circuit Foil U.S.A., Inc. Electrolytic copper foil having a modified shiny side
DE19937843C1 (de) * 1999-08-13 2001-02-08 Bolta Werke Gmbh Verfahren zur Herstellung einer selbsttragenden Kupferfolie
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
JP3794613B2 (ja) * 2000-05-18 2006-07-05 三井金属鉱業株式会社 電解銅箔の電解装置
US7148566B2 (en) * 2001-03-26 2006-12-12 International Business Machines Corporation Method and structure for an organic package with improved BGA life
KR100429770B1 (ko) * 2001-11-15 2004-05-03 한국과학기술연구원 구리 전기 도금 용액
JP4136496B2 (ja) * 2002-07-02 2008-08-20 三井金属鉱業株式会社 電解銅箔の製造方法
JP3789107B2 (ja) * 2002-07-23 2006-06-21 株式会社日鉱マテリアルズ 特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4413552B2 (ja) * 2002-08-01 2010-02-10 古河電気工業株式会社 電解銅箔および二次電池集電体用電解銅箔
TW200403358A (en) * 2002-08-01 2004-03-01 Furukawa Circuit Foil Electrodeposited copper foil and electrodeposited copper foil for secondary battery collector
TW200404484A (en) * 2002-09-02 2004-03-16 Furukawa Circuit Foil Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board
KR100389061B1 (ko) * 2002-11-14 2003-06-25 일진소재산업주식회사 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
KR100559933B1 (ko) * 2002-11-29 2006-03-13 엘에스전선 주식회사 저조도 동박의 전해연마방법 및 전해연마장치와 동박
KR100454270B1 (ko) * 2002-11-29 2004-10-26 엘지전선 주식회사 저조도 전해동박의 제조방법 및 전해동박
TW200424359A (en) * 2003-02-04 2004-11-16 Furukawa Circuit Foil Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
TW200500199A (en) 2003-02-12 2005-01-01 Furukawa Circuit Foil Copper foil for fine patterned printed circuits and method of production of same
JP2004244656A (ja) * 2003-02-12 2004-09-02 Furukawa Techno Research Kk 高周波用途対応可能銅箔とその製造方法
US20060191798A1 (en) * 2003-04-03 2006-08-31 Fukuda Metal Foil & Powder Co., Ltd. Electrolytic copper foil with low roughness surface and process for producing the same
JP4273309B2 (ja) 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
JP4255130B2 (ja) * 2003-07-29 2009-04-15 日鉱金属株式会社 特定骨格を有するジアルキルアミノ基含有重合体及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
US20050158574A1 (en) * 2003-11-11 2005-07-21 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
JP4087369B2 (ja) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 キャリア付き極薄銅箔、およびプリント配線板
JP4330979B2 (ja) * 2003-11-13 2009-09-16 福田金属箔粉工業株式会社 表面処理電解銅箔
DE602005022650D1 (de) * 2004-04-26 2010-09-16 Rohm & Haas Elect Mat Verbessertes Plattierungsverfahren
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
TWI396779B (zh) * 2005-02-21 2013-05-21 Copper foil and its manufacturing method, and flexible printed circuit board
KR100683961B1 (ko) * 2005-03-29 2007-02-15 한국지질자원연구원 전해생성된 염소를 이용한 침출과 이를 위한 전해침출장치
KR100753587B1 (ko) * 2005-12-29 2007-08-30 한국지질자원연구원 전해생성된 염소 또는 염소화합물을 이용한 전해침출장치
US8722199B2 (en) 2005-03-31 2014-05-13 Mitsui Mining & Smelting Co., Ltd. Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil
US20070015051A1 (en) * 2005-07-18 2007-01-18 Shen Ko C Secondary battery
JP2007146289A (ja) * 2005-10-31 2007-06-14 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板
TW200738913A (en) 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
TWI414638B (zh) * 2006-06-07 2013-11-11 Furukawa Electric Co Ltd A method for manufacturing a surface-treated electrolytic copper foil, and a circuit board
JP5128695B2 (ja) * 2010-06-28 2013-01-23 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を使用したリチウムイオン二次電池
JP5352542B2 (ja) 2010-07-15 2013-11-27 エル エス エムトロン リミテッド リチウム二次電池の集電体用銅箔
