KR100720077B1 - Method of manufacturing to memory card - Google Patents
Method of manufacturing to memory card Download PDFInfo
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- KR100720077B1 KR100720077B1 KR1020050083977A KR20050083977A KR100720077B1 KR 100720077 B1 KR100720077 B1 KR 100720077B1 KR 1020050083977 A KR1020050083977 A KR 1020050083977A KR 20050083977 A KR20050083977 A KR 20050083977A KR 100720077 B1 KR100720077 B1 KR 100720077B1
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- circuit board
- printed circuit
- memory card
- manufacturing
- filling
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 53
- 239000000088 plastic resin Substances 0.000 claims abstract description 20
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 230000035939 shock Effects 0.000 abstract description 17
- 229910000679 solder Inorganic materials 0.000 abstract description 16
- 238000005476 soldering Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 6
- 239000003990 capacitor Substances 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000012966 insertion method Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000005260 alpha ray Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
본 발명은 메모리 카드 제조 방법에 관한 것으로, 메모리 카드에 물리적 충격, 화학적 충격 또는 전기적 충격이 가해지더라도 인쇄회로기판과 소자 사이의 땜납이 떨어지지 않도록 언더필 공정이 추가된 메모리 카드 제조 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a memory card, and more particularly, to a method of manufacturing a memory card in which an underfill process is added to prevent solder from falling between a printed circuit board and a device even when a physical shock, a chemical shock, or an electrical shock is applied to the memory card.
본 발명의 메모리 카드 제조 방법은 인쇄회로기판에 회로소자를 실장 하는 단계; 상기 인쇄회로기판과 상기 회로소자 사이에 형성된 공간에 플라스틱수지를 충전하는 단계 및 상기 플라스틱수지를 경화시키는 단계를 포함하여 루어진다.The memory card manufacturing method of the present invention comprises the steps of mounting a circuit element on a printed circuit board; And filling the plastic resin in the space formed between the printed circuit board and the circuit element, and curing the plastic resin.
플래시 메모리, 메모리 카드, SD, MMC, CFC, Underfill, 납땜 Flash Memory, Memory Cards, SD, MMC, CFC, Underfill, Soldering
Description
도 1은 종래 표면실장 공정이 끝난 메모리 카드의 평면도,1 is a plan view of a memory card having a conventional surface mounting process;
도 2는 도 1에서 A-A'를 자른 단면도,FIG. 2 is a cross-sectional view taken along line AA ′ in FIG. 1;
도 3은 본 발명에 따라 언더필 공정이 끝난 메모리 카드의 평면도,3 is a plan view of a memory card having completed the underfill process according to the present invention;
도 4는 도 3에서 A-A'를 자른 단면도,4 is a cross-sectional view taken along line AA ′ of FIG. 3;
도 5는 도 3에서 컨트롤러를 분리하여 본 평면도,5 is a plan view of the controller separated from FIG.
도 6a는 본 발명에 적용될 수 있는 일 실시예의 충전법을 설명하기 위한 도,6A is a view for explaining a charging method of an embodiment that can be applied to the present invention;
도 6b는 본 발명에 적용될 수 있는 다른 실시예의 충전법을 설명하기 위한 도,6b is a view for explaining a charging method of another embodiment that can be applied to the present invention,
도 6c는 본 발명에 적용될 수 있는 또 다른 실시예의 충전법을 설명하기 위한 도,Figure 6c is a view for explaining a charging method of another embodiment that can be applied to the present invention,
도 6d는 본 발명에 적용될 수 있는 또 다른 실시예의 충전법을 설명하기 위한 도,Figure 6d is a view for explaining a charging method of another embodiment that can be applied to the present invention,
도 7은 본 발명에 따른 메모리 카드 제조 방법의 흐름도이다.7 is a flowchart of a memory card manufacturing method according to the present invention.
