JPH04119643A - Formation of positioning hole for tape carrier package - Google Patents
Formation of positioning hole for tape carrier packageInfo
- Publication number
- JPH04119643A JPH04119643A JP23901890A JP23901890A JPH04119643A JP H04119643 A JPH04119643 A JP H04119643A JP 23901890 A JP23901890 A JP 23901890A JP 23901890 A JP23901890 A JP 23901890A JP H04119643 A JPH04119643 A JP H04119643A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- tape carrier
- positioning hole
- positioning holes
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 title claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000011889 copper foil Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000005530 etching Methods 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 238000000206 photolithography Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 abstract description 6
- 239000007767 bonding agent Substances 0.000 abstract 3
- 239000011888 foil Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 238000004080 punching Methods 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、半導体素子（ＬＳＩ）の高密度実装、薄形実
装に近年多く使用されているテープキャリアパッケージ
に用いられる位置決め穴の形成方法に関するものである
。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for forming positioning holes used in tape carrier packages, which have been widely used in recent years for high-density and thin packaging of semiconductor devices (LSI). It is something.
（従来の技術）
従来、このような分野の技術としては、例えば以下に示
すようなものがあった。(Prior Art) Conventionally, as technologies in this field, there have been the following, for example.
第２図は、従来のテープキャリアパッケージの位置決め
穴の形成工程断面図であり、３層構造のテープキャリア
を使用した場合の断面図である。FIG. 2 is a cross-sectional view of the process of forming positioning holes in a conventional tape carrier package, and is a cross-sectional view when a three-layer tape carrier is used.
まず、第２図（ａ）に示すように、テープキャリア基材
１上には接着剤２が設けられ、この接着剤２によりテー
プキャリア基材ｌと、電気回路を構成する銅箔材との接
着を行う、この接着剤２上には接着剤２が仮硬化状態の
ため、表面保護を行う保護テープ３（カバーフィルムと
もいう）が設けられる。なお、テープキャリア基材１と
しては、主に、ポリイミド樹脂が多く使用されているが
、ガラスエポキシ材やポリエステル樹脂等も使用されて
いる。接着剤２としては主にエポキシ樹脂が多く用いら
れる。First, as shown in FIG. 2(a), an adhesive 2 is provided on the tape carrier base 1, and this adhesive 2 connects the tape carrier base 1 and the copper foil material constituting the electric circuit. Since the adhesive 2 is in a temporarily cured state, a protective tape 3 (also referred to as a cover film) for surface protection is provided on the adhesive 2 that performs the adhesion. Although polyimide resin is mainly used as the tape carrier base material 1, glass epoxy materials, polyester resins, etc. are also used. As the adhesive 2, epoxy resin is mainly used.
次に、第２図（ｂ）に示すように、所定の箇所に位置決
め穴４を開孔する。この位置決め穴４は金型によるプレ
ス加工により開孔する。Next, as shown in FIG. 2(b), positioning holes 4 are drilled at predetermined locations. This positioning hole 4 is opened by press working using a mold.
次に、第２図（ｃ）に示すように、テープキャリア基材
１上に電気回路を構成するための銅箔５を接着するため
、保護テープ３を引き剥がした後に、テープキャリア基
材１上に銅箔５を接着加工する。Next, as shown in FIG. 2(c), in order to bond the copper foil 5 for forming an electric circuit onto the tape carrier base material 1, after peeling off the protective tape 3, the tape carrier base material 1 is Copper foil 5 is bonded on top.
接着加工は、テープキャリア基材１と、銅箔５を貼り合
わせて、熱と荷重を加えながら行う、これは接着剤２が
軟化することにより、テープキャリア基材１と銅箔５と
を均一に接着するためである。The adhesion process is performed by pasting the tape carrier base material 1 and the copper foil 5 together and applying heat and load. This is done by softening the adhesive 2 and uniformly bonding the tape carrier base material 1 and the copper foil 5. This is for adhesion to.
（発明が解決しようとする課題）
しかしながら、接着ＷＩ２が加熱により軟化し、圧力が
加わるので、位置決め穴４の内側へ接着剤がはみ出して
くる。６はそのはみ出した接着剤である。その後、加熱
処理により、接着剤の硬化が完了する。(Problems to be Solved by the Invention) However, since the adhesive WI2 is softened by heating and pressure is applied, the adhesive protrudes inside the positioning hole 4. 6 is the adhesive sticking out. Thereafter, curing of the adhesive is completed by heat treatment.
次に、第２図（ｄ）に示すように、ホトリソ技術により
、レジストパターン形成を行い、銅箔５をエツチング完
了する。ここで、位置決め穴４の上には、はみ出した接
着剤６が残り、所定の穴径が得られない欠点があった。Next, as shown in FIG. 2(d), a resist pattern is formed by photolithography, and etching of the copper foil 5 is completed. Here, the overflowing adhesive 6 remains on the positioning hole 4, resulting in a drawback that a predetermined hole diameter cannot be obtained.
