JPH01241892A - Manufacture of metal base laminated board - Google Patents
Manufacture of metal base laminated boardInfo
- Publication number
- JPH01241892A JPH01241892A JP6820088A JP6820088A JPH01241892A JP H01241892 A JPH01241892 A JP H01241892A JP 6820088 A JP6820088 A JP 6820088A JP 6820088 A JP6820088 A JP 6820088A JP H01241892 A JPH01241892 A JP H01241892A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- sheet
- holes
- metal
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 68
- 239000002184 metal Substances 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000011889 copper foil Substances 0.000 claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 238000001035 drying Methods 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 26
- 238000010586 diagram Methods 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000013000 roll bending Methods 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 206010040954 Skin wrinkling Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000001007 puffing effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、キーホード装置等のプリント配線板として用
いられる金属ベース積層板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a metal base laminate used as a printed wiring board for a keychain device or the like.
パーソナルコンピュータやワードプロセッサ等の入力装
置として用いられるキーホード装置の内部には、各キー
スイッチの端子をスルーホールに挿通せしめたプリント
配線板が組み込まれているが、近年、かかるプリント配
線板として、絶縁膜でコーティングした金属板をベース
にした、所謂金属ベース積層板が広く使用されるように
なっている。この金属ベース積層板は、鉄、アルミニウ
ム等の金属板をベースにしているので、曲げ加工が容易
であるのみならず、放熱効果や磁気シールド効果を有し
、今後ともその需要は高まるものと期待されている。Keyboard devices used as input devices for personal computers, word processors, etc. are equipped with a printed wiring board in which the terminals of each key switch are inserted through through holes. So-called metal-based laminates based on metal plates coated with Since this metal-based laminate is based on metal plates such as iron and aluminum, it is not only easy to bend, but also has heat dissipation and magnetic shielding effects, and demand for it is expected to continue to increase. has been done.
第６図は従来の金属ベース積層板を示す要部断面図であ
る。同図において、金属ベース積層板１は、所定位置に
貫通孔２ａを有する鉄やアルミニウム等の金属板２と、
この金属板２をコーティングする絶縁膜３と、この絶縁
膜３の表面に形成された銅箔パターン４とから主に構成
されており、内壁面をコーティングされた各貫通孔２ａ
がスルーホール５となっていて、銅箔パターン４の表面
にはランド部を除いて半田レジスト６が印刷されている
。なお、上記絶縁膜３は、紙やガラス繊維にフェノール
等の樹脂を含浸させたプリプレグを加圧・加熱して形成
されている。FIG. 6 is a sectional view of a main part of a conventional metal base laminate. In the figure, a metal base laminate 1 includes a metal plate 2 made of iron, aluminum, or the like having a through hole 2a at a predetermined position.
It mainly consists of an insulating film 3 coating this metal plate 2 and a copper foil pattern 4 formed on the surface of this insulating film 3, and each through hole 2a whose inner wall surface is coated.
is a through hole 5, and a solder resist 6 is printed on the surface of the copper foil pattern 4 except for the land portion. The insulating film 3 is formed by pressing and heating prepreg, which is paper or glass fiber impregnated with a resin such as phenol.
この種の金属ベース積層板１を得るための製造工程とし
ては、例えば特開昭６１−９２８４．９号公報Ｇこ開示
されているように、まず所定位置に貫通孔２ａを穿設し
た金属板２を用意し、この金属板２の両面にプリプレグ
を重ね合わせ、さらに−方のプリプレグの表面に銅箔を
重ね合わせ、これらの積層体を加圧加熱成形して一体化
する。このとき、プリプレグから流れ出す樹脂によって
貫通孔２ａは充填され、このプリプレグ中の樹脂か硬化
すると絶縁膜３が形成される。次に、上記銅箔にエツチ
ング等を施して銅箔パターン４を形成し、この銅箔パタ
ーン４の表面にランド部を除いて半田レジスト６を印刷
するとともに、貫通孔２ａ内に充填されている樹脂をト
リル等によって穴あけしてスルーホール５を形成する。As a manufacturing process for obtaining this type of metal base laminate 1, as disclosed in JP-A No. 61-9284.9, for example, a metal plate is first formed with through holes 2a at predetermined positions. 2 is prepared, prepregs are superimposed on both sides of the metal plate 2, copper foil is further superimposed on the surface of the - side of the prepreg, and these laminates are pressurized and heated to be integrated. At this time, the through hole 2a is filled with the resin flowing out from the prepreg, and when the resin in the prepreg hardens, the insulating film 3 is formed. Next, etching or the like is performed on the copper foil to form a copper foil pattern 4, and a solder resist 6 is printed on the surface of the copper foil pattern 4 except for the land portion, and the through hole 2a is filled with the solder resist 6. A through hole 5 is formed by drilling a hole in the resin using a trill or the like.
