JPH09123650A - Ic card and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a warp generated by the thermal shrinkage of a resin in the manufacture of an IC card for storing an IC module by injection molding. SOLUTION: A front face label 1 and a rear face label 1 is arranged at a mutually opposite position to a rear face label 2 at an interval from each other in a molding die. In addition, an IC module 4 is arranged, in the center, between the front face label 1 and the rear face label 2, on the opposite face to the rear face label 2, through interspersed adhesive layers 8. Next, a molten resin 5 is poured into a cavity between these labels 1, 2, so that both labels 1, 2 are bound together with the IC module 4 in one piece. After cooling and solidifying the resin 5, the molding die is opened to obtain an IC card 11. As the IC module 4 is located in the center between the labels 1, 2, the thermal shrinkage of the front side and the rear side is equalized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an IC card equipped with an IC module including electronic parts and the like.

[0002]

2. Description of the Related Art Conventionally, magnetic recording media such as floppy disks and cassette tapes have been widely used as external recording devices for computers and electronic equipment using computers. However, in recent years, a card-shaped or package-shaped recording medium provided with a semiconductor memory such as a RAM or a ROM has been used in order to achieve miniaturization and easy handling. On the other hand, in a card-shaped recording medium such as a credit card, an ID card, and a cash card, a so-called IC module including a semiconductor memory such as a microprocessor, a RAM, or a ROM is mounted on a card material as an alternative to a magnetic card. IC cards have been developed. This type of IC card is classified into a contact type and a non-contact type, but in both cases, it is excellent in that it has a very large information storage capacity and high security.

As the non-contact type IC card, an IC card which operates by supplying power by utilizing electromagnetic induction of a coil inside the card has been developed. FIG. 7 shows an example of the structure of such an IC card. This IC
The card has an adhesive layer 3 on one of the upper and lower labels 1, 2.
The IC module 4 is fixed via the
The resin 5 melted between the two is injection-molded, cooled and solidified, and integrally molded. Each of the labels 1 and 2 is provided with a painting such as a picture or a character by a printing layer 6, and the printing layer 6 is covered with a transparent protective layer 7.

[0004]

When the above-mentioned conventional IC card is manufactured, there is a problem that when the molten resin 5 is cooled, the card is warped or otherwise distorted. That is, due to the difference in heat shrinkage between the coil portion and the resin in the metal IC module 4, the resin having a large heat shrinkage warps to the thick side (upper side in the case of FIG. 7). Also, IC
The uneven position of the module 4 on one side of the front and back sides (the lower side in FIG. 7), which causes uneven heat shrinkage, also causes warpage. The distortion such as the warpage was more remarkable in the larger coil having a long communication distance. Therefore, it is difficult to manufacture a non-contact type card having a long communication distance by injection molding.

The present invention has been made in view of the above circumstances. It is possible to stably manufacture a card with less distortion such as warpage, and to manufacture a non-contact type card with a long communication distance by injection molding. It is intended to provide a manufacturing method.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above object, and an IC card according to claim 1 comprises a front side label and a back side label which are arranged to face each other with a space therebetween. An IC card provided with an IC module fixed to at least one of the facing surfaces of the label via an adhesive layer, and a resin filled between the front label and the back label to integrally bond both labels with the IC module. In the above, the adhesive layer is scatteredly arranged on the surface of the label on the side where the IC module is fixed, and the thickness thereof is such that the IC module is arranged substantially in the center between the front side label and the back side label. It is characterized by being set as follows. According to a second aspect of the present invention, in the invention of the first aspect, the adhesive layer has a heat shrinkage rate substantially the same as that of the resin and is provided on substantially the entire surface of the label.

