KR20000031557A - Radio frequency integrated circuit card using conductive adhesive films and manufacturing method thereof - Google Patents

Radio frequency integrated circuit card using conductive adhesive films and manufacturing method thereof Download PDF

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Publication number
KR20000031557A
KR20000031557A KR1019980047660A KR19980047660A KR20000031557A KR 20000031557 A KR20000031557 A KR 20000031557A KR 1019980047660 A KR1019980047660 A KR 1019980047660A KR 19980047660 A KR19980047660 A KR 19980047660A KR 20000031557 A KR20000031557 A KR 20000031557A
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South Korea
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synthetic resin
chip
card
conductive adhesive
adhesive film
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KR1019980047660A
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Korean (ko)
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KR100284111B1 (en
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주동욱
이병덕
이태호
양필석
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주동욱
주식회사 비텍세미콘닥터
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/465—Associating two or more layers using chemicals or adhesives
    • B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/305—Associated digital information
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs

Abstract

PURPOSE: A method for manufacturing radio frequency integrated circuit card using conductive adhesive films is provided to remove the depression possibly occurred during the printing due to a gap by not using a package and to obtain a thin and flexible card made of ductile materials since the package frame and wire are not utilized any more. CONSTITUTION: A method for manufacturing radio frequency integrated circuit card using conductive adhesive films includes the steps of adhering by heat on a lower synthetic resin(1) a middle synthetic resin formed with a cavity at one side by punching to insert a chip(3) and containing a copper foil circuit arrangement(21) on an upper part, inserting the chip in the cavity of the middle synthetic resin and fixing on the lower synthetic resin by an adhesive agent, mounting a conductive adhesive film on the middle synthetic resin for connecting the copper foil circuit and the chip to operate the circuit and adhering an upper synthetic resin(5) after filling the gap between the chip and the cavity of the middle synthetic resin and coating an adhesive agent(6) on the chip, the middle synthetic resin and the conductive adhesive film to be the same height.

Description

전도성접착필름을 사용한 비접촉식아이씨카드와 그 제조방법Contactless IC card using conductive adhesive film and its manufacturing method

본 발명은 전도성접착필름을 사용한 비접촉식아이씨카드(Radio Frequency Integrated Circuit Card)와 그 제조방법에 관한 것으로, 특히 RF카드의 제조시 수지기판에 장착되는 칩과 프레임으로 이루어진 패키지(package)를 없애고 칩(Chip)만을 카드에 내장토록 하고 전도성접착필름을 사용하여 회로를 연결하여 카드의 두께를 줄이고 내부의 갭(Gap)을 없앰으로써 비접촉식카드 표면에 인쇄시 인쇄 상태가 양호하도록 한 비접촉식카드 및 그 제조방법에 관한 것이다.The present invention relates to a non-contact IC card (Radio Frequency Integrated Circuit Card) using a conductive adhesive film and a method for manufacturing the same, in particular, the chip (frame) consisting of the chip and the frame mounted on the resin substrate during the manufacture of the RF card chip ( Non-contact card and its manufacturing method to be printed on the non-contact card surface by reducing the thickness of the card and eliminating the internal gap by connecting the circuit using a conductive adhesive film and embedding only the chip into the card It is about.

현대사회가 신용사회로 접어들면서 지불수단으로 사용하는 화폐의 사용이 줄어들고 대신에 크레디트카드, 직불카드, 선불카드 등으로 구별되는 정보를 내장한 각종카드를 사용하여 화폐의 기능을 대신하고 있다.As the modern society enters the credit society, the use of money used as a means of payment decreases, and instead, various cards containing information distinguished by credit cards, debit cards, and prepaid cards are used to replace the functions of money.

이러한 각종 카드의 사용은 현금 사용시 문제로 대두되던 도난 및 화폐의 노후화로 인한 발행비등을 감소시키는 장점이 있다.The use of such various cards has the advantage of reducing the issuance costs due to theft of money and the aging of money, which has emerged as a problem when using cash.

