KR100720077B1 - Method of manufacturing to memory card - Google Patents

Method of manufacturing to memory card Download PDF

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Publication number
KR100720077B1
KR100720077B1 KR1020050083977A KR20050083977A KR100720077B1 KR 100720077 B1 KR100720077 B1 KR 100720077B1 KR 1020050083977 A KR1020050083977 A KR 1020050083977A KR 20050083977 A KR20050083977 A KR 20050083977A KR 100720077 B1 KR100720077 B1 KR 100720077B1
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KR
South Korea
Prior art keywords
circuit board
printed circuit
memory card
method
filling
Prior art date
Application number
KR1020050083977A
Other languages
Korean (ko)
Other versions
KR20070029321A (en
Inventor
김영대
Original Assignee
(주)티이에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)티이에스 filed Critical (주)티이에스
Priority to KR1020050083977A priority Critical patent/KR100720077B1/en
Publication of KR20070029321A publication Critical patent/KR20070029321A/en
Application granted granted Critical
Publication of KR100720077B1 publication Critical patent/KR100720077B1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561Batch processing
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a memory card, and more particularly, to a method of manufacturing a memory card in which an underfill process is added to prevent solder from falling between a printed circuit board and a device even when a physical shock, a chemical shock, or an electrical shock is applied to the memory card.
The memory card manufacturing method of the present invention comprises the steps of mounting a circuit element on a printed circuit board; And filling the plastic resin in the space formed between the printed circuit board and the circuit element, and curing the plastic resin.
Flash Memory, Memory Cards, SD, MMC, CFC, Underfill, Soldering

Description

Method of manufacturing to memory card

1 is a plan view of a memory card having a conventional surface mounting process;

FIG. 2 is a cross-sectional view taken along line AA ′ in FIG. 1;

3 is a plan view of a memory card having completed the underfill process according to the present invention;

4 is a cross-sectional view taken along line AA ′ of FIG. 3;

5 is a plan view of the controller separated from FIG.

6A is a view for explaining a charging method of an embodiment that can be applied to the present invention;

6b is a view for explaining a charging method of another embodiment that can be applied to the present invention,

Figure 6c is a view for explaining a charging method of another embodiment that can be applied to the present invention,

Figure 6d is a view for explaining a charging method of another embodiment that can be applied to the present invention,

7 is a flowchart of a memory card manufacturing method according to the present invention.

*** Explanation of symbols for the main parts of the drawing ***

110: printed circuit board 130: memory

131: memory lead 150: controller

151: controller lead 170: soldering

200: plastic resin

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a memory card manufacturing method, and more particularly, to a memory card manufacturing method in which solder between a printed circuit board and an element does not fall even when a physical shock, a chemical shock or an electrical shock is applied to the memory card.

In general, electronic products are completed by mounting components, such as capacitors, controller ICs, and memory ICs, on a printed circuit board (PCB). Methods include insertion method and surface mount method (SMT).

The above-described insertion mounting method is a method of soldering after inserting a lead of an element into a lead hole drilled at a predetermined position of a printed circuit board on which a connection pattern is patterned, and surface mounting method (Surface) Mounted Technology (SMT) is a method of connecting a lead of a device after printing solder cream on a connection pattern patterned on a printed circuit board, and melting solder by reflow soldering.

Therefore, the surface mount method does not require a lead hole for inserting the lead of the device, and since both sides of the printed circuit board, that is, the front and the back side, can be used, the product can be made smaller, lighter and thinner.

1 is a plan view of a memory card after a conventional surface mounting process.

As shown in FIG. 1, the surface mounting process of the memory card is completed with the elements 130 and 150 soldered to the printed circuit board 110, and then the product is completed through a plastic case housing process.

FIG. 2 is a cross-sectional view taken along the line A-A 'of FIG. 1, in which the leads 151 and 131 of the controller 150 and the memory 130 are soldered to the solder 170 on the printed circuit board 110. It is.

As described above, according to the conventional method of manufacturing a memory card, there is an advantage in that the memory card can be made smaller, lighter, and thinner by using the surface mount method, while physical shock, temperature, dust, or moisture due to falling or twisting the memory card, etc. When an electrical shock is applied due to a chemical shock or an alpha ray radiated from lead, the solder connecting the printed circuit board and the lead of the device may fall, thereby preventing the memory card from performing its original function.