In the method of manufacturing an IC card according to a third aspect of the present invention, the front side label and the back side label are arranged so as to face each other with a space therebetween, and the IC modules are interspersed on at least one of the facing surfaces of these labels. It is characterized in that it is arranged at a substantially central position between the front side label and the back side label via the layer, and thereafter, a molten resin is filled between these labels to integrally bond both labels with the IC module. According to a fourth aspect of the present invention, the adhesive layer is provided on substantially the entire surface of the label with a material having a thermal contraction rate substantially the same as that of the resin.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. A. First Embodiment (FIGS. 1 to 4: Claim 1 and
3 based) Figure 1 shows a manufacturing method of an IC card according to the first embodiment, reference numeral 20 is a die 20 for dividable injection molding vertically. The mold 20 has an inner part 21 formed in a thin card-shaped space having a predetermined size, and
An injection port 22 leading to the inside 21 is formed.

In manufacturing an IC card, first, the front surface label 1 and the back surface label 2 are placed inside the mold 20.
1. The upper surface and the lower surface of 1 are arranged parallel to each other with a space therebetween and are loaded. For loading, a means such as adsorption is used. Each of the labels 1 and 2 has the same thickness, and one side is provided with a painting such as a picture or a character by a printing layer 6, and the printing layer 6 is covered with a transparent protective layer 7. Inside of mold 20 2
When loading No. 1, the printing layer 6 faces the outer surface side. A cavity 23 filled with resin is formed between the labels 1 and 2.

Further, the upper surface of the back surface label 2 (front surface label 1
The IC module 4 is arranged and fixed in parallel with the back surface label 2 via the adhesive layer 8 in the center of the surface (opposite side to). As shown in FIG. 3, the adhesive layers 8 are scattered on the back surface label 2 at positions corresponding to the four corners of the IC module 4. The thickness of the adhesive layer 8 is set so that the IC module 4 is arranged substantially in the center between the front surface label 1 and the rear surface label 2. Conversely speaking, the IC module 4 fixed by the adhesive layer 8 is arranged just in the center between the front surface label 1 and the rear surface label 2.

Here, each of the labels 1, 2, the printing layer 6,
The materials, forming methods, and the like of the protective layer 7, the IC module 4, and the adhesive layer 8 will be described. (1) Label As the front surface label 1 and the rear surface label 2, any paper having printability, synthetic paper, a resin film, or a sheet made of a composite of those materials is used.
For example, as paper, fine paper, coated paper, art paper,
Examples include paper having printability such as card paper and synthetic paper. In the resin system, a resin film or sheet obtained by extruding a material such as a polyolefin resin such as polyethylene or polypropylene, a polyester resin, a polycarbonate resin, a polyvinyl chloride resin, or an ABS resin by an extrusion molding method, a calendar roll molding method, or the like is used. To be

(2) Printing Layer 6 The printing layer 6 can be provided by a known printing method such as an offset printing method, a gravure printing method or a screen printing method. The materials used differ slightly depending on the printing method and are exemplified below.・ Offset printing method-polyester acrylate resin, polyurethane acrylate resin, epoxy acrylate resin, alkyd resin. -Gravure printing method-polyester resin, polyurethane resin, acrylic resin, cellulosic resin, chlorinated propylene, vinyl chloride / vinyl acetate copolymer. -Screen printing method-vinyl chloride / vinyl acetate copolymer, acrylic polyol resin.

(3) Protective Layer 7 The protective layer 7 can be formed by printing using a gravure printing method or a roll coat printing method. As the material to be used, resins such as acrylic resin, vinyl chloride resin, nitrocellulose, hydroxycellulose, carboxymethyl cellulose, polyvinyl alcohol, styrene-maleic acid copolymer, polyester resin and ABS resin are used. Also,
A curable resin such as a thermosetting resin, an ultraviolet curable resin, or an electron beam curable resin may be used.

(4) IC Module 4 The IC module 4 includes an IC chip for memory, an electrostatic plate for data communication, a coil memory IC for receiving power supply by electromagnetic induction, and communication for electromagnetic induction. It is composed of a coil as a function of the antenna. FIG. 4 shows an I composed of an IC 30 and a coil 31.
An example of the form of the C module 4 is shown. IC module 4
Is usually sealed with an epoxy resin, a polypropylene resin or the like for convenience of handling.

