EP1123535A1 - Hot-melt adhesive component layers for smart cards - Google Patents

Hot-melt adhesive component layers for smart cards

Info

Publication number
EP1123535A1
EP1123535A1 EP99953800A EP99953800A EP1123535A1 EP 1123535 A1 EP1123535 A1 EP 1123535A1 EP 99953800 A EP99953800 A EP 99953800A EP 99953800 A EP99953800 A EP 99953800A EP 1123535 A1 EP1123535 A1 EP 1123535A1
Authority
EP
European Patent Office
Prior art keywords
hot melt
production
smart cards
melt adhesive
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99953800A
Other languages
German (de)
French (fr)
Inventor
Liane WÜSTRICH
Paul Ranft
Jürgen GRÜTZNER
Uwe Kolb
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of EP1123535A1 publication Critical patent/EP1123535A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0097—Glues or adhesives, e.g. hot melts or thermofusible adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a multilayer composite body, a process for its production and the use of thermoplastic hot melt adhesives for the production of this composite body.
  • a smart card is generally understood to mean a multi-layered shaped body in the form of a plastic card, which is usually imprinted with information and / or advertising and / or with security features, such as, for. B. a photo of the cardholder, a magnetic strip, an identification mark in the form of a hologram or the like.
  • This smart card usually consists of a plastic card laminated on one or both sides.
  • a so-called module is embedded in the card body of the smart card, the essential component of which is an electronic circuit (chip). This chip can sit on a carrier plate which, in a specific embodiment, is provided with a plurality of electrically conductive surface segments.
  • This segmented electrical contact surface is accessible from the outside, so that information such.
  • B. data and identification features can be exchanged via these contacts with external computers and / or control devices.
  • Newer card types contain an antenna electrically connected to the chip in the card body, so that both electronic information exchange and the energy supply of the chip in the card carrier can take place without contact via this antenna.
  • Smart cards of this type are used or provided as telephone cards, authorization cards for mobile messaging devices, check cards in monetary transactions, authorization certificates for health insurance companies, driver's licenses, train or bus tickets. The user pushes the contactless smart card into a card reader or passes it at some distance past the reader, which connects to the electronic circuit in the smart card via a corresponding antenna device. In this way, e.g. B. with a telephone card or a check card or a train ticket, an existing cash balance can be checked, an identity can be determined or another data exchange can be carried out.
  • WO-A-98/09252 describes a multi-stage manufacturing process.
  • the so-called component layer or card body is provided with openings, depressions or the like. Cavities, then the electronic components to be arranged in the card body are inserted into these cavities, then the card body is coated with an adhesive such that the cavities are filled and the adhesive forms a substantially flat surface.
  • a cover film is then applied to the surface of the adhesive that has not yet set or hardened and is therefore still plastically deformable.
  • the cover film is then held with its surface facing away from the card body on a shaped surface in such a way and for as long during the curing of the adhesive that the outer contour of the cover film and thus the outer contour of the finished smart card corresponds to the contour of the molding surface.
  • a cold-curable adhesive in particular an epoxy adhesive, is proposed as the adhesive.
  • this adhesive In order to prevent this adhesive from shrinking, it must be filled with a filling material such as glass, quartz or the like. This manufacturing process involves many work steps and is time-consuming and therefore very cost-intensive.
  • EP-A-0 692 770 describes a method in which the chip and the antenna are introduced into the cavity of an injection mold, whereupon a thermoplastic material is injected into this mold, optionally in several steps.
  • Typical thermoplastic material such as. B. PVC, ABS (acrylonitrile-butadiene-styrene terpolymer), polyethylene terephthalate (PET), polycarbonate (PC) or polyamide (PA) are proposed.
  • Such injection molding materials require very high temperatures and high pressures of z. B. 700 kg / cm 2 . Such high pressures and temperatures are, however, very poorly suited for the sensitive electronic circuits to be embedded, so that they are often damaged.
  • EP-A-0 709 804 proposes, in a multi-stage injection molding process, first to insert a plastic disc into the injection mold on which the antenna is placed. Then a liquid plastic material (specifically ABS, PC, PET, polyamide or reactive resins curable at higher temperatures such as polyurethane, epoxy-phenolic resins are distributed over the surface of the antenna, leaving the antenna connections free. A plastic layer is then placed over the antenna, which the Hole in the card closes This plastic layer has a recess in which the electronic chip is inserted so that it the antenna connections are in electrical contact. This procedure also requires high temperatures and high pressures for the injection molding steps, in addition, further work steps are required to insert the electronic circuit into the card body, to fasten it and to electrically connect it to the antenna.
  • a liquid plastic material specifically ABS, PC, PET, polyamide or reactive resins curable at higher temperatures such as polyurethane, epoxy-phenolic resins are distributed over the surface of the antenna, leaving the antenna connections free.
  • a plastic layer is then placed over the antenna
  • JP-A-08 276 459 describes a manufacturing method for contactless smart cards, in which the component carrier consists of a glass fiber reinforced epoxy resin which has a recess and optionally contains conductor tracks, also for forming the antenna.
  • the electronic chip is inserted into the recess of the component layer.
  • This entire component is then placed in an injection mold and, after closing, a liquid, thermosetting plastic material is injected into the mold at low pressure and cured there.
  • a thermosetting epoxy resin is specifically proposed for this purpose. It takes 4 to 5 minutes to cure the epoxy resin. After removing the casting from the casting mold, post-curing by heating to a certain temperature and for a certain time is necessary. No specific information is given about this post-curing.
  • EP-A-0 350 179 describes a manufacturing process for smart cards and similar electronic brands (token) using a reaction injection molding process.
  • the electronic circuit is encapsulated by a layer formed by the reaction injection molding material.
  • the cover foils of the two flat sides of the card are fed to the mold during the injection molding in such a way that they simultaneously serve as mold release agents for easier removal of the hardened card body from the injection mold.
  • Specific information about the Settlement of the plastic for the reaction injection molding process are not made, it is only said that any plastic material or plastic mixture can be used that will cure under reaction injection molding conditions.
  • Reaction injection molding machines are known to be expensive and complex because of the precise metering devices involved.
  • EP-A-0 846 743 describes a thermoplastic, thermosetting, self-adhesive adhesive film for implanting electrical modules into a card body, which is provided with a recess into which an electronic module is to be placed, which has a plurality of contact surfaces on the first side and on the opposite side has an IC chip, the connection points of which are connected to the contact surfaces via electrical conductors.
  • the adhesive film should be made up of a thermoplastic polymer, one or more tackifying resins and / or epoxy resins with hardeners and possibly also accelerators. These adhesive films must be cured in the heat at about 150 ° C for 30 minutes.
  • JP-A-05 270 173 describes a method for producing laminated plastic sheets for card blanks.
  • two rigid PVC rigid films are coated with a moisture-curing polyurethane hot-melt adhesive with a 5 to 50 ⁇ m thick layer at 100 to 120 ° C. and pressed for 10 seconds under a pressure of 5 kg / cm 2 .