*** 도면의 주요 부분에 대한 부호의 설명 ****** Explanation of symbols for the main parts of the drawing ***
110: 인쇄회로기판 130: 메모리110: printed circuit board 130: memory
131: 메모리 리드 150: 컨트롤러131: memory lead 150: controller
151: 컨트롤러 리드 170: 납땜151: controller lead 170: soldering
200: 플라스틱수지200: plastic resin
본 발명은 메모리 카드 제조 방법에 관한 것으로, 특히 메모리 카드에 물리적 충격, 화학적 충격 또는 전기적 충격이 가해지더라도 인쇄회로기판과 소자 사이의 땜납이 떨어지지 않도록 한 메모리 카드 제조 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a memory card manufacturing method, and more particularly, to a memory card manufacturing method in which solder between a printed circuit board and an element does not fall even when a physical shock, a chemical shock or an electrical shock is applied to the memory card.
일반적으로 전자제품은 인쇄회로기판에(Printed Circuit Board; PCB)에 부품 즉, 캐패시터(Capacitor), 컨트롤러(Controller IC) 및 메모리 (Memory IC) 등의 소자를 실장하여 완성되는바, 소자를 실장하는 방법으로는 삽입실장법과 표면실장법(SMT)이 있다.In general, electronic products are completed by mounting components, such as capacitors, controller ICs, and memory ICs, on a printed circuit board (PCB). Methods include insertion method and surface mount method (SMT).
상술한 삽입실장법은 접속패턴이 패터닝(patterning)된 인쇄회로기판의 소정위치에 천공된 리드구멍에 소자의 리드(Lead)를 삽입한 후 납땜(soldering)을 하는 방법이며, 표면실장법(Surface Mounted Technology; SMT)은 인쇄회로기판에 패터닝된 접속패턴에 땜납(Solder Cream)을 프린팅(printing)한 후 소자의 리드를 접속시키고, 땜납을 녹여(Reflow) 납땜하는 방법이다.The above-described insertion mounting method is a method of soldering after inserting a lead of an element into a lead hole drilled at a predetermined position of a printed circuit board on which a connection pattern is patterned, and surface mounting method (Surface) Mounted Technology (SMT) is a method of connecting a lead of a device after printing solder cream on a connection pattern patterned on a printed circuit board, and melting solder by reflow soldering.
따라서 표면실장법은 소자의 리드를 삽입할 리드구멍이 필요 없으며, 인쇄회로기판의 양면 즉 앞면과 뒷면을 모두 이용할 수 있기에 제품의 소형화, 경량화 및 박형화가 가능하다.Therefore, the surface mount method does not require a lead hole for inserting the lead of the device, and since both sides of the printed circuit board, that is, the front and the back side, can be used, the product can be made smaller, lighter and thinner.
도 1은 종래 표면실장 공정이 끝난 메모리 카드의 평면도이다.1 is a plan view of a memory card after a conventional surface mounting process.
도 1에 도시된 바와 같이 표면실장 공정이 끝난 메모리 카드는 인쇄회로기판(110)에 소자(130)(150)들이 납땝 되어 있으며, 이후 플라스틱 케이스 하우징 공정을 통하여 제품이 완성된다.As shown in FIG. 1, the surface mounting process of the memory card is completed with the
도 2는 도 1에서 A-A'를 자른 단면도인바, 인쇄회로기판(110) 상에 소자 즉, 컨트롤러(150) 및 메모리(130)의 리드(151)(131)들이 땜납(170)으로 납땝 되어 있다.FIG. 2 is a cross-sectional view taken along the line A-A 'of FIG. 1, in which the leads 151 and 131 of the
이와같이 종래의 메모리 카드 제조 방법에 따르면, 표면실장법을 이용하여 메모리 카드의 소형화, 경량화 및 박형화를 이룰 수 있는 장점이 있는 반면에 메모리 카드에 낙하 또는 비틀림 등에 의한 물리적 충격, 온도, 먼지 또는 습기 등에 의한 화학적 충격 또는 납에서 방사되는 알파선 등에 의한 전기적 충격이 가해지는 경우 인쇄회로기판과 소자의 리드를 연결하는 땝납이 떨어지는 경우가 발생하여 메모리 카드 본래의 기능을 다하지 못하는 문제점이 있었다.As described above, according to the conventional method of manufacturing a memory card, there is an advantage in that the memory card can be made smaller, lighter, and thinner by using the surface mount method, while physical shock, temperature, dust, or moisture due to falling or twisting the memory card, etc. When an electrical shock is applied due to a chemical shock or an alpha ray radiated from lead, the solder connecting the printed circuit board and the lead of the device may fall, thereby preventing the memory card from performing its original function.
