JPH09315057A - Ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a warping phenomenon from occurring by using each of labels which are different in terms of coefficient of heat shrinkage or thickness and mounting an IC module on the label, in an IC card comprising a card base of a resin packed in a space between the labels arranged opposite to each other at an equal interval on the front side and the back side. SOLUTION: Labels 3a, 3b which are different in terms of coefficient of heat shrinkage or thickness are sheets on which a pictorial design or a character is printed for a card and at the same time, which serve as a support for fixing an IC module 1 in a mold. In addition, a printed layer 5 and a protecting layer 6 are sequentially formed on each of the label bases 4. The IC module 1 has an antenna part and an IC part and is fixed to one of the labels 3a. The IC card is formed by arranging the labels 3a, 3b opposite to each other at an interval and using a card base 2 of a resin packed in a space between both labels 3a, 3b. Thus it is possible to easily manufacture a non-contact type IC card which is almost free from a warp merely by changing the thickness and material quality of the labels 3a, 3b.

Description

Detailed Description of the Invention

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a card in which an IC module made of an electronic component is incorporated inside the card, and a method of manufacturing the card.

[0002]

2. Description of the Related Art Conventionally, when power is supplied to an IC card or information is read or written (communication) in a reader / writer, an input / output terminal is provided on the card surface, and this is done through this terminal. However, according to this method, inconveniences such as breakage of terminals due to repeated use of the card, adhesion of sweat, grease, dust, and the like when the user holds the card with a finger, and short-circuiting due to charging of the card itself have occurred. Therefore, in recent years, as a non-contact type IC card, an IC card has been developed which incorporates an antenna in which electric wires are wound in a coil inside the card and uses the electromagnetic induction generated in this antenna to read and write information and supply electric power for that purpose. Has been done.

An IC card using power supply, reading and writing of information, and an electromagnetic wave therefor is generally divided into an antenna unit and an IC unit as an IC module. When an electromagnetic wave or the like is obtained by this antenna as energy for driving the IC, more energy can be obtained as the number of turns and the area of the coil forming the antenna are larger. Therefore, when the communication distance is increased or the power consumption of the IC is large, it is necessary to increase the shape of the antenna, and accordingly, the size of the IC module is increased.

As a method of manufacturing a card incorporating this IC module, a lamination method shown in FIG.
The injection molding method shown in FIG. The laminating method is a method in which oversheets on which characters and pictures are printed are laminated on both sides of a center core on which an IC module is mounted, and the cards are integrated by a hot press.
However, with this lamination method, particularly large I
When the C module 35 is coated, the oversheet 36 is torn or distorted, or a load is intensively applied to the IC module 35 to cause breakage, thereby lowering production efficiency. Therefore, an injection molding method is promising as a method for improving the production efficiency.

[0005] By the way, in order to manufacture a card by injection molding and improve the production efficiency, it is an issue how to reduce the number of steps. That is, in order to fit the IC module 31 in the card, how many steps are required to mount the IC module 31 on the label and simultaneously paint. This is disclosed in Japanese Unexamined Patent Publication No. 2-160594, in which a label 33a on which the IC module 31 is mounted is inserted into a mold, and another label 33b is placed on the label 33a.
Is inserted, and a resin is injected between the labels 33a and 33b by a so-called insert injection method. This makes it possible to manufacture a card by approximately one molding.

[0006]

However, when an IC card is manufactured by the above manufacturing method, the center of the IC module in the thickness direction is not at the center of the card in the thickness direction, but is shifted to the front side or the back side. In Therefore, when cooling the molten / injected resin inside the mold, the resin having a large shrinkage due to the difference between the heat shrinkage of the antenna portion in the metal IC module and the heat shrinkage with the injected resin. There was a problem that the card was warped on the side. This is based on the same principle as a thermoswitch that performs on / off operation, utilizing the fact that when heat is applied to a bimetal in which metals having different coefficients of thermal expansion are bonded to each other, the bimetal deforms to a smaller coefficient of thermal expansion. In particular, in the case of an IC card, it has been found that this phenomenon appears remarkably when the antenna is large and rectangular.