しかる後、ツインロールヘンディングマシン等を用いて
曲げ加工を行い、所定形状の金属ベース積層板１を完成
する。Thereafter, bending is performed using a twin roll bending machine or the like to complete the metal base laminate 1 in a predetermined shape.
しかしながら、上述した従来の製造方法は、プリプレグ
を加圧・加熱して絶縁膜３を形成するために減圧下で３
０分程度のプレス工程が必要であり、しかも貫通孔２ａ
内の絶縁膜３に気泡が残留して絶縁不良を引き起こす虞
れがあるので、生産性および製造歩留まりが悪く、その
結果としてト−タルコストが高くなってしまうという問
題があった。However, in the conventional manufacturing method described above, in order to pressurize and heat the prepreg to form the insulating film 3, three steps are required under reduced pressure.
A press process of about 0 minutes is required, and the through hole 2a
Since air bubbles may remain in the insulating film 3 inside, which may cause insulation defects, there is a problem in that productivity and manufacturing yield are poor, resulting in an increase in total cost.
本発明はこのような技術的背景に鑑みてなされたもので
、その目的は、生産性および歩留まりが良好な金属ベー
ス積層板の製造方法を提供することにある。The present invention has been made in view of such a technical background, and its purpose is to provide a method for manufacturing metal-based laminates with good productivity and yield.
上記目的を達成するために、本発明は、貫通孔を有する
金属板に静電粉体塗装を施して絶縁膜を塗装した後、こ
の金属板上に可撓性および耐熱性を有する銅張積層シー
トを接着し、しかる後、この銅張積層シートの銅箔面に
エツチングを施して配線回路を形成するようにした。In order to achieve the above object, the present invention applies electrostatic powder coating to a metal plate having through holes to coat an insulating film, and then coats the metal plate with a copper clad laminate having flexibility and heat resistance. The sheets were adhered, and then the copper foil surface of the copper-clad laminate sheet was etched to form a wiring circuit.
上記手段によれば、貫通孔を有する金属板に極めて短時
間の静電粉体塗装を施すだけで絶縁膜およびスルーホー
ルを有する金属基板が得られ、また、この金属基板に銅
張積層シートを接着した後にエツチングを行うので、銅
張積層シートの収縮や変形を防止することができる。According to the above means, a metal substrate having an insulating film and through holes can be obtained by simply performing electrostatic powder coating on a metal plate having through holes in an extremely short period of time, and a copper-clad laminate sheet can be coated on this metal substrate. Since etching is performed after adhesion, shrinkage and deformation of the copper-clad laminate sheet can be prevented.
以下、本発明の実施例を図に基ついて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図ないし第５図は本発明の一実施例を説明するため
のもので、第１図は金属ベース積層板の製造工程を示す
ブロック図、第２図は金属基板および銅張積層シートの
仮接着時の工程図、第３図は同しく金属基板および銅張
積層シートの本接着時の工程図、第４図は完成した金属
ベース積層板の要部断面図、第５図はその外観図である
。Figures 1 to 5 are for explaining one embodiment of the present invention. Figure 1 is a block diagram showing the manufacturing process of a metal base laminate, and Figure 2 is a block diagram showing the manufacturing process of a metal base laminate and a copper clad laminate sheet. Figure 3 is a process diagram for temporary bonding, Figure 3 is a process diagram for final bonding of metal substrates and copper-clad laminate sheets, Figure 4 is a sectional view of the main parts of the completed metal base laminate, and Figure 5 is its external appearance. It is a diagram.
