JP3785658B2 - IC card - Google Patents

Description

【００３８】
さらに隠蔽層として、以下の組成物をグラビア法により、乾燥温度１１０℃、塗布厚３μｍで塗布した後、６０℃、４８時間でエージングを行った。

【００３９】
次にオフセット印刷法により印刷部を膜厚１μｍとなるように絵柄等を設け、その上面に印刷部を保護する保護層をオフセット印刷法により膜厚２μｍでラベル全面に設けた。さらにラベルの他方の面にウレタン系接着層を介してエポキシ樹脂封止されたＩＣモジュールを接着し、固定によりラベルを作製した。
上記方法により得られた少なくとも一方のラベルにＩＣモジュールが配置されてなるラベルを、所望のカード形状に作製した金型にそれぞれ印刷部側が金型と接触するよう配置し、吸着させた後、アクリロニトリル−ブタジエン−スチレン樹脂からなる成形樹脂を射出し、冷却固化しをカードを作製した。
【００４０】
ラベルには予め印刷による文字・画像等が施されており、さらにラベルにＩＣモジュール固定用支持体としての機能とＳｎからなる低融点金属薄膜層による発行機能を有するカードを一回の射出成形工程により得ることができる。実施例１のＩＣモジュールの通信方式をマイクロ波方式としたところ、低融点金属薄膜層の熱溶融破壊前は完全に信号を遮断し通信不可能とし、ＩＣモジュールに相当する部分をカード両面からのサーマルヘッドにより熱破壊溶融後には通信可能となった。
【００４１】
（実施例２）
厚さ５０μｍの透明ポリ塩化ビニルベースシート上に文字・画像等をオフセット印刷法により印刷部を膜厚１μｍで設け、印刷部上にスクリーン印刷法により隠蔽層として白色インキを膜厚５μｍに設ける。さらに実施例１と同様に感熱増感層を、また低融点金属薄膜層を真空蒸着法によりＳｎの表面上の抵抗率が１. ５Ω／□になるような管理方法で膜厚約１２０００ｎｍに形成した。その上にウレタン系接着層を介してＩＣモジュールを接着し、固定によりラベルを作製した。
【００４２】
次に厚さ５０μｍの白色塩化ビニルシート上に同様に蒸着アンカー、低融点金属薄膜層、感熱増感層、隠蔽層と文字・画像等の印刷部を設け、その上に保護層をオフセット印刷法により膜厚２μｍでラベル全面に設けた。
上記方法により得られた２枚のラベルを、所望のカード形状に作製した金型にそれぞれ印刷部側が金型と接触するよう配置し、吸着させた後、アクリロニトリル−ブタジエン−スチレン樹脂を射出し、冷却固化しカードを作製した。
【００４３】
ラベルには予め印刷による文字・画像等が施されており、さらにラベルにＩＣモジュール固定用支持体としての機能とＳｎの低融点金属薄膜層による発行機能を有するカードを一回の射出成形工程により得ることができる。実施例１のＩＣモジュールの通信方式をマイクロ波方式としたところ、低融点金属薄膜層の熱溶融破壊前は完全に信号を遮断し、ＩＣモジュールに相当する部分をカード両面からのサーマルヘッドにより熱破壊溶融後には通信可能となった。
【００４４】
【発明の効果】
以上述べたように、ＩＣカードの表裏面に電磁波シールド層を形成し、これにより使用前の状態では非接触型ＩＣモジュールの通信機能を遮断させることで、不要な電池の消耗、不要なＩＣカードの応答などの誤動作の発生、使用前のデータの漏洩を防止することができる。そして初期化時（使用直前の発行段階）にＩＣモジュール部分の電磁波シールド層を加熱による溶融破壊から除去することにより、ＩＣモジュールの通信が可能となる初期化機能を備えたＩＣカードを提供することができる。
【００４５】
また、本発明のＩＣカードはＩＣモジュール、電磁波シールド層等をラベル上に配置又は形成することにより、射出成形方法により１回の射出成形行程で、ＩＣモジュールの内蔵と、文字・画像等の同時形成と、初期化機能を有する電磁波シールド層を備えたＩＣカードを得ることができた。
【００４６】
本発明のＩＣカードは、通信方式をマイクロ波方式としたところ、低融点金属薄膜からなる電磁波シールド層の熱溶融破壊前は完全にマイクロ波の信号を遮断しており、ＩＣモジュールに相当する部分のカード両面からのサーマルヘッドにより熱破壊溶融後にはマイクロ波の信号通信可能となった。
【図面の簡単な説明】
【図１】本発明のＩＣカードの平面図である。
【図２】 図１のＩＣカードのＸ−Ｘ線における断面図でありる。
【図３】 図２の部分拡大断面図である。
【図４】 ＩＣモジュールを説明するための概略説明図である。
【図５】 本発明のＩＣカードの製造に用いられる表裏面ラベルの断面図である。
【図６】 本発明のＩＣカードの製造工程を示す概略説明図である。
【図７】 本発明の他の実施例のＩＣカードの断面図である。
【図８】 本発明の他の実施例のＩＣカードの製造に用いられる表裏面ラベルの断面図である。
【図９】本発明の他の実施例のＩＣカードの断面図である。
【符号の説明】
１、１１、１２ ＩＣカード
２ カード基材
２１、２２ ラベル
３ ＩＣモジュール
４ 電磁波シールド層
５ 成形樹脂
６ 隠蔽層
７ 感熱増感層
８ 印刷部
９ 保護層
１０ 接着層
１５ プリント基板
１６ ＩＣチップ
１７ ループアンテナ
１８ アンテナ端子
１９ 電池
２０ 電子回路部品
２３、２４ 金型
２５ キャビティ
２６ 射出口[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC card capable of data communication with an external data processing device in a non-contact state, and more particularly to an IC card capable of inputting / outputting data for the first time when the IC card is issued.
