JP2008140869A - Printed circuit board, electronic apparatus, and method for manufacturing printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To secure quality in mounting an insertion component even in a high-density printed circuit board. <P>SOLUTION: The printed circuit board 8 includes: a printed wiring board 10; an electronic apparatus 20; and a spacer member 30. The printed wiring board 10 includes a plurality of through-holes 11. The electronic component 20 includes: a component body 21; and a plurality of lead members 22 which are projected from the component body 21, inserted to the through-holes 11, and connected by soldering. The spacer member 30 is arranged between the component body 21 and the printed wiring board 10 and also partially arranged between one lead member 22 and another lead member 22. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a printed circuit board, and more particularly to a printed circuit board on which an insertion part having a lead is mounted.

  For example, there is a printed circuit board in which an electronic component (inserted component) having a lead member such as a connector component is inserted into a through-hole portion of a printed wiring board and soldered. When such a printed circuit board performs reflow heating for solder joining, the electronic component main body may crush the solder paste applied to the through-hole portion. This crushing may form solder balls as the case may be. The presence of this solder ball becomes a factor that causes problems such as a short circuit.

In order to prevent the main body of the electronic component from coming into close contact with the printed circuit board, for example, as shown in Patent Document 1, it is conceivable to use a chip component as a spacer.
Japanese Patent Laid-Open No. 9-8434 (see page 5, FIG. 1)

  However, when the above-described Patent Document 1 is applied to a recent high-density printed circuit board, it may be difficult to prepare a chip component having an appropriate size and height as a spacer. In addition, if the lead and the chip component come into contact with each other, there may be a problem that a normal operation cannot be performed.

  Accordingly, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a printed circuit board that can ensure the mounting quality of the inserted component even in a high-density printed circuit board.

  In order to achieve the above object, a printed circuit board according to the present invention includes a printed wiring board having a plurality of through-hole portions, a component main body, a plurality of components protruding from the component main body and inserted into the through-hole portions and solder-connected. An electronic component having a lead member, and a spacer provided between the component main body and the printed wiring board, and at least a portion provided between the one lead member and the other lead member And a member.

  The electronic device of the present invention is an electronic device including a housing and a printed circuit board accommodated in the housing, and the printed circuit board includes a printed wiring board having at least one through hole portion. An electronic component having a component main body and a lead member protruding from the component main body and inserted into the through-hole portion, and a spacer member provided between the component main body and the printed wiring board. It is characterized by that.

  The printed circuit board manufacturing method of the present invention includes a wiring board preparation step of preparing a printed wiring board having at least one through-hole portion and a spacer mounting area for mounting a spacer member, and the through-hole portion. A solder application step of applying a solder paste; an adhesive application step of applying an adhesive to the spacer mounting region; a first mounting step of mounting the spacer member opposite the spacer mounting region; A second mounting step of mounting an electronic component having a lead member protruding from the component main body by inserting the lead member into the through hole, and the printed wiring mounted with the spacer member and the electronic component; And a heating step of reflow heating the plate.

  Another printed circuit board manufacturing method of the present invention includes a wiring board preparation step of preparing a printed wiring board having at least one through-hole portion and a spacer mounting region for mounting a spacer member, and the through-hole. An electronic component comprising: a solder application step of applying a solder paste to a portion; a first mounting step of mounting the spacer member so as to face the spacer mounting region; and a component main body and a lead member protruding from the component main body Including a second mounting step in which the lead member is inserted into the through-hole portion and mounting, and a heating step in which the printed wiring board on which the spacer member and the electronic component are mounted is reflow-heated. It is said.

  The mounting quality of the inserted part can be ensured.

  Hereinafter, an embodiment of a printed circuit board according to the present invention will be described with reference to the drawings, taking as an example a case where the printed circuit board is applied to a portable computer which is one of electronic devices.

  FIG. 1 is a perspective view of a portable computer according to an embodiment of the present invention. In FIG. 1, a main body 2 of a portable computer 1 is provided with a display unit housing 3 so as to be rotatable via a hinge mechanism. The main body 2 is provided with operation units such as a pointing device 4 and a keyboard 5. The display unit housing 3 is provided with a display device 6 such as an LCD.

  Further, the main body 2 is provided with a printed circuit board (mother board) 8 in which a control circuit for controlling the operation device such as the pointing device 4 and the keyboard 5 and the display device 6 is incorporated.