  • One of these foils has a recess or a cavity created by thermoforming for receiving the microprocessor to be inserted later. These fabrics are then left without pressing for several hours at room temperature so that the Adhesive cures to form a card base material that can be processed into the finished smart card in further processing steps.
  • thermoplastic hot melt adhesives for the production of the component layers of smart cards and in a process for the production of these smart cards in which the thermoplastic hot melt adhesives can be used at low temperatures and low pressures in the low pressure injection molding process.
  • thermoplastic hot-melt adhesives used are preferably the low-melting polyamides based on polyaminoamides, thermoplastic polyurethanes or atactic polypropylene or a mixture thereof for the production of the component layer.
  • These thermoplastic hot melt adhesives are characterized by a low viscosity of around 100 to 100,000 mPa.s at the processing temperature. As a result, they can be used in the low-pressure injection molding process at pressures between 1 and 50 bar, preferably at injection pressures between 10 and 30 bar.
  • the processing temperatures depend on the composition of the hot melt adhesive material, they are between 80 ° C and 250 ° C, preferably between 100 ° C and 230 ° C.
  • the preferred polyamides to be used usually have a viscosity below 10,000 mPa.s. at 210 ° C. Particularly preferred areas Before the processing viscosities at 210 ° C are between 1,500 and 4,000 mPa.s, this viscosity is usually measured with a Brookfield viscometer of the "RVDV II" type with thermo equipment.
  • reactive, moisture-crosslinking polyurethane hotmelt adhesives can also be used. Because of their sensitivity to moisture, the moisture-reactive polyurethane hotmelt adhesives require more effort during application, but their advantage lies in the significantly lower viscosity at the processing temperatures; reactive polyurethane hotmelt adhesives generally have viscosities of ⁇ 25,000 mPa.s at 130 ° C, preferably these viscosities are even below 15,000 mPa.s and very particularly preferably below 10,000 mPa.s at 130 ° C., the viscosity usually being measured using a Brookfield viscometer of the "RVDV II" type with thermoset equipment.
  • An advantage of the use of moisture-curing polyurethane hotmelt adhesives is their low melting point, which is usually below 100 ° C, preferably below 70 to 80 ° C, so that even very temperature sensitive circuits can be embedded with these hot melt adhesives and also very temperature sensitive laminating films v can be used. Through their post-crosslinking with moisture, a particularly resistant and temperature-resistant bond is created between the component layer and the base and cover films.
  • thermoplastic hot-melt adhesive By using the thermoplastic hot-melt adhesive to produce the component layer, the subsequent milling out of the space required for receiving the chip or chip and Antenna can be saved because these parts to be poured can be inserted into the corresponding casting mold before the base body is finished.
  • the chip or chip and antenna are enclosed by the base body (component carrier) so produced that an additional fixation is unnecessary and any necessary padding or filling of the electronic components no longer has to be carried out subsequently.
  • thermoplastic reactive and non-reactive hot melt adhesives can be used for the production of the card base body, as long as they can be processed at processing temperatures between 80 ° C and 250 ° C, preferably between 100 ° C and 230 ° C in the low pressure injection molding process, i.e. their processing viscosity should be between 100 and 100,000 mPa.s.
  • the pressure range for the low-pressure injection molding process is in the range from 1 to 50 bar, a range for the injection molding between 10 and 30 bar is particularly preferred. This ensures that the inserted chips or otherwise used electronic storage media are gently rinsed and cannot be damaged and destroyed by high injection pressures (500 to> 1000 bar) as in the regular injection molding process.
  • the hot melt adhesives can be made from the groups known per se: polyamide (especially polyaminoamide based on dimerized fatty acids), polyurethane, polyester , Ethylene-vinyl acetate (EVA) copolymer, low molecular weight polyethylene copolymer, atactic polypropylene (APP) or combinations thereof.
  • EVA Ethylene-vinyl acetate copolymer
  • APP atactic polypropylene
  • All of the films known in principle for this purpose can be used as the base or cover film, for example films based on polyester, in particular polyethylene terephthalate (PET), polyvinyl chloride (PVC), acrylonitrile-butadiene-styrene (ABS), polycarbonate (PC) ) or polyimide.
  • PET polyethylene terephthalate
  • PVC polyvinyl chloride
  • ABS acrylonitrile-butadiene-styrene
  • PC polycarbonate
  • These foils usually have material thicknesses of up to 100 ⁇ m, the foil thicknesses are preferably in the range between 30 and 70 ⁇ m.
  • the manufacturing process according to the invention can be carried out in various ways.
  • the chip and, if applicable, the associated antenna can first be inserted into the mold of the injection molding system. B. present on a carrier film. After closing the mold, the hot melt adhesive is then injected. After briefly cooling, the mold can be opened and the component layer thus produced can be removed from the mold.
  • a thin film of the hot melt adhesive can be inserted into the injection mold, the electronic component and the antenna can be placed thereon. The mold is then closed and the electronic components are completely encased by injecting further hot-melt adhesive material.
  • the films can be pressed with the component layer and are thus permanently connected to the layer.
  • the layer thickness of the hot-melt adhesive matrix including the cast-in chip is generally between 400 and 600, preferably 500 ⁇ m, but can be thinner or thicker depending on the chip type.
  • a low-pressure processing system from Optimel Schmelzgußtechnik can be used to embed the electronic component and the antenna in the matrix of the card carrier layer made of the hot-melt adhesive.
  • the preferred embodiment of the injection mold is shown in Figures 1 to 3. The shows
  • Fig. 1 is a plan view of the lower part of the injection mold
  • Fig. 2 is a side view of the upper part of the injection mold
  • Fig. 3 is a detailed view of the upper part.
  • the lower part 1 of the injection mold has a recess 2, the length and width of which correspond to the dimensions of the upper part of the injection mold.
  • the lower part of the injection mold contains the injection channel 3, which is designed so that the hot melt adhesive can fill the entire mold completely and without bubbles in the shortest possible cycle times.
  • the shape of the injection channel is designed so that the sprue remaining on the card body can be easily removed after the card body has solidified.
  • Fig. 2 shows a cross-sectional view of the upper part 4 of the injection mold on the section line AB of Fig. 1.
  • this upper part In its upper edge region, this upper part has a projection 5, so that when the upper part engages in the recess 2 of the lower part a completely closed space in the Injection mold is created.
  • the recess 6 of the upper part 4 corresponds in its length and width dimensions to the card carrier layer to be manufactured, the depth of the recess 6 corresponds to the thickness of the component layer to be manufactured.
  • FIG. 3 shows a detailed view C of FIG. 2, in which the recess 6 for the card carrier layer is shown in detail.
  • the base and top layer foils of the injection mold can be fed simultaneously with the chip and optionally with the antenna, which can optionally also be applied in a copper foil on a thin flexible film.
  • the hot melt adhesive is again injected.
  • the finished laminate can be transported further.
  • the base film and / or cover film can be produced in a preceding or subsequent production step with customary information and / or advertising imprints and / or security features such as.

