JP3325444B2 - IC card manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an IC card on which an external terminal contact type IC module is mounted by injection molding.

[0002]

2. Description of the Related Art Conventionally, magnetic recording media such as floppy disks and cassette tapes have been widely used as external storage devices for computers and electronic devices using computers. However, in recent years, a card-shaped or package-shaped recording medium provided with a semiconductor memory such as a RAM and a ROM has been used because of its smaller size and easier handling. On the other hand, in the fields of credit cards, ID cards, cash cards, and the like, microprocessors and R cards are used as card materials instead of magnetic cards.
A so-called IC card equipped with an IC module including a semiconductor memory such as an AM or a ROM has been newly developed because of its extremely large information recording capacity and high security. And, in the IC card, the IC module is mounted so as to be exposed on the surface,
There is an external terminal contact type in which external terminals are brought into contact with an IC module by being inserted into and removed from a reader / writer to read and write information.

As a method for manufacturing the external terminal contact type IC card, a counterbore method or an injection molding method is conventionally known. In the counterbore method, a hole is provided in a prepared card base material for mounting an IC module in a post-process, and the IC module is fitted into the mounting hole and fixed with an adhesive or the like to obtain a card. In the injection molding method, a card frame having a mounting hole for embedding an IC module is prepared in advance by injection molding, and a printing layer such as a character or a picture is provided on the card frame by a method such as small piece printing or foil transfer. Thereafter, the card is obtained by embedding the IC module in the mounting hole of the card frame and fixing it with an adhesive or the like.

[0004]

However, the above conventional method has the following disadvantages. That is, in the above-described counterbore method, the mounting hole of the IC module is provided in the prepared card base material, and the mounting hole needs to be slightly larger than the IC module. Therefore, in the completed IC card, a gap always occurs around the IC module. In addition, if the depth of the mounting hole and the thickness of the IC module do not match with high accuracy, the IC module portion is slightly protruded and dented. If a gap, bulge, or dent is formed in the card by the IC module, not only the appearance is impaired, but also the contact failure due to the attachment of fine dust and dust, and the rubbing when inserting and removing the card from the reader / writer. Cause damage.

On the other hand, in the above-described injection molding method, since the IC module is mounted after the card frame is formed, a gap is generated between the IC module and the mounting hole as in the counterbore method, causing the same problem. In addition, methods such as small piece printing and foil transfer for providing a printing layer on a card frame are inferior in production efficiency and high in cost.

The present invention has been made in view of the above circumstances, and has as its object to provide a method capable of manufacturing a high-quality external terminal contact type IC card by a simple method.

[0007]

The present invention achieves the above object by the following means. That is, claim 1
In the method for manufacturing an IC card described in the above section, an IC module is provided on the surface of a base sheet, and
A label is obtained by fixing it in a state protruding from the surface of the base sheet, the label is placed in an injection molding die, and the part of the IC module is applied to a card surface forming surface of the die. Contact, and insert with the cavity provided on the back side of the base sheet, then inject the molding resin into the cavity and reduce the pressure of the molding resin.
Therefore, the base sheet is pressed against the card surface forming surface.
It is characterized by being attached and deformed . Of the second aspect, the label printing layer is formed on the base sheet Rutotomoni, protective layer covering the print layer formed
And the IC module is fixed on the protective layer . According to a third aspect of the present invention, the base sheet of the label includes a magnetic recording layer. Further, the IC of claim 4
The method of manufacturing the card is such that an IC module is provided on the surface of the base sheet.
Module is part of the base sheet.
Obtain the front label by fixing it in a state protruding from the surface ,
The front side label is inserted into the injection molding die by bringing the part of the IC module into contact with the card surface forming surface of the die inner surface and facing the card surface forming surface. On the back side of the card, at least a back side label having a magnetic recording layer is inserted in a state where a cavity is formed between the back side label and the front side label,
With injecting a molding resin into the cavity, the
The base sheet is moved by the pressure of the molding resin.
It is characterized in that it is deformed by pressing against the surface on which the metal surface is formed . According to a fifth aspect of the present invention, the label is characterized in that at least a part of the IC module is fitted into a mounting hole formed in the base sheet and fixed to the base sheet. According to claim 6, an IC according to claim 5 is provided.
In card manufacturing method, in the bottom of the IC module that projects fitted in the cavity in the mounting hole, is characterized in that a claw-like engagement piece extending in the plane direction of the card.