[0007]

In order to solve the above-mentioned problems, in the IC card of the first invention, labels are arranged facing each other at equal intervals on the front surface side and the back surface side, and a resin is placed between the both labels. In an IC card in which a filled card base is formed, labels having different heat shrinkage rates or different thicknesses are used for the labels attached to the front surface side and the back surface side, respectively.
An IC module is mounted on either one of the labels.

According to a second aspect of the present invention, there is provided an IC card manufacturing method, wherein labels are arranged on the front surface side and the back surface side at equal intervals so as to face each other, and a card substrate filled with a resin is formed between the labels. In the method of manufacturing a card, labels having different heat shrinkage rates or different thicknesses are used as the labels attached to the front surface side and the back surface side, respectively, and the IC module is mounted on either one of the labels, It is characterized in that the label is inserted into a mold, the both labels are positioned, and a resin is filled between the both labels.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.

As shown in FIG. 1, the labels 3a, 3b are sheets as a support for fixing the IC module 1 in the molds 20a, 20b at the same time as printing a picture, characters, etc. on the card 10. is there. The labels 3a and 3b are formed by sequentially forming a printing layer 5 and, if necessary, a protective layer 6 on a label substrate 4.

As the material of the label substrate 4, any paper having printability, synthetic paper, plastic film, or a sheet made of a composite of these materials can be applied. Those containing glass fibers can be used for the purpose of adjusting the heat shrinkage rate. A surface treatment may be performed on the bonding portion of the molding resin so that the molding resin and the label are easily bonded by injection molding. As the paper and the synthetic paper, those having printability such as high quality paper, coated paper, art paper and card paper can be used. Further, as the plastic film or sheet, those made of a material such as polyolefin resin such as polyethylene or polypropylene, polyester resin, polycarbonate resin, polyvinyl chloride resin, ABS resin or the like by an extrusion molding method, a calendar roll molding method, or the like,
Alternatively, a composite sheet made of these materials may be used.
The thickness is 10 μm considering printability and embossability.
Those having a thickness of about 200 μm can be used.

The label substrate 4 is provided with a printing layer 5 composed of characters, patterns and the like in order to impart a decorative effect. As a method for forming the printing layer 5, a known printing method such as offset printing, gravure printing, or screen printing is used. In the case of the offset printing method, a material of the printing layer 5 is a polyester acrylate resin, a polyurethane acrylate resin, an epoxy acrylate resin, an alkyd resin, or the like. Similarly, in the case of the gravure printing method,
Polyester resin, polyurethane resin, acrylic resin,
Cellulose-based resins, chlorinated propylene, vinyl chloride / vinyl acetate copolymer, acrylic polyol-based resins, and the like are used. In the case of the screen printing method, polyester resin, vinyl chloride / vinyl acetate copolymer, acrylic polyol resin and the like are used.

A protective layer 6 may be provided on the printed layer 5 for the purpose of improving the abrasion resistance of the printed layer 5. Protective layer 6
A known printing method such as a gravure printing method or a roll coating method is used as the method for forming the slag. As the material of the protective layer 6, resins such as acrylic resin, vinyl chloride resin, nitrocellulose, hydroxycellulose, carboxymethylcellulose, polyvinyl alcohol, styrene-maleic acid copolymer, polyester resin and ABS resin can be used. Further, a curable resin such as a thermosetting resin, an ultraviolet curable resin, and an electron beam curable resin may be used.

The IC module 1a is generally divided into an antenna section 8 and an IC section 9 as shown in FIG. The most common antenna unit 8 is a wire wound in a coil shape.
It receives power supply using electromagnetic induction and reads and writes data. The shape of the coil varies from a circular type of about 10 mmΦ to a spiral shape using a printed wiring board and a credit card size. Further, an electrostatic plate may be used for data communication.

