JPH1110681A - Manufacture of ic card - Google Patents
Manufacture of ic cardInfo
- Publication number
- JPH1110681A JPH1110681A JP17044897A JP17044897A JPH1110681A JP H1110681 A JPH1110681 A JP H1110681A JP 17044897 A JP17044897 A JP 17044897A JP 17044897 A JP17044897 A JP 17044897A JP H1110681 A JPH1110681 A JP H1110681A
- Authority
- JP
- Japan
- Prior art keywords
- card
- mold
- resin
- manufacturing
- distribution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Credit Cards Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は運転免許証、社員
証、会員証、外国人登録証、学生証等の認証識別カード
に用いるのに好適な非接触式のＩＣカードを、射出成型
法により製造する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card suitable for use as an identification card for a driver's license, an employee card, a membership card, an alien registration card, a student ID card, etc. by an injection molding method. It relates to a method of manufacturing.
【０００２】[0002]
【従来の技術】非接触式のＩＣカードは電気部品が表面
に露出していないために、表面に顔画像等の認証識別画
像を形成したり、印刷を行ったりすることも可能で、且
つＩＣに本人確認情報等を記憶させることによって偽変
造を防止するのに有利で認証識別カードとしての用途に
好適である。その製造方式としては、熱貼合法、接着剤
貼合法及び射出成形法が知られているが、このうち射出
成形法が量産には有利である。2. Description of the Related Art A non-contact type IC card is capable of forming an authentication identification image such as a face image and printing on the surface because electric parts are not exposed on the surface. By storing personal identification information or the like in the storage device, it is advantageous to prevent forgery and falsification, and is suitable for use as an authentication identification card. As the manufacturing method, a heat bonding method, an adhesive bonding method, and an injection molding method are known. Among them, the injection molding method is advantageous for mass production.
【０００３】ＩＣカードを射出成形で製造する方法とし
ては、特開平５−２８６２９２号、同５−２８６２９４
号、同５−２８６２９５号及び同７−２３２３４５号に
ＩＣモジュールを収納する凹部を有するＩＣカード基板
を射出成形で製造し、該凹部にモジュールを載置してＩ
Ｃカードとすることが、特開平５−２１８２３７号には
内部にＩＣチップを含む部品が装着された外皮容器に発
泡性樹脂を注入して発泡させＩＣカード内部に樹脂を充
填することが、特開平５−２６２０８５号には金型の一
方の面に表面シート及びＩＣチップを含む部品を載置し
て樹脂を射出してＩＣカードとすることが、特開昭６１
−２２２７１２号、同６１−２２２７１３号、同６１−
２２２７１５号等にはＩＣチップを含む部品を金型内の
所定の位置に載置して樹脂を射出してＩＣカードとする
ことが、それぞれ記載されている。これらのうちでは、
予め双方の表面シートとＩＣチップを含む部品を金型内
の所定の位置に載置して樹脂を射出し、一体成形してＩ
Ｃカードとすることが工程を簡略にできるメリットがあ
る。As a method of manufacturing an IC card by injection molding, Japanese Patent Application Laid-Open Nos. 5-286292 and 5-286294.
No. 5-286295 and No. 7-232345, an IC card substrate having a concave portion for accommodating an IC module is manufactured by injection molding, and the module is placed in the concave portion, and
Japanese Patent Application Laid-Open No. Hei 5-218237 discloses that a foamable resin is injected into a skin container having a part including an IC chip mounted therein and foamed to fill the inside of the IC card with a resin. Japanese Unexamined Patent Publication No. Sho 61-26285 discloses that an IC card is formed by mounting a part including a surface sheet and an IC chip on one surface of a mold and injecting resin.
-222712, 61-222713, 61-
No. 222715 describes that an IC card is formed by mounting a component including an IC chip at a predetermined position in a mold and injecting resin. Of these,
Parts including the both surface sheets and the IC chip are previously placed at predetermined positions in the mold, resin is injected, and the resin is integrally molded.
The advantage of using a C card is that the process can be simplified.
【０００４】射出成形で作成したＩＣカードを認証識別
カードとする場合、強度や耐水性等の要請からカード基
材樹脂としては通常塩化ビニル系のものを用い、作成し
たカードの表面シートにフォーマットや顔写真等の認証
識別画像及び書誌事項を印刷し、必要に応じてエンボス
加工を施して筆記性を付与している。[0004] When an IC card prepared by injection molding is used as an authentication identification card, a vinyl chloride resin is usually used as a card base resin because of demands for strength, water resistance, and the like. An authentication identification image such as a face photograph and bibliographic items are printed, and embossing is performed as necessary to impart writability.