第４図、第５図に示す金属ベース積層板１０は、キーボ
ード装置のプリント配線板として製造したものであり、
多数のスルーホール１２を有する金属基板１１と、片面
に銅箔パターン１４が形成されているフィルム基板１３
と、これらの金属基板１１およびフィルム基板１３の間
に介在して両者を接着している接着層１５とから主に構
成されている。The metal base laminate 10 shown in FIGS. 4 and 5 is manufactured as a printed wiring board for a keyboard device.
A metal substrate 11 having a large number of through holes 12 and a film substrate 13 having a copper foil pattern 14 formed on one side.
and an adhesive layer 15 interposed between the metal substrate 11 and the film substrate 13 and bonding them together.
金属基板１１は、スルーホール１２用の貫通孔１６ａを
穿設した鋼板等の金属板１６と、この金属板１６にプラ
スチック粉末を静電粉体塗装して塗膜されている絶縁膜
１７とから構成されており、この実施例の場合、金属板
１６の板厚は０．８１１、絶縁膜１７の膜厚は１００μ
ｍ程度である。また、この実施例の静電粉体塗装に用い
たプラスチック粉末は、エポキシ樹脂粉末である。The metal substrate 11 is made up of a metal plate 16 such as a steel plate having a through hole 16a for the through hole 12, and an insulating film 17 coated on the metal plate 16 by electrostatic powder coating of plastic powder. In this embodiment, the thickness of the metal plate 16 is 0.811, and the thickness of the insulating film 17 is 100μ.
It is about m. Furthermore, the plastic powder used in the electrostatic powder coating of this example is epoxy resin powder.
フィルム基板１３は、可撓性および耐熱性を有する公知
の銅張積層シートの銅箔面をパターニングしてなるもの
で、この実施例の場合、銅張積層シートとして東洋紡■
製のコスモフレックスＡＨ１１２０（厚さ１２５μｍ）
を使用した。なお、フィルム基板１３の銅箔パターン１
４の表面には、ランド部を除いて半田レジスト１８が印
刷しである。The film substrate 13 is made by patterning the copper foil surface of a known copper-clad laminate sheet that has flexibility and heat resistance.
Cosmoflex AH1120 (thickness 125 μm) manufactured by
It was used. Note that the copper foil pattern 1 of the film substrate 13
A solder resist 18 is printed on the surface of 4 except for the land portion.
接着層１５は、熱硬化性の公知の接着シートを加圧・加
熱してなるもので、この実施例の場合、接着シートとし
て日東電工（２）製のＴ−５３１０（厚さ１５０μｍ）
を使用した。The adhesive layer 15 is made by pressing and heating a known thermosetting adhesive sheet. In this example, the adhesive sheet is T-5310 (thickness: 150 μm) manufactured by Nitto Denko (2).
It was used.
次に、第１Ｍを参照しながら、上記した金属ベース積層
板１０の製造方法を説明する。Next, a method for manufacturing the metal base laminate 10 described above will be explained with reference to the first M.
ます、ＮＣパンチ等を用いて金属板に穴あけ加工を行い
（工程１）、所定位置に貫通孔１．６２を有する金属板
１６を作製する。次いで、この金属板１６に静電粉体塗
装を施して、エポキシ樹脂からなる絶縁膜１７を塗膜し
く工程２）、所定位置にスルーポール１２を有する金属
基板１１を得る。First, a hole is punched in the metal plate using an NC punch or the like (step 1) to produce a metal plate 16 having through holes 1.62 at predetermined positions. Next, electrostatic powder coating is applied to this metal plate 16 to coat an insulating film 17 made of epoxy resin in step 2), thereby obtaining a metal substrate 11 having through-poles 12 at predetermined positions.