(First embodiment of printed circuit board)
FIG. 2 is a diagram showing a first embodiment of a printed circuit board housed inside the casing of the portable computer shown in FIG. 2A is a cross-sectional view, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. In FIG. 2B, the outer shape of the component main body 21 is also indicated by a dotted line for convenience.

  The printed circuit board 8 includes a printed wiring board 10, an electronic component 20, and a spacer member 30.

  The printed wiring board 10 has a first surface 10a and a second surface 10b, and penetrates through the first surface 10a and the second surface 10b and serves as a through hole. Part 11. A land 12 is provided at the edge of the through hole 11. The printed wiring board 10 may be a single-layer board or a multilayer board. The printed wiring board 10 may have wiring and electrodes in the inner layer as long as it is the first surface 10a, the second surface 10b, or a multilayer board. Moreover, the solder resist may be apply | coated to the 1st surface 10a and the 2nd surface 10b.

  The electronic component 20 includes, for example, a component main body 21 having a rectangular parallelepiped shape, and a plurality of lead members 22 that protrude from the component main body 21 and are inserted into the through-hole portions 11 and soldered.

The electronic component 20 in this embodiment has four lead members 22a, 22b, 22c, and 22d as shown in FIG.

  The spacer member 30 is an elastic material made of an insulating material such as an insulating resin, rubber, or sponge. In FIG. 2, the spacer member 30 has the shape of a flat rectangular parallelepiped as a whole having the end portions 30a and 30b. The width, length, and height of the spacer member 30 are preferably changed as appropriate in consideration of the relationship between the electronic component 20 to be mounted and the through-hole portion 11. That is, since the spacer member 30 is an elastic material made of an insulating material such as an insulating resin, rubber, or sponge, it is relatively easy to process the spacer member 30 to an appropriate size as a spacer. Therefore, it is preferable to adjust appropriately in consideration of the relationship between the electronic component 20 and the through hole portion 11.

  The spacer member 30 is provided between the component main body 21 and the first surface 10a. At least a part of the spacer member 30 is provided between one lead member 22 and another lead member 22. Specifically, as shown in FIG. 2B, the end 30a of the spacer member 30 is provided between the lead member 22a and the lead member 22b. Similarly, the end 30b of the spacer member 30 is provided between the lead member 22c and the lead member 22d. The arrangement position is not necessarily limited to the middle, and may be arranged closer to the lead member 22a or the lead member 22c, for example, as long as it plays a role as a spacer.

  The spacer member 30 is bonded to the first surface 10 a of the printed wiring board 10 with an adhesive 41. The adhesive 41 in the present invention is preferably a thermosetting adhesive.

  As described above, the spacer member 30 is positioned substantially at the center of the component main body 21, thereby playing a role of mounting the printed wiring board 10 and the component main body 21 of the electronic component 20 with a predetermined interval.

  A predetermined amount of the solder 40 is applied in the through hole portion 11. The solder 40 applied in the through-hole portion 11 may cause part of the solder 40 to come out (overflow) from the through-hole portion 11 when the lead member 22 is inserted into the through-hole portion 11. .

  As described above, by providing the spacer member 30, the component main body 21 and the printed wiring board 10 can be mounted with a predetermined interval. Thereby, formation of a solder ball can be prevented. Further, since the spacer member 30 is insulative, even if the solder 40 overflowing from the through-hole portion 11 adheres to the spacer member 30, there is no possibility of causing a short circuit with other electrodes and wiring. Therefore, the mounting quality of the inserted component can be ensured even in a high-density printed circuit board in which the distance between the lead members 22 is short.

(Second embodiment of printed circuit board)
FIG. 3 is a diagram showing a second embodiment of a printed circuit board housed inside the casing of the portable computer shown in FIG. 3A is a cross-sectional view, and FIG. 3B is a cross-sectional view taken along the line AA in FIG. In FIG. 3B, the outer shape of the component main body 21 is also indicated by a dotted line for convenience.

  In FIG. 3, the same parts as those of the first embodiment of FIG. The present embodiment is different from the first embodiment in the shape of the spacer member 30 and the arrangement position thereof.

