JPH10264162A - Mold and method for manufacturing ic card base - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture easily an IC card base of superior plane smoothness. SOLUTION: A label 3 to be a part of an IC card base is disposed in a fixed mold 8, and the fixed mold 8 and a movable mold 9 are moved close each other to form an inner hollow 12, and a recessed section mold 10 is infiltrated into the inner hollow 12, and the label 3 is clamped by the fixed mold 8 and the recessed section mold 10. Then a material for the card base is injected from a resin injection opening 11, and the IC card base is manufactured by injection molding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold for manufacturing an IC card substrate having a recess formed thereon, and this IC.
The present invention relates to a method for manufacturing a card base material.

[0002]

2. Description of the Related Art Conventionally, magnetic storage media such as floppy disks and cassette tapes have been widely used as external storage devices for computers and electronic devices attached to the computers. However, in recent years, a card-shaped or package-shaped storage medium provided with a semiconductor memory such as a RAM and a ROM has been used in order to reduce the size and improve the ease of handling. As such a storage medium, there is an IC card on which an IC module provided with a semiconductor memory is mounted. Meanwhile, credit card, ID
Conventionally, magnetic cards have been mainly used as storage media such as cards and cash cards. However, in recent years,
In order to use these as storage media, a microprocessor, a RAM, a semiconductor memory such as a ROM, etc.
An IC card mounting a C module has been developed.
This type of IC card includes a contact type and a non-contact type, but in any case, the information storage amount is very large and the security is high.

[0003] Such an IC card is manufactured by first preparing a card base material in which an IC module is embedded and mounting the IC module thereon. Conventionally, the following method has been proposed as a method for manufacturing the card base material. (1) A card base material is manufactured by a lamination method in which a plurality of resin sheets are integrated by pressing. Then, a recess for mounting the IC module is formed by cutting or the like. (2) A card substrate having a recess for mounting an IC module is manufactured by one injection molding. After this,
A printing layer is provided by small piece printing, foil transfer, or the like. (3) As shown in JP-A-3-24000, an IC module is placed in a mold, resin is first injected, and the IC module is fixed. Next, another mold is used to perform a second resin injection to produce an IC card. Thereafter, a printing layer is provided in the same manner as in (2). (4) After placing the printed label in the mold, an IC card base having a recess for mounting the IC module is prepared by injection molding, and the label is fixed to the card base.

[0004]

However, the manufacturing method of (1) has a problem in terms of efficiency and cost because the number of steps is increased because a recess for mounting an IC module is provided by post-processing. In addition, in the manufacturing method (2), a partial stress is generated in a portion forming a bottom wall of the concave portion (a portion of the card base material having the smallest thickness), which causes an unfilled molding resin or a flat surface of the card base material. Sex is impaired. For this reason, when a printing layer is provided on the surface of the card base material by small piece printing, foil transfer, or the like, there is a possibility that print omission or the like may occur during printing. In the manufacturing method (3), there is no problem of distortion due to partial stress during the first injection for fixing the IC module. Inside volume is reduced. For this reason, an uneven stress is generated, and planar smoothness is impaired. Furthermore, (4)
In the manufacturing method of (3), since the thickness of the portion forming the bottom wall of the concave portion (the thinnest portion of the card base material) is further reduced by the thickness of the label, distortion due to partial stress is reduced by the manufacturing method of (3). And the planar smoothness is impaired.

The present invention has been made in view of the above circumstances, and is an IC which can efficiently manufacture an IC card base material which has less distortion due to partial stress and has excellent flatness.
An object of the present invention is to provide a mold for manufacturing a card base material and a method for manufacturing an IC card base material.

[0006]

In order to solve the above-mentioned problems, a mold for manufacturing an IC card base material according to the present invention comprises a metal mold for manufacturing an IC card base material having a recess for embedding an IC module. A mold, a fixed mold, and a movable mold that is adapted to move relative to the fixed mold and forms an internal cavity for molding the IC card base material in cooperation with the fixed mold; A mold for a recess made to be able to enter the internal cavity in order to form the recess.

[0007] A method of manufacturing an IC card base material according to the present invention uses the above-described die for manufacturing an IC card base material, and arranges a label provided on the IC card base material in the fixed die.
The movable mold is brought closer to the fixed mold to form the internal cavity, and the concave mold is made to enter the internal cavity to label the label with the fixed mold or the movable mold and the concave. After being held by a mold, the material of the IC card base material is injected into the internal cavity and solidified to form the IC card base material having the concave portion formed thereon. .