Abstract

The invention relates to the utilization of thermoplastic hot melt adhesives for the production of component layers in smart cards or for the production of electronic transponders with the aid of a low pressure injection molding process at pressures ranging between 1 and 50 bar. Preferably, hot melt adhesives based on polyamide, polyurethane, polyester, atactic polypropylene, EVA copolymers or low molecular weight ethylene copolymers or the mixtures thereof are used in said method.

Description

"Komponentenschicht für Smart Cards aus Schmelzklebstoffen""Component layer for smart cards made of hot melt adhesives"
Die Erfindung betrifft einen mehrschichtigen Verbundkörper, ein Verfahren zu dessen Herstellung sowie die Verwendung von thermoplastischen Schmelzklebstoffen zur Herstellung dieses Verbundkörpers.The invention relates to a multilayer composite body, a process for its production and the use of thermoplastic hot melt adhesives for the production of this composite body.
Die vorliegende Erfindung befaßt sich überwiegend, aber nicht ausschließlich, mit der Herstellung von sog. Smart Cards. Unter einer Smart Card versteht man einen i. d. R. mehrschichtigen Formkörper in der Form einer Kunststoffkarte, die üblicherweise mit Hinweis- und/oder Werbeaufdrucken und/oder mit Sicherheitsmerkmalen, wie z. B. einem Foto des Karteninhabers, einem Magnetstreifen, einem Identifizierungszeichen in Form eines Hologramms oder dgl. versehen ist. Üblicherweise besteht diese Smart Card aus einer ein- oder doppelseitig kaschierten Kunststoffkarte. In den Kartenkörper der Smart Card ist ein sog. Modul eingebettet, dessen wesentlicher Bestandteil ein elektronischer Schaltkreis (Chip) ist. Dieser Chip kann auf einem Trägerplättchen sitzen, das in einer bestimmten Ausführungsform mit mehreren elektrisch leitfähigen Oberflächensegmenten versehen ist. Dabei ist diese segmentierte elektrische Kontaktfläche von außen zugänglich, so daß Informationen, z. B. Daten und Identifikationsmerkmale über diese Kontakte mit externen Rechnern und/oder Steuerungsgeräten ausgetauscht werden können. Neuere Kartenarten enthalten eine mit dem Chip elektrisch verbundene Antenne im Kartenkörper, so daß über diese Antenne sowohl der elektronische Informationsaustausch als auch die Energieversorgung des Chips im Kartenträger berührungslos erfolgen kann. Derartige Smart Cards werden als Telefonkarten, Berechtigungskarten für mobile Nachrichtengeräte, Scheckkarten im Geldverkehr, Berechtigungsnachweise für Krankenkassen, Führerscheine, Zug- bzw. Bustickets eingesetzt bzw. vorgesehen. Der Benutzer schiebt dabei die kontaktlose Smart Card in einen Kartenleser oder führt diese in einigem Abstand an dem Leser vorbei, der über eine entsprechende Antenneneinrichtung mit dem elektronischen Schaltkreis in der Smart Card in Verbindung tritt. Auf diese Weise kann z. B. bei einer Telefonkarte oder einer Scheckkarte oder einem Bahnticket ein vorhandenes Geldguthaben überprüft werden, eine Identität festgestellt werden oder ein sonstiger Datenaustausch vorgenommen werden.The present invention is primarily, but not exclusively, concerned with the production of so-called smart cards. A smart card is generally understood to mean a multi-layered shaped body in the form of a plastic card, which is usually imprinted with information and / or advertising and / or with security features, such as, for. B. a photo of the cardholder, a magnetic strip, an identification mark in the form of a hologram or the like. This smart card usually consists of a plastic card laminated on one or both sides. A so-called module is embedded in the card body of the smart card, the essential component of which is an electronic circuit (chip). This chip can sit on a carrier plate which, in a specific embodiment, is provided with a plurality of electrically conductive surface segments. This segmented electrical contact surface is accessible from the outside, so that information such. B. data and identification features can be exchanged via these contacts with external computers and / or control devices. Newer card types contain an antenna electrically connected to the chip in the card body, so that both electronic information exchange and the energy supply of the chip in the card carrier can take place without contact via this antenna. Smart cards of this type are used or provided as telephone cards, authorization cards for mobile messaging devices, check cards in monetary transactions, authorization certificates for health insurance companies, driver's licenses, train or bus tickets. The user pushes the contactless smart card into a card reader or passes it at some distance past the reader, which connects to the electronic circuit in the smart card via a corresponding antenna device. In this way, e.g. B. with a telephone card or a check card or a train ticket, an existing cash balance can be checked, an identity can be determined or another data exchange can be carried out.
Herstellverfahren für die kontaktlosen Smart Cards sind im Prinzip bekannt. So beschreibt die WO-A-98/09252 ein mehrstufiges Herstellverfahren. Dabei wird zunächst die sog. Komponentenschicht oder Kartenkörper mit Öffnungen, Einsenkungen oder dgl. Hohlräumen versehen, danach werden in diese Hohlräume die im Kartenkörper anzuordnenden elektronischen Bauteile eingesetzt, darauf wird der Kartenkörper mit einem Kleber derart beschichtet, daß die Hohlräume ausgefüllt sind und der Kleber eine im wesentlichen plane Oberfläche bildet. Anschließend wird eine Deckfolie auf die Oberfläche des noch nicht abgebundenen bzw. ausgehärteten und somit noch plastisch verformbaren Klebers aufgebracht. Die Deckfolie wird sodann mit ihrer dem Kartenkörper abgewandten Fläche auf einer Formfläche derart und so lange während des Aushärtens des Klebers fixiert gehalten, daß die Außenkontur der Deckfolie und damit die Außenkontur der fertigen Smart Card der Kontur der Formfläche entspricht. Als Kleber wird dabei ein kalt aushärtbarer Klebstoff, insbesondere ein Epoxidklebstoff, vorgeschlagen. Um die Schrumpfung dieses Klebstoffes zu verhindern, muß dieser mit einem Füllmaterial wie Glas, Quarz oder dgl. gefüllt sein. Dieses Herstellverfahren beinhaltet viele Arbeitsschritte und ist zeitaufwendig und damit sehr kostenintensiv.Manufacturing processes for contactless smart cards are known in principle. For example, WO-A-98/09252 describes a multi-stage manufacturing process. First, the so-called component layer or card body is provided with openings, depressions or the like. Cavities, then the electronic components to be arranged in the card body are inserted into these cavities, then the card body is coated with an adhesive such that the cavities are filled and the adhesive forms a substantially flat surface. A cover film is then applied to the surface of the adhesive that has not yet set or hardened and is therefore still plastically deformable. The cover film is then held with its surface facing away from the card body on a shaped surface in such a way and for as long during the curing of the adhesive that the outer contour of the cover film and thus the outer contour of the finished smart card corresponds to the contour of the molding surface. A cold-curable adhesive, in particular an epoxy adhesive, is proposed as the adhesive. In order to prevent this adhesive from shrinking, it must be filled with a filling material such as glass, quartz or the like. This manufacturing process involves many work steps and is time-consuming and therefore very cost-intensive.
