JPH10151643A - Card pitted with lippman hologram and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a card fitted with a Lippmann hologram simultaneously performing the molding of a card and the formation of a hologram by one injection molding process to integrally provide the hologram and the card and capable of impatting high durability to the hologram and a method for producing the same. SOLUTION: At a time of injection molding, a label wherein a Lippmann hologram is provided to at least a part of a base sheet 3 is mounted on the card surface forming surface in a mold and a separate label is mounted on the card rear surface forming surface opposed to the card surface forming surface to form a cavity between both labels. After mold clamping, a molding resin is injected into the cavity to press the respective base sheets to the card surface forming surface by resin pressure and the molding of a card and the application of the Lippmann hologram layer to the card are integrally performed at the same time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a card with a Lippmann hologram integrally molded by an injection molding method and a card with a Lippmann hologram. And a card with a Lippmann hologram.

[0002]

2. Description of the Related Art Holograms capable of reproducing a three-dimensional image by using light interference are widely used in displays, advertisements, books and magazine covers, gifts, novelties, and the like. In addition, as a means of preventing fraud due to the identifiability of the hologram image and the difficulty of duplication, etc., holograms are at least partially included in media such as credit cards, ID cards, securities such as gift certificates, and various certificates. Conventionally, a relief hologram (rainbow hologram) composed of a hologram forming layer on which a fine uneven pattern is formed and a reflective thin film layer is mainly used, but a volume phase hologram (hereinafter, Lippman) is used. It is also employed for the above-mentioned applications using a hologram).

The Lippmann hologram is formed by attaching a seal having a hologram and a transfer foil to an adherend, and is usually provided with a hologram in a final step. As a forming method, for example, by using a partial hologram provided partially on the entire hologram card provided on the entire surface of the card, the former is provided by a laminating method by heat laminating the entire surface of the card by a roll transfer machine, and the latter is provided by transferring a transfer foil by a hot stamping method. Provided.

[0004] One of the transfer foils (not shown) is
On the support, a release layer (a peelable protective layer functioning as a protective layer after peeling), a Lippmann hologram layer showing a hologram image, and an adhesive layer for bonding to an adherend are formed.

[0005] After the transfer foil is placed on the portion where the object is to be adhered, it is heated and pressurized, the transfer foil is adhered by an adhesive layer, and a medium having a hologram is formed by removing only the support. It is.

The recording material forming this Lippmann hologram hologram records interference fringes by changing the refractive index and forms interference fringes in the depth direction, so that a higher definition hologram image can be obtained. For this reason, it is required to be sensitive to laser light having a visible oscillation wavelength with high sensitivity and exhibit high resolution. In addition, when actually used for forming a hologram, the diffraction efficiency of the hologram and the reproducibility of the wavelength of the reproduced light are required. It is required that characteristics such as the band width (half-value width of the reproduction light peak) meet the purpose. Further, it is also required to have excellent storage stability over a long period of time.

[0007]

However, the recording material constituting the Lippmann hologram hologram does not have heat resistance. Therefore, in the laminating method or the hot stamping method, the Lippmann hologram is discolored by heat and is further recorded. There is a problem that the image is destroyed. In the hot stamping method, a complicated and multi-layered transfer foil must be separately prepared and then bonded and transferred to a substrate. In this process, the hologram images are transferred to the same position and the same image. There has been a demand for accurate positioning of the foil and the base material and for ensuring that there is no loss or stain on the image during transfer.

As described above, in the manufacturing method using the transfer foil, especially when the card is manufactured by injection molding, the card body is integrally formed, but the hologram portion must be formed separately. Since the hologram for the purpose of security must be managed as a transfer foil, there is a problem that the process is troublesome and the merit of integral molding is reduced.

The present invention has been made in view of the above-mentioned problems of the prior art, and does not use a transfer foil.
A single injection molding process can simultaneously perform card molding and hologram formation, enabling security-related holograms to be provided integrally with the card. Furthermore, scratches and dirt on the Lippman hologram provided on the card It is an object of the present invention to provide a method for manufacturing a card with a Lippmann hologram and a card with a Lippmann hologram, which can also realize an increase in the durability of the card.

[0010]

The means provided by the present invention to achieve the above object will be described below. The method for manufacturing a card with a Lippmann hologram according to claim 1, wherein a label having a Lipphologram provided on at least a part of a base sheet is brought into contact with a card surface forming surface in an injection mold, and the label is provided. Is mounted in a state where a cavity is provided on the back side thereof, and a molding resin is injected into the cavity to be integrally molded.

According to a second aspect of the present invention, there is provided a method for manufacturing a card with a Lippmann hologram, wherein a label is placed in contact with both of the opposing card surface forming surfaces in an injection mold, and the label is placed between the labels. Forming a cavity in the cavity, and injecting molding resin into the cavity to integrally mold the card, wherein at least one of the labels is provided with a Lippmann hologram on at least a part of a base sheet. It is a label.

[0012] The invention according to claim 3 is the invention according to claim 1 or 2.
5. The method for manufacturing a card with a Lippmann hologram according to any one of the above, wherein the label provided with the Lippmann hologram has a Lipphologram hologram recording layer and a protective layer formed on the base sheet in this order.

The invention described in claim 4 is the first or second invention.
In the method for manufacturing a card with a Lippmann hologram according to any one of the above, the label provided with the Lippmann hologram has a non-contact type IC module fixed on a surface of the base sheet opposite to a surface on which the Lippman hologram is formed. It is characterized by having.

According to a fifth aspect of the present invention, there is provided the first or second aspect.
In the method for manufacturing a card with a Lippmann hologram according to any one of the above, the label provided with the Lippmann hologram, a seal type Lippmann hologram in which an adhesive layer appears when the release sheet on the image side is peeled off is attached to the base sheet. A sticker is attached from the inside of the label so that the image of the Lippmann hologram can be clearly seen from the outside.

