SG47455A1 - Laser marking system and laser marking method - Google Patents

Laser marking system and laser marking method

Info

Publication number
SG47455A1
SG47455A1 SG1996001813A SG1996001813A SG47455A1 SG 47455 A1 SG47455 A1 SG 47455A1 SG 1996001813 A SG1996001813 A SG 1996001813A SG 1996001813 A SG1996001813 A SG 1996001813A SG 47455 A1 SG47455 A1 SG 47455A1
Authority
SG
Singapore
Prior art keywords
laser marking
marking system
marking method
laser
marking
Prior art date
Application number
SG1996001813A
Other languages
English (en)
Inventor
Taku Yamazaki
Yukinori Matsumura
Yukihiro Tsuda
Original Assignee
Komatsu Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP03441893A external-priority patent/JP3246786B2/ja
Priority claimed from JP5034419A external-priority patent/JP2729451B2/ja
Application filed by Komatsu Mfg Co Ltd filed Critical Komatsu Mfg Co Ltd
Publication of SG47455A1 publication Critical patent/SG47455A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
SG1996001813A 1993-01-29 1994-01-20 Laser marking system and laser marking method SG47455A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP03441893A JP3246786B2 (ja) 1993-01-29 1993-01-29 レーザマーキングシステム
JP5034419A JP2729451B2 (ja) 1993-01-29 1993-01-29 レーザマーキング方法および装置

Publications (1)

Publication Number Publication Date
SG47455A1 true SG47455A1 (en) 1998-04-17

Family

ID=26373231

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996001813A SG47455A1 (en) 1993-01-29 1994-01-20 Laser marking system and laser marking method

Country Status (5)

Country Link
US (1) US5821497A (fr)
GB (1) GB2290495B (fr)
SG (1) SG47455A1 (fr)
TW (1) TW245844B (fr)
WO (1) WO1994016858A1 (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3265553B2 (ja) * 1994-08-19 2002-03-11 株式会社小松製作所 レーザマーキング方法
JP2860765B2 (ja) * 1995-03-07 1999-02-24 株式会社小松製作所 レーザ刻印装置の制御装置
US5937270A (en) * 1996-01-24 1999-08-10 Micron Electronics, Inc. Method of efficiently laser marking singulated semiconductor devices
US6172328B1 (en) * 1998-02-17 2001-01-09 Advanced Foliar Technologies, Inc. Laser marking of plant material
US6180914B1 (en) * 1998-02-17 2001-01-30 Advanced Foliar Technologies, Inc. Laser marking of foliage and cigars
US6774340B1 (en) * 1998-11-25 2004-08-10 Komatsu Limited Shape of microdot mark formed by laser beam and microdot marking method
US6262388B1 (en) 1998-12-21 2001-07-17 Micron Electronics, Inc. Laser marking station with enclosure and method of operation
US6417484B1 (en) 1998-12-21 2002-07-09 Micron Electronics, Inc. Laser marking system for dice carried in trays and method of operation
US6413035B1 (en) 1999-01-11 2002-07-02 Amada Company, Limited Sheet working system
ES2154237B1 (es) * 1999-08-06 2001-10-01 Consejo Superior Investigacion Modificacion total o parcial de superficies ceramicas, sin variar sus caracteristicas funcionales, mediante radiacion laser.
US6331691B1 (en) 1999-09-20 2001-12-18 Automated Laser Corporation Precision guiding apparatus for laser marking system
US20030024913A1 (en) * 2002-04-15 2003-02-06 Downes Joseph P. Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like
AU2001232949A1 (en) * 2000-01-28 2001-08-07 Gsi Lumonics Inc. Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like
JP2001212797A (ja) * 2000-02-03 2001-08-07 Canon Inc 露光装置およびレーザ加工方法
US6528760B1 (en) 2000-07-14 2003-03-04 Micron Technology, Inc. Apparatus and method using rotational indexing for laser marking IC packages carried in trays
EP1267340A3 (fr) * 2001-06-11 2006-12-06 Pioneer Corporation Appareil d'enregistrement d'informations et procédé d'enregistrement d'informations et support d'enregistrement d'informations
US7169685B2 (en) 2002-02-25 2007-01-30 Micron Technology, Inc. Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
US7270932B2 (en) * 2004-02-06 2007-09-18 Rohm And Haas Electronic Materials Llc Imaging composition and method
US7977026B2 (en) * 2004-02-06 2011-07-12 Rohm And Haas Electronic Materials Llc Imaging methods
US7144676B2 (en) * 2004-02-06 2006-12-05 Rohm And Haas Electronic Materials Llc Imaging compositions and methods
US20050175941A1 (en) 2004-02-06 2005-08-11 Rohm And Hass Electronic Materials, L.L.C. Imaging composition and method
KR101125678B1 (ko) * 2004-02-06 2012-03-28 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 개선된 이미지화 조성물 및 방법
DE102005000953A1 (de) * 2004-06-09 2005-12-29 Eberhard Wiedenmann Verfahren zum Kennzeichnen von geräucherten Lebensmitteln
US20070222556A1 (en) * 2005-05-17 2007-09-27 Robbins Gene A Tracking system for distributable objects which are marked in single laser shot events with dynamically variable images
US7622806B2 (en) * 2005-10-14 2009-11-24 Chipmos Technologies (Bermuda) Ltd. Laser mark on an IC component
JP5518612B2 (ja) * 2010-07-20 2014-06-11 株式会社ディスコ 光学装置およびこれを備えるレーザー加工装置
CN102442142A (zh) * 2010-09-30 2012-05-09 富泰华工业（深圳）有限公司 镭射雕刻机台
JP5896459B2 (ja) * 2012-03-06 2016-03-30 東レエンジニアリング株式会社 マーキング装置及び方法
KR101536983B1 (ko) * 2014-02-25 2015-07-15 삼목강업주식회사 스프링용 레이저 마킹 시스템
CN105619577B (zh) * 2015-12-31 2017-11-28 唐山市开平区雅风陶瓷厂 全自动陶瓷表面加工专用刻花装置
JP6334074B1 (ja) * 2017-05-23 2018-05-30 堺ディスプレイプロダクト株式会社 素子基板の製造方法およびレーザクリーニング装置
JP7083645B2 (ja) * 2018-01-11 2022-06-13 Ｊｓｗアクティナシステム株式会社 レーザ処理装置、レーザ処理方法及び半導体装置の製造方法
US11524360B2 (en) 2018-07-10 2022-12-13 Shutterfly, Llc Marking system for decorating workpieces

