FR3077025B1 - PROCESS FOR INTEGRATION OF AN RFID COMPONENT IN A DEVICE - Google Patents

PROCESS FOR INTEGRATION OF AN RFID COMPONENT IN A DEVICE Download PDF

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Publication number
FR3077025B1
FR3077025B1 FR1850583A FR1850583A FR3077025B1 FR 3077025 B1 FR3077025 B1 FR 3077025B1 FR 1850583 A FR1850583 A FR 1850583A FR 1850583 A FR1850583 A FR 1850583A FR 3077025 B1 FR3077025 B1 FR 3077025B1
Authority
FR
France
Prior art keywords
rfid component
plastic
integration
mold
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1850583A
Other languages
French (fr)
Other versions
FR3077025A1 (en
Inventor
Olivier Deslias
Laurent Clere
Christian Delage
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LES BOUCHAGES DELAGE
Original Assignee
LES BOUCHAGES DELAGE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LES BOUCHAGES DELAGE filed Critical LES BOUCHAGES DELAGE
Priority to FR1850583A priority Critical patent/FR3077025B1/en
Publication of FR3077025A1 publication Critical patent/FR3077025A1/en
Application granted granted Critical
Publication of FR3077025B1 publication Critical patent/FR3077025B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D51/00—Closures not otherwise provided for
    • B65D51/24—Closures not otherwise provided for combined or co-operating with auxiliary devices for non-closing purposes
    • B65D51/245—Closures not otherwise provided for combined or co-operating with auxiliary devices for non-closing purposes provided with decoration, information or contents indicating devices, labels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • B29C2045/14844—Layers protecting the insert from injected material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/56—Stoppers or lids for bottles, jars, or the like, e.g. closures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2203/00—Decoration means, markings, information elements, contents indicators
    • B65D2203/10—Transponders

Abstract

La présente invention se rapporte à un procédé d'intégration d'un composant RFID (10) dans un dispositif (20), ledit procédé mettant en œuvre un moule et comportant une étape de surmoulage dudit composant RFID (10) en mettant en œuvre un sous-procédé d'injection plastique permettant d'obtenir une pièce en plastique, ledit composant RFID (10) comportant une puce (40) et se présentant sous la forme d'un insert, ledit procédé comportant en outre les étapes suivantes : - Aménagement d'un logement permettant de compenser l'épaisseur de l'insert dans ledit moule ; - Recouvrement de part et d'autre de la puce par de la matière plastique lors de l'opération d'injection, afin de limiter la contrainte mécanique sur ledit composant RFID (10) ; - Rigidification de la géométrie intérieure de la pièce en plastique obtenue au moyen dudit procédé d'injection plastique.The present invention relates to a method of integrating an RFID component (10) into a device (20), said method implementing a mold and comprising a step of overmolding said RFID component (10) by implementing a plastic injection sub-process making it possible to obtain a plastic part, said RFID component (10) comprising a chip (40) and being in the form of an insert, said process further comprising the following steps: - Arrangement a housing making it possible to compensate for the thickness of the insert in said mold; - Covering on either side of the chip with plastic material during the injection operation, in order to limit the mechanical stress on said RFID component (10); - Rigidification of the internal geometry of the plastic part obtained by means of said plastic injection process.

FR1850583A 2018-01-25 2018-01-25 PROCESS FOR INTEGRATION OF AN RFID COMPONENT IN A DEVICE Active FR3077025B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1850583A FR3077025B1 (en) 2018-01-25 2018-01-25 PROCESS FOR INTEGRATION OF AN RFID COMPONENT IN A DEVICE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1850583 2018-01-25
FR1850583A FR3077025B1 (en) 2018-01-25 2018-01-25 PROCESS FOR INTEGRATION OF AN RFID COMPONENT IN A DEVICE

Publications (2)

Publication Number Publication Date
FR3077025A1 FR3077025A1 (en) 2019-07-26
FR3077025B1 true FR3077025B1 (en) 2021-01-22

Family

ID=62455623

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1850583A Active FR3077025B1 (en) 2018-01-25 2018-01-25 PROCESS FOR INTEGRATION OF AN RFID COMPONENT IN A DEVICE

Country Status (1)

Country Link
FR (1) FR3077025B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4120134A1 (en) 2021-07-15 2023-01-18 Les Bouchages Delage Method for manufacturing a bottle cap including an rfid tag and plug

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19848712A1 (en) * 1998-10-22 2000-04-27 Henkel Kgaa Thermoplastics hot melt adhesive application for formation of smart card component layer or electronic transponder
US20040238623A1 (en) * 2003-05-09 2004-12-02 Wayne Asp Component handling device having a film insert molded RFID tag
DE102005036258A1 (en) * 2005-08-02 2007-02-08 Pierre Chappuis Decorative films and process for their preparation
US7850893B2 (en) * 2006-12-01 2010-12-14 Rexam Healthcare Packaging Inc. Molded plastic container and preform having insert-molded RFID tag
CH703121B1 (en) * 2010-05-10 2014-05-15 Weidmann Plastics Tech Ag A method for producing a prepared a sheet-like electronic element having plastic container, plastic container according to this method, as well as injection molding tool for carrying out the method.

Also Published As

Publication number Publication date
FR3077025A1 (en) 2019-07-26

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