(5) Adhesive Layer 8 The adhesive layer 8 is composed of an adhesive for fixing the IC module 4 to the label (in this case, the backside label 2), but depending on the material of the backside label 2 and the IC module 4, the adhesive layer 8 may be used. Adhesion with 8 may not be expected. In this case, a primer layer may be provided between the adhesive layer 8 and the IC module 4. As a method of forming the adhesive and the primer layer, a known printing method such as a gravure printing method, a screen printing method, and a tacho printing method can be used, or the adhesive and the material of the primer layer can be provided by simply dropping them. .

Materials for the adhesive and primer layers are exemplified below. -Adhesives-thermoplastic resins such as polyester resin, polyurethane resin, acrylic resin, cellulosic resin, chlorinated propylene, vinyl chloride / vinyl acetate copolymer, epoxy resin, polystyrene resin, and rubber resin. -Primer layer material-similar to adhesives, thermoplastic resins such as polyester resin, polyurethane resin, acrylic resin, cellulosic resin, chlorinated propylene, vinyl chloride / vinyl acetate copolymer, epoxy resin, polystyrene resin, rubber resin, etc. .

Now, when the labels 1 and 2 are set together with the IC module 4 in the inside 21 of the mold 20 as described above, a predetermined amount of molten resin is injected from the injection port 22 into the cavity 23.
It is injected and filled in, cooled and solidified. The resin may be filled by an injection compression molding method for the purpose of improving the filling property of the resin. After that, the mold 20 is opened to obtain the IC card 11 shown in FIG.

The IC card 11 is arranged facing each other with a space therebetween, and the front surface label 1 and the rear surface label 2 provided with the printing layer 6 and the protective layer 7, and the adhesive layer 8 on the upper surface of the rear surface label 2. The fixed IC module 4,
It is filled between both labels 1 and 2 and both labels 1 and 2 are integrated into an IC.
It consists of resin 5 that is integrally connected with module 4,
The adhesive layers 8 are arranged scattered on the surface of the back surface label 2, and the thickness of the adhesive layer 8 causes the IC module 4 to be arranged in the center between the front surface label 1 and the back surface label 2. ing.

According to the method of manufacturing the IC card of the first embodiment and the IC card 11 obtained by the method, the IC module 4 is placed between the front label 1 and the back label 2 depending on the thickness of the adhesive layer 8. Since it is arranged in the center, the thickness of the resin 5 on both sides of the IC module 4 is the same. Therefore, the heat shrinkage rates of the resins 5 on both sides of the IC module 4 are almost the same, and as a result, the heat shrinkage generated in the cooling process is uniformed and balanced between the front surface side and the back surface side, and the completed IC card 11 is obtained. There is very little distortion such as warpage.

Although it is considered that the heat shrinkage rate becomes non-uniform due to the presence of the adhesive layers 8, the adhesive layers 8 are scattered at the four corners of the IC module 4, and therefore the adhesive layers 8 are formed. The effect on heat shrinkage is small, and it is difficult to generate distortion such as warpage. Further, it is not necessary to limit the type of adhesive material that constitutes the adhesive layer 8. As described above, since a distortion such as a warp due to the influence of the difference in heat shrinkage is unlikely to occur, a non-contact type IC card of a type having a large coil and a long communication distance, which has conventionally been significantly distorted, It can be manufactured by injection molding.

B. Second Embodiment (FIGS. 5 and 6: Contract)
FIG. 5 shows a method for manufacturing an IC card according to the second embodiment of the present invention, and FIG. 6 shows an IC card 12 obtained by the same method ( based on requirements 2 and 4) . In these figures, the same components as those in FIGS. 1 and 2 are designated by the same reference numerals, and the description thereof will be omitted.