なお、工程２における静電粉体塗装は、概ね次のように
行う。すなわち、アースした金属板１６に曲りで、噴射
ガンの出口で負に帯電させたエポキシ樹脂粉末を噴射し
、この粉末を静電気的な引力で金属板１６の表面に付着
させた後、これを加熱炉に入れてエポキシ樹脂を溶融さ
せる。こうして、貫通孔１６ａの内壁面も含めてほぼ均
一な膜厚に塗膜された絶縁膜１７が得られる。The electrostatic powder coating in step 2 is generally performed as follows. That is, a negatively charged epoxy resin powder is injected onto a grounded metal plate 16 at the outlet of the injection gun, and after this powder is attached to the surface of the metal plate 16 by electrostatic attraction, it is heated. Place it in a furnace to melt the epoxy resin. In this way, an insulating film 17 coated with a substantially uniform thickness including the inner wall surface of the through hole 16a is obtained.
一方、工程１． ２と並行して、予め用意した銅張積層
ソートおよび接着シートをホットロールラミネータ等を
用いて貼り合わせ（工程３）、さらにＮＣドリル等を用
いてスルーホール１２と対応する個所に穴あけ加工を行
う（工程４）。On the other hand, step 1. In parallel with Step 2, the copper clad laminated sort and adhesive sheet prepared in advance are laminated using a hot roll laminator, etc. (Step 3), and holes are drilled at locations corresponding to the through holes 12 using an NC drill, etc. (Step 4).
しかる後、第２図に示すように、金属基板１１と接着シ
ート２５付きの銅張積層シート２３を、位置合わせ治具
２０上で積層して正確に位置合わせし、この状態で積層
体１９の一辺端の複数個所を電気ごて等を用いて加圧・
加熱して仮接着する（工程５）。このとき、積層体１９
は、金属板１６、銅張積層シート２３および接着シート
２５に予め形成しておいた透孔に位置合わせ治具２０の
位置決めピン２０ａを挿通させることによって容易に位
置決めすることができ、また、複数個所に仮接着ブロッ
ク１９ａを設けた後は積層体１９を一体品として取り扱
うことができる。Thereafter, as shown in FIG. 2, the metal substrate 11 and the copper-clad laminate sheet 23 with the adhesive sheet 25 are laminated and accurately aligned on the alignment jig 20, and in this state, the laminate 19 is Apply pressure to multiple locations on one side using an electric iron, etc.
Temporary bonding is performed by heating (Step 5). At this time, the laminate 19
can be easily positioned by inserting the positioning pins 20a of the positioning jig 20 into through holes previously formed in the metal plate 16, the copper-clad laminate sheet 23, and the adhesive sheet 25. After providing the temporary adhesive blocks 19a at the locations, the laminate 19 can be handled as an integrated product.
次いで、仮接着した積層体１９を位置合わせ治具２０か
ら取り外し、第３図に示すように、この積層体１９を仮
接着部１９ａ側からホットロールラミネータ２１ （加
熱温度は１２０℃）に投入して本接着する（工程６）。Next, the temporarily bonded laminate 19 is removed from the alignment jig 20, and as shown in FIG. 3, this laminate 19 is put into a hot roll laminator 21 (heating temperature is 120° C.) from the temporarily bonded portion 19a side. and then adhere it (Step 6).
これにより、銅張積層シート２３は全面にわたって金属
基板１１に接着され、ホットロールラミネータ２１を通
過する際に空気がしごき出されるので気泡の混入もほと
んどない。そして、この後１６０ ’Ｃの乾燥炉内でア
フターキュアを行い（工程７）、接着層１５ （接着シ
ート２５）を介して金属基板１１と銅張積層シート２３
を完全に一体化する。As a result, the entire surface of the copper-clad laminate sheet 23 is adhered to the metal substrate 11, and since air is squeezed out when passing through the hot roll laminator 21, there is almost no air bubbles mixed in. Then, after-curing is performed in a drying oven at 160'C (step 7), and the metal substrate 11 and the copper-clad laminate sheet 23 are bonded to each other via the adhesive layer 15 (adhesive sheet 25).
completely integrated.