According to a sixth aspect of the present invention, in the method of manufacturing a card with a Lippmann hologram according to any one of the first, second, or fifth aspect, the label provided with the Lippmann hologram is provided on the base sheet with a Lippman hologram. The hologram recording layer and the heat-resistant layer are formed in this order, and the hologram recording layer and the heat-resistant layer are placed so that the heat-resistant layer side is located on the cavity side.

The invention described in claim 7 is the first or second invention.
In the method for manufacturing a card with a Lippmann hologram according to any one of the above, the label provided with the Lippmann hologram has a non-contact type IC module fixed on the same side of the base sheet as the surface on which the Lippman hologram is formed. It is characterized by having been done.

[0018] The invention described in claim 8 is the invention according to claims 1 to 6.
The method for manufacturing a card with a Lippmann hologram according to any one of the above, wherein the base sheet of the label is a transparent sheet.

A card with a Lippmann hologram according to a ninth aspect is characterized in that a label having a Lippman hologram formed on at least a part of a base sheet is provided integrally with the card surface.

According to a tenth aspect of the present invention, in the card with a Lippmann hologram according to the ninth aspect, the label is formed by sequentially forming a Lippmann hologram recording layer and a protective layer on the base sheet. I do.

According to an eleventh aspect of the present invention, in the card with a Lippmann hologram according to the ninth aspect, the label is provided on a surface of the base sheet opposite to the surface on which the Lippmann hologram is formed, in a non-contact type IC module. Are fixed.

According to a twelfth aspect of the present invention, in the card with the Lippmann hologram according to the ninth aspect, a Lippman hologram recording layer is provided in the inner layer portion of the card below the label, and the Lipphologram hologram is formed from outside the card. The feature is that images can be seen.

At the time of injection molding, it is preferable to take care so that the Lippmann hologram does not discolor or the hologram image is destroyed due to the high temperature heat applied by the molten high temperature resin. . As a countermeasure to prevent such discoloration and destruction, for example, use a material having high heat resistance for the Lippmann hologram recording layer itself, or `` another layer '' between the molten high-temperature resin and the Lippman hologram recording layer Is arranged to prevent high-temperature heat from sufficiently transmitting to the Lippmann hologram recording layer. In the latter case, the "other layer" preferably has heat resistance, and more preferably has high heat insulation.

According to a thirteenth aspect of the present invention, in the card with a Lippmann hologram according to the ninth aspect, the Lippman hologram recording layer and the heat-resistant layer are located in the card inner layer portion below the label in this order. Characterized in that the image of the Lippmann hologram can be seen from outside.

According to a fourteenth aspect of the present invention, the card with the Lippmann hologram includes a label having a Lippman hologram formed on at least a part of the base sheet on the card surface side, and the card surface having the Lipphologram hologram forming portion is provided on the card surface. It is characterized by being smooth without any unevenness.

According to the present invention, the label formed by forming a Lippmann hologram on at least a part of the base sheet is pressed against the card surface forming surface of the mold by the pressure of the resin injected into the cavity in the injection mold. The application of the Lippmann hologram layer can be performed integrally and simultaneously with the molding of the card. That is, since no thermal stress is applied, the Lippmann hologram can be provided firmly without discoloration of the Lippmann hologram itself and destruction of the Lippman hologram image. In addition, the Lippmann hologram recording layer can be provided below the label (the inner layer side of the card). As a result, the durability of the Lippmann hologram against scratches and dirt can be increased.

In addition, since the hologram is formed continuously with the surface of the card in the area where the hologram is not integrally formed by only one step of the injection molding process, no protrusion or depression of the hologram occurs, and the appearance is improved. Is improved, and when the hologram of the card is tampered with or altered, it is easy to determine the hologram. Furthermore, by incorporating the non-contact type IC module mounted on the label at the same time as the injection molding of the resin, a hologram card having the non-contact type IC module can be manufactured in a short time, thereby improving production efficiency and reducing costs. Can be In addition, by providing a protective layer on the entire surface of the label including the hologram, damage to the card surface due to rubbing, scratching and the like can be prevented.

[0027]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic sectional view showing the structure of a label 2 used for manufacturing a card with a Lippmann hologram of the present invention, and FIG. 2 is a schematic view showing another structure of a label used for manufacturing a card with a Lippmann hologram of the present invention. FIG. 3 is a schematic sectional view of a mold used for manufacturing the card with a Lippmann hologram of the present invention.
FIG. 4 is a schematic sectional view showing a state in a mold in the production of the hologram card of the present invention in the first embodiment, and FIGS. 5 (a) and (b) show a hologram card manufactured by the present invention. FIG. 6 is a cross-sectional view illustrating a card with a Lippmann hologram according to the first embodiment, and FIG. 6 is a schematic cross-sectional view illustrating a configuration of a label 16 used for manufacturing a card with a Lippmann hologram of the present invention. FIG. 7 is a schematic cross-sectional view showing a state in a mold in manufacturing the card with the Lippmann hologram of the present invention in the second embodiment, and FIGS. 8A and 8B are manufactured by the present invention. It is sectional drawing which shows the card with a Lippmann hologram in 2nd Embodiment.

FIG. 10 is a schematic sectional view showing another example of the structure of the label 101 used for manufacturing the card with the Lippmann hologram of the present invention, and FIG. 11 is the label 10 used for manufacturing the card with the Lippmann hologram of the present invention.
FIG. 12 is a schematic cross-sectional view showing the configuration of No. 5, and FIG. 12 is a schematic cross-sectional view used for manufacturing a card with a Lippmann hologram of the present invention. FIG. 13 is a schematic sectional view showing a state in a mold in the production of the hologram card of the present invention in the third embodiment, and FIG.
It is sectional drawing which shows the card with a Lippmann hologram in embodiment.

