SG44362A1 - Chip carrier with protective coating for ciruitized surface - Google Patents

Chip carrier with protective coating for ciruitized surface

Info

Publication number
SG44362A1
SG44362A1 SG1995002312A SG1995002312A SG44362A1 SG 44362 A1 SG44362 A1 SG 44362A1 SG 1995002312 A SG1995002312 A SG 1995002312A SG 1995002312 A SG1995002312 A SG 1995002312A SG 44362 A1 SG44362 A1 SG 44362A1
Authority
SG
Singapore
Prior art keywords
encapsulant
chip carrier
composition
ciruitized
protective coating
Prior art date
Application number
SG1995002312A
Other languages
English (en)
Inventor
Brenda Diane Frey
Charles Arnold Joseph
Francis John Olshefski
James Warren Wilson
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of SG44362A1 publication Critical patent/SG44362A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Paints Or Removers (AREA)
  • Dicing (AREA)
SG1995002312A 1992-07-06 1993-07-01 Chip carrier with protective coating for ciruitized surface SG44362A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/909,368 US5249101A (en) 1992-07-06 1992-07-06 Chip carrier with protective coating for circuitized surface

Publications (1)

Publication Number Publication Date
SG44362A1 true SG44362A1 (en) 1997-12-19

Family

ID=25427125

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1995002312A SG44362A1 (en) 1992-07-06 1993-07-01 Chip carrier with protective coating for ciruitized surface

Country Status (12)

