TW245844B - - Google Patents
Info
- Publication number
- TW245844B TW245844B TW083100433A TW83100433A TW245844B TW 245844 B TW245844 B TW 245844B TW 083100433 A TW083100433 A TW 083100433A TW 83100433 A TW83100433 A TW 83100433A TW 245844 B TW245844 B TW 245844B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03441893A JP3246786B2 (ja) | 1993-01-29 | 1993-01-29 | レーザマーキングシステム |
JP5034419A JP2729451B2 (ja) | 1993-01-29 | 1993-01-29 | レーザマーキング方法および装置 |
PCT/JP1994/000069 WO1994016858A1 (en) | 1993-01-29 | 1994-01-20 | Laser marking system and method |
Publications (1)
Publication Number | Publication Date |
---|---|
TW245844B true TW245844B (zh) | 1995-04-21 |
Family
ID=26373231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083100433A TW245844B (zh) | 1993-01-29 | 1994-01-19 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5821497A (zh) |
GB (1) | GB2290495B (zh) |
SG (1) | SG47455A1 (zh) |
TW (1) | TW245844B (zh) |
WO (1) | WO1994016858A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI580505B (zh) * | 2012-03-06 | 2017-05-01 | Toray Engineering Company Limited | Marking device and method |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3265553B2 (ja) * | 1994-08-19 | 2002-03-11 | 株式会社小松製作所 | レーザマーキング方法 |
JP2860765B2 (ja) * | 1995-03-07 | 1999-02-24 | 株式会社小松製作所 | レーザ刻印装置の制御装置 |
US5937270A (en) | 1996-01-24 | 1999-08-10 | Micron Electronics, Inc. | Method of efficiently laser marking singulated semiconductor devices |
US6172328B1 (en) * | 1998-02-17 | 2001-01-09 | Advanced Foliar Technologies, Inc. | Laser marking of plant material |
US6180914B1 (en) * | 1998-02-17 | 2001-01-30 | Advanced Foliar Technologies, Inc. | Laser marking of foliage and cigars |
US6774340B1 (en) * | 1998-11-25 | 2004-08-10 | Komatsu Limited | Shape of microdot mark formed by laser beam and microdot marking method |
US6262388B1 (en) | 1998-12-21 | 2001-07-17 | Micron Electronics, Inc. | Laser marking station with enclosure and method of operation |
US6417484B1 (en) | 1998-12-21 | 2002-07-09 | Micron Electronics, Inc. | Laser marking system for dice carried in trays and method of operation |
EP1140420B1 (en) | 1999-01-11 | 2003-10-01 | Amada Company, Limited | Sheet working systems and method of transferring worpiece in one of the machines |
ES2154237B1 (es) * | 1999-08-06 | 2001-10-01 | Consejo Superior Investigacion | Modificacion total o parcial de superficies ceramicas, sin variar sus caracteristicas funcionales, mediante radiacion laser. |
US6331691B1 (en) | 1999-09-20 | 2001-12-18 | Automated Laser Corporation | Precision guiding apparatus for laser marking system |
WO2001054854A1 (en) * | 2000-01-28 | 2001-08-02 | Gsi Lumonics, Inc. | Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
US20030024913A1 (en) * | 2002-04-15 | 2003-02-06 | Downes Joseph P. | Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
JP2001212797A (ja) * | 2000-02-03 | 2001-08-07 | Canon Inc | 露光装置およびレーザ加工方法 |
US6528760B1 (en) | 2000-07-14 | 2003-03-04 | Micron Technology, Inc. | Apparatus and method using rotational indexing for laser marking IC packages carried in trays |
EP1267340A3 (en) * | 2001-06-11 | 2006-12-06 | Pioneer Corporation | Information recording apparatus and method for recording information and information recording medium |
US7169685B2 (en) | 2002-02-25 | 2007-01-30 | Micron Technology, Inc. | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |
KR101125678B1 (ko) * | 2004-02-06 | 2012-03-28 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | 개선된 이미지화 조성물 및 방법 |
US7270932B2 (en) * | 2004-02-06 | 2007-09-18 | Rohm And Haas Electronic Materials Llc | Imaging composition and method |
US7977026B2 (en) | 2004-02-06 | 2011-07-12 | Rohm And Haas Electronic Materials Llc | Imaging methods |