[0002]
[Prior art]
In recent years, as external storage devices for computers and electronic devices using computers, in addition to magnetic recording media such as floppy disks and cassette tapes, semiconductor memories such as RAM and ROM having features such as ease of handling and miniaturization have been provided. A card-shaped or package-shaped recording medium is used. On the other hand, in the financial field and security field, a microprocessor and / or a RAM are used as a new card in place of a magnetic card in a field such as a credit card, a cash card, and an ID card. A so-called IC card is used in which an IC module in which a semiconductor memory such as FRAM or ROM is disposed on a printed circuit board or a film substrate and electrically connected is embedded or embedded in a card base. They have a very large information recording capacity. Has developed advanced because it has high security, especially use in the financial field security fields by taking advantage of the latter feature is considered to be promising.
[0003]
Such an IC card is roughly classified into a contact IC card that performs writing / reading on a microprocessor or a memory by a contact method and a non-contact IC card that performs a contactless operation. The contact type IC card is electrically connected to the internal microprocessor or memory on the card surface, and the external terminal of the external data processing device is directly and electrically connected to the exposed external terminal. These are IC cards that perform power supply and information communication, and most types of IC cards currently fall into this category. In this type of IC card data reading / writing, the error rate is very low, but if the external terminals are damaged due to contamination or wear, the electrical continuity is lost, and there is a possibility that reading / writing cannot be performed. In a dry environment, there is a problem that causes reading / writing errors due to static electricity charged on the surface of the IC card.
[0004]
In recent years, non-contact type IC cards have been developed, consisting of an electrostatic plate that performs data communication of memory IC chips and coils for receiving power supplied by electromagnetic induction. It has become. Since this type of IC module performs data communication in a non-contact manner, there is no need to expose the communication terminal on the card surface, so there are few failures due to communication errors due to contamination of external terminals or static electricity as described above. It is considered as a feature.
[0005]
The data communication by the non-contact type IC card as described above is a response in a system including a responder (IC card) attached to a moving body such as a person or a car and an interrogator (antenna and controller) fixed. This is performed in a non-contact state, that is, using an electromagnetic wave, a magnetic field, a sound wave or the like as a carrier between the instrument and the interrogator. There are mainly four types of transmission systems: an electromagnetic induction system, an electromagnetic coupling system, a microwave system, and an optical communication system.
[0006]
In the electromagnetic induction method, loop coils or cored coils are arranged facing each other at intervals of several tens of centimeters, and an induction electromagnetic field generated in the vicinity by applying a signal current of several hundred kHz is used as an information transmission medium. It is.
In the electromagnetic coupling method, cored coils or air-core coils (one on the antenna side and the other on the IC card side) are arranged facing each other with an interval of several mm to several tens mm, and the antenna and the IC card are mutually guided by mutual induction. The information is transferred with
The microwave system uses a radiated electromagnetic field (so-called radio wave) generated by a quasi-microwave current having a wavelength of several tens of centimeters as an information transmission medium, and realizes appropriate directivity by combining multiple small antenna elements. ing.
In the optical communication system, near infrared light emitted from a light emitting diode on the transmission side is used as an information transmission medium, and photo-electric signal conversion is performed on the reception side by a phototransistor or a photodiode.
There are three types of access methods for IC cards from the antenna side: RO (Read Only) type, WORM (Write Once Read Many) type, and RW (Read Write).
Information on the RO type IC card is written in advance at the time of shipment from the manufacturer side, and access from the antenna side is only readable.
In the WORM type, information can be written to the IC card only once, and thereafter, the written information can be read only, and is often used for identification of information as in the RO type.
Since information can be written to and read from the RW type IC card arbitrarily, various information can be written and read in addition to ID information, and information in a specific area of recorded information can be read or rewritten as necessary. To do.