TWI525221B (zh) 2010-10-06 2016-03-11 Furukawa Electric Co Ltd Copper foil and its manufacturing method, carrier copper foil and its manufacturing method, printed circuit board and multilayer printed circuit board
WO2012066991A1 (ja) * 2010-11-15 2012-05-24 Jx日鉱日石金属株式会社 電解銅箔
WO2013080988A1 (ja) * 2011-11-29 2013-06-06 古河電気工業株式会社 電極用集電体、非水電解質二次電池用電極、非水電解質二次電池
JP5598884B2 (ja) * 2012-02-28 2014-10-01 古河電気工業株式会社 リチウムイオン二次電池、該二次電池の負極電極を構成する集電体、ならびに該負極電極集電体を構成する電解銅箔
JP5858849B2 (ja) * 2012-03-30 2016-02-10 Jx日鉱日石金属株式会社 金属箔
CN104321469A (zh) * 2012-12-27 2015-01-28 古河电气工业株式会社 低反弹性电解铜箔、使用该电解铜箔的线路板及挠性线路板
TWI539033B (zh) * 2013-01-07 2016-06-21 Chang Chun Petrochemical Co Electrolytic copper foil and its preparation method
JP5778331B1 (ja) * 2014-12-26 2015-09-16 古河電気工業株式会社 絶縁電線およびコイル
JP5778332B1 (ja) * 2014-12-26 2015-09-16 古河電気工業株式会社 耐曲げ加工性に優れる絶縁電線、それを用いたコイルおよび電子・電気機器
KR101897474B1 (ko) 2015-06-26 2018-09-12 케이씨에프테크놀로지스 주식회사 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지
JP6572083B2 (ja) * 2015-09-30 2019-09-04 大日本印刷株式会社 発光素子用基板、モジュール及び発光素子用基板の製造方法
TWI597390B (zh) * 2015-11-10 2017-09-01 Jx Nippon Mining & Metals Corp Electrolytic copper foil, manufacturing method of electrolytic copper foil, copper clad laminated board, printed wiring board, the manufacturing method of a printed wiring board, and the manufacturing method of an electronic device
JP6346244B2 (ja) * 2015-11-10 2018-06-20 Ｊｘ金属株式会社 電解銅箔、電解銅箔の製造方法、銅張積層板、プリント配線板、プリント配線板の製造方法及び電子機器の製造方法
MY190857A (en) * 2016-01-15 2022-05-12 Jx Nippon Mining & Metals Corp Copper foil, copper-clad laminate board,method for producing printed wiring board,method for producing electronic apparatus,method for producing transmission channel, and method for producing antenna
CN110537393B (zh) * 2017-04-17 2022-09-20 住友金属矿山株式会社 导电性基板、导电性基板的制造方法
CN109601024A (zh) * 2017-07-31 2019-04-09 卢森堡电路箔片股份有限公司 表面处理过的铜箔和覆铜箔层压板
KR20190040286A (ko) * 2017-07-31 2019-04-17 서키트 호일 룩셈부르크, 에스에이알엘 동장 적층 기판 및 이를 포함하는 인쇄 회로 기판
CN109115795B (zh) * 2018-09-06 2020-11-13 嘉兴鼎尚信息科技有限公司 雾化系统、使用该雾化系统的检测设备及工作方法
TWI675128B (zh) * 2019-04-19 2019-10-21 長春石油化學股份有限公司 電解銅箔
CN112981473B (zh) * 2021-02-05 2021-11-23 广东嘉元科技股份有限公司 一种电解铜箔及其制备方法
LU500134B1 (en) 2021-05-07 2022-11-08 Circuit Foil Luxembourg Method for producing an electrodeposited copper foil and copper foil obtained therewith
CA3172526A1 (en) * 2021-10-07 2023-04-07 Circuit Foil Luxembourg Copper foil with high energy at break and secondary battery comprising the same
CA3172019A1 (en) * 2021-10-07 2023-04-07 Circuit Foil Luxembourg Copper foil with high energy at break and secondary battery comprising the same

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DE4126502C1 (es) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen

Also Published As

Publication number Publication date
DE851944T1 (de) 1998-11-19
KR970070247A (ko) 1997-11-07
EP0851944A1 (en) 1998-07-08
DE69602104D1 (de) 1999-05-20
DE69602104T2 (de) 1999-10-28
ES2131952T3 (es) 1999-08-01
DK0851944T3 (da) 1999-10-25
SK282866B6 (sk) 2003-01-09
JPH09143785A (ja) 1997-06-03
BR9610640A (pt) 1999-05-18
MY114311A (en) 2002-09-30
ATE178954T1 (de) 1999-04-15
WO1997011210A1 (en) 1997-03-27
JP3313277B2 (ja) 2002-08-12
CZ77598A3 (cs) 1998-09-16
CZ292666B6 (cs) 2003-11-12
CA2230256A1 (en) 1997-03-27
SK34498A3 (en) 1998-12-02
CA2230256C (en) 2002-01-08
TW332223B (en) 1998-05-21
EP0851944B1 (en) 1999-04-14
US5834140A (en) 1998-11-10

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