According to the present invention, the base sheet is pressed against the card surface forming surface of the mold by the pressure of the resin injected into the cavity in the mold for injection molding, and at this time, the IC module is attached to the base sheet together with the adhesive layer. By being buried, both surfaces are processed to be flush with the mold surface forming surface of the mold. There is no gap between the IC module and the front side base sheet, and they are in close contact with each other, and there is no protrusion or depression. Therefore, the obtained IC card has a good external appearance and suppresses the occurrence of poor contact due to adhesion of dust or dust. In addition, when the IC module is inserted into and removed from a reader / writer for reading and writing information by the IC module, damage to the IC module due to rubbing is prevented. Furthermore, since the mounting of the IC module is completed simultaneously with the injection molding of the resin, the IC card can be manufactured in a short time,
Improvement of production efficiency and reduction of cost are achieved. Further, by fitting at least a part of the IC module into the mounting hole provided in the base sheet, deformation of the base sheet at the time of injection molding is reduced, so that the IC module and the base sheet are flushed and a gap is suppressed. The effect is further improved.
Further, if a claw-shaped engaging piece extending in the surface direction of the card is provided at the bottom of the IC module that is fitted into the mounting hole and projects into the cavity, the fixed state of the IC module is strengthened.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1. First Embodiment (FIGS. 1 to 5) Step 1: Production of Front Label and Back Label As shown in FIGS. 1 and 2, the IC module 6 is bonded to a desired position on the surface of the front base sheet 1. The front side label 7 is obtained by fixing with the terminal surface exposed on the surface via the adhesive layer 5 made of an agent or the like. Further, as shown in FIG. 3, after a character printing layer 12 such as a character or a picture is provided on the lower surface of the back base sheet 11, the entire lower surface of the back base sheet 11 is covered with a protective layer 13. The back label 14 is obtained.

Step 2: Inserting into a mold The front side label and the back side label are inserted into an injection mold 31 shown in FIG. In the mold 31, an upper mold 32 and a lower mold 33 are assembled so as to be separable. When the mold is clamped, a thin card-shaped space having a predetermined dimension is formed therein, and a molten resin injection port is formed. 34 are formed. On the inner surfaces of the upper mold 32 and the lower mold 33, a flat card surface forming surface 32a and a card back surface forming surface 33a forming the front and back surfaces of the IC card to be manufactured are formed so as to face each other in parallel. ing.

The front side label 7 is inserted into the die 31 by bringing the surface of the IC module 6 into contact with the card surface forming surface 32 a of the upper die 32.
The protective layer 13 on the card back surface forming surface 33a of the lower mold 33.
And insert it. As a method of the insert, a method such as adsorption is suitable. When both labels 7, 14 are inserted into the respective molds 32, 33, these molds 32,
33 is clamped. When the mold 31 is clamped, a cavity 35 is formed between the front base sheet 1 and the back base sheet 11.

Step 3: Injection Molding of Resin Next, a predetermined amount of molten resin is injected into the cavity 35 formed in the mold 31 from the injection port 34 and filled, and then cooled and solidified.

Step 4: Mold Opening When the molten resin has cooled and solidified, the upper mold 32 and the lower mold 33 are opened.
Is divided and opened, and the IC card 1 shown in FIG.
Get 01. This IC card 101 has characters and patterns applied to the back surface by the character printing layer 12, and the terminal surface of the IC module 6 is exposed on the front surface. Then, the IC module 6 is embedded in the front side base sheet 1 without any gap,
Both surfaces are flush with each other. This is because the IC module 6 is relatively buried in the front side base sheet 1 by pressing the front side base sheet 1 together with the adhesive layer 5 against the card surface forming surface 32a of the upper mold 32 by the pressure of the injected resin 21. As a result, the card surface forming surface 3
This is because the surface of the IC module 6 is processed to be flush with the front side base sheet 1 following 2a.

Here, each of the base sheets 1 and 11, the adhesive layer 5, the IC module 6, the character printing layer 12, and the protective layer 1
3 and the material and the forming method of the resin 21 will be described. (1) Front-side base sheet 1 The front-side base sheet 1 is preferably a film sheet or the like that is sufficiently ductile enough to be smoothly embedded without damaging the IC module during resin injection molding, and a character pattern not provided in the above embodiment. When a layer is provided, a layer having printability is used. For example, a resin film or sheet obtained by extrusion molding, calender roll molding, or the like of a material such as a polyolefin resin such as polyethylene or undrawn polypropylene, a polyvinyl alcohol resin, a polyvinyl chloride resin, and a composite sheet made of these materials. Is used. The thickness is selected from a range of about 10 to 200 μm in consideration of printability.

(2) Adhesive Layer 5 A solvent is used for the adhesive layer 5 in addition to the above adhesive. Examples of the adhesive include one- or two-component curable adhesives made of polyester, epoxy, urethane, silicone rubber, acrylic, and polyamide resins, hot melt waxes, and the like. Solvent bonding is a method in which the bonding surface is dissolved by a solvent having high solubility in common to both the front side base sheet and the resin sealing the IC module, and then dried to integrate the two.