[0029] 1. First Embodiment Step 1: Production of Label As shown in FIGS. 1 and 2, a hologram recording layer 4 on which a Lippmann hologram is recorded is formed on at least a part of a base sheet 3. The protective layer 5 is provided on the hologram recording layer 4 to obtain the label 2. In addition,
A printed layer (not shown) of characters or patterns is placed on either or both sides of the base sheet 3, or a non-contact type IC module 7 is placed on the back side of the base sheet 3 via the adhesive layer 6 as shown in FIG. Can also be placed. Although the adhesive layer 6 is not shown in FIG. 2, when the adhesive layer 6 is provided, it is provided between the surface of the base sheet 3 and the non-contact type IC module 7.

Step 2: Mounting in a mold The label 2 is mounted in an injection mold 9 shown in FIG. This mold 9 is formed by assembling an upper mold 10 and a lower mold 11 in a dividable manner. In the clamped state, a thin card-shaped space having a predetermined dimension is formed inside, and an injection port for molten resin. 13 are formed. On the inner surfaces of the upper mold 10 and the lower mold 11, a card surface forming surface 10a and a card back surface forming surface 11a that form the front and back surfaces of the card 1 with the Lippmann hologram to be manufactured.
Are formed to face each other in parallel.

As shown in FIG. 4, the label 2 is
The upper mold 10 is mounted on the card surface forming surface 10a. As a mounting method, a method such as suction is suitable. Label 2
Is mounted on the upper mold 10 and the molds 10 and 11 are clamped. When the mold 9 is clamped, the label 2 and the lower mold 11 are closed.
A cavity 12 is formed between.

Step 3: Injection molding of resin Next, a predetermined amount of molten resin is injected from the injection port 13 into the cavity 12 formed in the mold 9, and then cooled and solidified.

Step 4: Mold opening When the molten resin has cooled and solidified, the upper mold 10 and the lower mold 11
Is divided and opened, and a card 1 with a Lippmann hologram shown in FIG. 5A having a hologram recording layer 4 on which a Lippman hologram is recorded on the surface is formed and integrated with the injected resin 14. According to this, even if the hologram recording layer 4 is partially formed on the base sheet 3, the label 2 is pressed against the card surface forming surface 10 a of the upper mold 10 by the pressure of the injected resin 14, 14, the hologram recording layer 4 is relatively buried in the base sheet 3 and the card surface forming surface 1
0a, the surface of the label 2 is formed in a continuous state, and a Lippmann hologram image is observed from the card surface. In addition, this Lipman holographic card 1
From the front side, characters and patterns by the printing layer provided on the base sheet 3 as necessary are observed. In addition, in order to improve the filling property of the resin into the thin portion in the cavity by the injection molding, the molten resin may be filled by the injection compression molding method.

Here, the material of the base sheet 3, the reflective thin film 4, the printing layer 6, the protective layer 7 and the resin 14 used for the card constituting the label 2 and the method of forming the label 2 will be described. [1] Base Sheet 3 The base sheet 3 is a film sheet or the like that is rich in ductility such that the reflective thin film 4 is smoothly inserted into the resin without being damaged during resin injection molding, and on which a hologram pattern 5 having fine irregularities can be formed. When the print layer 6 is provided, a material having printability is naturally used. For example, a resin film or sheet obtained by extruding a material such as a polyolefin resin such as polyethylene or unstretched polypropylene, a polyester resin, a polycarbonate resin, a polyvinyl alcohol resin, a polyvinyl chloride resin, an ABS resin, or the like, a calender roll molding method, or the like. Further, a composite sheet made of these materials is used. The thickness is preferably in the range of about 10 to 200 μm in consideration of printability.

[2] Hologram recording layer 4 The material constituting the hologram recording layer 4 may be any material capable of recording a volume phase hologram (Lipman hologram), such as a photopolymer, a silver halide emulsion, a hardened dichromated gelatin, Dielectric crystals, photochromics and photodichroics, etc., these are suitable binders composed of solvent-soluble thermoplastic resins, such as acrylates, alpha-alkyl acrylate esters,
An acidic polymer, an interpolymer, or the like can be used alone or in combination of two or more. The thickness is preferably in the range of about 10 to 100 μm in consideration of recording characteristics.

[3] Protective Layer 5 The protective layer 2 can be formed by printing using a gravure printing method, a roll coat printing method, or the like. Materials used are acrylic resin, urethane resin, vinyl chloride resin, vinyl acetate resin, nitrocellulose, hydroxycellulose, carboxymethylcellulose, polyvinyl alcohol, styrene-maleic acid copolymer, polyester resin, melamine resin, epoxy resin, ABS A resin such as a resin is used. These are dissolved or dispersed in a solvent such as toluene or xylene, applied by a gravure printing method or a roll coat printing method, and dried to form a heat-resistant protective layer. Further, a curable resin such as a thermosetting resin, an ultraviolet curable resin, and an electron beam curable resin may be used. Further, additives for enhancing the resistance, extenders, fats and oils, and the like can be added in a range that does not impair the transparency of the protective layer. In addition, the film thickness is set to 0.5 to 5 μm in consideration of bonding characteristics and the like.
It is preferably in the range of m.

[4] Resin 14 Resin 14 is a general-purpose polystyrene resin, impact-resistant polystyrene resin, acrylonitrile styrene resin, ABS resin, acrylic resin, polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, polycarbonate resin, polyvinyl chloride. Thermoplastic resins such as resin, modified PPO resin, polyethylene terephthalate resin, polybutylene terephthalate resin, and polyphenylene sulphate resin, alloy resins obtained by compounding these materials, or reinforced resins obtained by adding glass fibers to them are used. .