In the second embodiment, an adhesive layer 9 different from the adhesive layer 8 of the first embodiment is provided instead of the adhesive layer 8 of the first embodiment. The adhesive layer 9 fixes the IC module 4 to the upper surface of the back label 2 as in the first embodiment, but is provided on the entire upper surface of the back label 2. The adhesive layer 9 is provided with an adhesive whose thermal shrinkage is the same as that of the resin 5. Further, the IC module 4 is arranged in the center between the front surface label 1 and the rear surface label 2 due to the thickness of the adhesive layer 9.

As shown in FIG. 5, after the front surface label 1 and the back surface label 2 are set in the mold 20 together with the IC module 4, a predetermined amount of molten resin is injected into the cavity 23 from the injection port 22 and filled. Allow to cool and solidify. After that, the mold 20 is opened to obtain the IC card 12 shown in FIG. The IC cards 12 are arranged facing each other with a space therebetween, and are fixed on the upper surface of the front surface label 1 and the rear surface label 2 provided with the print layer 6 and the protective layer 7 and the rear surface label 2 via the adhesive layer 9. An IC module 4 and a resin 5 that is filled between the labels 1 and 2 and integrally bonds the labels 1 and 2 together with the IC module 4, and an adhesive layer 9 is provided on the entire surface of the back surface label 2 and bonded. Due to the thickness of the layer 9, the IC module 4 is arranged in the center between the front surface label 1 and the rear surface label 2.

According to the method of manufacturing the IC card of the second embodiment and the IC card 12 obtained by the method, the IC module 4 has the surface label depending on the thickness of the adhesive layer 9 as in the first embodiment. 1 and the back surface label 2 are arranged in the center, and in addition to that, the adhesive layer 9 is made of a material having the same heat shrinkage ratio as the resin 5. That is, on the front surface side and the back surface side of the IC module 4, materials having the same heat shrinkage are provided with the same thickness. Therefore, the heat shrinkage that occurs in the cooling process of the resin 5 is made uniform on the front surface side and the back surface side and balanced, so that the finished IC card 12 has very little distortion such as warpage. Since distortion such as warpage is unlikely to occur in this way, it is possible to manufacture by injection molding a non-contact type IC card of a type having a large coil and a long communication distance, which has conventionally been significantly distorted.

C. Modifications The present invention is not limited to the above-described embodiment, and the following modifications are possible. I. Replace the IC module 4 with the front label 1 or the back label 2
It may be fixed to any of the above, or may be provided on both labels 1, 2. B. The printing layer 6 may be provided on only one of the front surface label 1 and the back surface label 2, in which case the printing layer 6
The protective layer 7 may not be provided on the label on the side not provided. C. Although the adhesive layers 8 in the first embodiment are scattered at the positions corresponding to the four corners of the IC module 4, the number and the position thereof are limited as long as they are scattered and the IC modules 4 can be fixed. Not done.

[0026]

EXAMPLE D. Examples Hereinafter, more specific examples based on the above-described embodiments will be described. The reference numerals are the same as those in the above-described embodiments (FIGS. 1 to 6). D-1. First Embodiment (FIGS. 1 and 2: First Embodiment)
On a white vinyl chloride sheet of states based on) the surface label 1 and the back label 2 thickness 50 [mu] m, a picture-printed layer 6 having a thickness of 1μm formed by offset printing, thereon, a protective layer having a thickness of 2μm offset printing 7 By providing, the front surface label 1 and the back surface label 2 were created. I on the non-printed side of the backside label 2 created above
A urethane-based adhesive layer 8 having a thickness of 27 μm is provided by a screen printing method at positions corresponding to the four corners of the C module 4, and the adhesive layer 8 is sealed with an epoxy resin to a thickness of 600 μm.
The IC module 4 was adhered and fixed. The labels 1 and 2 were loaded on the lower surface and the upper surface of the inside 21 of the mold 20 by suction with the printing surface facing the outer surface side. Then, in the cavity 23 between the labels 1 and 2, 2
Acrylonitrile-butadiene-styrene resin 5 heated to 00 ° was injected and filled, cooled, and solidified. After solidification, the mold 20 was opened to obtain the IC card 11.