[0007]
Data communication with the IC card is performed by these transmission methods and access methods, but the data recorded on the IC card, especially information necessary when using the IC card, such as a card identification code, a card ID, etc. When the IC card is shipped to the IC card user, it can be said that these IC cards have the above-mentioned information recorded and are usable. For example, in the ROM type, predetermined information is written on the IC card on the manufacturer or issuer side at the time of shipment.
[0008]
[Problems to be solved by the invention]
Therefore, when the IC card is obtained by a third party while the IC card is transferred from the manufacturer or the issuer side to the user side, the non-contact type IC card operates when it receives electromagnetic waves, etc., and thus may be misused. In particular, the type without a built-in power supply operates unconditionally when receiving electromagnetic waves for power supply. Similarly, other methods have the risk of information alteration, falsification, and information theft.
Further, the non-contact type IC card is not connected by a specific connection means, and when an electromagnetic wave having a predetermined value and intensity is supplied, it reacts unconditionally and transmits information from the IC card side to be in a communication operation enabled state. Therefore, when an unused (unissued) non-contact IC card is stored and electromagnetic waves of a predetermined value and intensity are supplied, it becomes an operating state all at once. There was a problem of expediting exhaustion. Therefore, the present invention forms an electromagnetic wave shielding layer on the front and back surfaces of the IC card, thereby blocking the communication function of the non-contact type IC module, and the electromagnetic wave shielding of the IC module part at the time of initialization (issue stage immediately before use). An object of the present invention is to provide an IC card having an initialization function of enabling communication of an IC module by removing a layer.
[0009]
[Means for Solving the Problems]
  The present invention, which has been made to achieve the above object, has at least the invention described in claim 1.WellMicroprocessor and / or memory, external data processing device and dataCommunication without contactIC module with communication means to be built in or embedded in card baseAndThe IC card is characterized in that an electromagnetic wave shielding layer that can be melted and removed by heat is formed on the front and back surfaces or the entire periphery of the card.
[0010]
  The invention described in claim 2At least a microprocessor and / or memory, and an IC module having a communication means for performing data communication with an external data processing device in a non-contact state are embedded or embedded in the card base, and are melted and removed by heat on the front and back surfaces or the entire periphery. A possible electromagnetic shielding layer is formed, andIt is characterized by forming at least a concealing layer, a printing layer, and a heat-resistant protective layer on the electromagnetic shielding layer.IC card.
[0011]
  According to a third aspect of the present invention, in the IC card of the first aspect, the electromagnetic wave shielding layer has a function of shielding electromagnetic waves and blocking communication with the outside of the IC module.Can be melted and destroyed by heat.It consists of a low melting point metal thin film.
[0012]
According to a fourth aspect of the present invention, in the IC card of the third aspect, the low melting point metal thin film layer is made of Bi, Sn, Mg, Zn, Pb, Al or Bi, Sn, Mg, Zn, Pb, Al, Cu alone. , Cu, Mn, In, Te, or an alloy.
[0013]
The invention according to claim 5 is the IC card according to any one of claims 1 to 4, wherein the communication means performs data communication and / or power supply of the IC card in a non-contact state with an external data processing device. To do.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is a plan view of the IC card of the present invention, FIG. 2 is a cross-sectional view of the IC card of FIG. 1, taken along line XX, FIG. 3 is a partially enlarged cross-sectional view of FIG. FIG. 5 is a schematic explanatory view for explaining a module, FIG. 5 is a cross-sectional view of a front and back label used for manufacturing an IC card of the present invention, and FIG. 6 is a schematic explanatory view showing a manufacturing process of the IC card of the present invention. 7 is a cross-sectional view of an IC card according to another embodiment, FIG. 8 is a cross-sectional view of a label used for manufacturing the IC card of FIG. 7, and FIG. 9 is a cross-sectional view of the IC card according to another embodiment. It is sectional drawing.
[0015]
The IC card of the present invention is covered with an electromagnetic wave shielding layer 4 as shown in FIGS. 1, 2, and 7, and the entire periphery of the IC card is covered with an electromagnetic wave shielding layer 4 as shown in FIG. Alternatively, the function of blocking communication with the outside of the IC module 3 is held by shielding electromagnetic waves that reach the embedded IC module 3, and particularly at the start of use of the IC card, that is, at the time of issue. In order to be usable, it is necessary that the material be capable of rapid issuance processing. In the present invention, a thin film made of a low-melting-point metal that can be melted and broken by heat is preferable.
In the issuing process, the low melting point metal thin film is melted and removed at least at a predetermined portion of the card surface of the IC module by heating with a heating means (not shown) such as a thermal head or a laser. Good. At the time of issuance, financial related information such as card initialization information, for example, issuance date, issuance contents, information related to the cardholder, card issuer, etc., card usage information such as the number of available cards and the amount available And product information can be recorded as visible information. This visible information may be combined with the removed portion or formed separately.
