JPH08310171A - Ic card and manufacture thereof - Google Patents

Abstract

PURPOSE: To provide an IC card with high reliability and a simple manufacturing method therefor. CONSTITUTION: In the first process S1, a printing label A is manufactured. In the second process S2, an adhesive layer 4 is provided over the whole unprinted surface of the printing label A. In the third process S3, an IC module 5 is fixed at a prescribed position on the adhesive layer 4. In the fourth process S4, an IC protective layer 6 is formed over the whole surface of the adhesive layer 4 so as to cover the whole IC module 5. In the fifth process S5, a raw material obtained from the first process S1 to the fourth process S4 is disposed at a metallic mold (a), and after closing the other metallic mold, an injection molding resin is injected to manufacture an IC card.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card manufactured by injection molding and a method for manufacturing an IC card.

[0002]

2. Description of the Related Art Conventionally, magnetic recording media such as floppy disks and cassette tapes have been widely used as external storage devices for computers and the like, but semiconductor memories such as RAM and ROM have been used for convenience of handling. A card-shaped or packaged IC card provided with the IC card is being used. On the other hand, in the fields of credit cards, ID cards, cash cards, etc., an IC card having an IC module having a microprocessor and a semiconductor memory mounted therein has been developed.

By the way, a laminating method and a spot facing method are known as methods for manufacturing this type of IC card. The laminating method is a method of manufacturing an IC card by wrapping an IC module and a card material in a laminating film, integrating them with a heating press, and then processing into small pieces. The spot facing method is a method of manufacturing an IC card by forming an IC module hole in a card material and fixing the IC module therein with an adhesive or the like.

Further, as documents showing a method of manufacturing an IC card using injection molding, Japanese Patent Laid-Open Nos. 3-24000 and 2-160594 are known. JP-A-3-24000 discloses a method of manufacturing an IC card by forming a base for fixing an IC module by injection molding, installing and fixing the IC module on the base, and then again injection molding. On the other hand, JP-A-2-16059
No. 4, gazette discloses that an IC module is fixed or temporarily attached to a printed sheet with an adhesive, the IC module is placed at a predetermined position in a molding die, the die is closed, and then a molding resin is injected. IC
A method of making a card is disclosed.

[0005]

However, the above-mentioned conventional techniques have the following drawbacks. That is, the laminating method requires a large number of steps, so that the yield is poor and it is not suitable for mass production. The counterbore method is I
When machining the C module hole, there is a drawback that strict dimensional accuracy by a lathe or the like is required. Further, the technique disclosed in Japanese Patent Laid-Open No. 3-24000 has a drawback that the production efficiency is poor because it requires two injection molding steps. Further, in the technique disclosed in JP-A-2-24000, since the IC module is simply fixed with an adhesive, the internal pressure during injection molding causes
There is a defect that the IC module is displaced or scattered, or the IC module itself is damaged. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an IC card manufacturing method for manufacturing a high quality IC card by a simple method and an IC card manufactured by the method.

[0006]

In order to solve the above-mentioned problems, in the structure according to claim 1, in an IC card manufactured by injection molding, a flat base member and a base member It is characterized by comprising an IC module fixed via an adhesive layer, an IC protective layer covering the IC module, and an injection molding layer laminated on the IC protective layer surface by injection molding.

According to the second aspect of the present invention, the base portion is formed by sequentially laminating a base sheet, a print layer having one surface thereof printed, and a print protective layer for protecting the base sheet. The adhesive layer is disposed on the other surface of the base sheet.

According to the third aspect of the present invention, in the base material portion, a transparent base sheet, a print layer on which one surface is reversed and printed and an opaque hiding layer are sequentially laminated. The adhesive layer is laminated in contact with the concealing layer.

Further, in the structure according to claim 4,
An IC card manufacturing method for manufacturing an IC card having a base material portion, an IC module, an IC protective layer, and an injection molding layer, wherein the IC module is fixed to the base material portion, and the IC module is covered therewith. The IC card is manufactured by disposing the IC protective layer, and injection-molding the injection-molded layer on the IC protective layer.

[0010]

In the structure according to the first aspect, the IC module is fixed to the flat plate-shaped base material portion with the adhesive layer interposed therebetween. Further, since the IC protective layer covers the IC module, it protects the IC module when the injection molding layer is injection molded thereon.