(3) IC Module 6 The IC module 6 is a module obtained by die-bonding and wire-bonding a microcomputer, a semiconductor memory, and the like on a glass epoxy substrate having terminal electrodes, and then sealing the epoxy with epoxy. Is used.

(4) Back-side base sheet 11 The back-side base sheet 11 is a sheet made of any paper, synthetic paper, resin film, or a composite of these materials, etc., having printability since the character print layer 12 is provided. Is applied. For example, examples of the paper include high-quality paper, coated paper, art paper, paper having printability such as card paper, and synthetic paper. Further, in the resin system, a resin film or sheet obtained by extrusion molding, calender roll molding, or the like of a material such as a polyolefin resin such as polyethylene and polypropylene, a polyester resin, a polycarbonate resin, a polyvinyl chloride resin, and an ABS resin. A composite sheet made of these materials is used. The thickness is 10 to 200 in consideration of printability.
Select from a range of about μm.

(5) Character printing layer 12 The character printing layer 12 can be provided by a known printing method such as an offset printing method, a gravure printing method or a screen printing method. The materials used vary slightly depending on the printing method, and are exemplified below. -Offset printing method-Inks such as polyester acrylate resin, polyurethane acrylate resin, epoxy acrylate resin, and alkyd resin. -Gravure printing method-inks such as cellulose resin, chlorinated polypropylene, vinyl chloride / vinyl acetate copolymer resin, saturated polyester resin, and acrylic resin. -Screen printing method-Inks such as polyester resin, vinyl chloride / vinyl acetate copolymer resin, and acrylic polyol resin.

(6) Protective Layer 13 The protective layer 13 can be formed by printing using a gravure printing method, a roll coat printing method, or the like. As the material used, resins such as acrylic resin, vinyl chloride resin, nitrocellulose, hydroxycellulose, carboxymethylcellulose, polyvinyl alcohol, styrene-maleic acid copolymer, polyester resin and ABS resin are used. These are dissolved or dispersed in a solvent such as toluene or xylene, applied by a gravure printing method or a roll coat printing method, and dried to form a heat-resistant protective layer. Further, a curable resin such as a thermosetting resin, an ultraviolet curable resin, and an electron beam curable resin may be used.

(7) Resin 21 Resins are polystyrene resin for general use, polystyrene resin for impact resistance, acrylonitrile styrene resin, ABS resin,
Thermoplastic resins such as acrylic resin, polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, polycarbonate resin, vinyl chloride resin, modified PPO resin, polyethylene terephthalate resin, polybutylene terephthalate resin, polyphenylene sulphate resin, or those materials A composite alloy resin, a reinforced resin by addition of glass fiber, or the like is used.

According to the above-mentioned method, the front base sheet 1 is moved by the pressure of the resin 21 injected into the cavity 35 in the mold 31 as described above.
The IC module 6 is buried in the front base sheet 1 together with the adhesive layer 5 at that time, and both surfaces are processed to be flush with the card surface forming surface 32a. Further, there is no gap between the IC module 6 and the front side base sheet 1 and both are in close contact with each other. Therefore, I
The surface of the IC card 101 on which the C module 6 is mounted is formed so as to have no troubles such as protrusions and depressions, let alone gaps. As a result, the external appearance of the IC card 101 is improved, and the occurrence of poor contact due to adhesion of dust or dust is suppressed. Further, when the IC module 6 is inserted into and removed from the reader / writer for reading and writing information by the IC module 6, the IC module 6 does not protrude, so that damage to the IC module 6 due to rubbing is prevented.
Further, since the front label 7 and the rear label 14 are integrated by the injection molding of the resin 21 and the mounting of the IC module 6 is completed, the IC card can be manufactured in a short time, and as a result, the production efficiency is improved and the cost is reduced. Is achieved.

2. Second Embodiment (FIGS. 6 to 9) Next, a second embodiment of the present invention will be described. Step 1: Manufacture of front side label and back side label As shown in FIGS. 6 and 7, on the surface of the front side base sheet 1, a pattern printing layer 2 is provided, and then a transparent protective layer 4 is provided. Next, the IC module 6 is fixed to a desired position on the surface of the protective layer 4 via the adhesive layer 5 so that the terminal surface is exposed on the surface. Further, as the back side label, the back side label 14 of the first embodiment shown in FIG. 3 is manufactured.

Step 2: Inserting into a mold As shown in FIG. 8, the front side label 7 and the back side label 14 are inserted into a mold 31 as in the first embodiment. That is, the front side label 7 is inserted by contacting the surface of the IC module 6 with the card surface forming surface 32a of the upper mold 32, and the back side label 14 is protected by the card rear surface forming surface 33a of the lower mold 33. The layer 13 is abutted and inserted. Place both labels 7, 14 in the molds 32, 3
After the insertion into 3, the molds 32 and 33 are clamped to form a cavity 35 between the front base sheet 1 and the back base sheet 11.