[5] Non-Contact IC Module 7 As shown in FIG.
Can be arranged on the back side of the surface on which the hologram is formed, that is, on the surface of the base sheet 3 located inside the card. Thereby, as shown in FIG. 5B, a function as a non-contact type IC card can be given to the hologram card. Data communication using this non-contact type IC card is performed in a system including a transponder (IC card) attached to a mobile object such as a person or a car and an interrogator (antenna and controller) fixed thereto. It is carried out between the vessels in a non-contact state, that is, using an electromagnetic wave, a magnetic field, a sound wave or the like as a carrier. The transmission system mainly includes four types: an electromagnetic induction system, an electromagnetic coupling system, a microwave system, and an optical communication system.

In the electromagnetic induction system, a loop coil or a coil with a core is arranged opposite to each other at intervals of several tens of centimeters, and several hundred k
An induction electromagnetic field generated in the vicinity by passing a signal current of Hz is used as an information transmission medium. The electromagnetic coupling method uses a core-to-core coil or air-core coils (one on the antenna side and the other on the IC card side) of several mm to
They are arranged facing each other with an interval of several tens of mm, and information is transferred between the coil and the IC card by mutual induction. The microwave method uses a radiated electromagnetic field (so-called radio wave) generated by a quasi-microwave current with a wavelength of more than 10 cm as an information transmission medium, and achieves appropriate directivity by combining a plurality of small antenna elements. ing.

In the optical communication system, near-infrared light emitted from a light emitting diode on the transmitting side is used as an information transmission medium, and on the receiving side, photoelectric conversion is performed by a phototransistor or a photodiode. The former three methods are mainly used, and they are formed as a non-contact type IC module 7 composed of a CPU, a memory IC chip and a coil or an antenna for data communication, power supply, etc. What is integrated on a substrate or integrated by wiring is used. The non-contact type IC module 7 is sealed with an epoxy resin, a polypropylene resin or the like from the viewpoint of convenience of handling and protection.

[6] Adhesive Layer 6 The method of fixing to the label 2 includes an adhesive method, a heat fusion method, a solvent adhesion method, a high frequency welding method, an ultrasonic welding method, and the like. , Structure, and purpose of use. In particular, the adhesive method uses epoxy resin, urethane resin, silicone rubber resin, acrylic resin,
One-component or two-component curable adhesives such as polyamide resins or hot melt waxes can be used.
In addition, the non-contact type IC module in the unsealed state can be fixed and fixed to the label 2 with an adhesive, and an epoxy resin, a polypropylene resin, a polyamide resin, or the like can be used as the sealing / adhesive. It is possible.
Further, the heat fusion method fixes the non-contact type IC module 8 to the label 2 using a means such as a heat sealer or a heat lamination, and the solvent bonding method seals the label 2 and the non-contact type IC module 8. The adhesive surface is dissolved by a solvent having a high solubility in common with the resin to be dried, and then dried and then adhered.

As described above, according to the above-described method, the label 2 provided with the hologram recording layer 4 on at least a part of the base sheet by the pressure of the resin 14 injected into the cavity 12 in the mold 9 is used. The hologram is pressed against the card surface forming surface 10a, and the hologram is formed simultaneously and simultaneously with the molding of the card, so that the thermal stress applied to the hologram recording layer 4 can be reduced. There was no occurrence. Furthermore, as shown in FIG. 5B, the label 2 is integrated with the resin 14 to be injection-molded, and at the same time, the mounting of the non-contact type IC module 8 can be completed. Can be manufactured, and as a result, the production efficiency can be improved and the cost can be reduced.

[7] Printing Layer Although not shown, the printing layer can be provided on one or both of the front and back surfaces of the label 2 by a known printing method such as an offset printing method, a gravure printing method, or a screen printing method. The materials used vary slightly depending on the printing method, and are exemplified below. -Offset printing method-Inks such as polyester acrylate resin, polyurethane acrylate resin, epoxy acrylate resin, and alkyd resin. -Gravure printing method-inks such as cellulose resin, chlorinated polypropylene, vinyl chloride / vinyl acetate copolymer resin, saturated polyester resin, and acrylic resin. -Screen printing method-Inks such as polyester resin, vinyl chloride / vinyl acetate copolymer resin, and acrylic polyol resin. Depending on the material of the label 2, printing can be performed on both the front and back of the label 2. In particular, if the label 2 is sufficiently transparent, a printing layer is provided on the back of the label 2 and printing is performed through the label 2. You can see. Further, it is also possible to provide a printing layer on the back surface of the label 2 provided with the hologram recording layer 4 and see the printing layer through the Lippmann hologram image and the label 2.

2. Second Embodiment Next, a second embodiment of the present invention will be described. Note that the same reference numerals are given to the parts having the same configuration in each figure according to the hologram card of the present invention described above. Step 1: Manufacture of Label As shown in FIGS. 1 and 2, a hologram recording layer 4 on which a Lippmann hologram is recorded is formed on at least a part of the base sheet 3, and if necessary, the hologram recording layer 4 is formed. The protective layer 5 is provided thereon, and the label 2 is obtained. In addition,
A printed layer (not shown) of characters or patterns is placed on either or both sides of the base sheet 3, or a non-contact type IC module 7 is placed on the back side of the base sheet 3 via the adhesive layer 6 as shown in FIG. Can also be placed. In addition, FIG.
Label 16 arranged opposite label 2 shown in FIG.
Is a hologram recording layer 4 on which a Lippmann hologram is recorded in the same manner as the base sheet 3 or the label 2, a protective layer 5, and / or a printing layer (not shown) for characters and pictures.
Alternatively, the label may be in the form shown below. Further, as shown in FIG. 6C, a non-contact IC module can be placed on the back surface of the base sheet.