Further, in the structure according to the second aspect, the base sheet, the print layer having one surface thereof printed, and the print protective layer for protecting the base sheet are sequentially laminated on the base material portion. . An adhesive layer is provided on the other surface of the base sheet.

Further, in the structure according to the third aspect, the base portion is provided with a transparent base sheet, a print layer on one surface of which is reversed and printed, and an opaque hiding layer. It is arranged. As a result, the printed contents can be seen through the base sheet, while the IC module is hidden by the hiding layer.

Further, in the structure according to claim 4,
The IC module is fixed to the base material portion, the IC protective layer covering the IC module is provided thereon, and the injection molding layer is injection-molded on the IC protective layer to manufacture an IC card. As a result, the IC module does not scatter during injection molding.

[0014]

【Example】

1. First Embodiment A. Configuration of IC Card The configuration of the IC card according to the first embodiment of the present invention will be described with reference to FIG. In the figure, 1 is a base sheet, which is a plastic film made of white acrylonitrile-styrene. One side of the base sheet 1 functions as a base for printing on the card, and the other side functions as a base for fixing the IC module. Reference numeral 2 is a pattern print layer, which is printed on one surface of the base sheet 1 as a character or a pattern. Also,
Reference numeral 3 denotes a print protection layer, which is a layer for protecting the pattern print layer 2 from abrasion or the like. As a material for the print protection layer 3, a transparent polyvinyl chloride resin or the like can be used. The print label A is composed of the base sheet 1, the pattern print layer 2 and the print protection layer 3 described above.

Reference numeral 4 denotes an adhesive layer, which is made of urethane adhesive and is laminated on the entire other surface of the base sheet 1. Reference numeral 5 denotes an IC module, which is a microprocessor, a memory, a coil-shaped antenna, and the like sealed with epoxy resin, polypropylene resin, or the like. Then, the IC module 5 is fixed to the non-printing surface of the print label A via the adhesive layer 4. In addition, IC module 5
Simultaneously performs power supply and data communication via an external device and an antenna.

Reference numeral 6 denotes an IC protective layer, which is provided to prevent the IC module 5 from being scattered or displaced due to the injection pressure and to prevent the IC module 5 itself from being damaged. The IC protective layer 6 is provided on the entire surface of the adhesive layer 4 so as to cover the entire IC module 5, and the material thereof is acrylonitrile-butadiene-styrene copolymer resin (hereinafter abbreviated as ABS resin). It is a film. Further, 7 is an injection molding layer, the material of which is ABS resin. The injection molding layer 7 and the IC protective layer 6 are made of the same material so that the temperature characteristics of the expansion coefficient are the same and the warpage of the IC card is prevented.

B. Method of Manufacturing IC Card A manufacturing process of the IC card according to the first embodiment will be described with reference to FIG. First, in the first step S1, the printed label A is manufactured. That is, after printing the pattern print layer 2 on one surface of the base sheet 1 by the offset printing method, the print protection layer 3 is printed thereon by the offset printing method. First step S
When 1 is completed, the process proceeds to the second step S2.

In the second step S2, the adhesive layer 4 is provided on the entire non-printed surface of the printed label A. When the second step S2 ends, the process proceeds to the third step S3. In the third step S3, the IC module 5 is fixed at a predetermined position on the adhesive layer 4. Third step S
When 3 is completed, the process proceeds to the fourth step S4.

In the fourth step S4, the IC protective layer 6 is provided on the entire surface of the adhesive layer 4 so as to cover the entire IC module 5. That is, the ABS resin is dissolved or dispersed in a solvent such as toluene or xylene, and is coated and dried by a gravure method, a roll coating method or the like to form the IC protective layer 6. When the fourth step S4 ends, the process proceeds to the fifth step S5.

In the fifth step S5, the material obtained in the fourth step S4 is placed in one mold a, the other mold b is closed, and then the injection molding resin is injected. In this case, since the injection molding resin injected into the space formed by the molds a and b is filled without touching the IC module 5, the resin flow does not move the IC module 5.

Since the IC protective layer 6 is provided in this way,
Compared with the case where the IC module 5 is simply fixed by using the adhesive layer 4, there is an advantage that the IC module 5 can be securely fixed, and as a result, the injection pressure at the time of injection molding performed in the fifth step S5 is made high. Moreover, since the IC protective layer 6 also functions as a heat insulating material, the temperature of the injection molding resin can be set high.