물론 상기와 같은 각종 카드는 화폐기능 뿐만 아니라 신원정보 등을 저장하는 보안관련 ID카드 역할도 수행함은 물론이다.Of course, the various cards as described above also serves as a security-related ID card for storing not only money functions but also identity information.

일반적으로 상기와 같은 카드의 정보 저장 매체로는 마그네틱필름을 사용하고 있는데 이러한 저장매체의 단점으로는 그 저장정보량이 적다는 점과 자성 물체와 접촉시 저장된 정보가 지워지거나 훼손될 수도 있다는 안정성의 문제점이 있다.Generally, magnetic film is used as the information storage medium of the card. The disadvantages of the storage medium include a small amount of information stored therein and a problem of stability that the stored information may be erased or damaged when contacted with a magnetic object. There is this.

이러한 문제점을 감안하여 근래 그 효용성이 증대되고 있는 것으로 기존 플라스틱 카드에 컴퓨터 칩을 넣은 IC카드가 있는데, 이 IC카드는 뛰어난 정보저장 능력으로 은행카드, 신용카드, 신분증명서카드, 자동요금징수카드, 보안/출입통제카드 외에 전자 상거래와 소형 컴퓨터 프로그램 가동 등 응용분야가 다양해 고도 정보사회의 새로운 휴대 미디어로 기대를 받고 있다.In view of these problems, the utility of these cards is increasing in recent years. IC cards with computer chips in existing plastic cards have excellent information storage capabilities, such as bank cards, credit cards, identity card cards, automatic toll collection cards, In addition to security / access control cards, there are many applications such as electronic commerce and small computer program operation.

이러한 IC카드는 카드에 저장된 정보를 읽는 판독기와의 데이터 교환방식에 따라 접촉식 IC카드인 스마트카드(Smart card)와, 비접촉식 IC카드인 RF카드(Radio Frequency Card)와, 통합식 IC카드인 콤비카드(Combi Card)로 나뉜다.The IC card is a smart card, which is a contact IC card, a RF card, which is a contactless IC card, and a combination IC card, according to a data exchange method with a reader that reads information stored in the card. It is divided into a card (Combi Card).

상기 카드 방식 중 근래에 그 중요성 및 활용성이 커지고 있는 것으로는 RF카드가 있는데 그 이유로는 정보를 교환하는 판독기와 직접 접촉하지 않아도 정보의 교환이 가능해 사용시 매우 편리하기 때문이다.Recently, the importance and utility of the card system is increasing, because the RF card is very convenient in use because it is possible to exchange information without directly contacting the reader for exchanging information.

즉, 접촉식 카드는 판독기와 직접 접촉을 해야만 정보가 교환되기 때문에 사용자가 이를 판독기에 접촉시켜야 하는 단계가 필수적으로 필요해 대중이 이용하는 지하철이나 버스 등에서 사용하기에는 사용상의 불편한 점이 있다.That is, since the contact card exchanges information only when the contact card is in direct contact with the reader, it is necessary to contact the reader with the reader, which is inconvenient for use in a subway or a bus used by the public.

이러한 문제점을 없앤 RF카드가 도 2 에 도시되어 있는데 그 제조공정 및 구조는 다음과 같다.RF card that eliminates this problem is shown in Figure 2, the manufacturing process and structure is as follows.

프레임이 들어갈 공간부(Cavity)가 형성되고 회로가 새겨진(또는 코일이 감겨진) 인렛(Inlet, 500)에 비접촉식 칩(601)과 프레임(602)으로 이루어진 패키지(Package,600)를 삽입하고 솔다(Solder)를 사용하여 양측을 붙여 만드는데,Insert and draw a package consisting of a non-contact chip 601 and a frame 602 into an inlet 500 formed with a cavity for the frame and a circuit engraved (or coil wound). I'm using (Solder) to glue both sides together.