The IC section 9 has functions of data communication and power control and may be encapsulated by a silicon bare chip or an epoxy resin. It also has a memory and is usually composed of an IC of one or more chips. Further, a diode, a resistor, a capacitor, or the like may be used as a peripheral component. They may be mounted on a printed wiring board, or may be formed on a silicon wafer of an IC.

As a method of fixing the IC module 1a to the labels 3a and 3b, heat fusion, solvent adhesion, high frequency welding,
Ultrasonic welding, fixing by using an adhesive, etc. can be considered. Examples of the heat fusion method include a heat sealer and a heat laminating method. Label 3 is used for solvent bonding.
a and the resin encapsulating the IC module 1a, the adhesive surface is dissolved by a solvent having a high solubility in common.
This is a method of adhering and integrating after drying. Furthermore, examples of adhesives include polyester-based, epoxy-based, urethane-based,
It is possible to use a one- or two-component curable adhesive made of silicone rubber-based, acrylic-based, or polyamide-based resin, hot-melt wax, or the like.

The card base 2 forms a card body, imparts mechanical strength to the card, and also plays a role of a housing for storing components such as the IC module 1. As the molding resin for the card substrate 2, general-purpose polystyrene resin, impact-resistant polystyrene resin, acrylonitrile-styrene resin, ABS resin, acrylic resin, polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, polycarbonate resin, vinyl chloride resin,
It is possible to use a thermoplastic resin such as a modified PPO resin, a polybutylene terephthalate resin, a polyphenylene sulphalde resin, or an alloy-based resin obtained by combining these materials, or a reinforced resin by adding glass fiber.

Next, a method of manufacturing the IC card of the present invention will be described. 3 to 7 show the manufacturing process of the IC card. First, the labels 3a and 3b formed by forming the printing layer 5 and, if necessary, the protective layer 6 on the label substrate 4 are taken out from the rack (not shown) (FIG. 3) and transferred to the IC module mounting position. Therefore, the module fixing portion 7 is formed by applying an adhesive agent or the like to attach the IC module 1 to the labels 3a and 3b.
Prepare for mounting on. IC on the labels 3a and 3b
Once module 1 is installed (Fig. 4), mold 20
It is inserted into a and 20b and positioned at a predetermined position (Fig. 5). After that, the molds 20a and 20b are closed (FIG. 6), the molding resin is filled between the labels 3a and 3b (FIG. 7), and when the molding resin is cooled and solidified, the molds 20a and 20b are opened to open the card 10 Take out. The obtained card 10 is shown in FIG.
As shown in, a high quality card with no warp was obtained.

Here, the molds 20a and 20b may be opened and closed by advancing and retracting only one or both of the molds 20a and 20b. The filling of the molding resin may be a normal injection molding or an injection compression molding method for the purpose of improving the filling property of the resin into the thin portion.

[0020]

EXAMPLES Specific examples of the present invention will be described below. [Example 1] A white vinyl chloride sheet having a thickness of 50 µm was provided with a pattern printing layer of 1 µm by offset printing, and a protective layer was provided on the entire surface of the sheet with offset printing of 2 µm to obtain an IC module mounting label. Similarly thickness 300
A 1 μm pattern printing layer was provided by offset printing on a white vinyl chloride sheet of μm, and a protective layer was provided on the entire surface of the 2 μm sheet by offset printing to obtain a label without IC module.

On the non-printing surface of the IC module mounting label, a urethane adhesive layer was provided by 27 μm by screen printing. Then, an IC module having a thickness of 400 μm and sealed with epoxy was adhered and fixed onto the IC module mounting label.

The two labels obtained by the above method are
The card-shaped mold was inserted into the positions corresponding to the front and back sides of the mold so that the printing side contacted the mold, and after adsorbing, the acrylonitrile-butadiene-styrene resin was added to
It was heated to 00 ° C. and injected. Then, it was cooled and solidified to obtain a card. As described above, by changing the thickness of the front and back labels, the expansion and contraction rates of the front and back are balanced, and the warpage occurs in one injection process.
A good card without distortion was obtained.