Country Link
US (1) US5249101A (enFirst)
EP (1) EP0578307B1 (enFirst)
JP (1) JP2501287B2 (enFirst)
KR (1) KR960015924B1 (enFirst)
CN (1) CN1028937C (enFirst)
AT (1) ATE143529T1 (enFirst)
CA (1) CA2091910C (enFirst)
DE (1) DE69305012T2 (enFirst)
ES (1) ES2092216T3 (enFirst)
MY (1) MY108750A (enFirst)
SG (1) SG44362A1 (enFirst)
TW (1) TW230272B (enFirst)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04291948A (ja) * 1991-03-20 1992-10-16 Fujitsu Ltd 半導体装置及びその製造方法及び放熱フィン
JPH0538479U (ja) * 1991-10-25 1993-05-25 曙ブレーキ工業株式会社 ブレーキ制御機構の電磁弁装置
US5288944A (en) * 1992-02-18 1994-02-22 International Business Machines, Inc. Pinned ceramic chip carrier
US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
KR100280762B1 (ko) * 1992-11-03 2001-03-02 비센트 비.인그라시아 노출 후부를 갖는 열적 강화된 반도체 장치 및 그 제조방법
US5403783A (en) * 1992-12-28 1995-04-04 Hitachi, Ltd. Integrated circuit substrate with cooling accelerator substrate
US5379187A (en) * 1993-03-25 1995-01-03 Vlsi Technology, Inc. Design for encapsulation of thermally enhanced integrated circuits
US5539545A (en) * 1993-05-18 1996-07-23 Semiconductor Energy Laboratory Co., Ltd. Method of making LCD in which resin columns are cured and the liquid crystal is reoriented
JPH0722722A (ja) * 1993-07-05 1995-01-24 Mitsubishi Electric Corp 樹脂成形タイプの電子回路装置
US5410806A (en) * 1993-09-15 1995-05-02 Lsi Logic Corporation Method for fabricating conductive epoxy grid array semiconductors packages
US5506756A (en) * 1994-01-25 1996-04-09 Intel Corporation Tape BGA package die-up/die down
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US6232152B1 (en) 1994-05-19 2001-05-15 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US6359335B1 (en) 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5706174A (en) 1994-07-07 1998-01-06 Tessera, Inc. Compliant microelectrionic mounting device
US5688716A (en) * 1994-07-07 1997-11-18 Tessera, Inc. Fan-out semiconductor chip assembly
MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
JPH0846098A (ja) * 1994-07-22 1996-02-16 Internatl Business Mach Corp <Ibm> 直接的熱伝導路を形成する装置および方法
US6169328B1 (en) 1994-09-20 2001-01-02 Tessera, Inc Semiconductor chip assembly
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
US5659952A (en) * 1994-09-20 1997-08-26 Tessera, Inc. Method of fabricating compliant interface for semiconductor chip
US6870272B2 (en) * 1994-09-20 2005-03-22 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US5757620A (en) * 1994-12-05 1998-05-26 International Business Machines Corporation Apparatus for cooling of chips using blind holes with customized depth
US5604978A (en) * 1994-12-05 1997-02-25 International Business Machines Corporation Method for cooling of chips using a plurality of materials
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor
GB9502178D0 (en) * 1995-02-03 1995-03-22 Plessey Semiconductors Ltd MCM-D Assemblies
US5798909A (en) * 1995-02-15 1998-08-25 International Business Machines Corporation Single-tiered organic chip carriers for wire bond-type chips
US6284563B1 (en) * 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
US6211572B1 (en) * 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US5744383A (en) * 1995-11-17 1998-04-28 Altera Corporation Integrated circuit package fabrication method
US6404049B1 (en) 1995-11-28 2002-06-11 Hitachi, Ltd. Semiconductor device, manufacturing method thereof and mounting board
US6007349A (en) * 1996-01-04 1999-12-28 Tessera, Inc. Flexible contact post and post socket and associated methods therefor
US5977629A (en) 1996-01-24 1999-11-02 Micron Technology, Inc. Condensed memory matrix
JP3527350B2 (ja) * 1996-02-01 2004-05-17 株式会社ルネサステクノロジ 半導体装置
US5851311A (en) * 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
US5700723A (en) * 1996-05-15 1997-12-23 Lsi Logic Corporation Method of packaging an integrated circuit
US5895976A (en) * 1996-06-03 1999-04-20 Motorola Corporation Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same
US6686015B2 (en) 1996-12-13 2004-02-03 Tessera, Inc. Transferable resilient element for packaging of a semiconductor chip and method therefor
US5891753A (en) 1997-01-24 1999-04-06 Micron Technology, Inc. Method and apparatus for packaging flip chip bare die on printed circuit boards
US5798563A (en) * 1997-01-28 1998-08-25 International Business Machines Corporation Polytetrafluoroethylene thin film chip carrier
US6639155B1 (en) 1997-06-11 2003-10-28 International Business Machines Corporation High performance packaging platform and method of making same
US6403882B1 (en) * 1997-06-30 2002-06-11 International Business Machines Corporation Protective cover plate for flip chip assembly backside
US6038136A (en) * 1997-10-29 2000-03-14 Hestia Technologies, Inc. Chip package with molded underfill
US6495083B2 (en) 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
US6324069B1 (en) 1997-10-29 2001-11-27 Hestia Technologies, Inc. Chip package with molded underfill
US5969947A (en) 1997-12-17 1999-10-19 International Business Machines Corporation Integral design features for heatsink attach for electronic packages
JP3017485B2 (ja) * 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
US6224711B1 (en) 1998-08-25 2001-05-01 International Business Machines Corporation Assembly process for flip chip package having a low stress chip and resulting structure
US6117797A (en) 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6008074A (en) 1998-10-01 1999-12-28 Micron Technology, Inc. Method of forming a synchronous-link dynamic random access memory edge-mounted device
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
US20020014688A1 (en) * 1999-03-03 2002-02-07 Suresh Ramalingam Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials
US6507101B1 (en) * 1999-03-26 2003-01-14 Hewlett-Packard Company Lossy RF shield for integrated circuits
US6077766A (en) * 1999-06-25 2000-06-20 International Business Machines Corporation Variable thickness pads on a substrate surface
KR100672130B1 (ko) * 1999-07-08 2007-01-19 산스타 기켄 가부시키가이샤 반도체 패키지용 언더필링 재료
US6426545B1 (en) * 2000-02-10 2002-07-30 Epic Technologies, Inc. Integrated circuit structures and methods employing a low modulus high elongation photodielectric
US6570259B2 (en) 2001-03-22 2003-05-27 International Business Machines Corporation Apparatus to reduce thermal fatigue stress on flip chip solder connections
US6974765B2 (en) * 2001-09-27 2005-12-13 Intel Corporation Encapsulation of pin solder for maintaining accuracy in pin position
US20050049334A1 (en) * 2003-09-03 2005-03-03 Slawomir Rubinsztain Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications
JP2006518944A (ja) * 2003-02-25 2006-08-17 テッセラ，インコーポレイテッド バンプを有するボールグリッドアレー
JP5593018B2 (ja) * 2005-02-25 2014-09-17 テッセラ，インコーポレイテッド コンプライアンスを有する超小型電子アセンブリ
DE102005029407B4 (de) * 2005-06-24 2008-06-19 Mühlbauer Ag Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat
US7749886B2 (en) 2006-12-20 2010-07-06 Tessera, Inc. Microelectronic assemblies having compliancy and methods therefor
US8710618B2 (en) 2007-03-12 2014-04-29 Honeywell International Inc. Fibrous laminate interface for security coatings
TW201025467A (en) * 2008-12-25 2010-07-01 United Test Ct Inc Ball implantation method and ball implantation system applying the method
JP6386746B2 (ja) * 2014-02-26 2018-09-05 株式会社ジェイデバイス 半導体装置
JP7358857B2 (ja) * 2019-09-04 2023-10-11 富士通株式会社 電子ユニット、電子ユニットの製造方法及び電子機器

