JPH09315056A - Ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card and a method for manufacturing the card so as not to cause warp at the time of manufacturing a non-contact IC card having a size of an antenna shape by injection molding. SOLUTION: The method for manufacturing an IC card integrally molded by injection molding comprises the steps of disposing labels 3a, 3b having embosses 7 of a suitable shape for positioning an IC module 1 at the center in an injection mold at one position of the front or rear surface of the card in the mold to direct the embossed surface inward in the mold, mounting the module 1 at the labels 3a, 3b, inserting the label having no emboss into the surfaces of the opposite side to the labels 3a, 3b having the embosses 7, injecting molten resin between the labels, and cooling to solidify it.

Description

Detailed Description of the Invention

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a card in which an IC module made of an electronic component is incorporated inside the card, and a method of manufacturing the card.

[0002]

2. Description of the Related Art Conventionally, when power is supplied to an IC card or information is read or written (communication) in a reader / writer, an input / output terminal is provided on the card surface, and this is done through this terminal. However, according to this method, inconveniences such as breakage of terminals due to repeated use of the card, adhesion of sweat, grease, dust, and the like when the user holds the card with a finger, and short-circuiting due to charging of the card itself have occurred. Therefore, in recent years, as a non-contact type IC card, an IC card has been developed which incorporates an antenna in which electric wires are wound in a coil inside the card and uses the electromagnetic induction generated in this antenna to read and write information and supply electric power for that purpose. Has been done.

An IC card using power supply, reading and writing of information, and an electromagnetic wave therefor is generally divided into an antenna unit and an IC unit as an IC module. When an electromagnetic wave or the like is obtained by this antenna as energy for driving the IC, more energy can be obtained as the number of turns and the area of the coil forming the antenna are larger. Therefore, when the communication distance is increased or the power consumption of the IC is large, it is necessary to increase the shape of the antenna, and accordingly, the size of the IC module is increased.

As a method of manufacturing a card incorporating this IC module, a laminating method shown in FIG.
The injection molding method shown in FIG. However, if the laminating method is used, the IC module 35 having a particularly large shape
Causes the oversheet 36 to be broken and the IC module 35 to be damaged during coating, thus lowering production efficiency. Therefore, an injection molding method is promising as a method for improving the production efficiency.

By the way, in order to manufacture a card by injection molding and improve the production efficiency, how to reduce the number of steps has been a problem. That is, how many steps are required to fit the IC module 31 in the card, and the IC module 31 is mounted in the mold and painting is performed at the same time. This is done by inserting the label 33a having the IC module 31 into the mold,
Insert another label 33b on top of the
A manufacturing method by a so-called insert injection method in which a resin is injected between b has been proposed, which makes it possible to manufacture a card by molding once.

[0006]

However, when an IC card is manufactured by the above manufacturing method, the center of the IC module in the thickness direction is not at the center of the card in the thickness direction, but is shifted to the front side or the back side. In Therefore, when cooling the molten / injected resin inside the mold, the resin having a large shrinkage due to the difference between the heat shrinkage of the antenna portion in the metal IC module and the heat shrinkage with the injected resin. There was a problem that the card was warped on the side. Therefore, it is difficult to manufacture a non-contact type IC card having a large antenna shape by the injection molding method.

The present invention has been made in view of the above points, and an IC card and a method of manufacturing an IC card in which warpage does not occur even if a non-contact type IC card having a large antenna shape is manufactured by injection molding. The purpose is to provide.

[0008]

In order to solve the above-mentioned problems, the IC card of the first invention is an IC card in which a front side label and a back side label are arranged opposite to each other on both sides of a card body made of injection resin. At the front side label,
A plurality of embosses projecting inside the card body are provided, and an IC module embedded in the card body is mounted so that it is located at the center of the card in the thickness direction by the embossing, and the back side label projects inside the card body. It is characterized in that no embossing is provided.

The IC card of the second invention is an IC card in which a front side label and a back side label are arranged opposite to each other on both sides of a card body made of injection resin, wherein the front side label is inside the card body. A plurality of embosses protruding from the card are provided, and an IC module embedded in the card main body is mounted so that it is located at the center of the card in the thickness direction by the embossing. Is provided, and the IC module is contacted with the emboss.

