SG52281A1 - A data carrier having an integrated circuit - Google Patents
A data carrier having an integrated circuitInfo
- Publication number
- SG52281A1 SG52281A1 SG1996001953A SG1996001953A SG52281A1 SG 52281 A1 SG52281 A1 SG 52281A1 SG 1996001953 A SG1996001953 A SG 1996001953A SG 1996001953 A SG1996001953 A SG 1996001953A SG 52281 A1 SG52281 A1 SG 52281A1
- Authority
- SG
- Singapore
- Prior art keywords
- integrated circuit
- carrier element
- adhesive layer
- data carrier
- carrier
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Abstract
The invention relates to a data carrier (1) with integrated circuit (5) and describes a method for producing data carriers. The data carrier (1) has the form of a card in which an appropriately shaped two-step recess (3) is provided for installing the carrier element (11). The carrier element (11) consists of a substrate (8) on which the integrated circuit is arranged. As protection against mechanical loading, at least the integrated circuit (5) is surrounded by a casting compound (10), for example a casting resin. The carrier element (11) is bonded to the card body by means of a thermally activatable adhesive layer (7) under the action of heat and pressure. The adhesive layer (7) is provided with an opening (19) which is dimensioned in such a manner that when the carrier element (11) is bonded to the card body (1), the casting compound (10) is at least partially covered by the adhesive layer in its edge region. <IMAGE>
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4040770A DE4040770C2 (en) | 1990-12-19 | 1990-12-19 | Data carrier with integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
SG52281A1 true SG52281A1 (en) | 1998-09-28 |
Family
ID=6420778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996001953A SG52281A1 (en) | 1990-12-19 | 1991-12-17 | A data carrier having an integrated circuit |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0493738B1 (en) |
JP (1) | JP3248932B2 (en) |
AT (1) | ATE155270T1 (en) |
DE (2) | DE4040770C2 (en) |
ES (1) | ES2106048T3 (en) |
SG (1) | SG52281A1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4122049A1 (en) * | 1991-07-03 | 1993-01-07 | Gao Ges Automation Org | METHOD FOR INSTALLING A CARRIER ELEMENT |
DE4340847A1 (en) * | 1993-11-26 | 1995-06-01 | Optosys Gmbh Berlin | Chip module with chip on substrate material |
DE4344297A1 (en) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Process for the production of identity cards |
DE9422424U1 (en) * | 1994-02-04 | 2002-02-21 | Giesecke & Devrient Gmbh | Chip card with an electronic module |
DE4427802C1 (en) * | 1994-08-05 | 1995-10-26 | Beiersdorf Ag | Heat-activated adhesive film for prodn. of data carrying security cards |
DE19502398A1 (en) * | 1995-01-26 | 1996-08-01 | Giesecke & Devrient Gmbh | Method for mounting an electronic module in a card body |
DE19519499B4 (en) | 1995-05-27 | 2005-05-25 | Tesa Ag | Thermoplastic adhesive film and its use |
AT1470U1 (en) * | 1995-08-01 | 1997-05-26 | Austria Card | LAMINATED CARD AND METHOD FOR THEIR PRODUCTION |
KR100480522B1 (en) * | 1995-08-01 | 2005-08-31 | 오스트리아 카드 플라스틱카르텐 운트 아우스바이스시스템게젤샤프트 엠베하 | Data carrier having a module including a component and having a coil, and method of manufacturing such a data carrier |
GB2309933B (en) * | 1996-02-12 | 2000-02-23 | Plessey Telecomm | Contact card |
JPH09315061A (en) * | 1996-06-03 | 1997-12-09 | Minolta Co Ltd | Ic card and ic card-mounting apparatus |
FR2791035B1 (en) * | 1999-03-19 | 2001-07-27 | Allibert Equipement | PROCESS FOR PACKAGING AN ELECTRONIC LABEL, CORRESPONDING PLASTIC LABEL AND PIECE |
DE19929912A1 (en) * | 1999-06-29 | 2001-01-18 | Orga Kartensysteme Gmbh | Carrier element for an IC chip |
ATE261846T1 (en) * | 1999-12-31 | 2004-04-15 | Allibert Equipement | METHOD FOR PRODUCING AN ELECTRONIC LABEL AND THE CORRESPONDING CHIP CARD |
FR2845805B1 (en) * | 2002-10-10 | 2005-06-03 | Gemplus Card Int | SHUTTERING ADHESIVE FORMING SHUTTLE |