상기 인렛(Inlet, 500)의 층구조는 프레임(602)과 동일면을 이루는 합성수지(501)와, 이 합성수지(501)와 접착제(502)로 접착되는 동박회로(503)가 새겨진 내부의 합성수지(504)와, 이 합성수지(504)와 접착제(505)로서 접착되는 합성수지(506)로 이루어지는 다층구조로 되어 있다.The layer structure of the inlet 500 is a synthetic resin 504 engraved with a synthetic resin 501 forming the same surface as the frame 602, and a copper foil circuit 503 bonded to the synthetic resin 501 and an adhesive 502. ) And a synthetic resin 506 bonded to the synthetic resin 504 and the adhesive 505.

상기 패키지(Package, 600)의 구조는 프레임(602) 하부에 접착제(603)를 사용하여 칩(601)을 고정하며 이 칩(601)에는 알루미늄, 금 등을 사용하여 본딩와이어(604)의 일측단을 접점시키고 나머지 일측단을 프레임(602)에 연결하여 솔더(700)를 통해 인렛(Inlet, 500)의 합성수지(501)상에 접착제(502)를 이용하여 접착된 동박회로(503)와 연결시켜 회로가 작동되도록 하며, 프레임(602)과 접착제(603)로 부착된 칩(601)의 외부는 몰딩용수지(605)를 사용하여 칩(601)과 프레임(602) 하부를 몰딩시켜 칩(601)을 보호하면서 고정시킨다.The structure of the package 600 secures the chip 601 using an adhesive 603 under the frame 602, and one side of the bonding wire 604 using aluminum, gold, etc. on the chip 601. The stage is contacted and the other end is connected to the frame 602 and connected to the copper foil circuit 503 bonded using the adhesive 502 on the synthetic resin 501 of the inlet 500 through the solder 700. The outside of the chip 601 attached to the frame 602 and the adhesive 603 by molding the chip 601 and the lower part of the frame 602 using a molding resin 605. 601) while securing.

상기와 같은 구조의 종래 RF카드의 문제점으로는 패키지가 대형화되고, 두껍게 되는 구조상의 문제로 인하여 패키지의 두께만큼 밖에는 얇아질 수가 없다는 문제점과,Problems of the conventional RF card of the above structure is that the size of the package is large, due to the structural problem of thickening can only be as thin as the thickness of the package,

패키지와 인렛(Inlet)사이에 구조적으로 발생하는 갭(Gap, 800)으로 인해서 카드 표면에 인쇄시 함몰이 많이 생겨 인쇄품질이 저하되는 문제점과,Due to the structural gap between the package and the inlet (Gap, 800) due to the formation of a lot of depressions when printing on the surface of the card, the print quality is deteriorated,

상기 갭(Gap)부분의 존재로 인한 패키지와 인렛(Inlet)이 구조적으로 결함이 생겨 내구성이 저하되는 문제점과,Due to the presence of the gap (Gap) the package and the inlet (Inlet) structurally defective and the durability is lowered,

와이어의 존재로 인한 칩 위에 와이어가 이루는 높이가 생겨 카드의 두께가 두꺼워지는 등의 문제점과,Due to the existence of the wire, the height of the wire is formed on the chip, and the thickness of the card becomes thick.

상기 패키지의 프레임이 알루미늄합금으로 이루어져 이와 맞닿는 인렛(Inlet)을 경화성이 큰 수지를 사용함으로써 카드를 이루는 수지의 탄력성이 적어 큰 힘을 받으면 카드가 부러지는 등의 문제점이 있다.Since the frame of the package is made of aluminum alloy and the inlet in contact with the resin is made of a resin having high curability, the resin constituting the card is less elastic and the card is broken when subjected to a large force.

상기와 같은 문제점을 해결하기 위한 본 발명의 목적은 비접촉식아이씨카드의 층구조를 단순화하고 프레임 없이 칩을 장착하여 종래의 카드에서 발생하는 갭과 같은 구조적인 결함을 제거함과 동시에 카드의 두께를 줄이고 카드가 과도하게 휘어져도 칩과 연결된 회로가 손상되지 않는 플렉시블한 비접촉식아이씨카드와 그 제조방법을 제공하는데 있다.An object of the present invention to solve the above problems is to simplify the layer structure of the contactless IC card and to remove the structural defects such as gaps generated in the conventional card by mounting the chip without a frame, and at the same time reduce the thickness of the card The present invention provides a flexible non-contact IC card and a method of manufacturing the same, in which a circuit connected to a chip is not damaged even if it is excessively bent.