[0016]
Specific examples of the low melting point metal include a simple metal such as Sn, Pb, Al, Zn, Bi, Cu, and Mg, or an alloy of these metals, orOxide, sulfideTransfer of a thin film formed from a compound such as SnO, ZnS or the like, or a mixture thereof by a physical vapor deposition method such as vacuum vapor deposition or sputtering, a chemical vapor deposition method such as CVD, a plating method, or a forming means as described above It can be formed by a method such as a transfer method in which a low-melting-point metal thin film is transferred and formed using a sheet or the like, or a laminate method in which a sheet on which a low-melting-point metal thin film is similarly formed is laminated.
[0017]
This low-melting-point metal thin film exhibits the main information transmission method of the above-mentioned or below-described non-contact type IC card as an electromagnetic wave shielding layer, that is, a communication blocking function in a non-contact state. Information transmission methods in the non-contact state mainly include electromagnetic coupling method, electromagnetic induction method, microwave method, optical communication method, etc., all of which can communicate with obstacles such as conductors such as metal and people. In particular, the metal thin film according to the present invention has a large communication blocking capability in the microwave method (especially around 2.4 GHz is effective and even lower than that) and the optical communication method.
In the initialization (issuance) process, it is easy to melt and break at least a predetermined portion of the card surface of the IC module part, that is, the melt removal process of the low melting point metal thin film by heating a heating means such as a thermal head or a laser. Therefore, it is advantageous that the melting point is low. Preferable examples include Sn alone or Sn alloy (SnBi alloy, SnPb alloy [solder], SnZn alloy, etc.). For example, the film thickness in the case of Sn alone is in the range of 1000 to 50000 nm. Although it is possible and thermal destruction is easy, if it is too thin, the ability to block communication is reduced, and if it is too thick, the thermal destruction ability is reduced.
The electromagnetic wave shielding layer 4 only needs to be formed so as to cover the surface of the IC card, and various forming methods have been devised in the IC card manufacturing process.
[0018]
First, although a non-contact type IC card is not shown, a recess for placing the IC module is formed on the card base, which is a plate-like support made of plastic, by counterboring, and the IC module is fitted into the recess. In recent years, a method of manufacturing a card by injection molding using an injection molding machine has been performed from the viewpoint of quality and production efficiency. As a resin used for such a card substrate, a vinyl chloride resin which is a thermoplastic resin suitable for processing; a polystyrene resin; an ABS resin (acrylonitrile-butadiene-styrene copolymer); an AS resin (acrylonitrile-styrene copolymer). Polymer) of ABS and polycarbonate, polybutylene terephthalate, etc .; AES resin (acrylonitrile-ethylenepropylene rubber-styrene copolymer); polyolefin such as acrylic resin, polysulfone, polycarbonate, polyethylene and polypropylene; Polyamide resin; Polyacetal resin; Fluororesin; Impact-resistant polyester resin (HIPS) and the like, and thermosetting resins such as phenol resin, urea resin, melamine resin, polyester resin, epoxy resin Shi resins, polyurethane resins, xylene resins, and silicone resins. Biodegradable plastics that can be disposed of can also be used. For example, microorganism produced polyester such as 3-hydroxybutyric acid and 3-hydroxyvaleric acid copolymer P (3HB-3HV), aliphatic polyester such as polycaprolactam (PCL), polyglycolide such as polylactic acid, polyvinyl alcohol, starch complex Etc. can be used.
[0019]
For example, as disclosed in Japanese Patent Laid-Open No. 61-222713, the above-described card manufacturing method by injection molding has a PCB substrate with an IC module installed on each of upper and lower mold surfaces, and a resin is injected between them. Japanese Patent Application Laid-Open No. 3-24000 is characterized in that a laminated sheet for cosmetics that is printed after being integrally molded by the method, and a method for fixing an IC module, is characterized in that a foundation for fixing an IC module is first disclosed Injected into Japanese Patent Application No. Hei 7-229467 by injection molding and then molding again after the IC module is installed and fixed on the base, and also by card molding at the same time as card production. IC card that is integrally molded by molding is printed on at least one surface at one position corresponding to the front or back surface of the in-mold card. And a label having an IC module fixed on the opposite surface or the same surface, and a label formed by forming a printing layer on at least one surface on the mold and the other position, There is a type in which a resin is injection molded between the labels.
[0020]
In the manufacture of the IC card of the present invention, it can be said that it is preferable to manufacture the card by injection molding in view of its configuration, necessary manufacturing process, production efficiency, etc. The above-described first and third methods are fixed IC modules. The processing of the front and back surfaces of the card is divided and can be processed separately. In particular, in the third method, the card can be manufactured by one injection molding, and the manufacturing process can be reduced.