こうして金属板１６をベースにして一体化された積層体
１９を得たなら、その銅箔面にエツチング等を施して銅
箔パターン１４を形成し、さらにランド部を除いて銅箔
パターン１４の表面に半田レジスト１８を印刷する（工
程８）。このとき、銅張積層シート２３ （フィルム基
板１３）は全面にわたって金属基板１１に接着されてい
るので、エツヂフグ後の水洗いを経てもシワが発生する
虞れはなく、収縮率も０．０１％程度で極めて小さい。After obtaining the integrated laminate 19 based on the metal plate 16 in this way, etching or the like is performed on the copper foil surface to form the copper foil pattern 14, and then the surface of the copper foil pattern 14 is removed by removing the land portion. A solder resist 18 is printed on (Step 8). At this time, since the entire surface of the copper-clad laminate sheet 23 (film substrate 13) is bonded to the metal substrate 11, there is no risk of wrinkles occurring even after washing with water after puffing, and the shrinkage rate is approximately 0.01%. It's extremely small.
最後に、ツインロールヘンディングマシン等を用いて曲
げ加工を行い（工程９）、第５図に示す如き所定形状の
金属ベース積層板１０を完成する。Finally, bending is performed using a twin roll bending machine or the like (step 9) to complete the metal base laminate 10 having a predetermined shape as shown in FIG.
そして、部品実装時には、キースイッチ３０の端子３１
をスルーホール１２に挿通してランド部に半田付けする
。When mounting components, the terminal 31 of the key switch 30
is inserted into the through hole 12 and soldered to the land portion.
上述の如く、この実施例は、金属板１６に静電粉体塗装
を施すだけで絶縁膜１７およびスルーホール１２を有す
る金属基板１１が得られ、ホットロールラミネータ等を
用いてこの金属基板１１に銅張積層シート２３を接着す
るだけで所望の積層構造が得られるので、プリプレグを
加圧・カロ熱するため減圧下で長時間のプレス工程を必
要とする従来技術に比して生産性を著しく高めることが
でき、気泡の混入も回避されているので歩留まりも良好
である。また、可撓性を有する銅張積層シート２３を金
属基板１１に固定した後に銅箔パターン１４を形成する
ので、大面積の銅張積層シートに対し通常のエツチング
ラインでパターニングを行うことができ、生産性の一層
の向上が可能となっている。As described above, in this embodiment, the metal substrate 11 having the insulating film 17 and the through holes 12 can be obtained simply by applying electrostatic powder coating to the metal plate 16, and then the metal substrate 11 can be coated using a hot roll laminator or the like. Since the desired laminated structure can be obtained simply by gluing the copper-clad laminated sheet 23, productivity is significantly improved compared to conventional technology that requires a long press process under reduced pressure to pressurize and heat the prepreg. Since the mixing of air bubbles is also avoided, the yield is also good. Furthermore, since the copper foil pattern 14 is formed after the flexible copper-clad laminate sheet 23 is fixed to the metal substrate 11, patterning can be performed on a large-area copper-clad laminate sheet using a normal etching line. This makes it possible to further improve productivity.
なお、上記実施例では、銅張積層シート２３に穴あけ加
工（工程４）を行った後にこれを金属基板１１に接着（
工程５．６）ｌ、ているが、この工程４を省略し、穴あ
けをしていない銅張積層シート２３を金属基板１１に接
着してもよい。そして、曲げ加工（工程９）後の部品実
装時にキースイッチ３０の端子３１の先端でフィルム基
板１３ （銅張積層シート２３）を突き破れば、工程数
が削減できるとともに、端子３１がフィルム基板１３に
支持されてキースイッチ３０が仮止めされるので、その
後の工程で部品の脱落が防止できるという付随効果かあ
る。In the above embodiment, after drilling holes in the copper-clad laminate sheet 23 (step 4), it is bonded to the metal substrate 11 (
Step 5.6) l) However, this step 4 may be omitted and the copper-clad laminate sheet 23 without holes may be bonded to the metal substrate 11. If the tips of the terminals 31 of the key switch 30 break through the film substrate 13 (copper-clad laminate sheet 23) during component mounting after bending (step 9), the number of steps can be reduced, and the terminals 31 can be attached to the film substrate 13. Since the key switch 30 is temporarily fixed by being supported by the key switch 30, there is an additional effect that parts can be prevented from falling off in subsequent steps.