【０００５】[0005]
【発明が解決しようとする課題】前述の如く、工程を簡
略にするために金型内部に筆記層を有するシートを載置
し、更にＩＣチップを含む部品を金型内の所定の位置に
載置して樹脂を射出し、一体成形してＩＣカードとする
と、２００〜３５０℃といった高温の溶融樹脂をゲート
部から流入させ、圧縮することなるので、筆記層の凹凸
が無くなって筆記性を損なってしまう場合が多い。As described above, in order to simplify the process, a sheet having a writing layer is placed inside a mold, and a part including an IC chip is placed at a predetermined position in the mold. When the resin is injected and molded into an IC card, the molten resin having a high temperature of 200 to 350 ° C. flows from the gate and is compressed, so that the unevenness of the writing layer is lost and the writing property is impaired. In many cases.
【０００６】これに対して、成形時の熱や圧力に耐えて
凹凸を維持するには特殊な材料を採用することになり製
品コスト上不利である。又、成形後に凹凸を付与して筆
記性を持たせることは製造工程を複雑にすることにな
る。On the other hand, in order to withstand heat and pressure during molding and maintain irregularities, a special material is used, which is disadvantageous in terms of product cost. In addition, providing irregularities after molding to impart writability complicates the manufacturing process.
【０００７】本発明は上記の事情に鑑みてなされたもの
であり、その目的は、射出成形により形成するＩＣカー
ドに筆記性を付与する簡便な方法を提供することに有
る。[0007] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a simple method for imparting writability to an IC card formed by injection molding.
【０００８】[0008]
【課題を解決するための手段】本発明の上記目的は、予
め双方の表面シートとＩＣチップを含む部品を金型内の
所定の位置に載置して樹脂を射出し、一体成形するにあ
たり、内面の少なくとも１部にシボを有する金型を用い
るＩＣカードの製造方法、前記シボは凹凸間の落差が１
〜１００μｍで、凸部の分布が略均一であること、前記
凹凸間の落差が５〜５０μｍであること、及び、前記凹
凸間の落差の分布の幅がＩＣカードの最大厚みの１／１
０〜１／５００の範囲にあること、によって達成され
る。SUMMARY OF THE INVENTION The object of the present invention is to provide a method for integrally mounting both parts including a top sheet and an IC chip at predetermined positions in a mold, injecting a resin, and integrally molding. A method for manufacturing an IC card using a mold having a grain on at least a part of an inner surface thereof, wherein the grain has a drop of 1
１００100 μm, the distribution of the projections is substantially uniform, the difference between the irregularities is 5 to 50 μm, and the width of the distribution of the difference between the irregularities is 1/1 of the maximum thickness of the IC card.
In the range of 0 to 1/500.
【０００９】即ち、本発明者は射出成形用の金型の内面
にシボ加工を施し、射出成形時にシボを転写してＩＣカ
ード表面に筆記性を付与しようと考え、本発明に至っ
た。That is, the inventor of the present invention thought that the inner surface of the mold for injection molding should be subjected to graining and that the grain should be transferred at the time of injection molding to give a writability to the surface of the IC card.
【００１０】[0010]
【発明の実施の形態】以下、実施形態を挙げて本発明を
詳細に説明するが、本発明の態様はこれに限定されな
い。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments, but embodiments of the present invention are not limited thereto.
【００１１】図１に本発明に係るＩＣカードの長辺方向
の断面の構成を示す。FIG. 1 shows a configuration of a cross section of a long side direction of an IC card according to the present invention.
【００１２】図においては、表面に筆記性を有するシー
ト１の裏面に直接又はクッション層を介してＩＣチップ
２及びコイル状アンテナ３が接合部４と共に接着剤５に
て接着されている（接着剤５で封入されている全体をＩ
Ｃモジュールとも言う）。シート１及び対向するシート
６の間の基板樹脂７は射出によって充填されたものであ
る。In FIG. 1, an IC chip 2 and a coiled antenna 3 are bonded together with a bonding portion 4 with an adhesive 5 directly or via a cushion layer on the back surface of a sheet 1 having a writable surface (adhesive). The whole enclosed in 5 is I
Also called C module). The substrate resin 7 between the sheet 1 and the opposing sheet 6 is filled by injection.
【００１３】表面シートの材質としては、ポリエチレン
テレフタレート（ＰＥＴ）、ポリエチレンナフタレート
（ＰＥＮ）、ＡＢＳ樹脂、塩化ビニル樹脂、ポリカーボ
ネート樹脂等を用いることができる。As the material of the topsheet, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), ABS resin, vinyl chloride resin, polycarbonate resin and the like can be used.