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0088050B1 (de) * 1982-02-26 1986-09-03 Ciba-Geigy Ag Photohärtbare gefärbte Massen
US4633573A (en) * 1982-10-12 1987-01-06 Aegis, Inc. Microcircuit package and sealing method
JPS6032807A (ja) * 1983-07-30 1985-02-20 Matsushita Electric Works Ltd 光硬化型樹脂組成物
EP0138754B1 (de) * 1983-08-15 1988-05-25 Ciba-Geigy Ag Photohärtbare Gemische
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
US4806574A (en) * 1985-07-22 1989-02-21 Desoto, Inc. Ultraviolet curable coatings for optical glass fiber based on a polyfunctional core
JP2568421B2 (ja) * 1987-03-24 1997-01-08 株式会社スリーボンド 嫌気硬化性接着シール剤組成物
US5039715A (en) * 1987-04-13 1991-08-13 Dymax Corporation Photocurable acrylate adhesive containing perester/tautomeric acid adhesion promoter
DE3881382T2 (de) * 1988-03-29 1994-01-20 Agency Ind Science Techn Halbleiterchip, verbunden mit einem Substrat.
US4973611A (en) * 1988-04-04 1990-11-27 Uvexs Incorporated Optical fiber buffer coating with Tg
EP0340492A3 (en) * 1988-05-02 1990-07-04 International Business Machines Corporation Conformal sealing and interplanar encapsulation of electronic device structures
US4915167A (en) * 1988-08-05 1990-04-10 Westinghouse Electric Corp. Thermal coupling to enhance heat transfer
JPH0269945A (ja) * 1988-09-05 1990-03-08 Hitachi Ltd 半導体装置及びその製造方法
US5053357A (en) * 1989-12-27 1991-10-01 Motorola, Inc. Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon
US5121190A (en) * 1990-03-14 1992-06-09 International Business Machines Corp. Solder interconnection structure on organic substrates
US5089440A (en) * 1990-03-14 1992-02-18 International Business Machines Corporation Solder interconnection structure and process for making
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
JP2843658B2 (ja) * 1990-08-02 1999-01-06 東レ・ダウコーニング・シリコーン株式会社 フリップチップ型半導体装置
US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5173764A (en) * 1991-04-08 1992-12-22 Motorola, Inc. Semiconductor device having a particular lid means and encapsulant to reduce die stress

Also Published As

Publication number Publication date
KR960015924B1 (ko) 1996-11-23
ATE143529T1 (de) 1996-10-15
MY108750A (en) 1996-11-30
ES2092216T3 (es) 1996-11-16
CN1081787A (zh) 1994-02-09
DE69305012T2 (de) 1997-04-03
EP0578307A2 (en) 1994-01-12
JPH0697309A (ja) 1994-04-08
DE69305012D1 (de) 1996-10-31
EP0578307B1 (en) 1996-09-25
CN1028937C (zh) 1995-06-14
TW230272B (enFirst) 1994-09-11
CA2091910A1 (en) 1994-01-07
KR940002031A (ko) 1994-02-16
JP2501287B2 (ja) 1996-05-29
US5249101A (en) 1993-09-28
CA2091910C (en) 1996-07-30
EP0578307A3 (en) 1994-08-24

Similar Documents

Publication Publication Date Title
EP0578307A3 (en) Chip carrier with protective coating for circuitized surface
MY112247A (en) Chip carrier with protective coating for circuitized surface
MY131396A (en) Semiconductor device with bumps
MY123847A (en) Flip chip attach on flexible circuit carrier using chip with metallic cap on solder
MY117421A (en) Integral design features for heatsink attach for electronic packages
EP0536682A3 (en) Semi-conductor device, method of fabrication and device used for the fabrication
EP0400023A4 (en) Semiconductor package
EP1041628A3 (en) An image sensor ball grid array package and the fabrication thereof
EP0964445A3 (en) Stress reduction for flip chip package
KR940004788A (ko) 기밀 밀봉된 집적회로
EP0967647A3 (en) Method of sealing a surface mount package type semiconductor device
EP0248314A3 (en) Soldering of electronic components
WO1997012386A3 (de) Optoelektronisches halbleiter-bauelement
MY141640A (en) Polytetrafluoroethylene thin film chip carrier
EP0395072A3 (en) Bonding pad used in semiconductor device
SG48840A1 (en) Semiconductor device with small die pad and method of making same
EP0331245A3 (en) Integrated circuit chip package and method
SG52281A1 (en) A data carrier having an integrated circuit
EP0286690A4 (en) ALUMINUM NITRIDE SINTER AND SEMICONDUCTOR SUBSTRATE MADE THEREOF.
HK101497A (en) Semi-conductor device and method of producing the same
US20050112795A1 (en) Novel encapsulation method for SBGA
KR940004786A (ko) 집적회로의 기밀 밀봉방법
EP0335603A3 (en) A fabrication method and structure for field isolation in field effect transistors on integrated circuit chips
JPS6444051A (en) Semiconductor device
JPS56167333A (en) Semiconductor device