Step 2: Inserting into a mold As shown in FIG.
Is placed in the mold 9 as shown in FIG. That is,
The label 2 is mounted on the card surface forming surface 10 a of the upper mold 10, and the label 16 is mounted on the card back surface forming surface 11 a of the lower mold 11. As a mounting method, a method such as suction is suitable. The upper mold 10 and the lower mold 11 are clamped. When the mold 9 is clamped, a cavity 12 is formed between the label 2 and the label 16.

Step 3: Injection molding of resin Next, a predetermined amount of molten resin is injected into the cavity 12 from the injection port 14 to fill it, and then cooled and solidified.

Step 4: Mold opening When the molten resin has cooled and solidified, the upper mold 10 and the lower mold 11
Is divided and opened, and a card 22 with a Lippmann hologram shown in FIG. 8A having a hologram recording layer 4 on which a Lippman hologram is recorded by being molded and integrated with the resin 14 is obtained. According to this, even if the hologram recording layer 4 is partially formed on the base sheet 3, the label 2 is moved by the pressure of the injected resin 14 to the upper mold 10.
The hologram recording layer 4 is relatively buried in the base sheet 3 by being pressed against the card surface forming surface 10a and being integrated with the resin 14, and the surface of the label 2 is continuous following the card surface forming surface 10a. And a Lippmann hologram image is observed from the card surface. Further, in the card 22 with the Lippmann hologram, characters and pictures by the print layer provided on the base sheet 3 as necessary are observed from the front side. The same applies when a hologram recording layer is formed on the label 16.

[7] Label 16 As the back label 16, an arbitrary paper, synthetic paper, resin film, or a sheet made of a combination of these materials, etc., having printability since the printing layer 6 is provided is applied. . For example, examples of the paper include high-quality paper, coated paper, art paper, paper having printability such as card paper, and synthetic paper. In the resin system, polyethylene, polypropylene and other polyolefin resins and polyester resins,
A resin film or sheet obtained by extruding a material such as a polycarbonate resin, a polyvinyl chloride resin, or an ABS resin by an extrusion molding method, a calendar roll molding method, or the like, and further, a composite sheet using these materials is used. The thickness is selected from a range of about 10 to 200 μm in consideration of printability.

According to the second embodiment, the label 2 provided with the hologram recording layer 4 on at least a part of the base sheet by the pressure of the resin 14 injected into the cavity 12 in the mold 9 is formed of the mold. The hologram is pressed against the card surface forming surface 10a, and the hologram is formed simultaneously and simultaneously with the molding of the card, so that the thermal stress applied to the hologram recording layer 4 can be reduced. There was no occurrence.

Similarly to the first embodiment, as shown in FIG.
16 and the mounting of the non-contact type IC module 8 can be completed at the same time, so that the non-contact type
The hologram card 23 provided with the C card function can be manufactured, and as a result, the production efficiency can be improved and the cost can be reduced.

Next, an embodiment of means provided by the present invention for imparting higher durability to the Lippmann hologram provided on the card will be described. 3. Third Embodiment Step 1: Production of Label As shown in FIG. 10, a Lippmann hologram in which a hologram recording layer 103 on which a Lippmann hologram is recorded and a heat-resistant layer 102 are combined at least under a base sheet 104. A sticker was pasted. The label 105 arranged on the opposite side of the label 101 shown in FIG.
Base sheet 6 alone, or hologram recording layer 10 on which Lippmann hologram is recorded in the same manner as label 101
3, a heat-resistant layer 102 and / or a printed layer (not shown) of characters, pictures, or the like, or a label having an aspect as described below.

Step 2: Inserting into a mold As shown in FIG. 13, the label 101 and the back label 105 are placed in the mold 7 as shown in FIG.
That is, the label 101 is mounted on the card surface forming surface 110 of the upper mold 108, and the label 105 is mounted on the card rear surface forming surface 111 of the lower mold. As a mounting method, a method such as suction is suitable. These upper molds 10
8. The lower mold 109 is clamped. When the mold 7 is clamped, a cavity 113 is formed between the label 101 and the label 105.

Step 3: Injection molding of resin Next, the cavity 113 is filled with a predetermined amount of molten resin by injecting it through the injection port 112, and then cooled and solidified.

Step 4: Mold opening When the molten resin has cooled and solidified, the upper mold 108 and the lower mold 1
09 is divided and the mold is opened to obtain a card 115 with a Lippmann hologram having the hologram recording layer 103 formed of the resin 114 as shown in FIG. Further, in the card 115 with the Lippmann hologram, characters and patterns by the printing layer provided on the base sheet 104 as necessary are observed from the front side. The same applies to the case where a hologram recording layer is formed on the label 105.

[1] The material constituting the hologram recording layer 103 may be any material capable of recording a volume phase hologram (Lipmann hologram), such as a photopolymer, a silver halide emulsion, a hardened dichromic acid-treated gelatin, Dielectric crystals, photochromics and photodichroics, etc., these are suitable binders composed of solvent-soluble thermoplastic resins, such as acrylates, alpha-alkyl acrylate esters,
An acidic polymer, an interpolymer, or the like can be used alone or in combination of two or more. The thickness is preferably in the range of about 10 to 100 μm in consideration of recording characteristics.

[2] Base sheet 104 Polyolefin resin such as polyethylene or undrawn polypropylene, polyester resin, polycarbonate resin, polyvinyl alcohol resin, polyvinyl chloride resin, ABS
A resin film or sheet obtained by extrusion molding, calender roll molding, or the like of a material such as a resin, or a composite sheet made of these materials is used. The thickness is
In consideration of printability, the thickness is preferably in the range of about 10 to 200 μm.

[3] Label 105 As the back label 105, a sheet made of any paper, synthetic paper, resin film, or a composite of these materials, which has printability since a printing layer is provided, is applied. For example, examples of the paper include high-quality paper, coated paper, art paper, paper having printability such as card paper, and synthetic paper. In the resin system, polyethylene, polypropylene and other polyolefin resins and polyester resins,
A resin film or sheet obtained by extruding a material such as a polycarbonate resin, a polyvinyl chloride resin, or an ABS resin by an extrusion molding method, a calendar roll molding method, or the like, and further, a composite sheet using these materials is used. The thickness is selected from a range of about 10 to 200 μm in consideration of printability.