2. Second Embodiment A. Configuration of IC Card The configuration of the IC card according to the second embodiment of the present invention will be described with reference to FIG. The same parts as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. In the figure, 41 is an adhesive layer, and 61 is an IC protective layer, which are different from those in FIG.

That is, the adhesive layer 4 in the first embodiment.
(See FIG. 1) was provided on the entire non-printed surface of the printed label A, but the adhesive layer 41 of this embodiment is provided on a part of the non-printed surface. In addition, the IC protective layer 6 in the first embodiment
(See FIG. 1) had substantially the same area as the entire non-printed surface of the printed label A, but the IC protective layer 61 of this embodiment was formed so as to have substantially the same area as the adhesive layer 41. There is.

As described above, the reason why the adhesive layer 41 is not provided on the entire non-printed surface of the printed label A is that the adhesive material peels off the base sheet 1 and the injection molding resin 7 due to factors such as aging. This is because this peeling is likely to occur from the side surface of the IC card. On the other hand, the adhesive layer 41 is an IC
Since the module 5 is fixed at a predetermined position, it is only necessary to obtain the required strength, and it is not always necessary to provide it on the entire non-printing surface.

B. Method of Manufacturing IC Card A manufacturing process of the IC card according to the second embodiment will be described with reference to FIG. The same manufacturing steps as those in FIG. 2 are designated by the same reference numerals. Further, FIG. 4 is different from FIG. 2 in S
Since this is No. 31, this point will be described below, and other description will be omitted.

The third step S31 is a step corresponding to the third step S3 of the first embodiment, but compared with the first embodiment,
The difference is that an adhesive layer 41 is provided on a part of the non-printing surface of the printed label A on which the IC module 5 is to be arranged.

3. Third Embodiment A. Configuration of IC Card The configuration of the IC card according to the third embodiment of the present invention will be described with reference to FIG. The same parts as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. In the figure, 11 is a base sheet and 8 is a hiding layer, which are different from those in FIG.

That is, the base sheet 1 (see FIG. 1) in the first embodiment was a white plastic film made of acrylonitrile-styrene, but the base sheet 11 in the third embodiment was made of transparent polyvinyl chloride. It is a plastic film made from. The reason why the base sheet 11 is made transparent in this way is that the base sheet 11 is used as a protective layer for the pattern print layer 2 so that the pattern print layer 2 can be seen through. The hiding layer 8 is made of white ink and is provided for the purpose of hiding the IC module 5 as the base sheet 11 is made transparent.

B. Method of Manufacturing IC Card The manufacturing process of the IC card according to the third embodiment will be described with reference to FIG. The same manufacturing steps as those in FIG. 2 are designated by the same reference numerals. 6 differs from FIG. 2 in S1.
Therefore, this point will be described below, and the other description will be omitted.

The first step S11 is a step corresponding to the first step S1 of the first embodiment, and is a step of producing the print label A. That is, first, the pattern print layer 2 is printed on the base sheet 11 by the offset printing method. However, since the pattern print layer 2 is seen through the base sheet 11, the plate used for printing is a reversed plate. After that, the concealing layer 8 is printed on the pattern print layer 2 by the offset printing method to obtain the print label A. The printed label A thus obtained becomes an IC card through the second step to the fifth step as in the first embodiment.

4. Modifications The present invention is not limited to the above-described embodiments, but the following modifications are possible. In the first and second embodiments, the base sheet 1 is
Although a white acrylonitrile-a plastic film made of styrene has been described as an example, the present invention is not limited thereto, and any plastic film can be applied, for example, a polyolefin resin such as polyethylene or polypropylene, A film or sheet made of polyester resin, polycarbonate resin, polyvinyl chloride resin, or the like can be applied. As the base sheet 11 in the third embodiment, the same material as the above-mentioned base sheet 11 can be used as long as it is transparent.

In each of the above-mentioned embodiments, the pattern printing layer 2 is designed to be printed by the offset printing method, but the present invention is not limited to this, and a well-known method such as a gravure printing method or a screen printing method is used. It may be printed by a printing method.