Die EP-A-0 692 770 beschreibt ein Verfahren, bei dem der Chip und die Antenne in den Hohlraum einer Spritzgußform eingebracht werden, worauf ein thermoplastisches Material in diese Form, gegebenenfalls in mehreren Arbeitsschritten, eingespritzt wird. Als thermoplastisches Material werden typische Spritzgußmaterialien wie z. B. PVC, ABS (Acrylnitril-Butadien- Styrol-Terpolymer), Polyethylenterephthalat (PET), Polycarbonat (PC) oder Polyamid (PA) vorgeschlagen. Derartige Spritzgußmaterialien erfordern bei der Verarbeitung sehr hohe Temperaturen und hohe Drücke von z. B. 700 kg/cm2. Derartig hohe Drücke und Temperaturen sind jedoch für die einzubettenden empfindlichen elektronischen Schaltungen sehr schlecht geeignet, so daß diese häufig Schaden nehmen.EP-A-0 692 770 describes a method in which the chip and the antenna are introduced into the cavity of an injection mold, whereupon a thermoplastic material is injected into this mold, optionally in several steps. Typical thermoplastic material such as. B. PVC, ABS (acrylonitrile-butadiene-styrene terpolymer), polyethylene terephthalate (PET), polycarbonate (PC) or polyamide (PA) are proposed. Such injection molding materials require very high temperatures and high pressures of z. B. 700 kg / cm 2 . Such high pressures and temperatures are, however, very poorly suited for the sensitive electronic circuits to be embedded, so that they are often damaged.
Die EP-A-0 709 804 schlägt vor, in einem mehrstufigen Spritzgußverfahren zunächst eine Plastikscheibe in die Spritzgußform einzulegen, auf die die Antenne plaziert wird. Anschließend wird ein flüssiges Kunststoffmaterial (konkret genannt werden ABS, PC, PET, Polyamid oder bei höherer Temperatur härtbare Reaktivharze wie Polyurethan, Epoxy-Phenolharze über der Antennenoberfläche verteilt, wobei die Antennenanschlüsse freigelassen werden. Anschließend wird eine Kunststoffschicht über die Antenne gelegt, die das Loch in der Karte schließt. Diese Kunststoffschicht hat eine Vertiefung, in die der elektronische Chip so eingebracht wird, daß er mit den Antennenanschlüssen im elektrischen Kontakt steht. Auch diese Vorgehensweise erfordert hohe Temperaturen und hohe Drucke für die Spritzgußschritte, zusätzlich sind weitere Arbeitsschritte erforderlich, um den elektronischen Schaltkreis in den Kartenkörper einzusetzen, zu befestigen und elektrisch mit der Antenne zu verbinden.EP-A-0 709 804 proposes, in a multi-stage injection molding process, first to insert a plastic disc into the injection mold on which the antenna is placed. Then a liquid plastic material (specifically ABS, PC, PET, polyamide or reactive resins curable at higher temperatures such as polyurethane, epoxy-phenolic resins are distributed over the surface of the antenna, leaving the antenna connections free. A plastic layer is then placed over the antenna, which the Hole in the card closes This plastic layer has a recess in which the electronic chip is inserted so that it the antenna connections are in electrical contact. This procedure also requires high temperatures and high pressures for the injection molding steps, in addition, further work steps are required to insert the electronic circuit into the card body, to fasten it and to electrically connect it to the antenna.
Die JP-A-08 276 459 beschreibt ein Herstellungsverfahren für kontaktlose Smart Cards, bei dem der Komponententräger aus einem glasfaserverstärkten Epoxidharz besteht, der eine Vertiefung hat und gegebenenfalls Leiterbahnen, auch zur Ausbildung der Antenne, enthält. In die Vertiefung der Komponentenschicht wird der elektronische Chip eingebracht. Anschließend wird dieses gesamte Bauteile in eine Spritzgußform eingelegt und nach Schließen ein flüssiges, wärmehärtendes Kunststoffmaterial bei niederem Druck in das Werkzeug gespritzt und dort ausgehärtet. Konkret vorgeschlagen wird hierzu ein wärmehärtendes Epoxidharz. Zur Aushärtung des Epoxidharzes werden 4 bis 5 Minuten benötigt, nach der Entnahme des Gießlings aus der Gießform ist eine Nachhärtung durch Erwärmen auf eine bestimmte Temperatur und eine bestimmte Zeit notwendig, konkrete Angaben werden über diese Nachhärtung nicht gemacht.JP-A-08 276 459 describes a manufacturing method for contactless smart cards, in which the component carrier consists of a glass fiber reinforced epoxy resin which has a recess and optionally contains conductor tracks, also for forming the antenna. The electronic chip is inserted into the recess of the component layer. This entire component is then placed in an injection mold and, after closing, a liquid, thermosetting plastic material is injected into the mold at low pressure and cured there. A thermosetting epoxy resin is specifically proposed for this purpose. It takes 4 to 5 minutes to cure the epoxy resin. After removing the casting from the casting mold, post-curing by heating to a certain temperature and for a certain time is necessary. No specific information is given about this post-curing.
Die EP-A-0 350 179 beschreibt ein Herstellverfahren für Smart Cards und ähnliche elektronische Marken (token) mit Hilfe eines Reaktionsspritzgußverfahrens. Dabei wird der elektronische Schaltkreis durch eine durch das Reaktionsspritzguß-Material gebildete Schicht eingekapselt. Die Deckfolien der beiden flächigen Seiten der Karte werden dabei während des Spritzgießens so der Form zugeführt, daß sie gleichzeitig als Entfor- mungsmittel zur leichteren Entfernbarkeit des aushärteten Kartenkörpers aus der Spritzgußform dienen. Konkrete Angaben über die Zusammen- setzung des Kunststoffes für das Reaktionsspritzgußverfahren werden nicht gemacht, es wird nur gesagt, daß jedes Kunststoffmaterial oder jede Kunststoffmischung genommen werden kann, das die unter Reaktionsspritzgußbedingungen aushärten. Reaktionsspritzgußmaschinen sind bekanntlich wegen der damit verbundenen genauen Dosiereinrichtungen teuer und aufwendig.EP-A-0 350 179 describes a manufacturing process for smart cards and similar electronic brands (token) using a reaction injection molding process. The electronic circuit is encapsulated by a layer formed by the reaction injection molding material. The cover foils of the two flat sides of the card are fed to the mold during the injection molding in such a way that they simultaneously serve as mold release agents for easier removal of the hardened card body from the injection mold. Specific information about the Settlement of the plastic for the reaction injection molding process are not made, it is only said that any plastic material or plastic mixture can be used that will cure under reaction injection molding conditions. Reaction injection molding machines are known to be expensive and complex because of the precise metering devices involved.