以上説明したように、本発明は、貫通孔を有する金属板
に極めて短時間の静電粉体塗装を行って絶縁膜およびス
ルーホールを有する金属基板を作製し、この金属基板に
銅張積層シートを接着して所望の積層構造を実現すると
いうものなので、プリプレグを加圧・加熱して絶縁膜を
形成する従来技術に比して生産性および歩留まりの向上
か図れ、しかも金属基板に銅張積層シートを接着した後
にエツチングを行うので、大面積の銅張積層シートに対
し通常のエツチングラインでパターニングを行うことが
できて生産性の一層の向上が可能であり、そのため高倍
転性の金属ベース積層板を低コストにて提供することが
できる。As explained above, the present invention performs electrostatic powder coating on a metal plate having through holes in an extremely short period of time to produce a metal substrate having an insulating film and through holes, and then coats this metal substrate with a copper-clad laminate. Since the desired laminated structure is realized by bonding the prepreg, it is possible to improve productivity and yield compared to the conventional technology that pressurizes and heats the prepreg to form an insulating film. Since etching is performed after the sheets are bonded, patterning can be performed on large-area copper-clad laminate sheets using a normal etching line, further improving productivity. The board can be provided at low cost.
第１図ないし第５図は本発明の一実施例を説明するため
のもので、第１図は金属ベース積層板の製造工程を示す
ブロック図、第２図は金属基板および銅張積層シートの
仮接着時の工程図、第３図は同じく本接着時の工程図、
第４図は完成した金属ベース積層板の要部断面図、第５
図はその外観図、第６図は従来技術で製造された金属ベ
ース積層板の要部断面図である。
１０・・・・・・金属ベース積層板、１１・・・・・・
金属基板、１２・・・・・・スルーホール、１３・・・
・・・フィルム基板、１４・・・・・・銅箔パターン（
配線回路）、１５・・・・・・接着層、１６・・・・・
・金属板、１６ａ・・・・・・貫通孔、１７・・・・・
・絶縁膜、２１・・・・・・ホットロールラミネータ、
２３・・・・・・銅張積層シート、２５・・・・・・接
着シート。
■
２、 第３図
第１ 。
、っ′：Figures 1 to 5 are for explaining one embodiment of the present invention. Figure 1 is a block diagram showing the manufacturing process of a metal base laminate, and Figure 2 is a block diagram showing the manufacturing process of a metal base laminate and a copper clad laminate sheet. The process diagram for temporary bonding, Figure 3 is also the process diagram for main bonding,
Figure 4 is a sectional view of the main parts of the completed metal base laminate, Figure 5
The figure is an external view, and FIG. 6 is a sectional view of the main part of a metal base laminate manufactured by the conventional technique. 10... Metal base laminate, 11...
Metal substrate, 12...Through hole, 13...
...Film board, 14...Copper foil pattern (
wiring circuit), 15...adhesive layer, 16...
・Metal plate, 16a...Through hole, 17...
・Insulating film, 21...Hot roll laminator,
23... Copper-clad laminate sheet, 25... Adhesive sheet. ■ 2. Figure 3, No. 1. , っ′：
Claims (1)
を塗膜した後、この金属板上に可撓性および耐熱性を有
する銅張積層シートを接着し、しかる後、この銅張積層
シートの銅箔面にエッチングを施して配線回路を形成す
ることを特徴とする金属ベース積層板の製造方法。After coating a metal plate with through holes with an insulating film using electrostatic powder coating, a flexible and heat-resistant copper-clad laminate sheet is adhered to the metal plate, and then this copper-clad laminate sheet is bonded onto the metal plate. A method for manufacturing a metal-based laminate, which comprises etching the copper foil surface of a laminate sheet to form a wiring circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6820088A JPH01241892A (en) | 1988-03-24 | 1988-03-24 | Manufacture of metal base laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6820088A JPH01241892A (en) | 1988-03-24 | 1988-03-24 | Manufacture of metal base laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01241892A true JPH01241892A (en) | 1989-09-26 |
Family
ID=13366916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6820088A Pending JPH01241892A (en) | 1988-03-24 | 1988-03-24 | Manufacture of metal base laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01241892A (en) |
-
1988
- 1988-03-24 JP JP6820088A patent/JPH01241892A/en active Pending
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