KR970065777A - 전기접점용 주석-납 합금도금 제조방법 - Google Patents
전기접점용 주석-납 합금도금 제조방법 Download PDFInfo
- Publication number
- KR970065777A KR970065777A KR1019960005792A KR19960005792A KR970065777A KR 970065777 A KR970065777 A KR 970065777A KR 1019960005792 A KR1019960005792 A KR 1019960005792A KR 19960005792 A KR19960005792 A KR 19960005792A KR 970065777 A KR970065777 A KR 970065777A
- Authority
- KR
- South Korea
- Prior art keywords
- tin
- alloy plating
- lead
- manufacturing
- electrical contacts
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
본 발명은 전자 및 통신장비에 내장되어 있는 콘넥터의 접속성능을 향상시키기 위해 사용되는 전기접점용 주석-납 합금도금의 제조방법에 관한 것으로, 먼저 동판위 니켈을 도금하고나서 붕불화주석, 붕불화납, 유리붕불산을 함유한 도금욕에 펩톤, 젤라틴, 베타-나프톨, 하이드로퀴논을 첨가하고, 1.5-2.5A/d㎡의 전류밀도를 가하면서 5-10중량%의 납을 함유한 합금도금층을 제조하는 방법에 관한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (3)
- a) 동판위에 니켈을 도금하는 단계, b) 40-70g/l의 붕불화주석, 3-18g/l의 붕불화납, 300-400g/l의 유리붕불산 및 25g/l의 유리붕산을 함유하는 도금욕에서, a) 단계를 거친 동판위에 직류전기를 가하는 단계로 이루어짐을 특징으로 하여 5-10중량%의 납을 함유하는 전기접점용 주석-납 합금도금의 제조 방법.
- 제1항에 있어서, b) 단계의 도금욕에 추가로 펩톤 4-5g/l, 젤라틴 2g/l, 베타-나프톨 1g/l, 하이드로퀴논 1g/l을 함유함을 특징으로 하는 방법.
- 제1항 또는 제2항에 있어서, 음극 전류밀도가 1.5 내지 2.5A/d㎡임을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960005792A KR100223320B1 (ko) | 1996-03-06 | 1996-03-06 | 전기접점용 주석-납 합금도금 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960005792A KR100223320B1 (ko) | 1996-03-06 | 1996-03-06 | 전기접점용 주석-납 합금도금 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970065777A true KR970065777A (ko) | 1997-10-13 |
KR100223320B1 KR100223320B1 (ko) | 1999-10-15 |
Family
ID=19452478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960005792A KR100223320B1 (ko) | 1996-03-06 | 1996-03-06 | 전기접점용 주석-납 합금도금 제조방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100223320B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100312593B1 (ko) * | 1999-11-11 | 2001-11-05 | 조충환 | 이극식 납축전지용 경량 기판의 제조방법 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101595248B (zh) | 2006-12-29 | 2011-04-27 | 日进素材产业株式会社 | Sn-B电镀液以及使用该电镀液的电镀方法 |
-
1996
- 1996-03-06 KR KR1019960005792A patent/KR100223320B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100312593B1 (ko) * | 1999-11-11 | 2001-11-05 | 조충환 | 이극식 납축전지용 경량 기판의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR100223320B1 (ko) | 1999-10-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY114311A (en) | Electrodeposited copper foil for fine pattern and method for producing the same | |
MY123655A (en) | Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof. | |
US6015482A (en) | Printed circuit manufacturing process using tin-nickel plating | |
EP1830617A3 (en) | Multilayer printed wiring board and method for producing the same | |
CA2275214A1 (en) | Process to electrolytically deposit copper layers | |
CA2143606A1 (en) | Method of Making Electronic Housings More Reliable by Preventing Formation of Metallic Whiskers on the Sheets Used to Fabricate Them | |
MY119378A (en) | A copper foil for a printed circuit board, a process and an apparatus for producing the same | |
CA2077286A1 (en) | Electrical connecting method | |
HK1035385A1 (en) | Method for metal coating of substrates | |
KR970073262A (ko) | 납땜 방법(Solder Method) | |
MY111443A (en) | Metal film resistor having fuse function and method for producing the same | |
CA2214130A1 (en) | Assemblies of substrates and electronic components | |
KR970065777A (ko) | 전기접점용 주석-납 합금도금 제조방법 | |
DE3663317D1 (en) | Electrical wire with refractory coating | |
US2934479A (en) | Process for masking printed circuits before plating | |
HK1019773A1 (en) | Electroless copper plating solution and method of electroless copper plating. | |
EP0381873A3 (en) | Activating composition for plating of electrically insulative substrates and method for plating of such substrates using said composition | |
EP1197586A3 (en) | Electrolyte | |
CN1094099A (zh) | 一种酸性镀锡的方法 | |
WO2000046877A3 (en) | Printed circuit boards with solid interconnect and method of producing the same | |
MY112350A (en) | Tin coated electrical connector | |
DE3563075D1 (en) | Process for maintaining the solderability of lead-tin coatings, and plated holes printed circuit board | |
JPS56142886A (en) | Tin plating method for aluminum alloy | |
EP0136713A2 (en) | Electric contact member and method of making same | |
Fellman | Plating with tin and tin-lead alloys |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20090706 Year of fee payment: 11 |
|
LAPS | Lapse due to unpaid annual fee |