[0021]
Therefore, the present invention will be described by taking an IC card having a configuration using injection molding as an example.
2 and 3 are a cross-sectional view and a partially enlarged cross-sectional view of an IC card manufactured by injection molding. The card substrate 2 has a molding resin 5 and the electromagnetic wave shielding layer 4 constitutes the front and back surfaces of the IC card. Formed on the labels 21 and 22, a heat-sensitive sensitizing layer and a concealing layer are further provided thereon, and an outermost layer is formed with a printing portion 8 for images and characters and a protective layer 9 for protecting them.
[0022]
For the labels 21 and 22, a sheet made of paper, synthetic paper, plastic film, or a composite material combining these materials having printability by a gravure printing method, a screen printing method, an offset printing method, a gravure coating method, or the like is used. It is done. For example, high-quality paper, coated paper, art paper, card paper, etc., printable paper, synthetic paper, and other materials such as polyolefin resin such as polyethylene and polypropylene, polyester resin, polycarbonate resin, polyvinyl chloride resin, ABS resin, etc. Examples include plastic films and sheets obtained by extrusion molding, calender roll molding, etc., and composite sheets made of these materials, and the thickness is preferably in the range of about 10 μm to 200 μm in consideration of printability. The material is appropriately selected depending on the material.
[0023]
On the label, the electromagnetic wave shielding layer 4 described above is provided. For improving the adhesion between the low melting point metal thin film and the labels 21 and 22, as a deposition anchor, for example, vinyl chloride-vinyl acetate copolymer, You may provide the vapor deposition anchor layer (not shown) using the resin which high molecular compounds, such as a polyester resin, a polyurethane resin, a urethane resin, and an acrylic resin used individually or as a mixed system. This vapor deposition anchor layer (not shown) can be formed by using a gravure printing method, an offset printing method, a screen printing method, various coating methods, or the like using an ink or a coating agent containing the above-mentioned resin as a main component. A vapor deposition anchor layer (not shown) can also be bonded and formed by a transfer method or a laminate method.
To do.
[0024]
The concealing layer 6 is provided when the label is transparent, white, etc., and the unmelted removed portion exhibiting this metallic tone (glossy tone) is completely concealed. The hiding layer 6 has as main components pigment components such as titanium oxide, barium sulfate, carbon black, nonmagnetic iron oxide, or dye components such as organic dyes, phthalocyanine compounds, cyanide compounds and vinyl chloride resins, vinyl acetate. Polymeric resins, vinyl chloride-vinyl acetate copolymer resins, polyester resins, polyurethane resins, acrylic resins and the like are used alone or as a mixture thereof. The concealing layer 6 can be formed by a gravure printing method, an offset printing method, a screen printing method, various coating methods, or the like. Increasing the pigment component or the like in order to increase the color density of the concealing layer tends to be absorbed by the concealing layer in the case of the hot melt recording type, so that the recording sensitivity may be lowered, and carbon black or the like If a conductive material is used for the colored layer, the metal thin film may be corroded and cannot be said to be a stable recording medium. In order to improve such a defect, heat for imparting a metal corrosion prevention function and improving recording sensitivity during hot melt recording between the concealing layer 6 and the electromagnetic wave shielding layer 4 (low melting point metal thin film layer). A heat-sensitive sensitizing layer 7 made of a plastic resin can be provided. The resin that can be used for the heat-sensitive sensitizing layer 7 is preferably a single thermoplastic resin or a mixture of the same thermoplastic resin as the concealing layer 6 in consideration of adhesion to the electromagnetic wave shielding layer 4 (low melting point metal layer) and the concealing layer 6. .
[0025]
On the label, the outermost layer can optionally be provided with a printing unit 8 for images, characters, etc. by a known printing method such as an offset printing method, a gravure printing method, or a screen printing method. In the printing part 8 for such characters and pictures, ink such as polyester acrylate resin, polyurethane acrylate resin, epoxy acrylate resin, alkyd resin, etc. can be used in the offset printing method. In the case of the gravure printing method, inks such as cellulose resin, chlorinated polypropylene, vinyl chloride vinyl acetate copolymer resin, saturated polyester resin, and acrylic resin can be used. In the case of the screen printing method, inks such as polyester resins, vinyl chloride vinyl acetate copolymer resins, and acrylic polyol resins can be used.