본 발명은 전술한 문제점을 해결하기 위하여 안출된 것으로서, 메모리 카드에 물리적 충격, 화학적 충격 또는 전기적 충격이 가해지더라도 인쇄회로기판과 소자 사이의 땜납이 떨어지지 않도록 언더필 공정이 추가된 메모리 카드 제조 방법을 제공하는데 그 목적이 있다.The present invention has been made to solve the above problems, and provides a memory card manufacturing method in which an underfill process is added so that solder between the printed circuit board and the device does not fall even when a physical shock, a chemical shock, or an electrical shock is applied to the memory card. Its purpose is to.
전술한 목적을 달성하기 위한 본 발명의 메모리 카드 제조 방법은 인쇄회로 기판에 회로소자를 실장 하는 단계; 상기 인쇄회로기판과 상기 회로소자 사이에 형성된 공간에 플라스틱수지를 충전하는 단계 및 상기 플라스틱수지를 경화시키는 단계를 포함하여 이루어진 메모리 카드 제조 방법을 제공한다.Memory card manufacturing method of the present invention for achieving the above object comprises the steps of mounting a circuit element on a printed circuit board; It provides a memory card manufacturing method comprising the step of filling the plastic resin in the space formed between the printed circuit board and the circuit element and curing the plastic resin.
이하에는 첨부한 도면을 참조하여 본 발명의 바람직한 실시예에 따라 메모리 카드 제조 방법에 대해서 상세하게 설명한다.Hereinafter, a memory card manufacturing method according to a preferred embodiment of the present invention with reference to the accompanying drawings will be described in detail.
본 발명에 적용되는 메모리카드는 SD(Secure Digital), MMC(MultiMedia Card) 또는 CFC(Compact Flash Card) 등의 소형 메모리 카드를 말하며, 표면실장 공정 및 언더필(Underfill) 공정은 당업자라면 쉽게 알 수 있는 공정이기에 개략적으로 설명하기로 한다.The memory card applied to the present invention refers to a small memory card such as SD (Secure Digital), MMC (MultiMedia Card) or CFC (Compact Flash Card), and the surface mounting process and the underfill process can be easily known to those skilled in the art. Since it is a process, it will be outlined.
먼저 표면실장 공정은 로딩(loading) 단계, 땜납 프린팅(solder cream screen printing) 단계, 소자 마운팅(mounting) 단계, 납땜(reflow, soldering) 단계 및 언로딩(unloading) 단계로 달성되는바, 먼저 로딩 단계는 표면실장 공정을 시작하기 위해 인쇄회로기판을 준비하는 단계이고, 땜납 프린팅 단계는 인쇄회로기판에 땜납을 프린팅하는 단계이며, 소자 마운팅 단계는 땜납이 프린팅된 인쇄회로기판 상에 미리 정해진 위치에 소자 즉, 캐패시터, 컨트롤러 및 메모리 등을 올려놓는 단계이고, 납땜 단계는 소자가 인쇄회로기판에 납땝 되도록 땜납을 녹이는 단계이며, 마지막으로 언로딩 단계는 표면실장 공정을 종료하는 단계이다.First, the surface mounting process is achieved by a loading step, solder cream screen printing step, device mounting step, reflow, soldering step and unloading step. Is a step of preparing a printed circuit board to start the surface mounting process, the solder printing step is to print the solder on the printed circuit board, the device mounting step is a device in a predetermined position on the printed printed circuit board That is, a capacitor, a controller, a memory, and the like are put on, and the soldering step is a step of melting the solder so that the device is soldered to the printed circuit board. Finally, the unloading step is a step of ending the surface mounting process.