Die EP-A-0 846 743 beschreibt eine thermoplastische hitzehärtbare selbstklebende Klebstoffolie zum Implantieren von elektrischen Modulen in einen Kartenkörper, der mit einer Aussparung versehen ist, in die ein elektronisches Modul einzuordnen ist, das auf der ersten Seite mehrere Kontaktflächen und auf der gegenüberliegenden Seite einen IC-Baustein aufweist, dessen Anschlußpunkte über elektrische Leiter mit den Kontaktflächen verbunden sind. Die Klebstoffolie soll dabei aus einem thermoplastischen Polymer, einem oder mehreren klebrigmachenden Harzen und/oder Epoxidharzen mit Härtern gegebenenfalls auch Beschleunigern aufgebaut sein. Diese Klebstoffolien müssen in der Hitze bei etwa 150°C für 30 Minuten ausgehärtet werden.EP-A-0 846 743 describes a thermoplastic, thermosetting, self-adhesive adhesive film for implanting electrical modules into a card body, which is provided with a recess into which an electronic module is to be placed, which has a plurality of contact surfaces on the first side and on the opposite side has an IC chip, the connection points of which are connected to the contact surfaces via electrical conductors. The adhesive film should be made up of a thermoplastic polymer, one or more tackifying resins and / or epoxy resins with hardeners and possibly also accelerators. These adhesive films must be cured in the heat at about 150 ° C for 30 minutes.
Die JP-A-05 270 173 beschreibt ein Verfahren zum Herstellen von laminierten Kunststoffflächengebilden für Kartenrohkörper. Dazu werden zwei steife PVC-Hartfolien mit einem feuchtigkeitshärtenden Polyurethanschmelzklebstoff mit einer 5 bis 50 μm starken Schicht bei 100 bis 120°C beschichtet und 10 Sekunden unter einem Druck von 5 kg/cm2 verpreßt. Eine dieser Folien weist dabei eine Aussparung oder einen durch Thermo- umformung erzeugten Hohlraum zur Aufnahme des später einzufügenden Mikroprozessors auf. Anschließend werden diese Flächengebilde ohne Pressung mehrere Stunden bei Raumtemperatur belassen, damit der Klebstoff aushärtet, um ein Kartenbasismaterial zu ergeben, das in weiteren Verarbeitungsschritten zur fertigen Smart Card verarbeitet werden kann.JP-A-05 270 173 describes a method for producing laminated plastic sheets for card blanks. For this purpose, two rigid PVC rigid films are coated with a moisture-curing polyurethane hot-melt adhesive with a 5 to 50 μm thick layer at 100 to 120 ° C. and pressed for 10 seconds under a pressure of 5 kg / cm 2 . One of these foils has a recess or a cavity created by thermoforming for receiving the microprocessor to be inserted later. These fabrics are then left without pressing for several hours at room temperature so that the Adhesive cures to form a card base material that can be processed into the finished smart card in further processing steps.
Es bestand also die Aufgabe, ein schonendes, schnelles und einfaches Verfahren zur Herstellung von Smart Cards zu entwickeln, das eine kostengünstige Großserienfertigung derartiger Smart Cards ermöglicht. Die erfindungsgemäße Lösung der Aufgabe ist den Ansprüchen zu entnehmen. Sie besteht im wesentlichen in der Verwendung von thermoplastischen Schmelzklebstoffen zur Herstellung der Komponentenschichten von Smart Cards sowie in einem Verfahren zur Herstellung dieser Smart Cards, bei dem die thermoplastischen Schmelzklebstoffe bei niedrigen Temperaturen und niedrigen Drucken im Niederdruck-Spritzgußverfahren eingesetzt werden können.The task was therefore to develop a gentle, quick and simple method for producing smart cards which enables inexpensive large-scale production of such smart cards. The achievement of the object according to the invention can be found in the claims. It consists essentially in the use of thermoplastic hot melt adhesives for the production of the component layers of smart cards and in a process for the production of these smart cards in which the thermoplastic hot melt adhesives can be used at low temperatures and low pressures in the low pressure injection molding process.
Vorzugsweise werden als thermoplastische Schmelzklebstoffe die niedrig- schmelzenden Polyamide auf der Basis von Polyaminoamiden, thermoplastischen Polyurethanen oder ataktischem Polypropylen oder deren Mischung zur Herstellung der Komponentenschicht eingesetzt. Diese thermoplastischen Schmelzklebstoffe zeichnen sich durch eine niedrige Viskosität von etwa 100 bis 100.000 mPa.s bei der Verarbeitungstemperatur aus. Dadurch können diese im Niederdruck-Spritzgußverfahren bei Drücken zwischen 1 und 50 bar, vorzugsweise bei Spritzdrücken zwischen 10 und 30 bar eingesetzt werden. Die Verarbeitungstemperaturen richten sich nach der Zusammensetzung des Schmelzklebstoffmaterials, sie liegen zwischen 80 °C und 250 °C, vorzugsweise zwischen 100 °C und 230 °C. Die vorzugsweise einzusetzenden Polyamide haben bei 210°C in der Regel eine Viskosität unterhalb von 10.000 mPa.s. Besonders bevorzugte Berei- ehe der Verarbeitungsviskositäten bei 210°C liegen zwischen 1.500 und 4.000 mPa.s, wobei diese Viskosität üblicherweise mit einem Brookfield- Viskosimeter vom Typ „RVDV II" mit Thermoseiausrüstung gemessen wird.The thermoplastic hot-melt adhesives used are preferably the low-melting polyamides based on polyaminoamides, thermoplastic polyurethanes or atactic polypropylene or a mixture thereof for the production of the component layer. These thermoplastic hot melt adhesives are characterized by a low viscosity of around 100 to 100,000 mPa.s at the processing temperature. As a result, they can be used in the low-pressure injection molding process at pressures between 1 and 50 bar, preferably at injection pressures between 10 and 30 bar. The processing temperatures depend on the composition of the hot melt adhesive material, they are between 80 ° C and 250 ° C, preferably between 100 ° C and 230 ° C. The preferred polyamides to be used usually have a viscosity below 10,000 mPa.s. at 210 ° C. Particularly preferred areas Before the processing viscosities at 210 ° C are between 1,500 and 4,000 mPa.s, this viscosity is usually measured with a Brookfield viscometer of the "RVDV II" type with thermo equipment.