According to a third aspect of the present invention, there is provided an IC card manufacturing method in which an IC card is integrally molded by injection molding. In the injection molding mold, one position corresponding to a front surface or a back surface of the in-mold card is provided. In order to position the IC module in the center of the mold, a label provided with an embossing of a suitable shape is arranged so that the embossed surface faces inward, the IC module is mounted on the label, and the embossing is provided. Insert a label without embossing on the surface opposite to the label, inject the molten resin between the labels, and cool.
It is characterized by being solidified.

According to a fourth aspect of the present invention, there is provided an IC card manufacturing method in which an IC card is integrally formed by injection molding. In the injection molding die, one position corresponding to a front surface or a back surface of the in-mold card is provided. In order to position the IC module in the center of the mold, a label provided with an embossing of a suitable shape is arranged so that the embossed surface faces inward, the IC module is mounted on the label, and the embossing is provided. It is characterized in that a label provided with an emboss is inserted into the surface opposite to the label, and a molten resin is injected between the labels, and then cooled and solidified.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.

As shown in FIG. 1, the labels 3a and 3b are sheets as a support for fixing the IC module 1 in the molds 20a and 20b at the same time as printing a picture, characters, etc. on the card 10. is there. The labels 3a and 3b are formed by sequentially forming a printing layer 5 and, if necessary, a protective layer 6 on a label substrate 4. The labels 3a and 3b may be provided on both the front surface side and the back surface side of the card 10, or only one of them may be provided.

As the material of the label substrate 4, any paper having printability and embossability, synthetic paper, plastic film, or a sheet made of a composite of those materials can be applied. As paper and synthetic paper,
Printable materials such as high-quality paper, coated paper, art paper, and card paper can be used. Also, plastic film,
As the sheet, a sheet made of a material such as a polyolefin resin such as polyethylene or polypropylene, a polyester resin, a polycarbonate resin, a polyvinyl chloride resin or an ABS resin by an extrusion molding method, a calender roll molding method, or a composite sheet made of these materials. Etc. The thickness considers printability and embossability,
Those having a thickness of about 10 μm to 200 μm can be used.

The label substrate 4 is provided with a printing layer 5 composed of characters, pictures and the like for providing a decorative effect. As a method for forming the printing layer 5, a known printing method such as offset printing, gravure printing, or screen printing is used. In the case of the offset printing method, a material of the printing layer 5 is a polyester acrylate resin, a polyurethane acrylate resin, an epoxy acrylate resin, an alkyd resin, or the like. Similarly, in the case of the gravure printing method,
Polyester resin, polyurethane resin, acrylic resin,
Cellulose-based resins, chlorinated propylene, vinyl chloride / vinyl acetate copolymer, acrylic polyol-based resins, and the like are used.

A protective layer 6 may be provided on the printed layer 5 for the purpose of improving the abrasion resistance of the printed layer 5. Protective layer 6
A known printing method such as a gravure printing method or a roll coating method is used as the method for forming the slag. As the material of the protective layer 6, resins such as acrylic resin, vinyl chloride resin, nitrocellulose, hydroxycellulose, carboxymethylcellulose, polyvinyl alcohol, styrene-maleic acid copolymer, polyester resin and ABS resin can be used. Further, a curable resin such as a thermosetting resin, an ultraviolet curable resin, and an electron beam curable resin may be used.

Of the labels 3a and 3b, the label 3a on which the IC module 1 is mounted has the emboss 7 formed at the mounting position of the IC module 1 (FIG. 8). The unevenness of the emboss 7 is determined in consideration of the thickness of the IC module 1 and the thickness of the card 10 after molding so that the center of the thickness of the IC module 1 substantially coincides with the center of the thickness of the card 10 after molding. It Further, the formation position of the emboss 7 on the label 3a is determined in consideration of the shape and size of the IC module 1 and the filling of the molding resin. Also, I
The surface of the label 3a carrying the C module 1 has a printing layer 5
It may be the opposite surface or the same surface.