상기와 같은 본 발명의 목적은 비접촉식 아이씨카드에 있어서,The object of the present invention as described above in the contactless IC card,

비접촉식 아이씨카드에 있어서, 하부의 합성수지와, 이 합성수지 위에 열접착되고 일부면이 천공되어 칩이 삽입되도록 한 공간부가 형성됨과 동시에 상부면에 동박회로가 새겨진 합성수지와, 이 공간부에 삽입되어 접착제로 합성수지 상부면에 고정되는 칩과, 칩과 합성수지의 상부에 새겨진 동박회로 간을 연결하여 회로가 작동하도록 하는 전도성접착필름과, 상기 공간부를 채워 칩과 합성수지 간의 갭을 메꿈과 동시에 상부의 합성수지를 접착시키는 접착제와, 이 접착제를 도포하여 칩과 합성수지와 전도성접착필름의 상부면 높이를 같게 한 후 접착되는 상부의 합성수지가 순서대로 적층된 구조로 이루어진 것을 특징으로 하는 전도성접착필름을 사용한 비접촉식아이씨카드를 제공함으로써 달성된다.In the non-contact IC card, a lower synthetic resin, a space portion which is heat-bonded on the synthetic resin, a part of which is punched to insert a chip, and a copper foil circuit is engraved on the upper surface, and inserted into the space by an adhesive A chip fixed to the upper surface of the synthetic resin, a conductive adhesive film which connects the chip and the copper foil circuit engraved on the upper portion of the resin to operate the circuit, and fills the gap to fill the gap between the chip and the synthetic resin and simultaneously bond the upper synthetic resin. A contactless IC card using a conductive adhesive film, characterized in that the adhesive and the adhesive is applied, and the chip and the synthetic resin and the upper surface of the conductive adhesive film to be the same, and then the upper synthetic resin is laminated in order. By providing.

상기와 같은 본 발명의 목적은 비접촉식 아이씨카드의 제조방법에 있어서,The object of the present invention as described above in the manufacturing method of the contactless IC card,

비접촉식 아이씨카드의 제조방법에 있어서, 하부의 합성수지에 위에 열접착되고 일부면이 천공되어 칩이 삽입되도록 한 공간부가 형성됨과 동시에 상부면에 동박회로가 새겨진 합성수지를 열접착하는 단계와, 이 합성수지의 공간부에 칩을 삽입하여 접착제로 합성수지 상부면에 고정하는 단계와, 칩과 합성수지의 상부에 새겨진 동박회로 간을 연결하여 회로가 작동하도록 하는 전도성접착필름을 장착하는 단계와, 상기 공간부를 채워 칩과 합성수지 간의 갭을 메꿈과 동시에 칩과 합성수지와 전도성접착필름의 상부면 높이가 같도록 접착제를 도포하여 상부의 합성수지를 접착시키는 단계를 거쳐 제조하는 것을 특징으로 하는 전도성접착필름을 사용한 비접촉식아이씨카드의 제조방법을 제공함으로써 달성된다.In the method of manufacturing a contactless IC card, the step of thermally bonding a synthetic resin engraved with a copper foil circuit on the upper surface of the synthetic resin at the same time is formed with a space portion that is thermally bonded to the upper synthetic resin on the lower part and the perforated part is inserted into the chip; Inserting the chip into the space part and fixing it to the upper surface of the synthetic resin with an adhesive; mounting a conductive adhesive film to connect the chip and the copper foil circuit engraved on the upper part of the resin to operate the circuit; Of the contactless IC card using a conductive adhesive film, which is manufactured by filling a gap between the resin and the synthetic resin and simultaneously applying an adhesive so that the height of the upper surface of the chip and the synthetic resin and the conductive adhesive film is the same. It is achieved by providing a manufacturing method.