다음 언더필 공정은 노즐이 부착된 주사기에 플라스틱수지를 삽입하고 플라스틱수지가 삽입된 주사기의 노즐을 표면실장 공정이 완료된 인쇄회로기판과 소자사이에 위치시켜 인쇄회로기판과 소자의 리드가 납땝된 부위에 적당량 충전(充塡) 하여 경화시킴으로써 달성된다.In the next underfill process, the plastic resin is inserted into the syringe with the nozzle and the nozzle of the syringe with the plastic resin is placed between the printed circuit board and the device where the surface mounting process is completed. It is achieved by filling by appropriate amount and curing.
상술한 플라스틱수지는 상온경화성수지 또는 열가소성수지로 달성될 수 있으나 열경화성수지가 바람직하며, 충전은 디스펜서(Dispensor)와 같은 충전장비에 의해 자동 또는 수동으로 충전될 수 있다. 특히 열경화성 수지는 오븐(Oven)에서 적정온도로 적정시간동안 방치하되, 100℃에서 40분, 120℃에서 20분 또는 150℃에서 5분이 바람직하다.The above-mentioned plastic resin may be achieved with a room temperature hardening resin or a thermoplastic resin, but thermosetting resin is preferable, and the filling may be automatically or manually filled by a filling equipment such as a dispenser. In particular, the thermosetting resin is left for an appropriate time at an appropriate temperature in an oven (Oven), 40 minutes at 100 ℃, 20 minutes at 120 ℃ or 5 minutes at 150 ℃ is preferred.
도 3은 본 발명에 따라 언더필 공정이 끝난 메모리 카드의 평면도인바, 본 발명에 따라 표면실장 공정이 끝난 후 인쇄회로기판과 소자 즉, 캐패시터, 컨트롤러 및 메모리 사이의 공간에 플라스틱수지를 충전하는 언더필 공정이 진행되고 있는 상태를 나타낸다.Figure 3 is a plan view of the memory card has been completed the underfill process according to the present invention, the underfill process of filling the plastic resin in the space between the printed circuit board and the device, that is, the capacitor, the controller and the memory after the surface mounting process is completed in accordance with the present invention This state is in progress.
도 3에 도시된 바와 같이 언더필 공정이 끝난 메모리 카드는 인쇄회로기판(110)에 컨트롤러(150) 등이 실장 되어있으며, 컨트롤러(150)와 인쇄회로기판(110) 사이에는 플라스틱수지(200)가 채워져 있다.As shown in FIG. 3, the underfilled memory card has a
도 4는 도 3에서 A-A'를 자른 단면도이다.4 is a cross-sectional view taken along line AA ′ of FIG. 3.
도 4에 도시된 바와 같이 언더필 공정이 완료된 메모리 카드는 인쇄회로기판(110), 인쇄회로기판(110)에 표면실장된 소자(130)(150) 및 소자(130)(150)와 인쇄회로기판(110) 사이에 채워진 플라스틱수지(200)를 포함하여 이루어진다.As shown in FIG. 4, the memory card in which the underfill process is completed may include a printed
따라서 메모리카드에 낙하 또는 비틀림 등에 의한 물리적 충격, 온도, 먼지 또는 습기 등에 의한 화학적 충격 또는 납에서 방사되는 알파선 등에 의한 전기적 충격이 가해지더라도 인쇄회로기판(110)과 소자의 리드(131)(151)를 연결하는 땜납 (170)이 떨어지지 않게 된다.Therefore, the printed
도 5는 도 3에서 컨트롤러를 분리하여 본 평면도인바, 컨트롤러(150)와 인쇄회로기판(110) 사이에 플라스틱수지(200)가 주입된 모양을 보인 사진이다.FIG. 5 is a plan view of the controller separated from FIG. 3, and is a photograph showing a state in which the
도면의 미설명 부호 115는 컨트롤러(150)의 하면에 형성된 리드와 인쇄회로기판(110)이 맞닿는 부위로서 실제로 컨트롤러(150)의 리드와 인쇄회로기판(110) 사이에 납땝이 되는 부위이며, 이곳에 언더필 공정에 의해 플라스틱수지(200)가 충전된다.
한편, 본 발명에 적용될 수 있는 언더필 공정의 충전법은 4가지 방법이 있을 수 있는바, 도 6a ~ 도 6b를 참조하여 설명한다.On the other hand, the filling method of the underfill process that can be applied to the present invention may have four methods, which will be described with reference to FIGS. 6A to 6B.