US20050175941A1 (en) | 2004-02-06 | 2005-08-11 | Rohm And Hass Electronic Materials, L.L.C. | Imaging composition and method |
US7144676B2 (en) * | 2004-02-06 | 2006-12-05 | Rohm And Haas Electronic Materials Llc | Imaging compositions and methods |
DE102005000953A1 (de) * | 2004-06-09 | 2005-12-29 | Eberhard Wiedenmann | Verfahren zum Kennzeichnen von geräucherten Lebensmitteln |
US20070222556A1 (en) * | 2005-05-17 | 2007-09-27 | Robbins Gene A | Tracking system for distributable objects which are marked in single laser shot events with dynamically variable images |
US7622806B2 (en) * | 2005-10-14 | 2009-11-24 | Chipmos Technologies (Bermuda) Ltd. | Laser mark on an IC component |
JP5518612B2 (ja) * | 2010-07-20 | 2014-06-11 | 株式会社ディスコ | 光学装置およびこれを備えるレーザー加工装置 |
CN102442142A (zh) * | 2010-09-30 | 2012-05-09 | 富泰华工业(深圳)有限公司 | 镭射雕刻机台 |
KR101536983B1 (ko) * | 2014-02-25 | 2015-07-15 | 삼목강업주식회사 | 스프링용 레이저 마킹 시스템 |
CN105619577B (zh) * | 2015-12-31 | 2017-11-28 | 唐山市开平区雅风陶瓷厂 | 全自动陶瓷表面加工专用刻花装置 |
JP6334074B1 (ja) * | 2017-05-23 | 2018-05-30 | 堺ディスプレイプロダクト株式会社 | 素子基板の製造方法およびレーザクリーニング装置 |
JP7083645B2 (ja) * | 2018-01-11 | 2022-06-13 | Jswアクティナシステム株式会社 | レーザ処理装置、レーザ処理方法及び半導体装置の製造方法 |
US11524360B2 (en) | 2018-07-10 | 2022-12-13 | Shutterfly, Llc | Marking system for decorating workpieces |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5714981A (en) * | 1980-06-30 | 1982-01-26 | Hitachi Ltd | Ink jet recording device |
US4638144A (en) * | 1985-04-24 | 1987-01-20 | Automated Industrial Systems | Indexing laser marker |
AT389850B (de) * | 1985-09-06 | 1990-02-12 | Walter Sticht | Druck- und beschriftungsverfahren fuer bauteile |
US4818835A (en) * | 1987-03-02 | 1989-04-04 | Hitachi, Ltd. | Laser marker and method of laser marking |
JPH0215887A (ja) * | 1988-06-30 | 1990-01-19 | Toshiba Corp | レーザマーキング装置 |
JP2775769B2 (ja) * | 1988-10-04 | 1998-07-16 | 旭硝子株式会社 | 投射型アクティブマトリクス液晶表示装置及びその製造方法 |
JP2810073B2 (ja) * | 1989-01-11 | 1998-10-15 | 株式会社日立製作所 | レーザマーキング方法 |
JPH02187288A (ja) * | 1989-01-11 | 1990-07-23 | Hitachi Ltd | レーザマーキングシステム |
JP2633954B2 (ja) * | 1989-04-10 | 1997-07-23 | 株式会社日立製作所 | 液晶式マーキング方法及びその装置 |
JPH02284786A (ja) * | 1989-04-27 | 1990-11-22 | Toshiba Corp | レーザマーキング方法及びその装置 |
JP3126368B2 (ja) * | 1990-06-22 | 2001-01-22 | 株式会社日立製作所 | 画像縮小拡大投影装置 |
US5132510A (en) * | 1990-09-04 | 1992-07-21 | Trumpf, Inc. | Laser machine assembly for flow of workpieces therethrough and method of using same |
EP0483652A1 (en) * | 1990-10-31 | 1992-05-06 | Yamazaki Mazak Kabushiki Kaisha | Laser machining cell |
JPH04169416A (ja) * | 1990-10-31 | 1992-06-17 | Yamazaki Mazak Corp | アンロードステーション |
TW225050B (zh) * | 1990-11-30 | 1994-06-11 | Hitachi Ltd | |
JPH0498384U (zh) * | 1991-01-08 | 1992-08-25 | ||
JPH04339581A (ja) * | 1991-05-16 | 1992-11-26 | Nec Corp | レーザマーキング装置 |
JP2701183B2 (ja) * | 1991-08-09 | 1998-01-21 | 株式会社小松製作所 | 液晶マスク式レーザマーカ |
JPH05313085A (ja) * | 1992-05-08 | 1993-11-26 | Komatsu Ltd | 走査装置 |
-
1994
- 1994-01-19 TW TW083100433A patent/TW245844B/zh active
- 1994-01-20 WO PCT/JP1994/000069 patent/WO1994016858A1/ja active Application Filing
- 1994-01-20 SG SG1996001813A patent/SG47455A1/en unknown
- 1994-01-20 US US08/495,451 patent/US5821497A/en not_active Expired - Fee Related
- 1994-01-20 GB GB9515713A patent/GB2290495B/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI580505B (zh) * | 2012-03-06 | 2017-05-01 | Toray Engineering Company Limited | Marking device and method |
Also Published As
Publication number | Publication date |
---|---|
WO1994016858A1 (en) | 1994-08-04 |
GB9515713D0 (en) | 1995-10-04 |
GB2290495A (en) | 1996-01-03 |
SG47455A1 (en) | 1998-04-17 |
GB2290495B (en) | 1996-08-28 |
US5821497A (en) | 1998-10-13 |