을 제공함으로써 달성된다.Is achieved by providing

도 1은 본 발명 비접촉식아이씨카드의 단면구조도이고,1 is a cross-sectional structural view of the present invention contactless IC card,

도 2는 종래 비접촉식아이씨카드의 단면구조도이다.2 is a cross-sectional view of a conventional contactless IC card.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

(1, 2, 5) : 합성수지 (3) : 칩(1, 2, 5): Synthetic Resin (3): Chip

(4) : 전도성접착필름 (6, 31) : 접착제(4): conductive adhesive films (6, 31): adhesive

(21) : 동박회로(21): copper foil circuit

상기한 바와 같은 목적을 달성하고 종래의 결점을 제거하기 위한 과제를 수행하는 본 발명의 실시예인 구성과 그 작용을 첨부도면에 연계시켜 상세히 설명하면 다음과 같다.When described in detail with reference to the accompanying drawings, the configuration and the operation of the embodiment of the present invention to achieve the object as described above and to perform the task for eliminating the conventional drawbacks.

도 1은 본 발명 비접촉식아이씨카드의 단면구조도인데, 본 발명의 층구조는 하부의 합성수지(1)와, 이 합성수지(1) 위에 열접착되고 일부면이 천공되어 칩이 삽입되도록 한 공간부가 형성됨과 동시에 상부면에 동박회로(21)가 새겨진 합성수지(2)와, 이 공간부에 삽입되어 접착제(31)로 합성수지(1) 상부면에 고정되는 칩(3)과, 칩(3)과 합성수지(2)의 상부에 새겨진 동박회로(21) 간을 연결하여 회로가 작동하도록 하는 전도성접착필름(4)과, 상기 공간부를 채워 칩(3)과 합성수지(2) 간의 갭을 메꿈과 동시에 상부의 합성수지(5)를 접착시키는 접착제(6)와, 이 접착제(6)를 도포하여 칩(3)과 합성수지(2)와 전도성접착필름(4)의 상부면 높이를 같게 한 후 접착되는 상부의 합성수지(5)가 순서대로 적층된 구조로 이루어진다.1 is a cross-sectional structure diagram of a non-contact IC card of the present invention, the layer structure of the present invention is a synthetic resin (1) at the bottom, and the space portion is heat-bonded on the synthetic resin (1) and a portion is perforated to insert the chip is formed and At the same time, the synthetic resin 2 having the copper foil circuit 21 engraved on the upper surface, the chip 3 inserted into the space portion and fixed to the upper surface of the synthetic resin 1 with an adhesive 31, the chip 3 and the synthetic resin ( 2) a conductive adhesive film 4 connecting the copper foil circuits 21 engraved on the upper part to operate the circuit, and filling the space to fill the gap between the chip 3 and the synthetic resin 2, and at the same time, (5) to bond the adhesive (6), and by applying the adhesive (6) to the same height of the upper surface of the chip 3, the synthetic resin (2) and the conductive adhesive film (4) and then the upper synthetic resin to be bonded ( 5) consists of a stacked structure in order.

상기에서 합성수지를 종이로 사용해도 된다.In the above, synthetic resin may be used as paper.

상기에서 동박회로는 코일을 사용해도 된다.In the above-mentioned copper foil circuit, you may use a coil.

상기와 같은 본 발명의 비접촉식아이씨카드의 제조방법은 다음과 같다.The manufacturing method of the contactless IC card of the present invention as described above is as follows.

하부의 합성수지(1)에 위에 열접착되고 일부면이 천공되어 칩(3)이 삽입되도록 한 공간부가 형성됨과 동시에 상부면에 동박회로(21)가 새겨진 합성수지(2)를 열접착하는 단계와,Thermally bonding the synthetic resin 2 engraved with the copper foil circuit 21 on the upper surface of the lower synthetic resin 1 and having a space portion formed thereon to allow the chip 3 to be inserted by being thermally bonded on the upper surface thereof;

이 합성수지(2)의 공간부에 칩(3)을 삽입하여 접착제(31)로 합성수지(1) 상부면에 고정하는 단계와,Inserting the chip 3 into the space portion of the synthetic resin 2 and fixing it to the upper surface of the synthetic resin 1 with an adhesive 31;

