DE4427802C1 - Heat-activated adhesive film for prodn. of data carrying security cards - Google Patents

Heat-activated adhesive film for prodn. of data carrying security cards

Info

Publication number
DE4427802C1
DE4427802C1 DE4427802A DE4427802A DE4427802C1 DE 4427802 C1 DE4427802 C1 DE 4427802C1 DE 4427802 A DE4427802 A DE 4427802A DE 4427802 A DE4427802 A DE 4427802A DE 4427802 C1 DE4427802 C1 DE 4427802C1
Authority
DE
Germany
Prior art keywords
adhesive film
thermo
film according
activatable adhesive
activatable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4427802A
Other languages
German (de)
Inventor
Hans-Karl Engeldinger
Hartwig Poppelbaum
Matthias Samson-Himmelstjerna
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beiersdorf AG
Original Assignee
Beiersdorf AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beiersdorf AG filed Critical Beiersdorf AG
Priority to DE4427802A priority Critical patent/DE4427802C1/en
Application granted granted Critical
Publication of DE4427802C1 publication Critical patent/DE4427802C1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G06K19/041Constructional details
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2409/00Presence of diene rubber

Abstract

Heat activated adhesive film for prodn. of a data carrier with an opening in a card body in which a carrier element is to be situated that consists of a substrate having a first side with several contact surfaces and a second side opposite the first carrying an integrated circuit (IC) device whose contact points are connected to the contact surfaces by electrical conductors, the adhesive layer being used for bonding the second side of the carrier element to the card body of the data carrier, whereby the adhesive film consists of nitrile rubber/phenolic resin, has a thickness of 25-35 (30) micrometers, and is heat activatable by hot pressing at reduced temps., esp. below 120 (90-100) deg.

Description

Die Erfindung betrifft eine thermoaktive Klebefolie zur Herstellung eines Datenträgers mit einer Aussparung in dessen Kartenkörper, in der ein Trägerelement anzuordnen ist. The invention relates to a thermoactive adhesive film for producing a data carrier a recess in the card body in which a carrier element is to be arranged.  

Datenträger mit integriertem Schaltkreis sind bekannt und weit verbreitet, als Telefonkarten, Identifikationskarten etc. Darin können die Trägerelemente (Module) in dafür im Kartenkörper vorgesehene Ausnehmungen, mit herkömmlichen Lösungsmittel-Klebern eingeklebt sein.Data carriers with an integrated circuit are known and widely used as phone cards, identification cards etc. The support elements (modules) can be used in the Card body provided recesses, with conventional Solvent glue must be glued in.

Es gibt aber auch bereits Datenträger, in die die Trägerele­ mente mittels thermoaktivierbarer Kleberschichten eingeklebt werden, wie EP-A 299.530 und EP-A 334.733. Und schließlich ist aus EP-A 493.738 ein Datenträger mit integriertem Schaltkreis bekannt, in welchem das Trägerelement mittels einer thermoaktivierbaren Klebeschicht mit dem Kartenkörper verbunden wird, wobei zusätzlich eine Gußmasse zum Schutz des integrierten Schaltkreises vor mechanischen Belastungen verwendet wird.However, there are also data carriers into which the carrier elements can be found elements glued in with thermally activated adhesive layers such as EP-A 299.530 and EP-A 334.733. And finally is a data carrier with integrated from EP-A 493.738 Known circuit in which the carrier element by means of a thermally activated adhesive layer with the card body is connected, in addition a casting compound for protection of the integrated circuit against mechanical loads is used.

Die bekannten Datenträger und deren Herstellung weisen jedoch für die Praxis bedeutsame Nachteile auf. The known data carriers and their manufacture show however, significant disadvantages in practice.  