また、この欠点を除去する方法として提案されている位
置決め穴構造として、第３図に示すものがある。これは
、位置決め穴４の上に銅箔５を残してエツチングによっ
て開孔し、位置決め穴４として使用する方法であるが、
前記の接着剤２のはみ出し６の影響は、除去可能である
が、銅箔５のエツチング精度によって穴径が変化するこ
とと、銅箔５の厚みが一般に３５〃ｍの銅箔を用いてい
るため、機械的強度が不足して、位置決め用として使用
不可能の場合も発生する欠点があった。Further, as a method for eliminating this drawback, there is a positioning hole structure shown in FIG. 3 as a proposed positioning hole structure. This is a method in which the copper foil 5 is left on the positioning hole 4 and the hole is opened by etching to be used as the positioning hole 4.
The effect of the overflow 6 of the adhesive 2 can be removed, but the hole diameter changes depending on the etching precision of the copper foil 5, and the thickness of the copper foil 5 is generally 35 mm. Therefore, there was a drawback that the mechanical strength was insufficient and it could not be used for positioning purposes.
本発明は、上記問題点を除去し、銅箔エツチング終了以
降の工程で、位置決め穴をプレス加工にて開孔し、位置
決め穴径の精度の優れたテープキャリアパッケージの位
置決め穴の形成方法を提供することを目的とする。The present invention eliminates the above-mentioned problems and provides a method for forming positioning holes in a tape carrier package, in which the positioning holes are formed by press processing in a process after the end of copper foil etching, and the positioning holes have excellent precision in the diameter of the positioning holes. The purpose is to
（課題を解決するための手段）
本発明は、上記目的を達成するために、テープキャリア
パッケージに位置決め穴を形成する方法において、テー
プキャリア基材に銅箔接着側を塗布し、銅箔ラミネート
後に接着剤を硬化する工程と、前記銅箔上にホトリソ技
術によりレジストパターン形成後、銅箔をエツチングす
る工程と、位置決め穴をプレス加工にて形成する工程と
を順に施すようにしたものである。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for forming positioning holes in a tape carrier package, in which a copper foil adhesive side is applied to a tape carrier base material, and after copper foil lamination, The steps of curing the adhesive, etching the copper foil after forming a resist pattern on the copper foil by photolithography, and forming positioning holes by press working are sequentially performed.
（作用）
本発明によれば、上記のように、テープキャリアパッケ
ージの位置決め穴の形成方法において、＃１ｗ１ラミネ
ートを行い、銅箔エツチングを行いった後、前記位置決
め穴をプレス加工にて開孔するようにしたので、従来の
ように、ラミネート後の接着剤のはみ出しによる穴径の
変化をな（すことができ、精度の高いテープキャリアパ
ッケージの位置決め穴を形成することができる。(Function) According to the present invention, as described above, in the method for forming positioning holes in a tape carrier package, #1w1 lamination is performed, copper foil etching is performed, and then the positioning holes are opened by press working. This makes it possible to change the hole diameter due to adhesive extrusion after lamination, unlike in the conventional case, and to form highly accurate positioning holes for the tape carrier package.
（実施例）
以下、本発明の実施例について図面を参照しながら詳細
に説明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第１図は本発明の実施例を示すテープキャリアパッケー
ジの位置決め穴の形成工程断面図である。FIG. 1 is a sectional view showing a process of forming positioning holes in a tape carrier package according to an embodiment of the present invention.
まず、第１図（ａ）に示すように、テープキャリア基材
１１上には接着剤１２が設けられ、この接着剤１２によ
りテープキャリア基材１１と、電気回路を構成する銅箔
１３との接着を行う、このように、銅箔ラミネート終了
時には、テープキャリア基材１１には、位置決め穴は開
孔していない。First, as shown in FIG. 1(a), an adhesive 12 is provided on the tape carrier base material 11, and this adhesive 12 connects the tape carrier base material 11 and the copper foil 13 constituting the electric circuit. In this way, when the copper foil lamination is completed, no positioning holes are formed in the tape carrier base material 11.
次に、第１図（ｂ）に示すように、ホトリソ技術により
、レジストパターン形成を行い、銅箔をエツチングする
。ここでは、位置決め穴が開孔する場所には、銅箔は残
しておかない。Next, as shown in FIG. 1(b), a resist pattern is formed by photolithography, and the copper foil is etched. Here, no copper foil is left where the positioning holes are to be drilled.
次に、第１図（ｃ）に示すように、位置決め穴１４を所
定の位置に金型等を用いて、プレス等の加圧装置で打ち
抜き加工する。Next, as shown in FIG. 1(c), the positioning hole 14 is punched out at a predetermined position using a die or the like and a pressurizing device such as a press.
このように構成するようにしたので、精確な位置決め穴
を形成することができる。With this configuration, accurate positioning holes can be formed.
比較データによると、従来の方法の場合は、所定の穴径
は±０．０５−程度であるのに対して、本発明の方法に
よれば、所定の穴径は±０．０２１と、その精度を高め
ることができる。According to the comparative data, in the case of the conventional method, the predetermined hole diameter is approximately ±0.05, whereas according to the method of the present invention, the predetermined hole diameter is ±0.021, which is approximately ±0.021. Accuracy can be increased.