칩(3)과 합성수지(2)의 상부에 새겨진 동박회로(21) 간을 연결하여 회로가 작동하도록 하는 전도성접착필름(4)을 장착하는 단계와,Mounting a conductive adhesive film 4 for connecting the chip 3 and the copper foil circuit 21 engraved on the upper portion of the synthetic resin 2 to operate the circuit;

상기 공간부를 채워 칩(3)과 합성수지(2) 간의 갭을 메꿈과 동시에 칩(3)과 합성수지(2)와 전도성접착필름(4)의 상부면 높이가 같도록 접착제(6)를 도포하여 상부의 합성수지(5)를 접착시키는 단계를 거쳐 제조한다.Fill the space to fill the gap between the chip (3) and the synthetic resin (2) and at the same time apply the adhesive (6) so that the top surface of the chip 3, the synthetic resin (2) and the conductive adhesive film 4 is the same It is prepared through the step of bonding the synthetic resin (5).

상기와 같이 구성된 본 발명의 작용은 다음과 같다.The operation of the present invention configured as described above is as follows.

본 발명의 비접촉식아이씨카드의 정보를 판독하는 판독기 근처 또는 판독기와의 통신거리한계 내에 접근하게 되면 카드 및 판독기간에 통신을 통한 정보 교환이 이루어지게 되어 판독기가 정보를 처리하게 된다.Access to the reader near the reader for reading the information of the contactless IC card of the present invention or within the communication distance limit with the reader causes information exchange through communication between the card and the reading period, and the reader processes the information.

상기와 같은 본 발명의 비접촉식 카드는 패키지가 존재치 않아 갭이 발생하지 않으며, 따라서 인쇄시 함몰이 없어진 장점이 있으며,The contactless card of the present invention as described above does not have a package because there is no gap, and thus there is an advantage that there is no depression during printing,

패키지의 프레임이 없어짐으로 인한 카드의 재질을 연성이 강한 카드로 제조하여 플렉시블한 카드를 제조할 수 있다는 장점이 있으며,There is an advantage that a flexible card can be manufactured by manufacturing the material of the card due to the loss of the frame of the package with a flexible card.

와이어가 존재치 않아 칩 위에 와이어가 이루는 높이를 없앤 등의 장점이 있으며,There is no wire, there is an advantage such as removing the height of the wire on the chip,

마지막으로 패키지가 존재치 않아 카드의 두께가 줄어 비접촉식아이씨카드를 얇게 만들 수 있다는 장점이 있다.Finally, there is no package, so the thickness of the card is reduced, making the contactless IC card thinner.

Claims (2)