So können mit herkömmlichen Klebern hergestellte Datenträger nur mit relativ langsamen Taktzeiten bearbeitet werden, was bei den großen Stückzahlen eine gravierende Begrenzung ist und zudem eine automatisierte Verfahrensweise erschwert. Aber auch die thermoaktivierbare Klebeschicht, die in Form einer Klebfolie eingesetzt wird, zeigt bei der praktischen Anwendung ihre Grenzen. Denn derartige Produkte, die als etwa 70 µm starke Klebfolien im Handel sind, verlangen eine Mindesttemperatur beim Heißverpressen von 120°C, um zu einer verläßlichen Verklebung zu führen. Bei einer derartigen, wenn auch nur kurzzeitigen Temperaturbeanspruchung werden die aus Kunststoff gefertigten Datenträger aber leicht beschädigt. Ferner treten im Boden der Datenträger Verfor­ mungen auf, die ihre spätere reibungslose Verwendung beein­ trächtigen können, z. B. bei Bank-Karten.So data carriers made with conventional adhesives can only be processed with relatively slow cycle times is a serious limitation for large quantities and also complicates an automated procedure. But also the thermally activated adhesive layer, which is in shape an adhesive film is used, shows in the practical Applying their limits. Because such products that as 70 µm thick adhesive films are commercially available, require one Minimum temperature during hot pressing of 120 ° C to become one to perform reliable bonding. With such a even if only be briefly exposed to temperature the data carriers made of plastic are light damaged. Furthermore Verfor occur in the bottom of the disk that affect their later smooth use can be pregnant, e.g. B. with bank cards.

Aufgabe der Erfindung war es, hier Abhilfe zu schaffen, insbesondere die thermoaktivierbare Klebefolie so auszugestalten, daß sie eine schnellere Herstellung der Datenträger bei geringeren Temperaturen ermöglicht.The object of the invention was to remedy this, in particular the thermo-activatable To design adhesive film so that it faster production of the disk allows lower temperatures.

Demgemäß betrifft die Erfindung eine thermoaktivierbare Klebefolie zur Herstellung eines Datenträgers, wie sie in den Patentansprüchen näher gekennzeichnet ist.Accordingly, the invention relates to a thermally activated adhesive film for producing a Data carrier, as it is characterized in the claims.

Die erfindungsgemäß erzielten Vorteile liegen insbesondere darin, daß eine geringere Verformung der Rückseite der Datenträger erfolgt und daß höhere Taktzeiten aufgrund einer schnelleren Aktivierung erzielt werden. Zudem wird es damit möglich, die Gesamtdicke des Moduls zu reduzieren, was bei den modernen Datenträgern ein beachtlicher Vorteil ist und die Frästiefe für die Aufnahme des IC-Bausteins zu verrin­ gern und damit einer Verformung des Datenträger-Bodens aufgrund einer Temperatur-Beanspruchung vorzubeugen. All dies wird erzielt bei zugleich höheren Festigkeitswerten für die Verklebung. Für Datenträger sind Testmodelle im Einsatz, bei denen aufgrund von vielfach wiederholtem Biegen geprüft wird, ob und wann Beschädigungen auftreten, insbesondere an der Verklebung des Moduls. Und trotz der geringeren Klebfo­ liendicke, wie sie erfindungsgemäß eingesetzt wird, stellt sich heraus, daß die Verklebung standfester ist als dies mit bisher bekannten Mitteln erreichbar war.The advantages achieved according to the invention are in particular in that less deformation of the back of the Data carrier takes place and that higher cycle times due to a  faster activation can be achieved. In addition, it will possible to reduce the overall thickness of the module, which at is a considerable advantage to modern data carriers and to reduce the milling depth for the mounting of the IC module gladly and thus a deformation of the disk bottom to prevent due to temperature stress. All this is achieved with higher strength values for the  Bonding. Test models are used for data carriers, at those tested due to repeated bending will determine whether and when damage occurs, in particular gluing the module. And despite the lower adhesive Line thickness, as used according to the invention out that the bond is more stable than this with previously known means was achievable.

Im folgenden soll die Erfindung beispielhaft beschrieben werden.The invention is described below by way of example become.

Beispielexample

In einem leistungsfähigen Schnellrührwerk werden 1,065 kg Zinkoxyd mit 0,960 kg Vinylchlorid-Polymerisat und 12,0 kg Butanon gut gemischt und in einen Kneter vorgelegt. Es werden 21,98 kg Nitrilkautschuk, weitere 20 kg Butanon und 4,32 kg Phenolharz unter Kneten zugegeben, gefolgt von weiteren 4,0 kg Butanon und 19,2 kg Phenolharz (gepulvert, Occidental Chem.). Es wird gut geknetet, und schließlich werden weitere 44,2 kg Butanon zur Endverdünnung in 3 Portionen zugegeben.In a powerful high-speed agitator, 1.065 kg Zinc oxide with 0.960 kg vinyl chloride polymer and 12.0 kg butanone well mixed and in one Kneader submitted. There are 21.98 kg of nitrile rubber, another 20 kg butanone and 4.32 kg Phenolic resin added with kneading, followed by another 4.0 kg butanone and 19.2 kg phenolic resin (powdered, Occidental Chem.). It is kneaded well, and finally another 44.2 kg of butanone are used for final dilution added in 3 portions.