【００１４】基板樹脂は、一般的にはＡＢＳ樹脂が多用
されており本発明にも適用できるが、射出成形用に結晶
化がコントロールされているイーストマンケミカル社の
ＰＥＴ−Ｇ（Ｒ）が、受像シートが融着し易い点からも
好適である。As the substrate resin, an ABS resin is generally widely used and can be applied to the present invention. However, PET-G (R) of Eastman Chemical Co., Ltd., whose crystallization is controlled for injection molding, is: It is also preferable in that the image receiving sheet is easily fused.
【００１５】図１のＩＣモジュールはアンテナコイルを
有するものであるが、アンテナパターンがプリント基板
に形成されているものを用いてもよい。プリント基板と
しては、ポリエステル等の熱可塑性のフィルムが用いら
れ、更に耐熱性が要求される場合はポリイミドが有利で
ある。この場合、ＩＣチップとアンテナパターンとの接
合は銀ペースト、銅ペースト、カーボンペースト等の導
電性接着剤（日立化成工業のＥＮ−４０００シリーズ、
東芝ケミカルのＸＡＰシリーズ等）や、異方性導電フィ
ルム（日立化成工業製アニソルム等）を用いて行う。Although the IC module shown in FIG. 1 has an antenna coil, an IC module having an antenna pattern formed on a printed circuit board may be used. As the printed circuit board, a thermoplastic film such as polyester is used, and when heat resistance is required, polyimide is advantageous. In this case, the bonding between the IC chip and the antenna pattern is performed using a conductive adhesive such as a silver paste, a copper paste, or a carbon paste (Hitachi Chemical's EN-4000 series,
This is performed using an anisotropic conductive film (such as Anisorm manufactured by Hitachi Chemical Co., Ltd.) or a Toshiba Chemical XAP series.
【００１６】図２は本発明に係る一体成形法を説明する
図である。FIG. 2 is a view for explaining the integral molding method according to the present invention.
【００１７】図２において、ゲート２３を有し、カード
に筆記性を付与する部分にシボ加工が施された下金型２
１にはＩＣモジュール８が裏面に接着されたシート１が
載置され真空吸着等の手段により固定される。一方、上
金型２２にも表面シートが載置されて同様に固定され
る。こちら側にも筆記性を付与するのであれば上金型に
もシボ加工を施す。両金型を突き合わせてキャビティ２
４を形成し、ゲート２３から基板樹脂を射出したのち、
上金型にてキャビティ２４を一点鎖線で示すカードの厚
さに相当する位置まで矢印の如く圧縮する。これにより
ゲートはカットされて、金型を開放することにより、前
述の図１の様なＩＣカードが得られる。In FIG. 2, a lower mold 2 having a gate 23 and a grain-finished portion is provided on a portion for giving writability to the card.
A sheet 1 having an IC module 8 adhered to its back surface is placed on 1 and fixed by means such as vacuum suction. On the other hand, the top sheet is also placed on the upper mold 22 and fixed similarly. If it is necessary to provide writability on this side, the upper mold is also subjected to graining. Cavity 2 with both molds
After forming 4 and injecting the substrate resin from the gate 23,
The upper mold is used to compress the cavity 24 to a position corresponding to the thickness of the card indicated by the dashed line as indicated by the arrow. Thus, the gate is cut and the mold is opened, whereby the IC card as shown in FIG. 1 is obtained.
【００１８】射出は、溶融樹脂の温度１５０〜２５０
℃、金型の温度２０〜９０℃、射出圧力３００〜２００
０ｋｇ／ｃｍ2程度の条件で行えばよい。The injection is performed at a temperature of the molten resin of 150 to 250.
° C, mold temperature 20 ~ 90 ° C, injection pressure 300 ~ 200
It may be performed under the condition of about 0 kg / cm 2 .
【００１９】図３（ａ）、（ｂ）にシボ加工の例を拡大
して示す。FIGS. 3A and 3B show an enlarged example of the graining.
【００２０】筆記性の観点から、金型のシボは凹凸間の
落差が１〜１００μｍ（更には５〜５０μｍ）で、凹凸
間の落差の分布の幅がＩＣカードの最大厚みの１／１０
〜１／５００の範囲にあり、凸部の分布が均一であるこ
とが好ましく、凸部の密度は２０〜１００００個／ｍｍ
2が好ましい。又、図３（ｂ）の様に微細な凹凸と相対
的に大きなうねりを組み合わせたシボとしても良い。From the viewpoint of writability, the grain of the mold has a drop between the unevenness of 1 to 100 μm (further 5 to 50 μm), and the width of the distribution of the drop between the unevenness is 1/10 of the maximum thickness of the IC card.