[4] Resin 114 Resin 114 is a general-purpose polystyrene resin, impact-resistant polystyrene resin, acrylonitrile styrene resin, ABS
Thermoplastic resins such as resin, acrylic resin, polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, polycarbonate resin, vinyl chloride resin, modified PPO resin, polyethylene terephthalate resin, polybutylene terephthalate resin, polyphenylene sulfur resin, and their materials Alloy-based resin or a reinforced resin obtained by further adding glass fiber to them.

[5] Printing Layer Although not shown, the printing layer can be provided on one or both of the front and back surfaces of the label 101 by a known printing method such as an offset printing method, a gravure printing method, or a screen printing method. The materials used vary slightly depending on the printing method, and are exemplified below. -Offset printing method-Inks such as polyester acrylate resin, polyurethane acrylate resin, epoxy acrylate resin, and alkyd resin. -Gravure printing method-inks such as cellulose resin, chlorinated polypropylene, vinyl chloride / vinyl acetate copolymer resin, saturated polyester resin, and acrylic resin. -Screen printing method-Inks such as polyester resin, vinyl chloride / vinyl acetate copolymer resin, and acrylic polyol resin.

In the third embodiment, as in the first and second embodiments, except that the label provided with the Lippmann hologram is different, as shown in FIG. Accordingly, a hologram card having a non-contact IC card function can be manufactured in a short time, and as a result, improvement in production efficiency and reduction in cost can be achieved.

Further, regarding the structure of the injection mold and its injection port, the injection mold 9 having the injection port 13
And an injection mold 107 having an injection port 112.
Types are illustrated, the former is cited in the first and second embodiments, and the latter is cited in the third embodiment. However, the present invention does not necessarily need to be limited to these combinations, for example, the latter mold and the first or second mold.
Or the combination of the former mold and the third embodiment.

[0062]

EXAMPLES Hereinafter, more specific examples based on the above embodiments will be described. FIGS. 9A to 9G are cross-sectional views illustrating steps of manufacturing a label according to the first embodiment of the present invention. 14 (a) to 14 (g) are cross-sectional views showing steps of manufacturing a label according to another embodiment 2 of the present invention. still,
The reference numerals correspond to those in the above embodiments.

<Example 1> [a] Production of label 2 (1) A thickness of 2 was set between two transparent substrates 31 having a thickness of 0.5 μm.
A sheet A [FIG. 9 (a)] on which a photopolymer 32 of a 0 μm photosensitive resin (the same expression as the photosensitive resin, in which the type of resin used is disclosed here) was obtained. (2) A thickness of 1 between two transparent substrates 33 having a thickness of 0.5 μm.
The sheet B (FIG. 9B) on which the tuning resin 34 of 5 μm was formed was obtained. (3) Adhesive layers 36 on both sides of black base material 35 having a thickness of 1 μm
(Thickness 0.5 μm) and sheet C (FIG. 9C) on which release paper 37 (thickness 1 μm) was formed. (4) The pressure-sensitive adhesive layer 38 (having a thickness of 0.1 μm) is formed on the protective layer 40 having a thickness of 1 μm.
5 [mu] m) and a sheet D [FIG. 9 (d)] on which release paper 39 (thickness 1 [mu] m) was formed.

First, an image is recorded as an interference fringe on the sheet A using a laser. One of the base material 31 of the sheet A is peeled off, and one of the transparent base material 33 of the sheet B is peeled off, and the tuning resin 34 and the photopolymer 32 are passed through a laminator and adhered to the sheet E (FIG. 9 (e)). Was prepared. The base material 31 of the sheet E is peeled off, and one side of the release paper 37 of the sheet C is peeled off to obtain a black base material 35 (1 μm thick).
m) was adhered to the photopolymer 32 via the adhesive 36 to obtain a sheet F (FIG. 9F). The transparent substrate 33 of the sheet F is peeled off, and the release paper 39 of the sheet D is released.
Is peeled off and adhered to the photopolymer 32 to form a sheet G [FIG.
(G)]. The hologram recording layer 4 and the protective layer 5 were formed by peeling the release paper 37 of the sheet G and bonding it to the base sheet 3 on a 100 μm-thick white polyethylene terephthalate resin sheet via an adhesive 36. Further, a non-contact type IC module 7 is bonded and fixed to the surface of the base sheet 3 opposite to the hologram recording layer 4 via an adhesive layer 6 made of a urethane-based adhesive. I got

[B] Production of Label 16 Further, a white polyethylene terephthalate resin sheet having a thickness of 100 μm was used as the label 16.

[C] Preparation of Card The prepared labels 2 and 16 are placed on the upper die 10 and the lower die 11 of the die 9 by suction in the same manner as in the second embodiment, and are placed in the cavity 12. Acrylic nitrile-butadiene-styrene (ABS) resin 14 melted at 200 ° C.
After injection, filling, cooling and solidification, a card 21 with a Lippmann hologram was obtained.

The thus obtained card 21 with Lippmann hologram can form a Lippmann hologram integrally on the card in only one injection molding step, and the interference pattern of the Lippmann hologram does not change. A card with a Lippmann hologram in which the image is not discolored or destroyed was obtained.