Step 3: Injection molding of resin Next, a predetermined amount of molten resin is injected into the cavity 35 from the injection port 34 to be filled, and then cooled and solidified.

Step 4: Mold opening When the molten resin has cooled and solidified, the upper mold 32 and the lower mold 33 are opened.
Is divided and opened, and the IC card 1 shown in FIG.
02 is obtained. The IC card 102 has characters and pictures on both the front and back sides by the picture printing layers 2 and 12, and the terminal surface of the IC module 6 is exposed on the front face. The IC module 6 is embedded in the protective layer 4 and the front side base sheet 1 without any gap, and the surface of the protective layer 4 and both surfaces are flush with each other.

According to the second embodiment, when the resin 21 is injected, the protective layer 4 and the front base sheet 1 are pressed against the card surface forming surface 32a of the upper mold 32 by the pressure. The IC module 6 is relatively buried in the protective layer 4 and the front base sheet 1, and as a result, the surface of the IC module 6 is processed to be flush with the protective layer 4 following the card surface forming surface 32a. That is, similarly to the first embodiment, the IC module 6 can be mounted on the surface without generating any gap, protrusion, or depression. The material of the picture printing layer 2 and the protective layer 4 of the front label 7 conforms to the picture character layer 12 and the protective layer 13 of the back label 14.

[0027]3. Third Embodiment (FIGS. 10 to 1)
3) Next, a third embodiment of the present invention will be described. Step 1: Manufacture of front side label and back side label As shown in FIG. 10 and FIG.
Desired position on the surface of the front side base sheet 1 having the recording layer 3
The IC module 6 is connected to the terminal surface via the adhesive layer 5.
Fix it so that it is exposed on the surface. In addition, the back side label
Then, the back side label 14 of the first embodiment shown in FIG.
To manufacture.

Here, the magnetic recording layer 3 will be described in detail.
In order to provide the magnetic recording layer 3 on one surface of the front side base sheet, for example, a stripe-shaped transfer foil in which a release layer, a magnetic recording layer, and an adhesive layer are laminated in this order on a support is used. Then, the support is heated and temporarily bonded to the front base sheet via the adhesive layer, and then the support is peeled off and removed from the magnetic recording layer by a release layer. As the support, a relatively thin polyethylene film, a polypropylene film, a resin film made of another polymer material, or the like having mechanical toughness and flexibility and flexibility is used. As this resin film, a polyethylene terephthalate resin film of about 12 to 100 μm is preferable.

The release layer can easily separate the magnetic recording layer from the support, and protects the magnetic recording layer when the magnetic recording layer is exposed on the surface (this is the case in the present embodiment). This release layer can be provided, for example, by applying a polymer material to a thickness of about 0.5 to 5 μm by a printing method or a coating method, and using an additive or a slipping agent such as wax in order to improve the release property. It can be added. As the polymer material, polyvinyl chloride, polyester, polyethylene, acrylic resin, or the like is used alone or in combination, and an acrylic resin having good releasability is preferably used. In order to enhance the protection of the magnetic recording layer, it is preferable to add a pigment. As the pigment, inorganic calcium carbonate, alumina, talc, silica and the like are preferable. Further, as the additive for improving the releasability, silicone oil, silicone wax, polyethylene wax, carnauba wax, zinc stearate, fluorine-based or the like is suitable.

The magnetic recording layer is formed by using a magnetic ink in which a magnetic material is dispersed in a polymer material as a magnetic film having a residual magnetic flux density of 300 to 500 gauss by a printing method or a coating method.
The thickness is set to about 5 to 20 μm. As a polymer material,
Polyvinyl chloride, polyvinyl chloride-vinyl acetate copolymer,
Polyester, polyethylene, acrylic resin and the like are used alone or in combination, preferably polyvinyl chloride,
Polyvinyl chloride acetic acid copolymer and polyester are used. As the magnetic material, powders of metals, alloys, and metal compounds such as magnetite, γ-iron oxide, γ-iron oxide coated with Co, barium ferrite, strontium ferrite, and chromium dioxide having a coercive force of 1000 e or more can be used. The magnetic recording layer can be provided by a thin film forming method such as a vapor deposition method, a sputtering method, and a plating method, in addition to the printing method and the coating method.

The adhesive layer can be provided, for example, by applying a polymer material having a softening point of 150 ° C. or less to a thickness of 0.5 to 10 μm by a printing method or a coating method. As the polymer material, polyvinyl chloride, polyvinyl chloride-vinyl acetate copolymer, polyester, polyethylene, polyurethane, acrylic resin, or the like that is compatible with the front base sheet is used, and polyurethane and polyester are preferably used.