In the above-mentioned first and second embodiments, the material of the print protection layer 3 has been described as an example of transparent polyvinyl chloride resin, but the present invention is not limited to this.
A transparent and abrasion-resistant substance is sufficient, and examples thereof include acrylic resin, vinyl chloride resin, nitrocellulose, hydroxycellulose, carboxymethyl cellulose, polyvinyl alcohol, styrene-maleic acid copolymer, polyester resin or ABS resin. Therefore, the transparent one can be applied. Further, a curable resin such as a thermosetting resin, an ultraviolet curable resin or an electron beam curable resin may be applied.

In each of the above embodiments, the use of the urethane adhesive as the adhesive layer 4 has been described as an example, but the present invention is not limited to this, and an epoxy type, a silicone rubber type or an acrylic type is used. A resin-based or polyamide-based adhesive can be used.

Although the sealed IC module 5 is used in each of the above-described embodiments, the present invention is not limited to this, and it goes without saying that an unsealed IC module may be used. . In this case, the IC module 5 may be fixed to the printed label A at the same time as the sealing, and the resin for sealing and fixing used at this time may be epoxy resin or polypropylene resin.

In the third embodiment, the hiding layer 8 is
Although forming by the offset printing method has been described as an example, the present invention is not limited to this, and may be formed by any printing method, for example, a well-known method such as a gravure printing method or a screen printing method. The printing method may be used.

In the second embodiment, the adhesive layer 41 may be made of the same material as the adhesive layer 4, and the IC protective layer 61 may be made of the same material as the IC protective layer 6, as a matter of course. .

[0038]

As described above, according to the constitutions of claims 1 to 6, especially, since the IC protective layer is provided between the IC module and the injection molding layer, it is possible to control the injection pressure during injection molding. Since the IC module is not scattered or damaged, the reliability of the IC card can be improved.
Since the injection pressure and the injection temperature can be set higher than those without the C protective layer, the degree of freedom in manufacturing can be expanded. Furthermore, since the IC card can be manufactured by a single injection molding, the production efficiency can be improved.

According to the second aspect of the invention, it is possible to provide an IC card on which a design is printed.

According to the third aspect of the present invention, the base material portion includes a transparent base sheet, a print layer on one side of which is reversed and printed, and an opaque hiding layer. Therefore, the base sheet can be used also as the print protection layer, and the IC module can be hidden.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining a configuration of an IC card according to a first embodiment.

FIG. 2 is a process drawing for explaining the manufacturing process of the IC card according to the first embodiment.

FIG. 3 is a sectional view for explaining the configuration of an IC card according to a second embodiment.

FIG. 4 is a process drawing for explaining the manufacturing process of the IC card according to the second embodiment.

FIG. 5 is a sectional view for explaining the configuration of an IC card according to a third embodiment.

FIG. 6 is a process drawing for explaining the manufacturing process of the IC card according to the third embodiment.

[Explanation of symbols]

 1 Base Sheet 2 Design Print Layer (Printing Layer) 3 Print Protective Layer 4 Adhesive Layer 5 IC Module 6 IC Protective Layer 7 Injection Molding Resin (Injection Molding Layer) 8 Concealment Layer A Printing Label (Base Material)

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuhisa Hoshino 1-5-1, Taito, Taito-ku, Tokyo Within Toppan Printing Co., Ltd. Company Japan Steel Works

Claims (4)

[Claims] 1. An IC card manufactured by injection molding, comprising: a flat base member, an IC module fixed to the base member via an adhesive layer, and an IC protective layer covering the IC module. An IC card comprising an injection molding layer laminated on the IC protective layer surface by injection molding. 2. The base material portion is formed by sequentially laminating a base sheet, a print layer having one surface thereof printed, and a print protective layer for protecting the base sheet, and the adhesive layer is formed of the base sheet. The IC card according to claim 1, wherein the IC card is disposed on the other surface. 3. The base material portion is formed by sequentially laminating a transparent base sheet, a print layer on one surface of which is printed upside down and an opaque hiding layer, and the adhesive layer is the hiding layer. The IC card according to claim 1, wherein the IC card is laminated in contact with the. 4. An IC card manufacturing method for manufacturing an IC card having a base material portion, an IC module, an IC protective layer, and an injection molding layer, the IC module being fixed to the base material portion, and An IC card manufacturing method, characterized in that the IC protective layer is provided to cover the IC module, and the injection molding layer is injection-molded on the IC protective layer to manufacture an IC card.