The IC module 1 is generally divided into an antenna section 8 and an IC section 9 as shown in FIG. The antenna unit 8 is formed by winding an electric wire in a coil shape, receives power supply using electromagnetic induction, and reads / writes data. The antenna section 8 may use a spiral coil using a printed wiring board. An electrostatic plate may be used for data communication.

The IC section 9 has functions such as data communication and power control, and may be sealed with a silicon bare chip or epoxy resin. It also has a memory and is usually composed of an IC of one or more chips. Further, a diode, a resistor, a capacitor, or the like may be used as a peripheral component. They may be mounted on a printed wiring board, or may be formed on a silicon wafer of an IC.

As the molding resin for the card substrate 2, general-purpose polystyrene resin, impact-resistant polystyrene resin, acrylonitrile-styrene resin, ABS resin, acrylic resin, polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, polycarbonate resin,
A thermoplastic resin such as a vinyl chloride resin, a modified PPO resin, a polybutylene terephthalate resin, a polyphenylene sulphalde resin, or an alloy resin formed by combining these materials, or a reinforced resin by adding glass fiber can be used.

Next, a method of manufacturing an IC card according to the present invention will be described. 2 to 7 show the steps of manufacturing the IC card. First, the labels 3a and 3b formed by forming the printing layer 5 and, if necessary, the protective layer 6 on the label substrate 4 are taken out from the stacker (not shown) (FIG. 2) and transferred to the embossing formation position. Therefore, the emboss 7 is formed at the IC module 1 mounting position on the label 3a on which the IC module 1 is mounted (FIG. 3). Label 3a with embossed 7
The IC module 1 is mounted on the die (Fig. 4), and the die 20
It is inserted into a and 20b and positioned at a predetermined position. If the back of the card also has letters, pictures, etc., label 3b
Is inserted into the molds 20a, 20b and is also positioned at a predetermined position (FIG. 5). Then, the molds 20a and 20b are closed (FIG. 6), the molding resin is filled between the labels 3a and 3b or between the label 3a and the mold 20b (FIG. 7), and when the molding resin is cooled and solidified, The molds 20a and 20b are opened, and the card 10 is taken out. As shown in FIG. 7, the obtained card 10 was a good card with no warp.

Here, the position where the emboss 7 is formed on the label 3a needs to be a position where the IC module 1 can be mounted, and is appropriately determined according to the shape and size of the IC module 1. The opening and closing of the molds 20a and 20b may be performed by advancing and retracting only one or both of the molds 20a and 20b. The filling of the molding resin may be ordinary injection molding or may be an injection compression molding method for the purpose of improving the filling property of the resin into the thin portion.

[0023]

EXAMPLES Specific examples of the present invention will be described below. Example 1 A 1 μm pattern printing layer was provided by offset printing on a white vinyl chloride sheet having a thickness of 50 μm, and a protective layer was provided by 2 μm by offset printing on it. The front side and back side labels were obtained by the above method. Emboss 8 on the front label so that the thickness of the embossed part is 230 μm.
It was created in one place (Fig. 9). An adhesive is applied to the non-printed surface of the front side label, and then an IC module with a thickness of 300 μm sealed with epoxy is adhered to the front side label.
Fixed. The above-mentioned front side label was inserted into positions corresponding to the front and back of a mold formed in the shape of a card so that the printing surfaces thereof would come into contact with the mold, adsorbed thereto, and acrylonitrile-butadiene-styrene resin was heated to 200 ° C. and injected. Then, it was cooled and solidified to obtain a card. As mentioned above,
By arranging the IC module at the center of the card thickness direction by embossing, the upper and lower parts of the IC module are filled with resin, the expansion and contraction rates of the upper and lower sides are balanced, and a card without distortion can be obtained.

Example 2 A pattern printing layer of 1 μm was formed by offset printing on a white vinyl chloride sheet having a thickness of 50 μm.
The protective layer was provided thereon by offset printing to a thickness of 2 μm. The front side and back side labels were obtained by the above method.
Embossments were formed at 12 places on the front side label so that the thickness of the embossed portion was 200 μm (FIG. 10). An adhesive was applied to the non-printed surface of the front side label, and then an IC module with a thickness of 360 μm sealed with epoxy was adhered and fixed onto the label. The front side label and the back side label are inserted into positions corresponding to the front and back sides of a mold formed into a card shape so that the printing surfaces come into contact with the mold, and are adsorbed, and the acrylonitrile-butadiene-styrene resin is heated to 200 ° C. Ejected. Then, it was cooled and solidified to obtain a card. As described above, by arranging the IC module in the central portion of the card by embossing, the upper and lower parts of the IC module are filled with resin, the expansion and contraction rates of the upper and lower sides are balanced, and a card without distortion can be obtained.