  That is, the spacer member in the present embodiment is composed of two spacer members 31a and 31b having a substantially spherical shape. The spacer member 31a is provided between the lead member 22a and the lead member 22b. Similarly, the spacer member 31b is provided between the lead member 22c and the lead member 22d. The arrangement position is not necessarily limited to the middle, and may be arranged closer to the lead member 22a or the lead member 22c, for example, as long as it plays a role as a spacer.

  The spacer members 31a and 31b may be the adhesive itself. When the spacer members 31a and 31b are adhesives, the adhesive 41 need not be applied to the portions.

  When the lead member 22 of the electronic component 20 is inserted into the through hole portion 11 of the printed wiring board 10, the spacer members 31a and 31b are crushed. As a result, the contact area between the spacer members 31a and 31b and the component main body 21 is a circular area. Similarly, the contact area between the spacer members 31a and 31b and the first surface 10a of the printed wiring board 10 is a circular area.

  3A is provided between the lead member 22a and the lead member 22b, and between the lead member 22c and the lead member 22d, the component main body 21 and the printed wiring. It plays a role of providing a predetermined distance from the plate 10.

  By providing the spacer members 31a and 31b, the component main body 21 and the printed wiring board 10 can be mounted at a predetermined interval. Thereby, formation of a solder ball can be prevented. Further, since the spacer members 31a and 31b are insulative, even if the solder 40 overflowing from the through-hole portion 11 adheres to the spacer members 31a and 31b, there is no possibility of causing a short circuit with other electrodes and wirings. Therefore, the mounting quality of the inserted component can be ensured even in a high-density printed circuit board in which the distance between the lead members 22 is short.

(First Embodiment of Printed Circuit Board Manufacturing Method)
A first embodiment of the above-described printed circuit board manufacturing method will be described below. FIG. 4 is a diagram showing a first embodiment of a method for manufacturing a printed circuit board according to an embodiment of the present invention. FIG. 4 illustrates the printed circuit board according to the first embodiment described above as an example.

  First, as shown in FIG. 4A, a spacer mounting region A for mounting the spacer member 30 and a printed wiring board 10 having a plurality of through-hole portions 11 are prepared (wiring board preparation step, step S1). ).

  Next, as shown in FIG.4 (b), a solder paste is apply | coated to the through-hole part 11 (a solder application process, step S2). In this solder application process, a metal mask having an opening in the area where solder is applied is mounted on the printed wiring board 10, solder paste is applied from above the metal mask, and the metal is applied using a predetermined tool such as a squeegee. Uniformly spread the solder applied on the mask. Thereby, solder is applied from the opening.

  Next, as shown in FIG. 4C, a thermosetting adhesive 41 is applied to the spacer mounting area A (adhesive application step, step S3).

  Next, as shown in FIG. 4D, the spacer member 30 is mounted to face the region where the adhesive 41 in the spacer mounting region A is applied (first mounting step, step S4). In the first mounting process, for example, the spacer member 30 is sucked using a mounting machine such as a mounter, and the spacer member 30 is moved to the spacer mounting area A on the printed wiring board 10 and mounted on the mounter from above.

  Next, as shown in FIG. 4E, the electronic component 20 having the component main body 21 and the lead member 22 is mounted by inserting the lead member 22 into the through hole portion 11 (second mounting step, Step S5). This second mounting process is also mounted using a mounting machine such as a mounter.

  Next, as shown in FIG. 4F, the printed wiring board 10 on which the spacer member 30 and the electronic component 20 are mounted is heated to bond the solder and the adhesive (heating process, step S6).

In this heating step, for example, a reflow furnace is used to perform a heat treatment with a predetermined temperature profile.

  Through the steps S1 to S6 described above, the component main body 21 is pressed against the printed wiring board 10 and mounted. However, since the spacer member 30 is mounted, the component main body 21 and the printed wiring board 10 are mounted at a predetermined interval. Thereby, formation of a solder ball can be prevented. Here, since the spacer member 30 is insulative, even if the solder 40 overflowing from the through-hole portion 11 adheres to the spacer member 30, there is no possibility of causing a short circuit with other electrodes and wiring. Therefore, the mounting quality of the inserted component can be ensured even in a high-density printed circuit board in which the distance between the lead members 22 is short.

(Second Embodiment of Printed Circuit Board Manufacturing Method)
A second embodiment of the method for manufacturing a printed circuit board will be described below. FIG. 5 is a diagram showing a second embodiment of the method for manufacturing a printed circuit board according to the embodiment of the present invention.