In this method, the label is held between the fixed or movable mold and the concave mold. Since the recess mold forms the recess of the IC card base material,
The material of the IC card base material does not enter between the label and the concave portion. As a result, the problem that the material enters the thin part of the mold and generates an uneven stress is avoided, and it is possible to manufacture an IC card substrate having excellent planar smoothness. Further, it is not necessary to form a concave portion for mounting the IC module in a later step. Furthermore, there is no need for post-printing since the card base is made after the pre-printed label is placed. For these reasons, the number of steps is small and the process is efficient and cost-effective.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. (1) Configuration of IC Card First, FIG. 1 is a side sectional view of an IC card base material 1 formed by a manufacturing method according to an embodiment of the present invention. As shown in the figure, the IC card base 1 is made of a solidified resin 2
And a label 3 are laminated, and a printing layer 4 is formed on the label 3 as necessary. A concave portion 5 is formed in a layer of the resin 2 of the IC card base material 1. The recess 5 penetrates through the layer of the resin 2 and reaches the label 3. As shown in FIG. 2, an IC module 7 having a built-in semiconductor memory is fitted into the concave portion 5 of the IC card substrate 1, and the IC module 7 is bonded to the concave portion 5 by an adhesive 6. Thus, the IC card is completed by embedding the IC module 7 in the recess 5.

(2) Configuration of IC Card Base Manufacturing Die FIG. 3 is a side sectional view of an IC card base manufacturing die according to an embodiment of the present invention. As shown in the figure, the mold for manufacturing an IC card base material includes a fixed mold 8 and a fixed mold 8.
And a movable mold 9 disposed above the movable mold 9. Fixed mold 8
A concave portion 8a is formed on the upper surface of the movable mold 9, and a concave portion 9a is formed on the lower surface of the movable mold 9. The movable mold 9 is
The movable mold 9 is movable up and down.
, An inner cavity 12 (see FIG. 5) described later is formed by the concave portions 8a and 9a. In addition, a concave mold 10 is disposed on the upper wall of the movable mold 9. The concave mold 10 is movable with respect to the movable mold 9 and can enter the internal cavity 12. Also, fixed mold 8
Is formed with a resin injection port 11 for injecting a resin into the internal cavity 12.

(3) Method for Manufacturing IC Card Base Material Next, the method for manufacturing an IC card according to the present embodiment will be described. As shown in FIG. 4, the label 3 provided on the IC card substrate 1 is placed in the recess 8 a of the fixed mold 8. Label 3
Is a thickness (50) obtained by subtracting the depth of the concave portion 5 for mounting the IC module 7 from the thickness of the IC card substrate 1.
μm to 200 μm).

As shown in FIGS. 1 and 2, the label 3 is a portion having the smallest thickness of the card substrate 1, and also has a role of fixing a printed layer 4 on which a pattern, characters, etc. are printed on an IC card. Sheet. Examples of the material of the label 3 include high-quality paper, coated paper, art paper, paper having printability such as card paper, synthetic paper, polyolefin resins such as polyethylene and polypropylene, polyester resins, polycarbonate resins, polyvinyl chloride resins, ABS (acrylonitrile-butadiene-styrene copolymer) resin,
Alternatively, a composite of these resins is used. A plastic film or sheet formed from these materials by extrusion molding, calender roll molding, or the like can be used as the label 3.

The printing layer 4 on the label 3 can be provided by a known printing method such as an offset printing method, a gravure printing method, and a screen printing method. As the ink for forming the printing layer 4, in the case of offset printing, polyester acrylate resin, polyurethane acrylate resin,
Epoxy acrylate resins, alkyd resins, and the like can be used. In the case of gravure printing, inks such as cellulose resin, chlorinated polypropylene, vinyl chloride / vinyl acetate copolymer resin, saturated polyester resin, and acrylic resin can be used. In the case of screen printing, inks such as polyester resins, vinyl chloride / vinyl acetate copolymer resins, and acrylic resins can be used.