In besonderen Fällen können anstelle der obengenannten thermoplastischen Schmelzklebstoffe auch reaktive, feuchtigkeitsnachvernetzende Polyurethanschmelzklebstoffe eingesetzt werden. Die feuchtigkeitsreaktiven Polyurethanschmelzklebstoffe erfordern zwar wegen ihrer Feuchtigkeitsempfindlichkeit während der Applikation einen erhöhten Aufwand, ihr Vorteil liegt jedoch in der deutlich niedrigeren Viskosität bei den Verarbeitungstemperaturen, reaktive Polyurethanschmelzklebstoffe haben bei 130°C in der Regel Viskositäten < 25.000 mPa.s, vorzugsweise liegen diese Viskositäten sogar unterhalb von 15.000 mPa.s und ganz besonders bevorzugt unterhalb von 10.000 mPa.s bei 130°C, wobei die Viskosität üblicherweise mit einem Brookfield-Viskosimeter vom Typ „RVDV II" mit Thermoseiausrüstung gemessen wird. Ein Vorteil der Verwendung von feuchtigkeitshärtenden Polyurethan-Schmelzklebstoffen ist ihr niedriger Schmelzpunkt, der in der Regel unterhalb von 100°C, vorzugsweise unterhalb von 70 bis 80°C liegt, so daß auch sehr temperaturempfindliche Schaltkreise mit diesen Schmelzklebstoffen eingebettet werden können und auch sehr temperaturempfindliche Laminierfolien verwendet werden können. Durch ihre Nachvernetzung mit Feuchtigkeit entsteht ein besonders widerstandsfähiger und temperaturbeständiger Verbund zwischen Komponentenschicht und Grund- und Deckfolie.In special cases, instead of the above-mentioned thermoplastic hotmelt adhesives, reactive, moisture-crosslinking polyurethane hotmelt adhesives can also be used. Because of their sensitivity to moisture, the moisture-reactive polyurethane hotmelt adhesives require more effort during application, but their advantage lies in the significantly lower viscosity at the processing temperatures; reactive polyurethane hotmelt adhesives generally have viscosities of <25,000 mPa.s at 130 ° C, preferably these viscosities are even below 15,000 mPa.s and very particularly preferably below 10,000 mPa.s at 130 ° C., the viscosity usually being measured using a Brookfield viscometer of the "RVDV II" type with thermoset equipment. An advantage of the use of moisture-curing polyurethane hotmelt adhesives is their low melting point, which is usually below 100 ° C, preferably below 70 to 80 ° C, so that even very temperature sensitive circuits can be embedded with these hot melt adhesives and also very temperature sensitive laminating films v can be used. Through their post-crosslinking with moisture, a particularly resistant and temperature-resistant bond is created between the component layer and the base and cover films.
Durch die Verwendung des thermoplastischen Schmelzklebstoffes zur Herstellung der Komponentenschicht kann das nachträgliche Herausfräsen des erforderlichen Platzes zur Aufnahme des Chips bzw. von Chip und Antenne eingespart werden, da diese einzugießenden Teile vor der Fertigstellung des Grundkörpers in die entsprechende Vergußform eingelegt werden können. Beim anschließend Vergußvorgang werden Chip oder Chip und Antenne durch den so hergestellten Grundkörper (Komponententräger) dermaßen umschlossen, daß sowohl eine zusätzliche Fixierung unnötig wird als auch eine eventuell notwendige Aufpolsterung bzw. Verfül- lung der elektronischen Komponenten nicht mehr nachträglich vorgenommen werden müssen. Es kann auch bei der Aufbringung der bedruckbaren oder bedruckten Grund- und Deckfolie auf einen zusätzlichen Klebstoffauftrag auf den Komponententräger verzichtet werden, da dieser ja selbst aus Klebstoff gefertigt ist und, gegebenenfalls nach geeigneter Aktivierung durch Erwärmung, eine sichere Verbindung zu den Grund- und/oder Deckfolien schafft.By using the thermoplastic hot-melt adhesive to produce the component layer, the subsequent milling out of the space required for receiving the chip or chip and Antenna can be saved because these parts to be poured can be inserted into the corresponding casting mold before the base body is finished. During the subsequent encapsulation process, the chip or chip and antenna are enclosed by the base body (component carrier) so produced that an additional fixation is unnecessary and any necessary padding or filling of the electronic components no longer has to be carried out subsequently. It is also possible to dispense with an additional adhesive application to the component carrier when applying the printable or printed base and cover film, since this is made of adhesive itself and, if necessary after suitable activation by heating, a secure connection to the base and / or creates cover foils.
Erfindungsgemäß lassen sich alle thermoplastischen reaktiven und nicht reaktiven Schmelzklebstoffe zur Herstellung des Kartengrundkörpers verwenden, solange sie bei Verarbeitungstemperaturen zwischen 80 °C und 250 °C, vorzugsweise zwischen 100 °C und 230 °C im Niederdruckspritzgußverfahren verarbeitbar sind, d. h. ihre Verarbeitungsviskosität soll zwischen 100 und 100.000 mPa.s liegen. Der Druckbereich für das Niederdruck-Spritzgußverfahren liegt im Bereich von 1 bis 50 bar, besonders bevorzugt ist ein Bereich für den Spritzguß zwischen 10 und 30 bar. Hierdurch wird gewährleistet, daß die eingelegten Chips oder sonst verwendeten elektronischen Speichermedien schonend umspült und nicht wie im regulären Spritzgußverfahren durch hohe Spritzdrücke (500 bis > 1000 bar) beschädigt und zerstört werden können. Je nach Art der verwendeten Grund- und Deckfolie für die fertige Karte und der Anforderungen an Steifheit bzw. Elastizität des Kartenkörpers sowie dessen möglicher Temperaturbelastungen können die Schmelzklebstoffe aus den an sich bekannten Gruppen Polyamid (speziell Polyaminoamid auf der Basis dimerisierter Fettsäuren), Polyurethan, Polyester, Ethylen- Vinylacetat-(EVA-)Copolymer, niedermolekulares Polyethyiencopolymer, ataktisches Polypropylen (APP) oder deren Kombinationen ausgewählt werden. Wie oben bereits erwähnt, kann es in besonderen Fällen günstig sein, anstelle der vorgenannten thermoplastischen Schmelzklebstoffe reaktive Schmelzklebstoffe auf der Basis von feuchtigkeitsnachvernetzenden Polyurethanen einzusetzen.According to the invention, all thermoplastic reactive and non-reactive hot melt adhesives can be used for the production of the card base body, as long as they can be processed at processing temperatures between 80 ° C and 250 ° C, preferably between 100 ° C and 230 ° C in the low pressure injection molding process, i.e. their processing viscosity should be between 100 and 100,000 mPa.s. The pressure range for the low-pressure injection molding process is in the range from 1 to 50 bar, a range for the injection molding between 10 and 30 bar is particularly preferred. This ensures that the inserted chips or otherwise used electronic storage media are gently rinsed and cannot be damaged and destroyed by high injection pressures (500 to> 1000 bar) as in the regular injection molding process. Depending on the type of base and cover film used for the finished card and the requirements for stiffness or elasticity of the card body and its possible temperature loads, the hot melt adhesives can be made from the groups known per se: polyamide (especially polyaminoamide based on dimerized fatty acids), polyurethane, polyester , Ethylene-vinyl acetate (EVA) copolymer, low molecular weight polyethylene copolymer, atactic polypropylene (APP) or combinations thereof. As already mentioned above, it can be advantageous in special cases to use reactive hot melt adhesives based on moisture-reticulating polyurethanes instead of the aforementioned thermoplastic hot melt adhesives.