도 6a는 본 발명에 적용될 수 있는 일 실시예의 충전법을 설명하기 위한 도인바, I자 충전법을 나타내고 있다.Figure 6a is a diagram illustrating a charging method of an embodiment, which can be applied to the present invention, the I-shaped filling method.
도 6a에 도시된 바와 같이 I자 충전법은 충전하고자 하는 부위 즉, 인쇄회로기판과 소자 사이의 일 측면을 따라 플라스틱수지를 주입함으로써 달성된다.As shown in FIG. 6A, the I-shaped filling method is achieved by injecting a plastic resin along one side between a portion to be filled, that is, a printed circuit board and an element.
도 6b는 본 발명에 적용될 수 있는 다른 실시예의 충전법을 설명하기 위한 도인바, ㄷ자 충전법을 나타내고 있다.Figure 6b is a diagram illustrating a charging method, c-shaped filling method for explaining another embodiment of the filling method that can be applied to the present invention.
도 6b에 도시된 바와 같이 ㄷ자 충전법은 충전하고자 하는 부위 즉, 인쇄회로기판과 소자 사이의 연결된 3개 측면을 따라 플라스틱수지를 주입함으로써 달성된다.As shown in FIG. 6B, the U-charging method is achieved by injecting a plastic resin along three sides connected between a portion to be filled, that is, a printed circuit board and a device.
도 6c는 본 발명에 적용될 수 있는 또 다른 실시예의 충전법을 설명하기 위한 도인바, L자 충전법을 나타내고 있다.6C is a view illustrating a filling method of another embodiment, which is applicable to the present invention, showing an L-shaped filling method.
도 6c에 도시된 바와 같이 L자 충전법은 충전하고자 하는 부위 즉, 인쇄회로기판과 소자 사이의 연결된 2개 측면을 따라 플라스틱수지를 주입함으로써 달성된다.As shown in FIG. 6C, the L-shaped filling method is achieved by injecting plastic resin along two sides connected between the portion to be filled, that is, the printed circuit board and the device.
도 6d는 본 발명에 적용될 수 있는 또 다른 실시예의 충전법을 설명하기 위한 도인바, L자 + Dot 충전법을 나타내고 있다.FIG. 6D illustrates a drawing bar, an L-shape and a dot filling method for explaining a filling method according to another embodiment of the present invention.
도 6d에 도시된 바와 같이 L자 + 돗트(Dot) 충전법은 충전하고자 하는 부위 즉, 인쇄회로기판과 소자 사이의 연결된 2개 측면 및 2개 측면과 만나지 않는 모서리를 플라스틱수지로 주입함으로써 달성된다.As shown in Fig. 6D, the L-shaped + dot filling method is achieved by injecting into the plastic resin a portion to be filled, that is, two connected sides between the printed circuit board and the element and an edge not meeting the two sides. .
도 7은 본 발명에 따른 메모리 카드 제조 방법의 흐름도이다.7 is a flowchart of a memory card manufacturing method according to the present invention.
도 7에 도시된 바와 같이 본 발명에 따른 메모리 카드 제조 방법은 먼저 단계 S11에서는 인쇄회로기판을 로딩(loading) 즉, 준비하며, 단계 S13에서는 준비된 인쇄회로기판에 땜납(solder cream)을 프린팅(screen printing)한다.As shown in FIG. 7, in the method of manufacturing a memory card according to the present invention, first, in step S11, the loading of the printed circuit board is performed, i.e., in step S13, solder cream is printed on the prepared printed circuit board. printing).
다음 단계 S15에서는 땜납이 프린팅된 인쇄회로기판에 각종 소자를 마운팅(mounting) 즉, 올려놓으며, 단계 S17에서는 프린팅된 땜납을 녹여 소자들을 인쇄회로기판에 납땜(reflow)하고, 단계 S19에서는 소자들이 납땜된 인쇄회로기판을 언로딩(unloading)하여 일반적인 표면실장 공정(S10)을 완료한다.Next, in step S15, various elements are mounted on the printed circuit board on which the solder is printed, i.e., in step S17, the printed solder is melted to reflow the devices onto the printed circuit board, and in step S19, the devices are soldered. Unloading the printed circuit board is completed to complete the general surface mounting process (S10).