Although not shown, a protective layer for improving the abrasion resistance of the printed layer 4 on the label 3 may be provided. Acrylic resin, vinyl chloride resin,
Nitrocellulose, hydroxycellulose, carboxymethylcellulose, polyvinyl alcohol, styrene
Maleic acid copolymers, polyester resins, ABS resins and the like can be used. These can be dissolved or dispersed in a solvent such as toluene or xylene, applied by a gravure method, a roll coating method, or the like, and then dried to form a protective layer. According to this method, it is possible to impart heat resistance to the protective layer. Further, a curable resin such as a thermosetting resin or an electron beam curable resin may be used.

After placing the label 3 in the recess 8a of the fixed mold 8 as described above, the movable mold 9 is moved closer to the fixed mold 8 to form the internal cavity 12 as shown in FIG. Then, the concave mold 10 is made to enter the internal cavity 12, and the label 3 is held between the fixed mold 8 and the concave mold 10. Thereafter, the material of the card base material is injected from the resin injection port 11 and the material is waited for solidification. Thus, the IC card substrate 1
Is injection molded. Further, as shown in FIG.
Thus, the IC card is completed by bonding the IC card substrate 1 and the IC module 7 together. In order to enhance the uniformity of the card surface, the movable mold may be moved before the solidification of the card base material and before the solidification, to compress the filled material.

(4) Modified Example of Manufacturing Method of IC Card Base In the above embodiment, the concave mold 10 is provided in the movable mold 9, and the concave mold 10 is moved to fix the fixed mold 8. The label 3 is held between the recessed mold 10 and the recessed mold 10, but the recessed mold is disposed so as to be movable to the fixed mold, and the label 3 is held between the recessed mold and the movable mold. May be.

[0017]

First, a 200 μm-thick polyvinyl chloride resin label 3 printed on one side by offset printing was used.
As shown in FIG. 4, it was arranged in the recess 8a of the fixed mold 8. Thereafter, as shown in FIG. 5, the movable mold 9 is moved closer to the fixed mold 8 to form an internal cavity 12, and the concave mold 10 is made to enter the internal cavity 12 to attach the label 3 to the fixed mold. After being held between the mold 8 and the concave mold 10, the resin 2 is formed by injection molding.
Was injected. In this way, the IC card substrate 1 on which the concave portion 5 for mounting the IC module 7 was formed was completed. By mounting the IC module 7 on the IC card substrate 1 with the adhesive 6, an IC card having good appearance and high quality could be manufactured.

[0018]

As described above, according to the present invention,
When performing injection molding, distortion due to partial stress can be reduced. This makes it possible to manufacture an IC card having excellent planar smoothness. Further, in the present invention, it is not necessary to form the concave portion for mounting the IC module by post-processing as compared with the conventional method. Further, since the card base material is manufactured after the pre-printed label is arranged, the necessity of post-printing is eliminated. For these reasons, the number of steps is small and the process is efficient and cost-effective.

[Brief description of the drawings]

FIG. 1 is a side sectional view of an IC card base material manufactured by an IC card base material manufacturing method according to an embodiment of the present invention.

FIG. 2 is a side sectional view of an IC card on which an IC module is mounted.

FIG. 3 is a side sectional view of a mold for manufacturing an IC card base material according to an embodiment of the present invention.

FIG. 4 is a side sectional view showing a state where a label is arranged in a fixed mold of the mold for manufacturing an IC card base material.

FIG. 5 is a side sectional view showing a state in which a label is held between a fixed die and a concave die of the IC card base material manufacturing die.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... IC card base material, 2 ... resin, 3 ... label, 4 ... printing layer, 5 ... recessed part, 6 ... adhesive, 7 ... IC module, 8 ...
Fixed mold, 9: movable mold, 10: concave mold, 11: resin injection port, 12: internal cavity

Claims (2)

[Claims] 1. A mold for manufacturing an IC card base material having a recess for embedding an IC module, wherein the mold is adapted to move relative to a fixed mold and the fixed mold. A movable mold for forming an internal cavity for molding the IC card base material in cooperation with a fixed mold; and a concave mold for allowing penetration into the internal cavity for molding the concave. Characteristic mold for manufacturing IC card base material. 2. Using the mold for manufacturing an IC card base material according to claim 1, arranging a label provided on the IC card base material in the fixed mold, and positioning the label on the fixed mold. Forming the internal cavity by approaching the movable mold, and allowing the concave mold to enter the internal cavity to narrow the label between the fixed mold or the movable mold and the concave mold. Manufacturing the IC card base material, wherein the material of the IC card base material is injected into the internal cavity and solidified to form the IC card base material in which the concave portions are formed. Method.