<Example 2> [a] Production of label 101 (1) Photopolymer 117 made of photosensitive resin having a thickness of 20 µm between two transparent substrates 116 having a thickness of 0.5 µm
(The same expression as the photosensitive resin. In this case, what kind of resin was used is disclosed.)
(A)] was obtained. (2) Sheet B in which tuning resin 119 having a thickness of 15 μm is formed between two transparent substrates 118 having a thickness of 0.5 μm
[FIG. 15 (b)] was obtained. (3) An adhesive layer 121 (thickness 0.5 μm) and a release paper 122 on an upper surface of a black base material 120 (black base material) having a thickness of 1 μm.
A sheet C (FIG. 15C) having a thickness of 1 μm was obtained. (4) Sheet D (FIG. 15D) was obtained in which an adhesive layer 123 (0.5 μm in thickness) and a release paper 124 (1 μm in thickness) were formed on a protective layer 125 having a thickness of 1 μm.

First, an image is recorded on sheet A as interference fringes using a laser. One of the transparent bases 16 of the sheet A is peeled off, and one of the transparent bases 118 of the sheet B is peeled off. The tuning resin 119 and the photopolymer 117 are passed through a laminator and adhered to the sheet E [FIG.
5 (e)]. The transparent substrate 116 of the sheet E
And the release paper 122 of the sheet C is released to remove the black base material 12.
0 (black polyethylene terephthalate sheet, thickness 1μ)
m) is an adhesive layer 1 having both heat resistance and optical properties of transparency.
21 and the photopolymer 117, and the sheet F
[FIG. 15F]. The transparent substrate 11 of the sheet F
8 and the release paper 124 of the sheet D is peeled off and adhered to the photopolymer 117 to form the sheet G [FIG.
(G)]. Next, the protective layer 125 of the sheet G is peeled off, and the hologram recording layer 103 and the heat-resistant layer 102 are adhered to each other via a pressure-sensitive adhesive 123 on a transparent rigid vinyl chloride sheet having a thickness of 100 μm as the base sheet 104.
Was formed.

[B] Preparation of Label 105 Further, a transparent polyvinyl chloride sheet having a thickness of 100 μm was used as the label 105.

[C] Production of Cards The produced labels 101 and 105 are placed in an injection molding die 10.
7, acrylonitrile-butadiene-styrene (A) which was placed on predetermined surfaces of the upper mold 108 and the lower mold 109 by suction, and was heated and melted at 200 ° C. in the cavity 113.
BS) Resin 114 was injected and filled, and a cooling time of 30 seconds was taken in order to suppress warping and twisting of the card, thereby obtaining a card 115 with a Lippmann hologram.

The thus obtained card 115 with a Lippmann hologram can form the Lippmann hologram integrally on the card by only one injection molding step, and the interference pattern of the Lippman hologram does not change. A card with a Lippmann hologram in which the image is not discolored or destroyed was obtained.

<Comparative Example> The labels 2 and 16 obtained in the same manner as in the above example were bonded and formed to a separately formed card substrate by a thermal lamination method. The hologram image was discolored and the image was destroyed.

[0074]

According to the present invention, a label formed by forming a Lippmann hologram on at least a part of the base sheet by the pressure of the resin injected into the cavity in the mold for injection molding is pressed against the card surface forming surface of the mold. The molding of the card and the application of the Lippmann hologram layer are integrated,
In addition, since the thermal stress is not applied to the Lippmann hologram because it can be performed at the same time, the Lippmann hologram can be firmly provided without causing discoloration of the Lippmann hologram itself and destruction of the Lippman hologram image.

Further, according to the present invention, the hologram is formed continuously with the surface of the card in the area where the hologram is not integrally formed by only one step of the injection molding step. In addition, the appearance is improved, and when the hologram of the card is tampered with or altered, it is easy to determine the hologram. Furthermore, by incorporating the non-contact type IC module mounted on the label at the same time as the injection molding of the resin, a hologram card having the non-contact type IC module can be manufactured in a short time, thereby improving production efficiency and reducing costs. Can be
In addition, by providing a protective layer on the entire surface of the label including the hologram, damage to the card surface due to rubbing, scratching and the like can be prevented.

Further, according to the present invention, a card with a Lippmann hologram produced by injection molding by pasting from the inside of a transparent base sheet with the image side of the Lippmann hologram facing up is different from a card pasted with a counterbore. In contrast, the card can be manufactured in a short time by integral molding by injecting a resin, and is a high-quality card without any unevenness on the card surface. In addition, the thickness of the card can be easily controlled by manufacturing by injection molding.

In addition, according to the present invention, since the label covers the Lippmann hologram, the Lipphologram can be protected from scratches and dirt without directly touching the hand, and there is no fear of slipping or peeling. There is no. Moreover, since the Lippmann hologram encapsulated from the outside can be visually observed, there is a sense of security and a sense of quality. Since the surface is a transparent hard vinyl chloride sheet, it is also excellent in decorating a card, and can easily be embossed on the card surface, pasted with a magnetic stripe, and transferred with a card printer.

In general, according to the present invention, card molding and hologram formation are performed simultaneously by one injection molding process without using a transfer foil, and a hologram related to security is provided integrally with the card. A method for manufacturing a card with a Lippmann hologram and a card with a Lippmann hologram, which enable the Lippman hologram provided on the card to be more durable against scratches and dirt, can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing a configuration of a label used for manufacturing a card with a Lippmann hologram of the present invention.

FIG. 2 is a schematic sectional view showing another configuration of the label 2 used for manufacturing the card with the Lippmann hologram of the present invention.

FIG. 3 is a schematic sectional view showing a configuration inside a mold used for manufacturing the card with a Lippmann hologram of the present invention.

FIG. 4 is a schematic cross-sectional view showing a state in a mold in manufacturing the card with the Lippmann hologram of the present invention in the first embodiment.

FIGS. 5A and 5B are cross-sectional views showing a card with a Lippmann hologram manufactured in the first embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view showing a configuration of a back label 16 used for manufacturing a card with a Lippmann hologram of the present invention.

FIG. 7 is a schematic cross-sectional view showing a state in a mold in manufacturing the card with a Lippmann hologram of the present invention in the second embodiment.