The present invention has been made to solve the above problems, and provides a memory card manufacturing method in which an underfill process is added so that solder between the printed circuit board and the device does not fall even when a physical shock, a chemical shock, or an electrical shock is applied to the memory card. Its purpose is to.

Memory card manufacturing method of the present invention for achieving the above object comprises the steps of mounting a circuit element on a printed circuit board; It provides a memory card manufacturing method comprising the step of filling the plastic resin in the space formed between the printed circuit board and the circuit element and curing the plastic resin.

Hereinafter, a memory card manufacturing method according to a preferred embodiment of the present invention with reference to the accompanying drawings will be described in detail.

The memory card applied to the present invention refers to a small memory card such as SD (Secure Digital), MMC (MultiMedia Card) or CFC (Compact Flash Card), and the surface mounting process and the underfill process can be easily known to those skilled in the art. Since it is a process, it will be outlined.

First, the surface mounting process is achieved by a loading step, solder cream screen printing step, device mounting step, reflow, soldering step and unloading step. Is a step of preparing a printed circuit board to start the surface mounting process, the solder printing step is to print the solder on the printed circuit board, the device mounting step is a device in a predetermined position on the printed printed circuit board That is, a capacitor, a controller, a memory, and the like are put on, and the soldering step is a step of melting the solder so that the device is soldered to the printed circuit board. Finally, the unloading step is a step of ending the surface mounting process.

In the next underfill process, the plastic resin is inserted into the syringe with the nozzle and the nozzle of the syringe with the plastic resin is placed between the printed circuit board and the device where the surface mounting process is completed. It is achieved by filling by appropriate amount and curing.

The above-mentioned plastic resin may be achieved with a room temperature hardening resin or a thermoplastic resin, but thermosetting resin is preferable, and the filling may be automatically or manually filled by a filling equipment such as a dispenser. In particular, the thermosetting resin is left for an appropriate time at an appropriate temperature in an oven (Oven), 40 minutes at 100 ℃, 20 minutes at 120 ℃ or 5 minutes at 150 ℃ is preferred.

Figure 3 is a plan view of the memory card has been completed the underfill process according to the present invention, the underfill process of filling the plastic resin in the space between the printed circuit board and the device, that is, the capacitor, the controller and the memory after the surface mounting process is completed in accordance with the present invention This state is in progress.

As shown in FIG. 3, the underfilled memory card has a controller 150 mounted on a printed circuit board 110, and a plastic resin 200 is disposed between the controller 150 and the printed circuit board 110. It is filled.

4 is a cross-sectional view taken along line AA ′ of FIG. 3.

As shown in FIG. 4, the memory card in which the underfill process is completed may include a printed circuit board 110, elements 130 and 150 mounted on the printed circuit board 110, elements 130 and 150, and a printed circuit board. It comprises a plastic resin 200 filled between the (110).

Therefore, the printed circuit board 110 and the leads 131 and 151 of the memory card may be subjected to physical shocks due to dropping or twisting, chemical shocks due to temperature, dust or moisture, or electric shocks such as alpha rays emitted from lead. Solder 170 to connect the fall does not fall.

FIG. 5 is a plan view of the controller separated from FIG. 3, and is a photograph showing a state in which the plastic resin 200 is injected between the controller 150 and the printed circuit board 110.

Reference numeral 115 in the drawing is a portion where the lead formed on the bottom surface of the controller 150 and the printed circuit board 110 abuts, and is a portion that is actually soldered between the lead of the controller 150 and the printed circuit board 110. The plastic resin 200 is filled by the underfill process.

On the other hand, the filling method of the underfill process that can be applied to the present invention may have four methods, which will be described with reference to FIGS. 6A to 6B.

Figure 6a is a diagram illustrating a charging method of an embodiment, which can be applied to the present invention, the I-shaped filling method.

As shown in FIG. 6A, the I-shaped filling method is achieved by injecting a plastic resin along one side between a portion to be filled, that is, a printed circuit board and an element.

Figure 6b is a diagram illustrating a charging method, c-shaped filling method for explaining another embodiment of the filling method that can be applied to the present invention.

As shown in FIG. 6B, the U-charging method is achieved by injecting a plastic resin along three sides connected between a portion to be filled, that is, a printed circuit board and a device.

6C is a view illustrating a filling method of another embodiment, which is applicable to the present invention, showing an L-shaped filling method.