Als Grund- bzw. Deckfolie können dabei alle hierfür im Prinzip bekannten Folien eingesetzt werden, beispielhaft erwähnt seien Folien auf der Basis von Polyester, insbesondere Polyethylenterephthalat (PET), Polyvinylchlorid (PVC), Acrylnitril-Butadien-Styrol (ABS), Polycarbonat (PC) oder Poly- imid. Diese Folien haben üblicherweise Materialstärken bis zu 100 μm, vorzugsweise liegen die Folienstärken im Bereich zwischen 30 und 70 μm.All of the films known in principle for this purpose can be used as the base or cover film, for example films based on polyester, in particular polyethylene terephthalate (PET), polyvinyl chloride (PVC), acrylonitrile-butadiene-styrene (ABS), polycarbonate (PC) ) or polyimide. These foils usually have material thicknesses of up to 100 μm, the foil thicknesses are preferably in the range between 30 and 70 μm.
Bei dem erfindungsgemäßen Herstellverfahren kann auf verschiedene Weisen vorgegangen werden. Zum einen kann der Chip und gegebenenfalls die zugehörige Antenne zunächst in die Gießform der Spritzgußanlage eingelegt werden, dabei können Chip und Antenne auch in vorkonfektionierter Form z. B. auf einer Trägerfolie vorliegen. Nach Schließen der Form wird dann der Schmelzklebstoff eingespritzt. Nach kurzem Erkalten kann die Form geöffnet werden und dϊe so hergestellte Komponentenschicht aus der Form entnommen werden. Für die nachfolgende Kaschierung mit einer Grund- und/oder Deckfolie wird kein WO 00/25264 -, Q PCT/EP99/07683The manufacturing process according to the invention can be carried out in various ways. On the one hand, the chip and, if applicable, the associated antenna can first be inserted into the mold of the injection molding system. B. present on a carrier film. After closing the mold, the hot melt adhesive is then injected. After briefly cooling, the mold can be opened and the component layer thus produced can be removed from the mold. For the subsequent lamination with a base and / or cover film, none is used WO 00/25264 -, Q PCT / EP99 / 07683
weiterer Klebstoffauftrag benötigt, da die Matrix der Kartenträgerschicht selbst als Klebstoff fungiert, die Folien müssen lediglich, gegebenenfalls unter Erwärmen, mit der Komponentenschicht verpreßt werden.Further adhesive application is required because the matrix of the card carrier layer itself functions as an adhesive; the foils only have to be pressed with the component layer, if necessary with heating.
Alternativ kann eine dünne Folie des Schmelzklebstoffs in die Spritzgußform eingelegt werden, das elektronische Bauteil und die Antenne darauf plaziert werden. Anschließend wird die Form geschlossen und die elektronischen Komponenten durch Einspritzen weiteren Schmelzklebstoffmaterials vollständig umhüllt. Zum Laminieren mit der Grund- und/oder Deckfolie ist ebenfalls kein weiterer Klebstoffauftrag notwendig, da auch hier, gegebenenfalls unter Erhitzen, die Folien mit der Komponentenschicht verpreßt werden können und so dauerhaft mit der Schicht verbunden sind. Die Schichtstärke der Schmelzklebstoffmatrix inklusive des eingegossenen Chips liegt heute in der Regel zwischen 400 und 600, vorzugsweise bei 500 μm, kann aber je nach Chip-Typ dünner oder dicker ausfallen.Alternatively, a thin film of the hot melt adhesive can be inserted into the injection mold, the electronic component and the antenna can be placed thereon. The mold is then closed and the electronic components are completely encased by injecting further hot-melt adhesive material. For the lamination with the base and / or cover film, no further application of adhesive is likewise necessary, since here too, if necessary with heating, the films can be pressed with the component layer and are thus permanently connected to the layer. The layer thickness of the hot-melt adhesive matrix including the cast-in chip is generally between 400 and 600, preferably 500 μm, but can be thinner or thicker depending on the chip type.
Für die Einbettung des elektronischen Bauteils und der Antenne in die Matrix der Kartenträgerschicht aus dem Schmelzklebstoff kann in einer besonders bevorzugten Ausführungsform ein Niederdruckverarbeitungssystem der Firma Optimel Schmelzgußtechnik verwendet werden. Die bevorzugte Ausführungsform der Spritzgußform ist in den Figuren 1 bis 3 dargestellt. Dabei zeigt dieIn a particularly preferred embodiment, a low-pressure processing system from Optimel Schmelzgußtechnik can be used to embed the electronic component and the antenna in the matrix of the card carrier layer made of the hot-melt adhesive. The preferred embodiment of the injection mold is shown in Figures 1 to 3. The shows
Fig. 1 eine Aufsicht auf das Unterteil der SpritzgußformFig. 1 is a plan view of the lower part of the injection mold
Fig. 2 eine Seitenansicht des Oberteils der SpritzgußformFig. 2 is a side view of the upper part of the injection mold
Fig. 3 eine Detailansicht des Oberteils. Gemäß Fig. 1 besitzt das Unterteil 1 der Spritzgußform eine Aussparung 2, deren Länge und Breite den Abmessungen des Oberteils der Spritzgußform entspricht. Zusätzlich enthält das Unterteil der Spritzgußform den Einspritzkanal 3, der so ausgebildet ist, daß der Schmelzklebstoff in möglichst kurzen Taktzeiten die gesamte Gießform vollständig und blasenfrei ausfüllen kann. Außerdem ist die Formgebung des Einspritzkanals so ausgebildet, daß das am Kartenkörper verbleibende Angußteil nach dem Erstarren des Kartenkörpers leicht entfernt werden kann.Fig. 3 is a detailed view of the upper part. 1, the lower part 1 of the injection mold has a recess 2, the length and width of which correspond to the dimensions of the upper part of the injection mold. In addition, the lower part of the injection mold contains the injection channel 3, which is designed so that the hot melt adhesive can fill the entire mold completely and without bubbles in the shortest possible cycle times. In addition, the shape of the injection channel is designed so that the sprue remaining on the card body can be easily removed after the card body has solidified.
Die Fig. 2 zeigt eine Querschnittsansicht des Oberteils 4 der Spritzgußform an der Schnittlinie A-B der Fig. 1. In seinem oberen Randbereich hat dieses Oberteil einen Vorsprung 5, so daß beim Eingreifen des Oberteils in die Aussparung 2 des Unterteils ein vollständig geschlossener Raum in der Spritzgußform entsteht. Die Aussparung 6 des Oberteils 4 entspricht in ihren Längen- und Breitenabmessungen die zu fertigende Kartenträgerschicht, die Tiefe der Aussparung 6 entspricht der Dicke der zu fertigenden Komponentenschicht.Fig. 2 shows a cross-sectional view of the upper part 4 of the injection mold on the section line AB of Fig. 1. In its upper edge region, this upper part has a projection 5, so that when the upper part engages in the recess 2 of the lower part a completely closed space in the Injection mold is created. The recess 6 of the upper part 4 corresponds in its length and width dimensions to the card carrier layer to be manufactured, the depth of the recess 6 corresponds to the thickness of the component layer to be manufactured.