なお、本発明は上記実施例に限定されるものではなく、
本発明の趣旨に基づいて種々の変形が可能であり、これ
らを本発明の範囲から排除するものではない。Note that the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
（発明の効果）
以上、詳細に説明したように、本発明によれば、テープ
キャリアパッケージの位置決め穴の形成に当り、銅箔ラ
ミネート後、接着剤を硬化し、該銅箔をエツチング終了
後に、位置決め穴をプレス加工にて形成するようにした
ので、従来のように、ラミネート後の接着剤のはみ出し
による穴径の変化をな（すことができ、精度の高いテー
プキャリアパッケージの位置決め穴を形成することがで
きる。(Effects of the Invention) As described above in detail, according to the present invention, in forming the positioning holes of the tape carrier package, after laminating the copper foil, curing the adhesive, and after etching the copper foil, Since the positioning holes are formed by press processing, the hole diameter can be changed due to adhesive extrusion after lamination, unlike conventional methods, and the positioning holes of tape carrier packages can be formed with high precision. can do.
特に、テープキャリアのパッケージは、高密度実装に使
用される場合が多いので、接続される実装基板とは、高
精度な位置合わせが要求されている０本発明によれば、
テープキャリアパッケージ側に高精度な位置決め穴を形
成することができるので、上記実装基板との位置合わせ
を精確に、しかも容易に行うことが可能となる。In particular, since tape carrier packages are often used for high-density packaging, highly accurate alignment is required with respect to the mounting board to which they are connected.According to the present invention,
Since highly accurate positioning holes can be formed on the tape carrier package side, alignment with the mounting board can be performed accurately and easily.
第１図は本発明の実施例を示すテープキャリアパッケー
ジの位置決め穴の形成工程断面図、第２図は従来のテー
プキャリアパッケージの位置決め穴の形成工程断面図、
第３図は従来の他のテープキャリアパッケージの位置決
め穴の断面図である。
１１・・・テープキャリア基材、１２・・・接着剤、１
３・・・銅箔、１４・・・位置決め穴。
特許出願人 沖電気工業株式会社
代理人 弁理士 清 水 守（外２名）第
図
第３図
第
図FIG. 1 is a cross-sectional view of the process of forming positioning holes in a tape carrier package showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the process of forming positioning holes in a conventional tape carrier package.
FIG. 3 is a sectional view of the positioning holes of another conventional tape carrier package. 11...Tape carrier base material, 12...Adhesive, 1
3...Copper foil, 14...Positioning hole. Patent Applicant Oki Electric Industry Co., Ltd. Agent Patent Attorney Mamoru Shimizu (2 others) Figure 3 Figure 3
Claims (1)
において、 （ａ）テープキャリア基材に銅箔接着剤を塗布し、銅箔
ラミネート後に接着剤を硬化する工程と、（ｂ）前記銅
箔上にホトリソ技術によりレジストパターン形成後、銅
箔をエッチングする工程と、（ｃ）位置決め穴をプレス
加工にて形成する工程とを順に施すことを特徴とするテ
ープキャリアパッケージの位置決め穴の形成方法。[Claims] A method for forming positioning holes in a tape carrier package, comprising the steps of: (a) applying a copper foil adhesive to a tape carrier base material and curing the adhesive after laminating the copper foil; Formation of positioning holes in a tape carrier package characterized by sequentially performing a step of etching the copper foil after forming a resist pattern on the copper foil by photolithography technology, and (c) a step of forming the positioning holes by press working. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23901890A JPH04119643A (en) | 1990-09-11 | 1990-09-11 | Formation of positioning hole for tape carrier package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23901890A JPH04119643A (en) | 1990-09-11 | 1990-09-11 | Formation of positioning hole for tape carrier package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04119643A true JPH04119643A (en) | 1992-04-21 |
Family
ID=17038672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23901890A Pending JPH04119643A (en) | 1990-09-11 | 1990-09-11 | Formation of positioning hole for tape carrier package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04119643A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100447495B1 (en) * | 2001-12-28 | 2004-09-07 | 이규한 | circuit pattern of tape carrier type semiconductor package and the method of manufacturing the same |
| CN100403499C (en) * | 2004-11-29 | 2008-07-16 | 晶强电子股份有限公司 | Positioning hole of soft sheet bearing device for wafer and soft sheet connection and its laser perforating process |
| KR100905328B1 (en) * | 2001-12-26 | 2009-07-02 | 엘지디스플레이 주식회사 | Chip on film and method of fabrication thereof |
-
1990
- 1990-09-11 JP JP23901890A patent/JPH04119643A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100905328B1 (en) * | 2001-12-26 | 2009-07-02 | 엘지디스플레이 주식회사 | Chip on film and method of fabrication thereof |
| KR100447495B1 (en) * | 2001-12-28 | 2004-09-07 | 이규한 | circuit pattern of tape carrier type semiconductor package and the method of manufacturing the same |
| CN100403499C (en) * | 2004-11-29 | 2008-07-16 | 晶强电子股份有限公司 | Positioning hole of soft sheet bearing device for wafer and soft sheet connection and its laser perforating process |
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