[0026]
The protective layer 9 protects the surface of the IC card of the present invention from scratches and dirt, and further prevents sticking at the time of destruction (melting removal) and prevents surface destruction. It consists of a lubricant and various fillers. Usable resins include thermoplastic resins, thermosetting acrylic resins, heat-resistant acrylic emulsion resins, various UV-curable resins, and hard resins having heat resistance such as OP varnish for offset printing. In addition, silicon-based, metal soaps such as zinc stearate and fluorine-based lubricants can be used as lubricants, but wax-based lubricants are used in consideration of friction resistance, coating film protection during heating and sliding performance. Preferably, the melting point is in the range of 30 to 150 ° C. Paraffin wax, microcrystalline wax, carnauba wax, rice wax, montan wax, low molecular polyethylene wax, oxidized polyethylene wax, low molecular polypropylene wax, various fatty acids, monoamides, bisamide Various natural and synthetic waxes such as system and beef tallow are added alone or in a mixed system. As additives, fillers such as calcium carbonate, talc, silica, and alumina, various surfactants, stabilizers, curing agents, and the like are used as necessary. The paints and inks composed of these are provided with a film thickness of about 1 to 10 μm by various coating methods such as gravure coating, reverse roll coating, knife coating and blade coating, and printing methods such as gravure printing and screen printing. In general, water-based coating materials are advantageous in terms of ease of handling and safety compared to solvent-based coating materials, and emulsion systems are particularly advantageous in terms of application and processing suitability because the paint has a low viscosity. It is used in various forms as a coating agent and adhesive for various paper processing, various building materials and industrial materials. As a measure of heat resistance, the minimum film-forming temperature (MFT) is 60 ° C. or higher, but preferably 100 ° C. or higher.
[0027]
If there is no particular need to improve the heat resistance, such as melting and breaking the metal thin film by a heating means such as a thermal head with low printing energy, that is, resistance to scratches, abrasion, etc. of the printing part 8 for characters, pictures, etc. When the purpose is to improve the protective layer, the protective layer is made of acrylic resin, vinyl chloride resin, nitrocellulose, hydroxycellulose, carboxymethylcellulose, polyvinyl alcohol, styrene-maleic acid copolymer, polyester resin, ABS resin. These can be dissolved or dispersed in a solvent such as toluene or xylene and coated and dried by a gravure method, a roll coating method or the like to form a protective layer. Further, a curable resin such as a thermosetting resin, an ultraviolet curable resin, or an electron beam curable resin may be used.
[0028]
Next, FIG. 4 shows an IC module 3 in which an IC chip 16 such as a CPU and a memory, and an electronic circuit component 20 are electrically connected and mounted on a printed circuit board 15, and further, an insulating coated conductor as a communication antenna. A loop antenna 17 composed of, for example, is connected via an antenna terminal 18 on the printed circuit board 15. The IC module 3 is sealed with a resin such as an epoxy resin, a polypropylene resin, or a polyamide resin as necessary. In addition, there are a method in which a battery 19 is built in as a power source and a method in which an electromagnetic wave transmitted from an external data processing device is received by the loop antenna 17 and electric power is obtained from the electromagnetic wave. The former can operate more actively, and the latter Has a feature that there is no concern about battery life.
[0029]
Other antennas include a microstrip antenna printed on a printed circuit board, a coil antenna, a capacitor, and the like. Particularly, in the present invention, a communication method and an optical communication method in the frequency band of the microwave method (2.4 GHz) are suitable. . Also suitable. In addition, the use of reflection such as radio waves is effective, but the problem of magnetism is that the material and thickness of the shield layer are problems, and it may be difficult to remove the melt.
Furthermore, there are an electromagnetic induction method comprising a dedicated or dual-purpose coil as a function of a power supply by electromagnetic induction and a communication antenna by electromagnetic induction, and a capacitance method using an electrostatic plate for the above data communication, and the power source is a battery. However, it is difficult to shield the electromagnetic induction type magnetic field with the low melting point metal thin film used as the electromagnetic wave shielding layer of the present invention because it can be shielded only by a thick iron plate.
[0030]
As another method, in the optical communication method, the communication means is composed of an LED of a light emission source and a PD of a light receiver, and data is transmitted / received by turning on / off the light. These IC modules are sealed with epoxy resin, polypropylene resin or the like from the viewpoint of convenience in handling.
[0031]
Next, as shown in FIG. 5, the IC card manufacturing method of the present invention forms an electromagnetic wave shielding layer 4, a concealing layer 6, a heat-sensitive sensitizing layer 7, a printing part 8, and a protective layer 9 made of a low melting point metal thin film, At least one of the dies 23 and 24 in the IC card manufacturing process of the present invention shown in FIG. The printing unit 8 faces the outer surface and is arranged in parallel to face each other. Examples of the bonding method include a heat fusion method, a solvent bonding method, a high frequency welding method, and an ultrasonic welding method in addition to the use of an adhesive. Examples of the adhesive include one-part curable adhesives such as epoxy, urethane, silicone rubber, acrylic, and polyamide resins, or two-part curable adhesives and hot-melt waxes. Examples of the heat fusion method include a heat sealer and a heat laminate. In the solvent bonding method, the adhesive surface is dissolved with a solvent having a high solubility in common for both the label and the resin sealing the IC module, and is bonded after drying. Further, the labels 21 and 22 are arranged by a fixing means such as suction, and the labels 21 and 22 are fixed by a fixing means such as suction during the subsequent injection molding. The molds 23 and 24 are closed, and a cavity 25 filled with resin is formed between the labels 21 and 22. A predetermined amount of molten resin is injected and filled into the cavity 25 from the injection port 26, and then cooled and solidified. At this time, an injection compression molding method may be used in order to improve the filling property of the resin. Thereafter, the molds 23 and 24 are opened, and the IC card shown in FIG. 2 can be manufactured.