Step 2: Inserting into a mold As shown in FIG. 12, the front side label 7 and the back side label 14 are inserted into a mold 31 as in the first embodiment. That is, the front side label 7 is
Then, the front surface of the IC module 6 is inserted into the card surface forming surface 32a of the lower mold 33 while the protective layer 13 is in contact with the card rear surface forming surface 33a of the lower mold 33. Labels 7 and 14 are placed in each mold 3
2 and 33, these molds 32 and 33 are clamped, and the front base sheet 1 and the back base sheet 11 are closed.
To form a cavity 35.

Step 3: Injection molding of resin Next, a predetermined amount of molten resin is injected into the cavity 35 from the injection port 34 to be filled, and then cooled and solidified.

Step 4: Mold opening When the molten resin has cooled and solidified, the upper mold 32 and the lower mold 33 are opened.
Is divided and the mold is opened to obtain the IC card 103 shown in FIG. 13 which is molded with the resin 21 and has the IC module 613 mounted on the surface. The IC card 103 has the magnetic recording layer 3 provided on the front surface, the terminal surface of the IC module 6 is exposed, and the back surface is provided with characters and patterns by the character printing layer 12. The IC module 6 is embedded in the front base sheet 1 without any gap, and both surfaces are flush with each other.

According to the third embodiment, when the resin 21 is injected, the front side base sheet 1 is pressed against the card surface forming surface 32a of the upper mold 32 by the pressure, whereby the IC module 6 The magnetic recording layer 3 is relatively buried in the front base sheet 1, and as a result, the surfaces of the IC module 6 and the magnetic recording layer 3 are processed flush with the front base sheet 1 following the card surface forming surface 32 a. That is, as in the first embodiment, the IC module 6 is mounted on the surface without causing any gap, protrusion or depression, and the magnetic recording layer 3 is similarly provided flush with the surface.

[0036]4. Fourth Embodiment (FIGS. 14 to 1)
6) Step 1: Manufacture of front side label and back side label
The front side label 7 of the embodiment is manufactured. Also, back label 1
As shown in FIG. 14, as in FIG.
The same magnetic field as in the third embodiment is provided on the back side of the back side label.
The recording layer 3 is provided to obtain the back label 7.

Step 2: Inserting into a mold The front side label 7 is inserted into the upper mold 32 as in the first embodiment. Also, the back side label 14 is inserted into the lower mold 33 with the protective layer 13 facing the card back side forming surface 33a and the magnetic recording layer 3 contacting the card back side forming surface 33a. Labels 7 and 14 are placed in each mold 3
2 and 33, these molds 32 and 33 are clamped, and the front base sheet 1 and the back base sheet 11 are closed.
To form a cavity 35.

Step 3: Injection Molding of Resin Next, the cavity 35 is filled with a predetermined amount of molten resin by injecting it from the injection port 34, and then cooled and solidified.

Step 4: Mold opening When the molten resin is cooled and solidified, the upper mold 32 and the lower mold 33 are opened.
Is divided and the mold is opened to obtain an IC card 104 shown in FIG. 16 which is molded with the resin 21 and has the IC module 6 mounted on the surface. The terminal surface of the IC module 6 is exposed on the front surface of the IC card 104, characters and patterns are provided on the back surface by the character printing layer 12, and the magnetic recording layer 3 is provided.

According to the fourth embodiment, similarly to the first embodiment, the IC module 6 is buried in the front base sheet 1 without any gap and is flush with the magnetic recording layer. 3 are provided flush with each other.

[0041]5. Fifth Embodiment (FIG. 17 and FIG. 1)
8) In the fifth embodiment, the IC module 6 is attached to the front side label 7.
Mounting method, that is, IC module on front side base sheet 1
The fixing method of the rule 6 is changed. That is, as shown in FIG.
As shown in FIG.
A mounting hole 41 is formed in which a part is fitted.
Part of the IC module 6 is fitted to the front base sheet 1
Surface and the IC module 6 are fixed with the adhesive layer 5 interposed therebetween.
ing. FIG. 18 shows the front label 7 and the rear label 14 up.
Insert into the mold in the same manner as in
I obtained by injecting resin 21 into the cavity between 7 and 14
The C card 105 is shown.

According to this method, the bottom of the IC module 6 is integrated with the resin 21. And IC module 6
Is partially fitted in the mounting hole 41, so that the deformation (elongation) of the front base sheet 1 when the IC module 6 is buried is small. For this reason, the IC module 6 and the front side base sheet 1 are flushed and the effect of suppressing generation of a gap is further improved. Conversely, the front base sheet 1 is
It can be manufactured with a material having a smaller stretchability than those of the above embodiments.