DE10357837B4 (en) * | 2003-12-09 | 2013-08-08 | Sennheiser Electronic Gmbh & Co. Kg | Method for surface mounting of acoustic transducers |
DE102012001346A1 (en) | 2012-01-24 | 2013-07-25 | Giesecke & Devrient Gmbh | Method for producing a data carrier |
GB2607113A (en) * | 2021-05-21 | 2022-11-30 | Zwipe As | Manufacturing a smartcard |
WO2022243432A1 (en) * | 2021-05-21 | 2022-11-24 | Zwipe As | Manufacturing a smartcard |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3151408C1 (en) * | 1981-12-24 | 1983-06-01 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | ID card with an IC module |
JPS58116496A (en) * | 1981-12-29 | 1983-07-11 | Nippon Kayaku Co Ltd | Amide n-substituted bleomycins |
DE3248385A1 (en) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | ID CARD WITH INTEGRATED CIRCUIT |
FR2580416B1 (en) * | 1985-04-12 | 1987-06-05 | Radiotechnique Compelec | METHOD AND DEVICE FOR MANUFACTURING AN ELECTRONIC IDENTIFICATION CARD |
DE3639630A1 (en) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME |
DE3723547C2 (en) * | 1987-07-16 | 1996-09-26 | Gao Ges Automation Org | Carrier element for installation in ID cards |
FR2629236B1 (en) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | PROCESS FOR REALIZING AN ELECTRONIC MEMORY CARD AND CARD AS OBTAINED BY IMPLEMENTING SAID METHOD |
-
1990
- 1990-12-19 DE DE4040770A patent/DE4040770C2/en not_active Expired - Fee Related
-
1991
- 1991-12-16 JP JP33221091A patent/JP3248932B2/en not_active Expired - Fee Related
- 1991-12-17 SG SG1996001953A patent/SG52281A1/en unknown
- 1991-12-17 DE DE59108771T patent/DE59108771D1/en not_active Expired - Lifetime
- 1991-12-17 EP EP91121612A patent/EP0493738B1/en not_active Expired - Lifetime
- 1991-12-17 AT AT91121612T patent/ATE155270T1/en not_active IP Right Cessation
- 1991-12-17 ES ES91121612T patent/ES2106048T3/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE4040770C2 (en) | 1999-11-11 |
ES2106048T3 (en) | 1997-11-01 |
JP3248932B2 (en) | 2002-01-21 |
EP0493738A1 (en) | 1992-07-08 |
EP0493738B1 (en) | 1997-07-09 |
ATE155270T1 (en) | 1997-07-15 |
DE4040770A1 (en) | 1992-06-25 |
DE59108771D1 (en) | 1997-08-14 |
JPH04314598A (en) | 1992-11-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG52281A1 (en) | A data carrier having an integrated circuit | |
HK54295A (en) | Support for inclusion into identity cards. | |
ES2092216T3 (en) | CHIP SUPPORT WITH PROTECTIVE LAYER FOR CIRCUIT SURFACE. | |
HK1007015A1 (en) | Card with at least one electronic element and process for manufacturing said card | |
EP1394734A4 (en) | Ic card | |
EP0654819A3 (en) | Heat dissipation device and associated fabrication process. | |
EP0723244A3 (en) | Record carrier with an electronic module | |
EP0865082A4 (en) | Semiconductor device, process for producing the same, and packaged substrate | |
US5965937A (en) | Thermal interface attach mechanism for electrical packages | |
KR960001604B1 (en) | Semiconductor device with an encapsulation package | |
SG66292A1 (en) | A method for incorporating a carrier element | |
MY119389A (en) | Silicone bonding agent for optical memory element optical memory element, and method for manufacturing optical memory element | |
MXPA93003941A (en) | Component module. | |
PT724228E (en) | METHOD FOR MOUNTING AN ELECTRONIC MODULE IN THE BODY OF A CARD | |
DE3473972D1 (en) | Semiconductor device comprising a substrate | |
EP0408768A4 (en) | Chip carrier | |
IT1213140B (en) | INTEGRATED ELECTRONIC COMPONENT FOR SURFACE ASSEMBLY. | |
AU7006394A (en) | An integrated circuit card | |
KR950006836Y1 (en) | Semiconductor package | |
IT1202453B (en) | PACKAGING FOR POWER COMPONENTS | |
JPS644029A (en) | Semiconductor device | |
JPS645895A (en) | Tape carrier | |
FR2795200B1 (en) | ELECTRONIC DEVICE COMPRISING AT LEAST ONE CHIP FIXED ON A SUPPORT AND METHOD FOR MANUFACTURING SUCH A DEVICE | |
JPS6449246A (en) | Semiconductor device | |
Martens | Multi-Wire Printed Circuit With Mixed IC and Chip Carrier Mounting |