Example 2 White AB having a thickness of 100 μm
Offset printing on the S resin sheet by 1μ
m, and the protective layer was provided on the entire surface of the sheet by offset printing to a thickness of 2 μm to obtain an IC module mounting label. Similarly, a pattern printing layer of 1 μm is formed by offset printing on a sheet of glass fiber containing 100 μm thick white ABS resin.
m, and a protective layer was provided on the entire surface of the 2 μm sheet by offset printing to obtain an IC module non-mounted label.

An SBR adhesive layer was provided on the non-printed surface of the IC module mounting label by a blade coating method to a thickness of 27 μm. After that, a 400 μm thick I
The C module was adhered and fixed onto the IC module mounting label.

The two labels obtained by the above method are
The card-shaped mold was inserted into the positions corresponding to the front and back sides of the mold so that the printing side contacted the mold, and after adsorbing, the acrylonitrile-butadiene-styrene resin was added to
It was heated to 00 ° C. and injected. Then, it was cooled and solidified to obtain a card. As described above, by changing the contraction rates of the front and back labels, the expansion and contraction rates of the front and back sides were balanced, and a good card free from warpage and distortion by one injection process could be obtained.

[0026]

The IC card of the present invention is a non-contact type IC card having a large antenna shape, and has no terminals exposed on the card surface. It was excellent and high quality.
Further, according to the method for manufacturing an IC card of the present invention, a non-contact type IC card with almost no card warpage can be manufactured by simply changing the thickness and material of the label, and the manufacturing is easy. I can do it.

[0027]

[Brief description of drawings]

FIG. 1 is a sectional view of an example of an IC card of the present invention.

FIG. 2 is a cross-sectional view of another example of the IC card of the present invention.

FIG. 3 is a cross-sectional view of a label used in the IC card of the present invention.

FIG. 4 is a sectional view showing a state in which an IC module and a dummy module are mounted on a label used for the IC card of the present invention.

FIG. 5 is a cross-sectional view showing a state where a label used for the IC card of the present invention is positioned at a predetermined position in a mold.

FIG. 6 is a cross-sectional view showing a state where a label used for the IC card of the present invention is positioned at a predetermined position in a mold, and then the mold is closed.

FIG. 7 is a cross-sectional view showing a state in which the label used for the IC card of the present invention is positioned at a predetermined position in the mold, the mold is closed, and the molding resin is filled.

FIG. 8 is a plan view showing an example of an IC module.
It is.

FIG. 9 is a perspective view of the completed card.

FIG. 10 is a cross-sectional view of a card manufactured by a laminating method.

FIG. 11 is a cross-sectional view of a card manufactured by a conventional injection molding method.

[Explanation of symbols]

1a IC module 2 Card base 3a, 3
b Label 4 Label substrate 5 Printing layer 6 Protective layer 7
Module fixing part 8 IC part 9 Antenna part 10 IC cards 20a, 20b Mold 31 IC module 3
2 ... Card base 33a, 33b ... Label 34 ... Label base 35
Printing layer 36 Protection layer 37 Oversheet

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Claims (2)

[Claims] 1. An IC card in which labels are arranged facing each other at equal intervals on a front surface side and a back surface side, and a card base filled with a resin is formed between the labels, and the IC card is attached to the front surface side and the back surface side. For each label to be worn, a label having a different heat shrinkage rate or a different thickness is used, and an IC module is mounted on either one of the labels.
C card. 2. A method of manufacturing an IC card, comprising: a label and a label. The labels are arranged opposite to each other on the front surface side and the back surface side at equal intervals, and a card base filled with a resin is formed between the two labels. Labels having different heat shrinkage rates or different thicknesses are used for the respective labels to be attached to the side, the IC module is mounted on one of the labels, and both labels are inserted into a mold, An IC characterized in that a label is positioned and a resin is filled between the both labels.
Card manufacturing method.