FIG. 5 illustrates an example in which the spacer members 31a and 31b are adhesives in the printed circuit board according to the second embodiment described above. In FIG. 5, the same parts as those of the first embodiment of the printed circuit board manufacturing method of FIG. 4 are denoted by the same symbols, and the description thereof is omitted.

  First, as shown in FIGS. 5A and 5B, a wiring board preparation step (step S1), a solder application step, and (step S2) are performed.

  Next, as shown in FIG. 5D, spacer members 31a and 31b are mounted facing the spacer mounting region A (first mounting step, step S3). In the first mounting process, for example, the spacer members 31a and 31b are sucked using a mounting machine such as a mounter, and moved to the spacer mounting area A on the printed wiring board 10 and mounted on the mounter from above.

  Next, as shown in FIG.5 (e), a 2nd mounting process (step S4) and a heating process (step S5) are performed.

  The component main body 21 is also pressed and mounted on the printed wiring board 10 through the steps S1 to S5 described above. However, since the spacer members 31a and 31b are mounted, the component main body 21 and the printed wiring board 10 are mounted at a predetermined interval. Thereby, formation of a solder ball can be prevented. Here, since the spacer members 31a and 31b are insulative, even if the solder 40 overflowing from the through-hole portion 11 adheres to the spacer members 31a and 31b, there is no possibility of causing a short circuit with other electrodes and wirings. Therefore, the mounting quality of the inserted component can be ensured even in a high-density printed circuit board in which the distance between the lead members 22 is short.

1 is a perspective view of a portable computer according to an embodiment of the present invention. The figure which showed 1st Embodiment of the printed circuit board accommodated in the inside of the housing | casing of the portable computer shown in FIG. The figure which showed 2nd Embodiment of the printed circuit board accommodated in the housing | casing of the portable computer shown in FIG. The figure which showed 1st Embodiment of the manufacturing method of the printed circuit board which concerns on embodiment of this invention. The figure which showed 2nd Embodiment of the manufacturing method of the printed circuit board which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Portable computer 2 Main body 3 Display part housing | casing 4 Pointing device 5 Keyboard 6 Display device 8 Printed circuit board 10 Printed wiring board 10a 1st surface 10b 2nd surface 11 Through-hole part 12 Land 20 Electronic component 21 Component main body 22 Lead Member 30, 31, 31a, 31b Spacer member 30a, 30b End 40 Solder 41 Adhesive A Spacer mounting region

Claims (6)

A printed wiring board having a plurality of through-hole portions;
An electronic component having a component main body and a plurality of lead members which protrude from the component main body and are inserted into the through-hole portion and soldered;
A spacer member provided between the component main body and the printed wiring board, and at least a part of the spacer member provided between the one lead member and the other lead member;
A printed circuit board comprising: The printed circuit board according to claim 1, wherein the spacer member is bonded to the printed wiring board with an adhesive. A housing,
An electronic device comprising a printed circuit board housed in the housing,
The printed circuit board is:
A printed wiring board having at least one through hole;
An electronic component having a component main body and a lead member that protrudes from the component main body and is inserted into the through-hole portion;
A spacer member provided between the component main body and the printed wiring board;
An electronic device characterized by comprising: A wiring board preparation step of preparing a printed wiring board having at least one through-hole portion and a spacer mounting region for mounting the spacer member;
A solder application step of applying a solder paste to the through hole,
An adhesive application step of applying an adhesive to the spacer mounting region;
A first mounting step of mounting the spacer member facing the spacer mounting region;
A second mounting step of mounting an electronic component having a component body and a lead member protruding from the component body by inserting the lead member into the through-hole portion; and
A printed circuit board manufacturing method comprising: a heating step of reflow heating the printed wiring board on which the spacer member and the electronic component are mounted. A wiring board preparation step of preparing a printed wiring board having at least one through-hole portion and a spacer mounting region for mounting the spacer member;
A solder application step of applying a solder paste to the through hole,
A first mounting step of mounting the spacer member facing the spacer mounting region;
A second mounting step of mounting an electronic component having a component body and a lead member protruding from the component body by inserting the lead member into the through-hole portion; and
A printed circuit board manufacturing method comprising: a heating step of reflow heating the printed wiring board on which the spacer member and the electronic component are mounted.   6. The method of manufacturing a printed circuit board according to claim 5, wherein the spacer member is a thermosetting adhesive.

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