6 Modification of the fifth embodiment (IC module
Modification Example of Method of Mounting Roll) A modification example based on the fifth embodiment will be described. 6-1. Modification Example 1 As shown in FIG. 19, a mounting hole 41 into which the entire IC module 6 fits is formed in the front side base sheet 1, and the IC module 6 is fitted into the mounting hole 41 so that the IC module 6 becomes almost flush. Then, the front base sheet 1 and the IC module 6 are fixed via the adhesive layer 5. As described above, when the IC module 6 is mounted on the front side label 7 and injection-molded in the same manner as in each of the above embodiments, as shown in FIG.
C module 6 is flush with each other and IC module 6
To obtain an IC card 106 integrated with the resin 21. In this case, deformation of the front side base sheet 1 when the resin 21 is injected is minimized. In addition, front side base sheet 1
The gap between the IC module 6 and the IC module 6 is filled with the adhesive layer 5 to be flush.

6-2. Modification 2 As shown in FIG. 21, the bottom surface of the IC module 6 is covered with a protective laminate 51 via an adhesive layer 5, and a part of the IC module 6 is fitted into a mounting hole 41 formed in the front base sheet 1. Then, the protective laminate 51 and the surface of the front side base sheet 1 are adhered and fixed by the adhesive layer 5. When the IC module 6 is mounted on the front label 7 and injection-molded in the same manner as in the above embodiments, the front base sheet 1 and the IC module 6 obtain an IC card 107 flush with each other as shown in FIG. . In this case, similarly to the fifth embodiment, the deformation of the front side base sheet 1 is suppressed,
Since the bottom surface of the IC module 6 and the resin 21 are not integrated and are cut off by the protective laminate 51, the deformation is not directly transmitted to the IC module 6 when the card is bent,
Problems such as characteristic changes due to deformation are avoided.

6-3. Modification Example 3 As shown in FIG. 23, in addition to the modification example 1, the bottom surface of the IC module 6 and the back surface of the front base sheet 1 around the IC module 6 are covered with the protective laminate 51 via the adhesive layer 5. When the IC module 6 is mounted on the front label 7 and injection-molded in the same manner as in the above embodiments, the front base sheet 1 and the IC module 6 obtain an IC card 108 flush with each other as shown in FIG. . In this case, the deformation of the front side base sheet 1 is minimized as in the first modification, and the gap between the front side base sheet 1 and the IC module 6 is filled with the adhesive layer 5 so as to be flush. Become. Further, similarly to the second modification, the IC module 6
The bottom surface of the card is not integrated with the resin 21 and the edge is cut by the protective laminate 51. Therefore, when the card is bent, the deformation is not directly transmitted to the IC module 6, thereby avoiding a problem such as a change in characteristics due to the deformation. Is done.

6-4. Modification 4 As shown in FIG. 25, the mounting hole 41 formed in the front side base sheet 1 is set larger than the fitting portion of the IC module 6, and a part of the IC module 6 is fitted into the mounting hole 41. Next, as shown in FIG. 25 and FIG.
A plurality of claw-shaped engaging pieces 62 are fixed to the bottom surface of the module 6 via an adhesive layer 61. The engagement piece 62 extends in the surface direction of the card. When the IC module 6 is mounted on the front side label 7 and injection molded in the same manner as in the above embodiments,
As shown in FIG. 27, the front base sheet 1 and the IC module 6 obtain an IC card 109 flush with each other. In this case, in addition to the resin 21 wrapping around between the IC module 6 and the front base sheet 1, the engagement piece 62 is buried in the resin 21, so that the fixed state of the IC module 6 is further strengthened. You.

The present invention is not limited to the above embodiments. For example, a molten resin may be filled by an injection compression molding method in order to improve the filling property of the resin.

[0048]

[Example] 7. Examples Hereinafter, more specific examples based on the above embodiments will be described. The reference numerals are based on the above embodiments. 7-1. First Example (FIGS. 1 to 5: Based on First Embodiment) Front Label 7 and Back Label 14 An IC module 6 is fixed on a 50 μm thick white vinyl chloride sheet 1 with a silicone adhesive 5. And the front side label 7 was obtained. Next, a white vinyl chloride sheet 11 having a thickness of 50 μm
A character printing layer 12 having a thickness of 1 μm was provided thereon by a screen printing method, and a protective layer 13 having a thickness of 2 μm was provided on the entire surface by a screen printing method to obtain a backside label 14. The front side label 7 and the back side label 14 created above are
As in the first embodiment, the mold is inserted into the mold 31 by suction, and the acrylnitrile-butadiene-styrene resin 21 is injected and filled into the cavity 35, and cooled.
After solidification, an IC card 101 was obtained.