이후 단계 S20에서는 소자와 인쇄회로기판 사이 즉, 소자의 리드가 인쇄회로기판에 납땜된 부위에 플라스틱수지를 충전하는 언더필(Underfill) 공정을 진행하며, 단계 S20이 완료되면, 단계 S30으로 진행하여 언더필 공정이 완료된 인쇄회로기판을 플라스틱 케이스(Plastic Case)로 밀봉하는 플라스틱 케이스 하우징 (Housing)공정을 행함으로써 제품을 완성한다.Subsequently, in step S20, an underfill process of filling the plastic resin between the device and the printed circuit board, that is, a region where the lead of the device is soldered to the printed circuit board is performed. When step S20 is completed, the process proceeds to step S30 to underfill. The product is completed by performing a plastic case housing process in which the printed circuit board is sealed with a plastic case.
본 발명의 메모리 카드 제조 방법은 전술한 실시예에 국한 되지 않고 삽입실장법을 통하여 제작된 메모리 카드에도 적용될 수 있는 등 본 발명의 기술 사상이 허용하는 범위에서 다양하게 변형하여 실시할 수가 있다.The memory card manufacturing method of the present invention is not limited to the above-described embodiments, but can be applied to a memory card manufactured through an insertion method, and can be modified in various ways within the scope of the technical idea of the present invention.
이상에서 설명한 바와 같은 본 발명의 메모리 카드 제조 방법에 따르면, 메모리 카드에 물리적 충격, 화학적 충격 또는 전기적 충격이 가해지더라도 인쇄회로기판과 소자 사이의 땜납이 떨어지지 않는 효과가 있다.According to the memory card manufacturing method of the present invention as described above, even if a physical shock, a chemical shock or an electrical shock is applied to the memory card there is an effect that the solder between the printed circuit board and the element does not fall.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050083977A KR100720077B1 (en) | 2005-09-09 | 2005-09-09 | Method of manufacturing to memory card |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020050083977A KR100720077B1 (en) | 2005-09-09 | 2005-09-09 | Method of manufacturing to memory card |
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| KR20070029321A KR20070029321A (en) | 2007-03-14 |
| KR100720077B1 true KR100720077B1 (en) | 2007-05-18 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08310171A (en) * | 1995-05-17 | 1996-11-26 | Toppan Printing Co Ltd | Ic card and manufacture thereof |
| JPH0950650A (en) * | 1995-08-03 | 1997-02-18 | Canon Inc | Production of substrate of optical card with magnetic stripe |
| JPH1035161A (en) | 1996-07-24 | 1998-02-10 | Toppan Printing Co Ltd | Ic card and manufacture of ic card |
| KR20030061370A (en) * | 2000-10-02 | 2003-07-18 | 마츠시타 덴끼 산교 가부시키가이샤 | Card type recording medium and production method therefor |
| JP2005115646A (en) | 2003-10-07 | 2005-04-28 | Hitachi Ltd | Radio communication medium, and manufacturing method therefor |
-
2005
- 2005-09-09 KR KR1020050083977A patent/KR100720077B1/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08310171A (en) * | 1995-05-17 | 1996-11-26 | Toppan Printing Co Ltd | Ic card and manufacture thereof |
| JPH0950650A (en) * | 1995-08-03 | 1997-02-18 | Canon Inc | Production of substrate of optical card with magnetic stripe |
| JPH1035161A (en) | 1996-07-24 | 1998-02-10 | Toppan Printing Co Ltd | Ic card and manufacture of ic card |
| KR20030061370A (en) * | 2000-10-02 | 2003-07-18 | 마츠시타 덴끼 산교 가부시키가이샤 | Card type recording medium and production method therefor |
| JP2005115646A (en) | 2003-10-07 | 2005-04-28 | Hitachi Ltd | Radio communication medium, and manufacturing method therefor |
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