Die Masse wird mittels Streichbalken auf ein siliconisiertes Trennpapier ausgestrichen und zu einer Klebfolie von 30 µm getrocknet.The mass is siliconized using a coating bar Spread the release paper and form an adhesive film of 30 µm dried.

Wie in EP-A 493.738 beschrieben, werden Stanzlinge dieser Folie zum Verkleben von Trägerelementen in Datenträger ein­ gesetzt. Der Klebeverbund wird heiß verpreßt derart, daß der Stanzling der Klebfolie auf eine Temperatur von 100°C aufge­ heizt wird. Die erhaltenen Datenträger sind ohne Ausschuß und weisen einen hochfesten und dauerhaften Verbund auf.As described in EP-A 493.738, die cuts become these Film for gluing carrier elements into data carriers set. The adhesive bond is hot pressed in such a way that the Die cut the adhesive film to a temperature of 100 ° C is heated. The data media received are without rejects and have a high-strength and durable bond.

Claims (8)

1. Thermoaktivierbare Klebefolie zur Herstellung eines Datenträgers mit einer Aussparung in dessen Kartenkörper, in der ein Trägerelement anzuordnen ist, welches aus einem Substrat besteht, das eine erste Seite mit mehreren Kontaktflächen und eine der ersten Seite gegenüberliegende zweite Seite mit einem lC-Baustein aufweist, dessen Anschlußpunkte über elektrische Leiter mit den Kontaktflächen verbunden sind, wobei die Klebeschicht zur Verbindung der zweiten Seite des Trägerelementes mit dem Kartenkörper des Datenträgers dient, dadurch gekennzeichnet, daß die Klebefolie
  • - aus Nitrilkautschuk/-Phenolharz besteht,
  • - eine Dicke von 25 bis 35 µm aufweist und
  • - durch Heißverpressen bei reduzierten Temperaturen thermoaktivierbar ist.
1. Thermo-activatable adhesive film for producing a data carrier with a recess in its card body, in which a carrier element is to be arranged, which consists of a substrate that has a first side with a plurality of contact surfaces and a second side opposite the first side with an IC module, whose connection points are connected via electrical conductors to the contact surfaces, the adhesive layer serving to connect the second side of the carrier element to the card body of the data carrier, characterized in that the adhesive film
  • - consists of nitrile rubber / phenolic resin,
  • - Has a thickness of 25 to 35 microns and
  • - Can be thermoactivated by hot pressing at reduced temperatures.
2. Thermoaktivierbare Klebefolie nach Anspruch 1, dadurch gekennzeichnet, daß die Klebfolie eine Dicke von 30 µm hat.2. Thermo-activatable adhesive film according to claim 1, characterized in that the adhesive film has a thickness of 30 µm. 3. Thermoaktivierbare Klebefolie nach Anspruch 1, dadurch gekennzeichnet, daß das Heißverpressen bei Temperaturen von unter 120°C, insbe­ sondere bei 90-100°C erfolgt. 3. Thermo-activatable adhesive film according to claim 1, characterized in that hot pressing at temperatures below 120 ° C, especially especially at 90-100 ° C.   4. Thermoaktivierbare Klebefolie nach Anspruch 1, dadurch gekennzeichnet, daß die Klebfolie etwa gleiche Teile Nitrilkautschuk und Phenol­ harz enthält.4. Thermo-activatable adhesive film according to claim 1, characterized in that the adhesive film about equal parts of nitrile rubber and phenol contains resin. 5. Thermoaktivierbare Klebefolie nach Anspruch 1, dadurch gekennzeichnet, daß die Klebfolie neben Nitrilkautschuk und Phenolharz weitere übliche Zusatzstoffe enthält.5. Thermo-activatable adhesive film according to claim 1, characterized in that the adhesive film in addition to nitrile rubber and phenolic resin Contains usual additives. 6. Thermoaktivierbare Klebefolie nach Anspruch 1, dadurch gekennzeichnet, daß der IC-Baustein von einer Gußmasse umgeben ist und die Kleb­ folie mit einer Öffnung versehen ist, die derart bemessen und zum Trägerelement positioniert ist, daß sie die Gußmasse zumindest in den Randbereichen teilweise überdeckt.6. Thermo-activatable adhesive film according to claim 1, characterized in that the IC chip is surrounded by a casting compound and the adhesive film is provided with an opening which is dimensioned in this way and positioned to the support member that it the casting mass partially covered at least in the peripheral areas. 7. Thermoaktivierbare Klebefolie nach Anspruch 1, dadurch gekennzeichnet, daß die Klebfolie die gleichen Maße wie das Substrat hat.7. thermo-activatable adhesive film according to claim 1, characterized in that the adhesive film has the same dimensions as the substrate. 8. Thermoaktivierbare Klebefolie nach Anspruch 1, dadurch gekennzeichnet, daß die Klebfolie einen an ihren Außenrand führenden Kanal aufweist.8. Thermo-activatable adhesive film according to claim 1, characterized in that the adhesive film has a channel leading to its outer edge having.
DE4427802A 1994-08-05 1994-08-05 Heat-activated adhesive film for prodn. of data carrying security cards Expired - Fee Related DE4427802C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4427802A DE4427802C1 (en) 1994-08-05 1994-08-05 Heat-activated adhesive film for prodn. of data carrying security cards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4427802A DE4427802C1 (en) 1994-08-05 1994-08-05 Heat-activated adhesive film for prodn. of data carrying security cards