7-2. Second example (FIGS. 3, 6 to 9: based on the second embodiment) Front side label 7 and back side label 14 A picture having a thickness of 1 μm on a white polyvinyl chloride sheet 1 having a thickness of 50 μm by a screen printing method. After the printing layer 2 is provided, the IC module 6 is fixed thereon with the silicon-based adhesive 5,
The front side label 7 was obtained. Next, a character printing layer 12 having a thickness of 1 μm is provided by a screen printing method on a white vinyl chloride sheet 11 having a thickness of 50 μm, and a protective layer 13 having a thickness of 2 μm is provided on the entire surface by a screen printing method. Label 14 was obtained. The front side label 7 and the back side label 14 created above are
As in the second embodiment, the mold is inserted into the mold 31 by suction, and the acrylnitrile-butadiene-styrene resin 21 is injected and filled into the cavity 35, and cooled.
After solidification, an IC card 102 was obtained.

7-3. Third Example (FIGS. 3, 10 to 13: Based on the Third Embodiment) Front Label 7 and Back Label 14 Temporarily bond magnetic recording layer 3 to 50 μm thick white vinyl chloride sheet 1 by thermal transfer. After that, the IC module 6 was fixed thereon with the silicone adhesive 5 to obtain the front side label 7. Next, a white vinyl chloride sheet 11 having a thickness of 50 μm
A character printing layer 12 having a thickness of 1 μm was provided thereon by a screen printing method, and a protective layer 13 having a thickness of 2 μm was provided on the entire surface by a screen printing method to obtain a backside label 14. The front side label 7 and the back side label 14 created above are
Similarly to the above-described third embodiment, the acrylonitrile-butadiene-styrene resin 21 is inserted into the cavity 31 by suction, and injected into the cavity 35, and cooled.
After solidification, an IC card 103 was obtained.

7-4. Fourth embodiment (FIGS. 1 and 2,
14 to 16: Based on the fourth embodiment) Front side label 7 and back side label 14 The IC module 6 is fixed on the white vinyl chloride sheet 1 having a thickness of 50 μm with the silicone adhesive 5 to obtain the front side label 7. Was. Next, a white vinyl chloride sheet 11 having a thickness of 50 μm
A character printing layer 12 having a thickness of 1 μm is provided thereon by a screen printing method, a protective layer 13 having a thickness of 2 μm is provided on the entire surface by a screen printing method, and the magnetic recording layer 3 is temporarily bonded by thermal transfer. The back label 14 was obtained. The front side label 7 and the back side label 14 created above are
Similarly to the fourth embodiment, the mold is inserted into the mold 31 by suction, and the acrylnitrile-butadiene-styrene resin 21 is injected and filled into the cavity 35, and cooled.
After solidification, an IC card 104 was obtained.

The I obtained in the first to fourth embodiments described above.
In the C card 101 to 104, an IC card having no external protrusions or depressions on the surface of the card, no gap around the IC module, and good appearance was obtained by one injection process.

[0053]

According to the present invention, the surface of the IC module and the base sheet are flush with the surface of the mold on which the card is formed by the pressure of the molding resin injected into the cavity in the mold for injection molding. Since the processing is performed, problems such as gaps, protrusions, or depressions due to the IC module do not occur.
As a result, the appearance is improved, and the occurrence of poor contact due to adhesion of dust or dust is suppressed. Also, I
Reader / writer for reading / writing information by C module
When inserted into and removed from the writer, damage to the IC module due to rubbing is prevented. Furthermore, at the same time as resin injection molding, IC
Since the mounting of the module is completed, the IC card can be manufactured in a short time, thereby improving the production efficiency and reducing the cost. Also, by fitting at least a part of the IC module into the mounting hole provided in the base sheet, deformation of the base sheet during injection molding is reduced, so that the IC module and the base sheet are flush with each other and a gap is not generated. The suppression effect is further improved. Further, if a claw-shaped engaging piece extending in the surface direction of the card is provided at the bottom of the IC module that is fitted into the mounting hole and projects into the cavity, the fixed state of the IC module is strengthened.

[Brief description of the drawings]

FIG. 1 is a plan view of a front side label of an IC card manufactured by a manufacturing method according to first and fourth embodiments of the present invention.

FIG. 2 is a sectional view of the same.

FIG. 3 is a cross-sectional view of a back label of an IC card manufactured by the manufacturing method according to the first, second, and third embodiments of the present invention.

FIG. 4 is a side sectional view showing a state where front and rear labels are inserted into a mold in the first embodiment.

FIG. 5 is an IC obtained by the manufacturing method according to the first embodiment.
It is sectional drawing of a card.

FIG. 6 is a plan view of a front side label of an IC card manufactured by the manufacturing method according to the second embodiment of the present invention.

FIG. 7 is a sectional view of the same.

FIG. 8 is a side sectional view showing a state where front and rear labels are inserted into a mold in the second embodiment.

FIG. 9 is an IC obtained by the manufacturing method according to the second embodiment.
It is sectional drawing of a card.

FIG. 10 is a plan view of a front side label of an IC card manufactured by a manufacturing method according to a third embodiment of the present invention.