As shown in FIG. 6C, the L-shaped filling method is achieved by injecting plastic resin along two sides connected between the portion to be filled, that is, the printed circuit board and the device.

FIG. 6D illustrates a drawing bar, an L-shape and a dot filling method for explaining a filling method according to another embodiment of the present invention.

As shown in Fig. 6D, the L-shaped + dot filling method is achieved by injecting into the plastic resin a portion to be filled, that is, two connected sides between the printed circuit board and the element and an edge not meeting the two sides. .

7 is a flowchart of a memory card manufacturing method according to the present invention.

As shown in FIG. 7, in the method of manufacturing a memory card according to the present invention, first, in step S11, the loading of the printed circuit board is performed, i.e., in step S13, solder cream is printed on the prepared printed circuit board. printing).

Next, in step S15, various elements are mounted on the printed circuit board on which the solder is printed, i.e., in step S17, the printed solder is melted to reflow the devices onto the printed circuit board, and in step S19, the devices are soldered. Unloading the printed circuit board is completed to complete the general surface mounting process (S10).

Subsequently, in step S20, an underfill process of filling the plastic resin between the device and the printed circuit board, that is, a region where the lead of the device is soldered to the printed circuit board is performed. When step S20 is completed, the process proceeds to step S30 to underfill. The product is completed by performing a plastic case housing process in which the printed circuit board is sealed with a plastic case.

The memory card manufacturing method of the present invention is not limited to the above-described embodiments, but can be applied to a memory card manufactured through an insertion method, and can be modified in various ways within the scope of the technical idea of the present invention.

According to the memory card manufacturing method of the present invention as described above, even if a physical shock, a chemical shock or an electrical shock is applied to the memory card there is an effect that the solder between the printed circuit board and the element does not fall.

Claims (3)

  1. delete
  2. Mounting circuit elements including a memory and a controller together on an upper surface of the printed circuit board;
    Filling the thermosetting plastic resin in the space formed between the printed circuit board and the circuit element by I-shaped filling, C-shaped filling, L-shaped filling or L-shaped + dot filling method and
    And thermosetting the thermosetting plastic resin for a predetermined time under a predetermined thermosetting temperature exceeding room temperature.
  3. A memory card manufactured by the manufacturing method of claim 2.
KR1020050083977A 2005-09-09 2005-09-09 Method of manufacturing to memory card KR100720077B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020050083977A KR100720077B1 (en) 2005-09-09 2005-09-09 Method of manufacturing to memory card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050083977A KR100720077B1 (en) 2005-09-09 2005-09-09 Method of manufacturing to memory card

Publications (2)

Publication Number Publication Date
KR20070029321A KR20070029321A (en) 2007-03-14
KR100720077B1 true KR100720077B1 (en) 2007-05-18

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Application Number Title Priority Date Filing Date
KR1020050083977A KR100720077B1 (en) 2005-09-09 2005-09-09 Method of manufacturing to memory card

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08310171A (en) * 1995-05-17 1996-11-26 Japan Steel Works Ltd:The Ic card and manufacture thereof
JPH0950650A (en) * 1995-08-03 1997-02-18 Canon Inc Production of substrate of optical card with magnetic stripe
JPH1035161A (en) 1996-07-24 1998-02-10 Toppan Printing Co Ltd Ic card and manufacture of ic card
KR20030061370A (en) * 2000-10-02 2003-07-18 마츠시타 덴끼 산교 가부시키가이샤 Card type recording medium and production method therefor
JP2005115646A (en) 2003-10-07 2005-04-28 Hitachi Ltd Radio communication medium, and manufacturing method therefor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08310171A (en) * 1995-05-17 1996-11-26 Japan Steel Works Ltd:The Ic card and manufacture thereof
JPH0950650A (en) * 1995-08-03 1997-02-18 Canon Inc Production of substrate of optical card with magnetic stripe
JPH1035161A (en) 1996-07-24 1998-02-10 Toppan Printing Co Ltd Ic card and manufacture of ic card
KR20030061370A (en) * 2000-10-02 2003-07-18 마츠시타 덴끼 산교 가부시키가이샤 Card type recording medium and production method therefor
JP2005115646A (en) 2003-10-07 2005-04-28 Hitachi Ltd Radio communication medium, and manufacturing method therefor

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