FIGS. 8A and 8B are cross-sectional views showing a card with a Lippmann hologram manufactured in a second embodiment of the present invention.

FIGS. 9A to 9G are cross-sectional views illustrating steps of manufacturing a label according to an embodiment of the present invention.

FIG. 10 is a schematic sectional view showing another configuration of the label 101 used for manufacturing the card with the Lippmann hologram of the present invention.

FIG. 11 is a schematic sectional view showing a configuration of a back label 105 used for manufacturing a card with a Lippmann hologram of the present invention.

FIG. 12 is a schematic cross-sectional view schematically showing a configuration inside a mold used for manufacturing a card with a Lippmann hologram of the present invention.

FIG. 13 is a cross-sectional view showing a state inside a mold in manufacturing the card with a Lippmann hologram of the present invention.

FIG. 14 is a sectional view showing a card with a Lippmann hologram manufactured in the embodiment of the present invention.

FIG. 15 is a cross-sectional view showing a label manufacturing process according to the embodiment of the present invention.

[Explanation of symbols]

 1 ··· Card with Lippmann hologram 2 ··· Label 3 ··· Base sheet 4 ··· Hologram recording layer 5 ··· Protective layer 6 ··· Adhesive layer 7 ··· Contact type IC module 9 Injection molding die 10 Upper die 10a Card surface forming surface 11 Lower die 11a Card back forming surface 12 Cavity 13 ... Injection port 14 ... Resin 16 ... Label 21, 22, 23 ... Card with Lippmann hologram 31 ... Transparent substrate 32 ... Photopolymer 33 ... Transparent substrate 34 ..Tuning resin 35 ・ ・ ・ Black base material 36 ・ ・ ・ Adhesive layer 37 ・ ・ ・ Release paper 38 ・ ・ ・ Adhesive layer 39 ・ ・ ・ Release paper 40 ・ ・ ・ Protective layer 101 ・ ・ ・ Label 102・ Heat-resistant layer 103 ・ ・ ・ Holog Ram recording layer 104 base sheet 105 label 106 base sheet 107 injection mold 108 upper mold 109 lower mold 110 card surface formation Surface 111: Card back surface forming surface 112: Injection port 113: Cavity 114: Resin 115: Card with Lippman hologram 116: Transparent substrate 117: Photopolymer 118 ... Transparent substrate 119 Tuning resin 120 Black substrate 121 Adhesive layer 122 Release paper 123 Adhesive layer 124 Release paper 125 Protection layer

Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI G09F 3/02 G09F 19/12 L 19/12 G06K 19/00 D // B29L 31:34 (72) Inventor Takehisa Kita Taito-ku, Tokyo 1-5-1, Toppan Printing Co., Ltd.

Claims (14)

[Claims] 1. A card surface forming surface in an injection molding die,
A label formed by providing a Lippmann hologram on at least a part of the base sheet, and placed in a state where a cavity is provided on the back side of the label, and a molding resin is injected into the cavity and integrally molded. A method for manufacturing a card with a Lippmann hologram. 2. A label is placed in contact with both opposing card surface forming surfaces in an injection molding die, a cavity is formed between the labels, and a molding resin is injected into the cavity. A method for manufacturing a card to be integrally molded, wherein at least one of the labels is a label having a Lippmann hologram provided on at least a part of a base sheet. . 3. The label according to claim 1, wherein the label provided with the Lippmann hologram has a Lippman hologram recording layer and a protective layer formed on the base sheet in this order. A method for manufacturing a card with a Lippmann hologram. 4. The label provided with the Lippmann hologram, wherein a non-contact type IC module is fixed on a surface of the base sheet opposite to a surface on which the Lippmann hologram is formed. Or the method for producing a card with a Lippmann hologram according to any one of the above items. 5. A label provided with the Lippmann hologram, wherein a sticker-type Lippmann hologram in which an adhesive layer appears when the release sheet on the image side is peeled off is adhered to a base sheet. 3. The method for manufacturing a card with a Lippmann hologram according to claim 1, wherein the image of the Lippmann hologram is clearly seen from the outside by sticking. 6. The label provided with the Lippmann hologram has a Lipphologram hologram recording layer and a heat-resistant layer formed on the base sheet in this order, and is placed so that the heat-resistant layer side is positioned on the cavity side. The method for producing a card with a Lippmann hologram according to any one of claims 1, 2, and 5. 7. The label provided with the Lippmann hologram, wherein a non-contact type IC module is fixed on the same surface of the base sheet as the surface on which the Lippmann hologram is formed. 3. The method for manufacturing a card with a Lippmann hologram according to any one of 1 and 2. 8. The method according to claim 1, wherein the base sheet of the label is a transparent sheet. 9. A card with a Lippmann hologram, wherein a label having a Lippman hologram formed on at least a part of a base sheet is provided integrally with a card surface. 10. The card with a Lippmann hologram according to claim 9, wherein the label is formed by sequentially forming a Lippman hologram recording layer and a protective layer on the base sheet. 11. The label according to claim 9, wherein a non-contact type IC module is fixed on a surface of the base sheet opposite to a surface on which the Lippmann hologram is formed. card. 12. The Lippmann hologram according to claim 9, wherein a Lippman hologram recording layer is provided on an inner layer portion of the card below the label so that an image of the Lippmann hologram can be viewed from outside the card. With card. 13. The Lipphologram hologram recording layer and the heat-resistant layer are located below the label in this order in the inner layer of the card, so that an image of the Lippmann hologram can be seen from the outside of the card. Item 10. A card with a Lippmann hologram according to item 9. 14. A label having a Lippman hologram formed on at least a part of a base sheet on the card surface side, and the card surface is smooth without any irregularities of the Lippman hologram formation portion. A card with a Lippmann hologram characterized by the following.