[0025]

According to the present invention, even for a non-contact type IC card having a large antenna shape, the IC card can be efficiently manufactured by injection molding without selecting the type of molding resin. The obtained IC card is of high quality with no warp.

[0026]

[Brief description of drawings]

FIG. 1 is a sectional view of an IC card of the present invention.

FIG. 2 is a sectional view of a label used for the IC card of the present invention.

FIG. 3 shows a label I used among the labels used in the IC card of the present invention.
It is a sectional view showing a state where a label on which a C module is mounted is embossed.

FIG. 4 is a cross-sectional view showing a state in which a label used in the IC card of the present invention is embossed and the label is mounted on the emboss.

FIG. 5 is a cross-sectional view showing a state where a label used for the IC card of the present invention is positioned at a predetermined position in a mold.

FIG. 6 is a cross-sectional view showing a state where a label used for the IC card of the present invention is positioned at a predetermined position in a mold, and then the mold is closed.

FIG. 7 is a cross-sectional view showing a state in which the label used for the IC card of the present invention is positioned at a predetermined position in the mold, the mold is closed, and the molding resin is filled.

FIG. 8 is a perspective view showing an example of embossing.

FIG. 9 is a plan view of the embossed label of Example 1;

FIG. 10 is a plan view of an embossed label of Example 2;

FIG. 11 is a plan view showing an example of an IC module.

FIG. 12 is a perspective view of a completed card.

FIG. 13 is a cross-sectional view of a card manufactured by a laminating method.

FIG. 14 is a sectional view of a card manufactured by a conventional injection molding method.

[Explanation of symbols]

1 IC module 2 Card base 3a, 3b
Label 4 Label base 5 Printing layer 6 Protective layer 7 Embossing 8 IC section 9 Antenna section 10 IC card 20a, 20b Mold 31 IC module 32 ... Card base 33
a, 33b {label 34} label base 35 35 printed layer 36 protective layer 37 over sheet

Claims (4)

[Claims] 1. An IC card in which a front side label and a back side label are arranged opposite to each other on both sides of a card body made of injection resin, wherein the front side label has a plurality of embosses protruding inside the card body. It is provided with an IC module embedded in the card body so as to be positioned in the center of the card in the thickness direction by the embossing, and the back side label is not provided with an embossing protruding into the card body. IC card to do. 2. An IC card in which a front side label and a back side label are arranged opposite to each other on both sides of a card body made of injection resin, wherein the front side label has a plurality of embosses protruding inside the card body. An IC module is provided which is embedded in the card body so as to be located at the center of the card in the thickness direction by the embossing, and the back side label is also provided with a plurality of embossing protruding into the card body. An IC card, which is in contact with the IC module according to. 3. A method of manufacturing an IC card integrally molded by injection molding, wherein in a mold for injection molding, an IC module is provided in one of the front surface and the back surface of the card in the mold, and the IC module is in the center of the mold. A label provided with an embossing of an appropriate shape for arranging the parts is placed so that the embossed surface faces inward, the IC module is mounted on the label, and the embossed label is provided on the surface opposite to the label provided with the embossed. A method for manufacturing an IC card, characterized in that a label not provided with is inserted, a molten resin is injected between the labels, and then cooled and solidified. 4. A method of manufacturing an IC card integrally molded by injection molding, wherein in a mold for injection molding, an IC module is provided at the center of the mold in one position corresponding to the front surface or the back surface of the card in the mold. A label provided with an embossing of an appropriate shape for arranging the parts is placed so that the embossed surface faces inward, the IC module is mounted on the label, and the embossed label is provided on the surface opposite to the label provided with the embossed. A method for manufacturing an IC card, characterized in that a label provided with is inserted, a molten resin is injected between the labels, and the mixture is cooled and solidified.