D-2. Second embodiment (FIGS. 5 and 6:
(Based on the second embodiment) Front label 1 and back label 2 A 1 μm-thick pattern printing layer 6 is provided by offset printing on a 50 μm thick white vinyl chloride sheet, and a 2 μm-thick pattern printing layer is provided thereon. The front side label 1 and the back side label 2 were prepared by providing the protective layer 7 of 1. On the entire non-printed side of the back label 2 created above,
An SBR adhesive layer 9 having a thickness of 27 μm was provided by a blade coating method, and an IC module 4 having a thickness of 600 μm sealed with an epoxy resin was adhered and fixed to the adhesive layer 9. The labels 1 and 2 were loaded on the lower surface and the upper surface of the inside 21 of the mold 20 by suction with the printing surface facing the outer surface side. Then, in the cavity 23 between the labels 1 and 2, 2
Acrylonitrile-butadiene-styrene resin 5 heated to 00 ° was injected and filled, cooled, and solidified. After solidification, the mold 20 was opened to obtain the IC card 12.

The IC cards 11 and 12 obtained in the first and second embodiments can be commercialized as good IC cards with almost no distortion such as warpage.

[0029]

According to the present invention, since the heat shrinkage occurring in the cooling process of the resin is equalized between the front side and the back side of the IC module, distortion such as warpage due to the difference in heat shrinkage is extremely small and good quality. IC card can be obtained.
In addition, since it is not affected by heat shrinkage and has little distortion, it is possible to manufacture by injection molding a non-contact type IC card of a type having a large coil and a long communication distance, which has been difficult in the past.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a method of manufacturing an IC card according to a first embodiment of the present invention.

FIG. 2 is a side sectional view of an IC card obtained by the manufacturing method.

FIG. 3 is a plan view showing an arrangement of an adhesive layer on a back label.

FIG. 4 is a plan view showing an example of an IC module.

FIG. 5 is a side sectional view showing the method of manufacturing the IC card of the second embodiment of the present invention.

FIG. 6 is a side sectional view of an IC card obtained by the manufacturing method.

FIG. 7 is a side sectional view of an IC card obtained by a conventional manufacturing method.

[Explanation of symbols]

1 ... Front side label, 2 ... Back side label, 8, 9 ... Adhesive layer, 4
... IC module, 5 ... Resin, 11, 12 ... IC card, 20 ... Mold.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI Technical display location H01L 21/56 H01L 23/02 Z 23/02 23/28 Z 23/28 G06K 19/00 K

Claims (4)

[Claims] 1. A front-side label and a back-side label that are arranged to face each other with a space therebetween, an IC module fixed to at least one of the facing surfaces of these labels via an adhesive layer, and between the front-side label and the back-side label. In an IC card provided with a resin that is filled in a label to integrally bond both labels together with the IC module, the adhesive layer is scattered on the surface of the label on the side where the IC module is fixed, Its thickness
An IC card, wherein the IC module is set so as to be disposed substantially in the center between the front label and the back label. 2. The IC card according to claim 1, wherein the adhesive layer has a thermal contraction rate substantially the same as that of the resin and is provided on substantially the entire surface of the label. 3. A front-side label and a back-side label are arranged so as to face each other with a space therebetween, and an IC module is provided on at least one of the facing surfaces of these labels with an adhesive layer interspersed with the front-side label and the back-side label. A method for manufacturing an IC card, which is characterized in that it is arranged substantially at the center between the labels and then a molten resin is filled between the labels to integrally bond both labels together with the IC module. 4. The method for manufacturing an IC card according to claim 3, wherein the adhesive layer is provided on substantially the entire surface of the label by using a material having a heat shrinkage rate substantially the same as that of the resin.