JP2002259930A - Manufacturing method of non-contact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a non-contact IC card with the usage of a hot-melt adhesive capable of reducing a size of a producing device as well as securing smoothness and thickness accuracy of the card. SOLUTION: In this manufacturing method of the non-contact IC provided with an antenna coil 1a, an electronic part 1 electrically connected to the antenna, and two outer layer resin sheet members 2 stuck to each other with the hot-melt adhesive 3, the card is molded by injecting the melted hot-melt adhesive 3 into a metallic mold 9 wherein the outer layer resin sheet members 2 and the electronic part 1 to be installed are positioned.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a non-contact IC card for performing communication using electromagnetic waves, and more particularly, to a method for incorporating an antenna coil and electronic components electrically connected to the antenna. The present invention relates to a method for manufacturing a non-contact IC card having a structure in which two outer layer sheets are bonded with a hot melt adhesive.

[0002]

2. Description of the Related Art An IC card that performs communication using electromagnetic waves is called a non-contact IC card, and the input and output of information such as data and commands, the power and the like between the non-contact IC card and a reader / writer device. The supply of a clock signal or the like is performed in a non-contact state using electromagnetic waves or the like.

[0003] In general, a non-contact IC card is connected to an antenna coil for performing data communication by non-contact communication by electromagnetic induction with an external device, and is connected to the antenna coil to generate a signal in response to an external input. Electronic components such as an IC module including an IC chip.

FIG. 2 is an explanatory view showing a hot press lamination method which is a conventional method for manufacturing a non-contact IC card.
Is a built-in electronic component comprising an antenna coil 1a and an IC module 1b, 2 is an outer resin sheet material as an outer sheet material, 3 is a hot melt adhesive, and 4 is a hot press laminating apparatus. In this hot press lamination method, the outer resin sheet materials 2 are superposed and laminated by heat and pressure.

FIG. 3 is an explanatory view showing a roll laminating method which is a conventional manufacturing method, wherein 1 denotes an antenna coil 1a.
A built-in electronic component comprising an IC module 1b, an outer resin sheet material 2 as an outer sheet material, a hot melt adhesive 3, a roll laminating device 5, and the like. Further, the configuration of the roll laminating apparatus 5 includes a hot melt coating section 6, a roll laminating section 7, and a cooling caterpillar section 8.

In this conventional roll laminating method, the outer layer resin sheet material 2 is supplied in a roll state, and a hot melt adhesive 3 is applied thereto in a molten state in a hot melt application section 6, and a predetermined amount is applied in a roll lamination section 7. After being laminated to a thickness, it is cooled by the cooling caterpillar unit 8.

[0007]

However, in the conventional hot press laminating method shown in FIG. 2, since each outer layer resin sheet material 2 is superposed and laminated by heat and pressure, when the hot melt adhesive 3 is melted, However, it flows out of the outer layer resin sheet material 2 and there is a problem that the card is not smooth and the thickness is not accurate.

In the conventional roll laminating method shown in FIG. 3, the clearance between the outer resin sheets 2 and 2 is determined by the setting of the roll position of the roll laminating section 7. For this reason, the problems of the smoothness and thickness accuracy of the card, which were problems in the hot press lamination method, are solved.

However, in the case of the conventional roll laminating method shown in FIG. 3, the supply of the outer layer resin sheet material is limited to a roll state. Since the material supply of the outer layer resin sheet is performed in a roll state, the apparatus line is inevitably lengthened, and the apparatus becomes large-scale because it is necessary to provide two unwinding portions of the outer layer resin sheet. In particular, the necessity of providing the cooling caterpillar portion 8 causes the device line to be longer and larger.

Accordingly, an object of the present invention is to solve the above-mentioned problems, to ensure the smoothness and thickness accuracy of the card, and to reduce the size of the manufacturing apparatus. An object of the present invention is to provide a method of manufacturing a type IC card.

[0011]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention incorporates an antenna coil and electronic components electrically connected to the antenna, and bonds two outer sheet materials by hot melt bonding. In a method for manufacturing a non-contact IC card having a structure of bonding with an agent, molding of the card is performed by injecting a molten hot melt adhesive into a mold in which an outer layer sheet material and a built-in electronic component are arranged. (Claim 1).

More specifically, the present invention has a structure in which an antenna coil and electronic parts electrically connected to the antenna are built in, and two outer sheet materials are bonded with a hot melt adhesive. In the method for manufacturing a non-contact IC card, a first outer layer sheet material, the antenna coil and the electronic component are arranged on one of a pair of molds, and a second outer layer sheet material is arranged on the other mold. After the molds are brought into contact with each other, the molten hot melt adhesive is injected into the molds to fill the space between the outer layer sheets, and after the hot melt adhesives are cooled, the molded IC card is taken out from the molds. (Claim 2).