비접촉식 아이씨카드에 있어서,In contactless IC card, 하부의 합성수지(1)와, 이 합성수지(1) 위에 열접착되고 일부면이 천공되어 칩이 삽입되도록 한 공간부가 형성됨과 동시에 상부면에 동박회로(21)가 새겨진 합성수지(2)와, 이 공간부에 삽입되어 접착제(31)로 합성수지(1) 상부면에 고정되는 칩(3)과, 칩(3)과 합성수지(2)의 상부에 새겨진 동박회로(21) 간을 연결하여 회로가 작동하도록 하는 전도성접착필름(4)과, 상기 공간부를 채워 칩(3)과 합성수지(2) 간의 갭을 메꿈과 동시에 상부의 합성수지(5)를 접착시키는 접착제(6)와, 이 접착제(6)를 도포하여 칩(3)과 합성수지(2)와 전도성접착필름(4)의 상부면 높이를 같게 한 후 접착되는 상부의 합성수지(5)가 순서대로 적층된 구조로 이루어진 것을 특징으로 하는 전도성접착필름을 사용한 비접촉식아이씨카드.A synthetic resin 2 having a copper foil circuit 21 engraved on the upper surface of the lower synthetic resin 1 and a space portion which is heat-bonded on the synthetic resin 1 and has a perforated part to insert a chip. The circuit 3 is operated by connecting the chip 3 inserted into the part and fixed to the upper surface of the synthetic resin 1 with the adhesive 31 and the copper foil circuit 21 engraved on the upper portion of the chip 3 and the synthetic resin 2. A conductive adhesive film (4), an adhesive (6) for filling the spaces and filling the gap between the chip (3) and the synthetic resin (2) and bonding the upper synthetic resin (5) at the same time, and applying the adhesive (6) Using the conductive adhesive film, characterized in that the chip 3, the synthetic resin (2) and the upper surface of the conductive adhesive film 4 equal to the height of the upper surface of the synthetic resin (5) in order to be laminated in order Contactless IC card. 비접촉식 아이씨카드의 제조방법에 있어서,In the manufacturing method of the contactless IC card, 하부의 합성수지(1)에 위에 열접착되고 일부면이 천공되어 칩(3)이 삽입되도록 한 공간부가 형성됨과 동시에 상부면에 동박회로(21)가 새겨진 합성수지(2)를 열접착하는 단계와,Thermally bonding the synthetic resin 2 engraved with the copper foil circuit 21 on the upper surface of the lower synthetic resin 1 and having a space portion formed thereon to allow the chip 3 to be inserted by being thermally bonded on the upper surface thereof; 이 합성수지(2)의 공간부에 칩(3)을 삽입하여 접착제(31)로 합성수지(1) 상부면에 고정하는 단계와,Inserting the chip 3 into the space portion of the synthetic resin 2 and fixing it to the upper surface of the synthetic resin 1 with an adhesive 31; 칩(3)과 합성수지(2)의 상부에 새겨진 동박회로(21) 간을 연결하여 회로가 작동하도록 하는 전도성접착필름(4)을 장착하는 단계와,Mounting a conductive adhesive film 4 for connecting the chip 3 and the copper foil circuit 21 engraved on the upper portion of the synthetic resin 2 to operate the circuit; 상기 공간부를 채워 칩(3)과 합성수지(2) 간의 갭을 메꿈과 동시에 칩(3)과 합성수지(2)와 전도성접착필름(4)의 상부면 높이가 같도록 접착제(6)를 도포하여 상부의 합성수지(5)를 접착시키는 단계를 거쳐 제조하는 것을 특징으로 하는 전도성접착필름을 사용한 비접촉식아이씨카드의 제조방법.Fill the space to fill the gap between the chip (3) and the synthetic resin (2) and at the same time apply the adhesive (6) so that the top surface of the chip 3, the synthetic resin (2) and the conductive adhesive film 4 is the same Method of producing a contactless IC card using a conductive adhesive film, characterized in that the manufacturing through the step of bonding the synthetic resin (5).
KR1019980047660A 1998-11-07 1998-11-07 Contactless IC card using conductive adhesive film and its manufacturing method KR100284111B1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010014925A (en) * 1999-05-21 2001-02-26 모기 쥰이찌 Non-contact type ic card
KR101530051B1 (en) * 2014-07-04 2015-06-19 유비트론 주식회사 Security Card with Key-lock Module
CN105279648A (en) * 2014-07-04 2016-01-27 Ub特伦株式会社 Internet banking login service system by using key-lock card with security card and internet banking login method thereof
KR102138682B1 (en) * 2019-06-12 2020-07-28 (주)비티비엘 Method of manufacturing smart card with improved the quality and smart card thereof
KR102138684B1 (en) * 2019-07-03 2020-07-28 (주)비티비엘 Method of manufacturing smart card with improved flatness and smart card thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010014925A (en) * 1999-05-21 2001-02-26 모기 쥰이찌 Non-contact type ic card
KR101530051B1 (en) * 2014-07-04 2015-06-19 유비트론 주식회사 Security Card with Key-lock Module
CN105279648A (en) * 2014-07-04 2016-01-27 Ub特伦株式会社 Internet banking login service system by using key-lock card with security card and internet banking login method thereof
KR102138682B1 (en) * 2019-06-12 2020-07-28 (주)비티비엘 Method of manufacturing smart card with improved the quality and smart card thereof
KR102138684B1 (en) * 2019-07-03 2020-07-28 (주)비티비엘 Method of manufacturing smart card with improved flatness and smart card thereof

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