It is preferable that the distribution of the projections is uniform, and the density of the projections is 20 to 10000 / mm.
2 is preferred. Also, as shown in FIG. 3B, a grain may be formed by combining fine irregularities and a relatively large undulation.
【００２１】又、例えば図４の如く、点線で囲んだ部分
のみに落差１０μｍの凹凸を形成して筆記性を付与する
ことを目的とした、部分的なシボ加工を施せば良い。Further, as shown in FIG. 4, for example, partial embossing may be performed for the purpose of imparting writability by forming irregularities with a drop of 10 μm only in the portion surrounded by the dotted line.
【００２２】[0022]
【発明の効果】本発明によれば、射出成形時にＩＣカー
ドに筆記性を付与できる。According to the present invention, writability can be imparted to an IC card during injection molding.
【図１】本発明に係るＩＣカードの長辺方向の断面の構
成を示す図。FIG. 1 is a diagram showing a configuration of a cross section of a long side direction of an IC card according to the present invention.
【図２】本発明に係る一体成形法を説明する図。FIG. 2 is a diagram illustrating an integral molding method according to the present invention.
【図３】シボ加工の例の拡大図。FIG. 3 is an enlarged view of an example of graining.
【図４】筆記性を付与する例を示す図。FIG. 4 is a diagram showing an example in which writability is imparted.
１，６ 表面シート ２ ＩＣチップ ３ コイル状アンテナ ４ 接合部 ５ 接着剤 ７ 基板樹脂 ８ ＩＣモジュール ２１ 下金型 ２２ 上金型 ２３ ゲート ２４ キャビティ 1,6 Surface sheet 2 IC chip 3 Coiled antenna 4 Joining part 5 Adhesive 7 Substrate resin 8 IC module 21 Lower mold 22 Upper mold 23 Gate 24 Cavity
Claims (4)
む部品を金型内の所定の位置に載置して樹脂を射出し、
一体成形するにあたり、内面の少なくとも１部にシボを
有する金型を用いることを特徴とするＩＣカードの製造
方法。1. A part including both surface sheets and an IC chip is previously placed at a predetermined position in a mold, and a resin is injected.
A method of manufacturing an IC card, comprising: using a mold having a grain on at least a part of an inner surface when integrally molding.
ｍで、凸部の分布が略均一であることを特徴とする請求
項１に記載のＩＣカードの製造方法。2. The grain has a drop between unevenness of 1 to 100 μm.
2. The method for manufacturing an IC card according to claim 1, wherein the distribution of the protrusions is substantially uniform in m.
ことを特徴とする請求項２に記載のＩＣカードの製造方
法。3. The method for manufacturing an IC card according to claim 2, wherein the difference between the irregularities is 5 to 50 μm.
ドの最大厚みの１／１０〜１／５００の範囲にあること
を特徴とする請求項２又は３に記載のＩＣカードの製造
方法。4. The method for manufacturing an IC card according to claim 2, wherein the width of the distribution of the drop between the irregularities is in the range of 1/10 to 1/500 of the maximum thickness of the IC card. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17044897A JPH1110681A (en) | 1997-06-26 | 1997-06-26 | Manufacture of ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17044897A JPH1110681A (en) | 1997-06-26 | 1997-06-26 | Manufacture of ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1110681A true JPH1110681A (en) | 1999-01-19 |
Family
ID=15905125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17044897A Pending JPH1110681A (en) | 1997-06-26 | 1997-06-26 | Manufacture of ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1110681A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002288619A (en) * | 2001-03-26 | 2002-10-04 | Hitachi Cable Ltd | Manufacturing method for ic card |
| JP2008207457A (en) * | 2007-02-27 | 2008-09-11 | Hara Kasei Kogyo Kk | Soft card |
-
1997
- 1997-06-26 JP JP17044897A patent/JPH1110681A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002288619A (en) * | 2001-03-26 | 2002-10-04 | Hitachi Cable Ltd | Manufacturing method for ic card |
| JP4706117B2 (en) * | 2001-03-26 | 2011-06-22 | 凸版印刷株式会社 | IC card manufacturing method |
| JP2008207457A (en) * | 2007-02-27 | 2008-09-11 | Hara Kasei Kogyo Kk | Soft card |
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