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5714981A (en) * 1980-06-30 1982-01-26 Hitachi Ltd Ink jet recording device
US4638144A (en) * 1985-04-24 1987-01-20 Automated Industrial Systems Indexing laser marker
AT389850B (de) * 1985-09-06 1990-02-12 Walter Sticht Druck- und beschriftungsverfahren fuer bauteile
US4818835A (en) * 1987-03-02 1989-04-04 Hitachi, Ltd. Laser marker and method of laser marking
JPH0215887A (ja) * 1988-06-30 1990-01-19 Toshiba Corp レーザマーキング装置
JP2775769B2 (ja) * 1988-10-04 1998-07-16 旭硝子株式会社 投射型アクティブマトリクス液晶表示装置及びその製造方法
JPH02187288A (ja) * 1989-01-11 1990-07-23 Hitachi Ltd レーザマーキングシステム
JP2810073B2 (ja) * 1989-01-11 1998-10-15 株式会社日立製作所 レーザマーキング方法
JP2633954B2 (ja) * 1989-04-10 1997-07-23 株式会社日立製作所 液晶式マーキング方法及びその装置
JPH02284786A (ja) * 1989-04-27 1990-11-22 Toshiba Corp レーザマーキング方法及びその装置
JP3126368B2 (ja) * 1990-06-22 2001-01-22 株式会社日立製作所 画像縮小拡大投影装置
US5132510A (en) * 1990-09-04 1992-07-21 Trumpf, Inc. Laser machine assembly for flow of workpieces therethrough and method of using same
JPH04169416A (ja) * 1990-10-31 1992-06-17 Yamazaki Mazak Corp アンロードステーション
EP0483652A1 (fr) * 1990-10-31 1992-05-06 Yamazaki Mazak Kabushiki Kaisha Station d'usinage au laser
TW225050B (fr) * 1990-11-30 1994-06-11 Hitachi Ltd
JPH0498384U (fr) * 1991-01-08 1992-08-25
JPH04339581A (ja) * 1991-05-16 1992-11-26 Nec Corp レーザマーキング装置
JP2701183B2 (ja) * 1991-08-09 1998-01-21 株式会社小松製作所 液晶マスク式レーザマーカ
JPH05313085A (ja) * 1992-05-08 1993-11-26 Komatsu Ltd 走査装置

Also Published As

Publication number Publication date
GB2290495B (en) 1996-08-28
WO1994016858A1 (fr) 1994-08-04
GB2290495A (en) 1996-01-03
GB9515713D0 (en) 1995-10-04
TW245844B (fr) 1995-04-21
US5821497A (en) 1998-10-13

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