According to the present invention, as a card molding method, an outer layer sheet and a built-in electronic component are placed inside a mold.
Since the method of injecting the molten hot-melt adhesive is used, the molten hot-melt adhesive does not flow outside the outer layer resin sheet material, and the clearance of the outer layer resin is determined by the mold, so the molded card is smooth. In addition, the desired card thickness can be obtained while maintaining the properties. Also, the manufacturing apparatus can use a conventional hot melt applicator, and the mold can be molded from aluminum.
The equipment is compact and relatively inexpensive equipment. Further, since a mold is used for molding, material supply of the outer layer resin sheet or the like can be performed in either a roll state or a small cut sheet state. In addition, since the cooling of the IC card is performed simultaneously inside the mold, there is no need to provide a cooling caterpillar as in the prior art. Furthermore, since the singulation is performed in the mold process, there is no need to install a take-up reel.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiment.

FIG. 1 shows an embodiment of the present invention. this is,
An electronic component such as an IC module including an antenna coil and an electronic component electrically connected to the antenna, that is, an IC module that generates a signal in response to an external input; This is an embodiment of manufacturing a non-contact IC card having a structure in which a sheet material is bonded with a hot melt adhesive.

In the method of manufacturing an IC card according to this embodiment, first, a printed or unprinted outer resin sheet material 2 is printed on both inner surfaces of a pair of molds 9 made of an aluminum material which is easy to process and has excellent heat conduction. Place (Fig. 1
(A)).

Here, the inner surface of one of the two outer-layer resin sheets 2 (in this example, the first outer-layer resin sheet 2a in the left mold) is already provided with the antenna coil and the IC.
An electronic component 1 and the like composed of a module are arranged and fixed. In the other mold, only the outer layer resin sheet (second outer layer resin sheet material 2b) is arranged.

Next, after the two dies are brought into contact with each other, the molten hot melt adhesive 3 is injected into the dies 9 to fill the space between the outer layer sheets 2 and 2 (FIG. 1B). That is, the molten hot melt adhesive 3 is injected between the outer resin sheet materials 2a and 2b by a general-purpose hot melt applicator.

Then, it waits for the hot melt adhesive 3 to be hardened by cooling (FIG. 1 (c)). After the hot melt adhesive is cooled, the molded IC card is taken out of the mold 9 and completed. Obtained card (Fig. 1
(D)).

According to the above-described manufacturing method, the molten hot melt adhesive 3 does not flow out of the outer layer resin sheet material 2 and the clearance of the outer layer resin sheet material 2 is determined by the mold 9. The card can maintain a smoothness and obtain a desired card thickness.

Since the cooling of the IC card is performed simultaneously inside the mold, there is no need to provide a cooling caterpillar as in the prior art. Furthermore, since the singulation is performed in the mold process, there is no need to install a take-up reel.

[0022]

As described above, according to the present invention, the following excellent effects can be obtained.

In the present invention, as a card molding method, an outer layer sheet and a built-in electronic component are arranged in a mold.
Since the method of injecting the molten hot melt adhesive is used, the molten hot melt adhesive does not flow out of the outer layer resin sheet material, and the clearance of the outer layer resin is also determined by the mold, so that the molded card is used. A desired card thickness can be obtained while maintaining smoothness.

In the present invention, the manufacturing apparatus can use a conventional hot-melt applicator, and the mold can be formed of aluminum. Therefore, the manufacturing apparatus is compact and relatively inexpensive equipment.

Further, since a mold is used for molding, the supply of the material such as the outer resin sheet material can be performed in either a roll state or a small cut sheet state.

Since the cooling of the IC card is performed simultaneously inside the mold, there is no need to provide a cooling caterpillar portion as in the prior art.

Furthermore, since the singulation is performed in the die step, there is no need to install a take-up reel.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a method for manufacturing a non-contact IC card according to the present invention.

FIG. 2 is a non-contact IC manufactured by a conventional hot press lamination method.
It is an explanatory view showing an example of a method for manufacturing a card.

FIG. 3 is an explanatory view showing an example of a method of manufacturing a non-contact IC card by a conventional roll lamination method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 1a Antenna coil 1b IC module 2 Outer resin sheet material (outer sheet material) 3 Hot melt adhesive 9 Mold

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Claims (2)

[Claims] 1. A non-contact IC card manufacturing method comprising a structure in which an antenna coil and an electronic component electrically connected to the antenna are built in and two outer sheet materials are bonded with a hot melt adhesive. Non-contact I wherein the molding of a card is performed by injecting a molten hot melt adhesive into a mold in which an outer layer sheet material and a built-in electronic component are arranged.
Manufacturing method of C card. 2. A method for manufacturing a non-contact IC card having a structure in which an antenna coil and an electronic component electrically connected to the antenna are built-in and two outer sheet materials are bonded with a hot melt adhesive. After arranging the first outer layer sheet material, the antenna coil and the electronic component on one of the pair of molds, and arranging the second outer layer sheet material on the other mold, and bringing the two molds into contact with each other A non-contact IC wherein the molten hot melt adhesive is injected into the mold to fill the space between the outer layer sheets, and after the hot melt adhesive is cooled, the molded IC card is removed from the mold. Card manufacturing method.