Publications (1)

Publication Number Publication Date
DE4427802C1 true DE4427802C1 (en) 1995-10-26

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Family Applications (1)

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DE4427802A Expired - Fee Related DE4427802C1 (en) 1994-08-05 1994-08-05 Heat-activated adhesive film for prodn. of data carrying security cards

Country Status (1)

Country Link
DE (1) DE4427802C1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1078965A2 (en) * 1999-08-25 2001-02-28 Lohmann GmbH & Co. KG Thermally activatable adhesive foil and process of structural bonding
WO2004094550A1 (en) * 2003-04-10 2004-11-04 3M Innovative Properties Company Heat-activatable adhesive
DE102007022140A1 (en) 2007-05-11 2008-11-13 L + L Maschinenbau Gmbh & Co. Kg Base body made of polyurethane for bedding body, base bedding or filler, has adhesive coating provided at exterior as protective layer, which is added to mold before production of base body
DE102009025641A1 (en) 2009-06-17 2010-12-23 Tesa Se Use of heat-activated adhesive tapes for the bonding of flexible printed circuit boards

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0299530A1 (en) * 1987-07-16 1989-01-18 GAO Gesellschaft für Automation und Organisation mbH Support for inclusion into identity cards
EP0334733A1 (en) * 1988-03-22 1989-09-27 Schlumberger Industries Manufacturing process of an electronic memory card and card obtained by such process
EP0493738A1 (en) * 1990-12-19 1992-07-08 GAO Gesellschaft für Automation und Organisation mbH Record carrier with integrated circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0299530A1 (en) * 1987-07-16 1989-01-18 GAO Gesellschaft für Automation und Organisation mbH Support for inclusion into identity cards
EP0334733A1 (en) * 1988-03-22 1989-09-27 Schlumberger Industries Manufacturing process of an electronic memory card and card obtained by such process
EP0493738A1 (en) * 1990-12-19 1992-07-08 GAO Gesellschaft für Automation und Organisation mbH Record carrier with integrated circuit

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1078965A2 (en) * 1999-08-25 2001-02-28 Lohmann GmbH & Co. KG Thermally activatable adhesive foil and process of structural bonding
EP1078965A3 (en) * 1999-08-25 2001-04-18 Lohmann GmbH & Co. KG Thermally activatable adhesive foil and process of structural bonding
WO2004094550A1 (en) * 2003-04-10 2004-11-04 3M Innovative Properties Company Heat-activatable adhesive
US7695804B2 (en) 2003-04-10 2010-04-13 3M Innovative Properties Company Heat-activatable adhesive
DE102007022140A1 (en) 2007-05-11 2008-11-13 L + L Maschinenbau Gmbh & Co. Kg Base body made of polyurethane for bedding body, base bedding or filler, has adhesive coating provided at exterior as protective layer, which is added to mold before production of base body
DE102009025641A1 (en) 2009-06-17 2010-12-23 Tesa Se Use of heat-activated adhesive tapes for the bonding of flexible printed circuit boards

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