Die Fig. 3 zeigt eine Detailansicht C der Fig. 2, in der die Aussparung 6 für die Kartenträgerschicht im Detail dargestellt wird.FIG. 3 shows a detailed view C of FIG. 2, in which the recess 6 for the card carrier layer is shown in detail.
Alternativ können in einem kontinuierlichen Fertigungsverfahren die Grund- und Deckschichtfolie der Spritzgußform gleichzeitig mit dem Chip und gegebenenfalls der Antenne, die gegebenenfalls auch in einer Kupferfolie auf einem dünnen flexiblen Film aufgebracht sein kann, zugeführt werden. Nach Schließen der Form wird wiederum der Schmelzklebstoff eingespritzt. Nach kurzem Erkalten und Öffnen der Form kann der fertige Schichtkörper weiter transportiert werden. Diese Vorgehensweise bietet den Vorteil, daß die Grund- und Deckschicht gleichzeitig als Formtrennmittel in der Spritzgußform dienen können. Dabei kann in allen vorgenannten Herstellverfahren die Grund- und/oder Deckfolie in einem vor- oder nachgelagerten Fertigungsschritt mit üblichen Hinweis- und/oder Werbeaufdrucken und/oder Sicherheitsmerkmalen wie z. B. einem Foto des Karteninhabers, einem Magnetstreifen, einem Identifizierungszeichen in Form eines Hologramms oder dergleichen versehen sein.Alternatively, in a continuous manufacturing process, the base and top layer foils of the injection mold can be fed simultaneously with the chip and optionally with the antenna, which can optionally also be applied in a copper foil on a thin flexible film. After closing the mold, the hot melt adhesive is again injected. After briefly cooling and opening the mold, the finished laminate can be transported further. This procedure has the advantage that the base and top layers can simultaneously serve as mold release agents in the injection mold. In all of the above-mentioned manufacturing processes, the base film and / or cover film can be produced in a preceding or subsequent production step with customary information and / or advertising imprints and / or security features such as. B. a photo of the card holder, a magnetic stripe, an identification mark in the form of a hologram or the like.
Die Vorteile der erfindungsgemäßen Verwendung von thermoplastischen Schmelzklebstoffen zur Herstellung der Komponentenschichten gegenüber dem Stand der Technik sind:The advantages of the use of thermoplastic hot melt adhesives according to the invention for producing the component layers compared to the prior art are:
• Es kann auf separat im normalen Spritzgußverfahren herzustellendes Trägermaterial verzichtet werden• There is no need for support material to be produced separately in the normal injection molding process
• Fräsarbeiten zum Herstellen der Aussparungen für den Chip und die Antenne entfallen• Milling work to create the cutouts for the chip and the antenna is omitted
• Weiterhin entfällt das separate Einkleben von Chip und Antenne in die Aussparungen• Furthermore, there is no need to glue the chip and antenna separately into the cutouts
• Nach dem Kaschieren mit Grund- und Deckfolie gibt es kein „read through" der Unebenheiten herkömmlicher Fertigung, da die Kartenträgerschicht zum einen eine sehr glatte Oberfläche besitzt und zum anderen selbst als Klebstoff fungiert.• After lamination with base and cover film, there is no "read through" of the unevenness of conventional production, since the card carrier layer has a very smooth surface on the one hand and on the other hand acts as an adhesive itself.
Obwohl das Hauptanwendungsgebiet der Erfindung in der Herstellung von kontaktlosen elektronische Schaltkreise enthaltenden Karten (Smart Cards) besteht, kann diese Technik auch zur Herstellung von Transpondem für die Fahrzeugindustrie, im Maschinenbau und Behälterbau zur Steuerung von Abläufen verwendet werden. Although the main field of application of the invention is the production of cards containing contactless electronic circuits (smart cards), this technique can also be used for the production of transponders for the automotive industry, in mechanical engineering and in container construction for controlling processes.

Claims

Patentansprüche claims
1. Verwendung von thermoplastischen Schmelzklebstoffen zur Herstellung von Komponentenschichten von Smart Cards.1. Use of thermoplastic hot melt adhesives for the production of component layers of smart cards.
2. Verwendung von thermoplastischen Schmelzklebstoffen zur Herstellung von Transpondem.2. Use of thermoplastic hot melt adhesives for the production of transponders.
3. Verwendung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Schmelzklebstoff auf der Basis von Polyamid, Polyurethan, Polyester, ataktischem Polypropylen (APP), Ethylen-Vinylacetat-(EVA)-Copolyme- ren, niedermolekularen Polyethylencopolymeren oder deren Mischungen aufgebaut ist.3. Use according to claim 1 or 2, characterized in that the hot melt adhesive is based on polyamide, polyurethane, polyester, atactic polypropylene (APP), ethylene-vinyl acetate (EVA) copolymers, low molecular weight polyethylene copolymers or mixtures thereof .
4. Verfahren zur Herstellung von elektronische Schaltkreise enthaltenden Kartenkörpern (Smart Cards), dadurch gekennzeichnet, daß als Kom- ponentenschichtmaterial ein thermoplastischer Schmelzklebstoff verwendet wird, dessen Verarbeitungsviskosität zwischen 100 und 100.000 mPa.s (Brookfield, RVDV II + Thermosel) liegt.4. A process for the production of electronic circuits containing card bodies (smart cards), characterized in that a thermoplastic hot-melt adhesive is used as the component layer material, the processing viscosity of which is between 100 and 100,000 mPa.s (Brookfield, RVDV II + Thermosel).
5. Verfahren nach Anspruch 4, dadurch gekennzeichnet, daß die Komponentenschicht im Niederdruck-Spritzgußverfahren bei Drücken zwischen 1 und 50 bar und Verarbeitungstemperaturen zwischen 80°C und 250°C, vorzugsweise zwischen 100°C und 230°C gegossen wird.5. The method according to claim 4, characterized in that the component layer in the low pressure injection molding process at pressures between 1 and 50 bar and processing temperatures between 80 ° C and 250 ° C, preferably between 100 ° C and 230 ° C is cast.
6. Mehrschichtiger Kartenkörper, dadurch gekennzeichnet, daß die elektronische Schaltkreise tragende Schicht aus einem thermoplastischen Schmelzklebstoff besteht. 6. Multi-layer card body, characterized in that the electronic circuit-bearing layer consists of a thermoplastic hot melt adhesive.
EP99953800A 1998-10-22 1999-10-13 Hot-melt adhesive component layers for smart cards Withdrawn EP1123535A1 (en)

Applications Claiming Priority (3)

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DE19848712A DE19848712A1 (en) 1998-10-22 1998-10-22 Thermoplastics hot melt adhesive application for formation of smart card component layer or electronic transponder
DE19848712 1998-10-22
PCT/EP1999/007683 WO2000025264A1 (en) 1998-10-22 1999-10-13 Hot-melt adhesive component layers for smart cards

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