[0032]
Examples of molding resins include general-purpose polystyrene resins, impact-resistant polystyrene resins, acrylonitrile styrene resins, ABS resins, acrylic resins, polyethylene resins, polypropylene resins, polyamide resins, polyacetal resins, polycarbonate resins, vinyl chloride resins, and modified resins. Examples thereof include thermoplastic resins such as PPO resin, polybutylene terephthalate resin, and polyphenylene sulfide resin, alloy resins obtained by combining these materials, and reinforced resins obtained by adding glass fibers.
[0033]
Next, FIG. 7 shows another embodiment of the IC card according to the present invention. As shown in FIG. 8, a printing unit 8, a concealing layer 6, a heat-sensitizing layer 7 and an electromagnetic wave shielding layer 4 are provided on a label 21. And the electromagnetic wave shielding layer 4, the heat-sensitive sensitizing layer 7, and the concealing layer 6 on one side of the label 22, and the printing portion 8 and the protective layer 9 on the other side, respectively, or a combination thereof, or One type is selected from them (not shown), the IC module 3 is arranged on at least one label, and the IC card can be manufactured by the injection molding method described above in the same manner as described above.
[0034]
As another example, there is an IC card in which an electromagnetic wave shielding layer 4 is provided around the card base 2 as shown in FIG.
[0035]
【Example】
Examples of the present invention will be described in detail below.
[0036]
(Example 1)
As an electromagnetic wave shielding layer on one surface of a white vinyl chloride sheet having a thickness of 50 μm, Sn (single element) is deposited by vacuum deposition, and the film thickness is about 12000 nm so that the resistivity on the surface becomes 1.5Ω / □. A melting point metal thin film layer was formed. Between these, as a vapor deposition anchor layer, the following composition was applied by a gravure method at a drying temperature of 110 ° C. and a coating thickness of 3 μm, and then aged at 60 ° C. for 48 hours.
○ Vapor deposition anchor layer composition
Polyester resin Byron 20SS: 100 parts manufactured by Toyobo
[0037]
Further, the following composition was applied as a heat-sensitive sensitizing layer on the low melting point metal thin film layer by a gravure method at a drying temperature of 110 ° C. and a coating thickness of 2 μm, and then subjected to aging at 60 ° C. for 48 hours.

[0038]
Further, as a concealing layer, the following composition was applied by a gravure method at a drying temperature of 110 ° C. and a coating thickness of 3 μm, and then aged at 60 ° C. for 48 hours.

[0039]
Next, a pattern or the like was provided so that the printing part had a film thickness of 1 μm by the offset printing method, and a protective layer for protecting the printing part was provided on the upper surface of the printing part with a film thickness of 2 μm by the offset printing method. Further, an IC module sealed with an epoxy resin was bonded to the other surface of the label through a urethane adhesive layer, and a label was prepared by fixing.
After a label having an IC module disposed on at least one of the labels obtained by the above method is placed on a mold produced in a desired card shape so that the printing part side comes into contact with the mold, and adsorbed, acrylonitrile -A molding resin made of butadiene-styrene resin was injected and cooled and solidified to produce a card.
[0040]
The label is pre-printed with characters, images, etc., and the card has a function as a support for fixing the IC module and a card having an issuance function with a low melting point metal thin film layer made of Sn in one injection molding process. Can be obtained. When the communication system of the IC module of Example 1 is a microwave system, the signal is completely blocked before the low melting point metal thin film layer is melted and the communication is impossible. Communication was possible after thermal destruction by thermal head.
[0041]
(Example 2)
On a transparent polyvinyl chloride base sheet having a thickness of 50 μm, a printed portion is provided with a film thickness of 1 μm by an offset printing method, and white ink is provided as a concealing layer on the printing portion with a film thickness of 5 μm by a screen printing method. Further, as in Example 1, a heat-sensitive sensitizing layer and a low-melting point metal thin film layer are formed to a film thickness of about 12000 nm by a management method such that the resistivity on the Sn surface is 1.5 Ω / □ by vacuum deposition. did. An IC module was adhered onto the adhesive layer via a urethane adhesive layer, and a label was produced by fixing.