FIG. 11 is a sectional view of the same.

FIG. 12 is a side sectional view showing a state where front and rear labels are inserted into a mold in the third embodiment.

FIG. 13 is an IC obtained by the manufacturing method according to the third embodiment.
It is sectional drawing of a card.

FIG. 14 is a plan view of a back label of an IC card manufactured by the manufacturing method according to the fourth embodiment of the present invention.

FIG. 15 is a side sectional view showing a state where front and rear labels are inserted into a mold in the fourth embodiment.

FIG. 16 is an IC obtained by the manufacturing method according to the fourth embodiment.
It is sectional drawing of a card.

FIG. 17 is a cross-sectional view of a front label of an IC card manufactured by the manufacturing method according to the fifth embodiment of the present invention.

FIG. 18 is a sectional view of an IC card obtained by the same manufacturing method.

FIG. 19 is a cross-sectional view of a front label of an IC card manufactured by a manufacturing method according to Modification Example 1 of the fifth embodiment.

FIG. 20 is a sectional view of an IC card obtained by the same manufacturing method.

FIG. 21 is a cross-sectional view of a front label of an IC card manufactured by a manufacturing method according to Modification 2 of the fifth embodiment.

FIG. 22 is a cross-sectional view of the IC card obtained by the same manufacturing method.

FIG. 23 is a cross-sectional view of a front side label of an IC card manufactured by a manufacturing method according to Modification 3 of the fifth embodiment.

FIG. 24 is a sectional view of an IC card obtained by the same manufacturing method.

FIG. 25 is a cross-sectional view of a front label of an IC card manufactured by a manufacturing method according to Modification 4 of the fifth embodiment.

FIG. 26 is a bottom view of the IC module in the same manufacturing method.

FIG. 27 is a cross-sectional view of the IC card obtained by the same manufacturing method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Front base sheet, 2 ... Picture printing layer, 3 ... Magnetic recording layer, 6 ... IC module, 7 ... Front label, 11 ... Back base sheet, 12 ... Character printing layer, 14 ... Back label,
Reference numeral 21: molding resin, 31: injection molding die, 32a: card surface forming surface, 33a: card back surface forming surface, 35: cavity, 41: mounting hole, 62: engaging piece, 101, 10
2, 103, 104, 105, 106, 107, 10,
8, 109 ... IC card.

────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Katsuhiro Fujii 4102-142 Miyanodai Miyanoji, Iruma-shi, Saitama Japan Steel Works Co., Ltd. (56) References JP-A 1-275197 (JP, A) JP-A Sho 62 -140896 (JP, A) JP-A-7-147374 (JP, A) JP-A-2-197139 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G06K 19/077 B29C 45/14 B42D 15/10

Claims (6)

(57) [Claims] 1. A method for manufacturing an IC card on which an IC module of an external terminal contact type is mounted, wherein the IC module is mounted on a surface of a base sheet.
Some of the joules protrude from the surface of the base sheet
A label is obtained by fixing the IC module in a state, and the label is brought into contact with an injection molding die, the part of the IC module is brought into contact with a card surface forming surface of the die, and a cavity is provided on the back side of the base sheet. inserted in a state, then, when injecting a molding resin into the cavity together
The base sheet is pressed by the pressure of the molding resin.
A method for manufacturing an IC card, wherein the IC card is deformed by being pressed against the card surface forming surface . Wherein said label, said printing layer on the base sheet is formed Rutotomoni, protective layer covering the printed layer
The IC card manufacturing method according to claim 1, wherein the IC module is fixed on the protective layer . 3. The method according to claim 1, wherein the base sheet of the label has a magnetic recording layer. 4. A method for manufacturing an IC card having an external terminal contact type IC module mounted thereon, wherein the IC module is mounted on a surface of a base sheet.
Some of the joules protrude from the surface of the base sheet
The front side label is obtained by fixing the front side label in the state, and the front side label is inserted into the injection mold by bringing the part of the IC module into contact with the card surface forming surface on the inner surface of the mold. At the same time, a back side label having at least a magnetic recording layer is inserted in a state in which a cavity is formed between the front side label and the back side label having a magnetic recording layer on a card back side forming side opposite to the card front side forming surface. together when the resin is injected
The base sheet is pressed by the pressure of the molding resin.
A method for manufacturing an IC card, wherein the IC card is deformed by being pressed against the card surface forming surface . 5. The label according to claim 1, wherein at least a part of the IC module is fitted into a mounting hole formed in the base sheet and fixed to the base sheet. 3. The method for manufacturing an IC card according to item 1. 6. A claw-shaped engaging piece extending in a surface direction of a card is provided at a bottom of an IC module fitted into the mounting hole and protruding into the cavity.
3. The method for manufacturing an IC card according to item 1.