[0042]
Next, a deposition anchor, a low-melting point metal thin film layer, a heat-sensitive sensitizing layer, a concealing layer, and a printing part for characters / images are similarly provided on a white vinyl chloride sheet having a thickness of 50 μm, and a protective layer is formed thereon by offset printing. Was provided on the entire surface with a film thickness of 2 μm.
After placing and adsorbing two labels obtained by the above method in a mold produced in a desired card shape so that the printed part side is in contact with the mold, acrylonitrile-butadiene-styrene resin is injected, Cooled and solidified to produce a card.
[0043]
The label is pre-printed with characters, images, etc., and the card has a function as an IC module fixing support and an issue function with a Sn low melting point metal thin film layer in a single injection molding process. Obtainable. When the communication system of the IC module of Example 1 is a microwave system, the signal is completely cut off before the thermal melting destruction of the low melting point metal thin film layer, and the part corresponding to the IC module is heated by the thermal head from both sides of the card. Communication was possible after fracture melting.
[0044]
【The invention's effect】
As described above, an electromagnetic wave shielding layer is formed on the front and back surfaces of the IC card, thereby blocking the communication function of the non-contact type IC module before use, thereby eliminating unnecessary battery consumption and unnecessary IC card. It is possible to prevent the occurrence of malfunctions such as the response of data and the leakage of data before use. To provide an IC card having an initialization function that enables communication of an IC module by removing the electromagnetic wave shielding layer of the IC module part from melting and melting by heating at the time of initialization (issue stage immediately before use). Can do.
[0045]
In addition, the IC card of the present invention has an IC module, an electromagnetic wave shielding layer, etc. arranged or formed on the label, so that the IC module can be incorporated and characters / images etc. can be simultaneously used in one injection molding process by an injection molding method. An IC card provided with an electromagnetic wave shielding layer having a formation and initialization function could be obtained.
[0046]
In the IC card of the present invention, when the communication system is the microwave system, the microwave signal is completely cut off before the heat-shielding destruction of the electromagnetic shielding layer made of the low melting point metal thin film, and the part corresponding to the IC module The thermal head from both sides of the card enabled microwave signal communication after thermal destruction and melting.
[Brief description of the drawings]
FIG. 1 is a plan view of an IC card of the present invention.
2 is a cross-sectional view taken along line XX of the IC card in FIG. 1. FIG.
3 is a partially enlarged cross-sectional view of FIG.
FIG. 4 is a schematic explanatory diagram for explaining an IC module.
FIG. 5 is a cross-sectional view of the front and back labels used for manufacturing the IC card of the present invention.
FIG. 6 is a schematic explanatory view showing a manufacturing process of the IC card of the present invention.
FIG. 7 is a cross-sectional view of an IC card according to another embodiment of the present invention.
FIG. 8 is a cross-sectional view of a front and back label used for manufacturing an IC card according to another embodiment of the present invention.
FIG. 9 is a cross-sectional view of an IC card according to another embodiment of the present invention.
[Explanation of symbols]
1, 11, 12 IC card
2 Card base material
21 and 22 labels
3 IC module
4 Electromagnetic wave shielding layer
5 Molding resin
6 Concealment layer
7 Heat-sensitized layer
8 Printing department
9 Protective layer
10 Adhesive layer
15 Printed circuit board
16 IC chip
17 Loop antenna
18 Antenna terminal
19 battery
20 Electronic circuit components
23, 24 Mold
25 cavity
26 Injection port

Claims (5)

Least also, microprocessor and / or memory, incorporates or embedded in the card substrate of the IC module having a communication means for external data processing device and the data communication in a non-contact state, the front and back surfaces or the entire periphery of the card An IC card comprising an electromagnetic wave shielding layer that can be melted and removed by heat. At least a microprocessor and / or memory, and an IC module having a communication means for performing data communication with an external data processing device in a non-contact state are embedded or embedded in the card base, and are melted and removed by heat on the front and back surfaces or the entire periphery. possible electromagnetic wave shielding layer is formed, even at least concealing layer on the electromagnetic shield layer, printing layer, I C card you characterized by being obtained by forming a heat-resistant protective layer. 2. The electromagnetic wave shielding layer is formed of a low-melting-point metal thin film having a function of shielding electromagnetic waves and blocking communication with the outside of the IC module and capable of melting and breaking by heat. IC card.   The low melting point metal thin film layer is made of a simple substance of Bi, Sn, Mg, Zn, Pb, Al, Cu or a mixture of Bi, Sn, Mg, Zn, Pb, Al, Cu, Mn, In, Te, or an alloy. The IC card according to claim 3.   5. The IC card according to claim 1, wherein the communication means performs data communication and / or power supply of the IC card in a non-contact state with an external data processing device.

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