JP2008135410A - Method for mounting electronic component, circuit board having electronic component mounted thereon, and electronic equipment having circuit board mounted thereon - Google Patents

Method for mounting electronic component, circuit board having electronic component mounted thereon, and electronic equipment having circuit board mounted thereon Download PDF

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JP2008135410A
JP2008135410A JP2005070680A JP2005070680A JP2008135410A JP 2008135410 A JP2008135410 A JP 2008135410A JP 2005070680 A JP2005070680 A JP 2005070680A JP 2005070680 A JP2005070680 A JP 2005070680A JP 2008135410 A JP2008135410 A JP 2008135410A
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electronic component
circuit board
adhesive
solder bump
solder
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Yasue Motohashi
恭枝 本橋
Ryoichi Kawamura
僚一 川村
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2005070680A priority Critical patent/JP2008135410A/en
Priority to PCT/JP2006/304948 priority patent/WO2006098294A1/en
Publication of JP2008135410A publication Critical patent/JP2008135410A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

<P>PROBLEM TO BE SOLVED: To solve the following problem: a circuit board may have incompletion in curing of a thermosetting adhesive and solder junction, in a method in which the thermosetting adhesive is applied to the circuit board and an electronic component is mounted, and then, reflow is used to collectively execute curing of the thermosetting adhesive and the solder junction. <P>SOLUTION: A thermosetting adhesive is applied to a circuit board in its position where an electronic component is mounted. Solder is printed on a land on which another electronic component is mounted, and the electronic component is mounted. The circuit board and the electronic component are brought into contact or electrically connected to each other by thermocompression bonding. The thermosetting adhesive is brought into an initial state or a semi-cured state in which the cured state is present, the other electronic component is mounted, and then electric joint of the electronic component, other electronic component and circuit board and thermosetting adhesive curing are executed by reflow. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、熱硬化性接着剤による電子部品と回路基板との実装方法及び電子部品を実装した回路基板に関するものである。   The present invention relates to a method for mounting an electronic component and a circuit board using a thermosetting adhesive, and a circuit board on which the electronic component is mounted.

電子部品と回路基板とを実装する方法としては、回路基板にはんだを印刷し、電子部品をマウントし、電子部品と回路基板をリフローによる加熱によってはんだ接合を形成して、電気的な接合と電子部品の固定が行われている。しかし、電子部品を実装した回路基板を搭載する電子機器において、特に人が携帯する小型電子機器によっては落下等によって衝撃が加わることがある。この際、電子部品と回路基板の接合は、電子機器の構造や電子部品の形状等によっては、はんだ接合だけでは衝撃時に発生する力に耐えうる強度を保つことができず、接合の剥離等の破壊現象が発生する。従来、この破壊現象を防ぎ電子部品と回路基板間の接合強度を保つために、はんだ接合の後に電子部品と回路基板の間に熱硬化性の樹脂を含む熱硬化性接着剤をすきまから注入し、加熱して熱硬化させることによって機械的な強度を保つ方法があった。しかし、はんだ中のフラックスの残渣によって、又は電子部品と回路基板のバンプ間隔の狭い接合面に外部から注入して塗布するために、熱硬化性接着剤を接合面に均等に広げることが困難であった。また、熱硬化性接着剤を注入する工程と、注入した熱硬化性接着剤を熱硬化させるために加熱する工程が加わることで、電子機器の製造工程における工数が増加した。   As a method of mounting the electronic component and the circuit board, solder is printed on the circuit board, the electronic component is mounted, and the electronic component and the circuit board are heated by reflow to form a solder joint. Parts are fixed. However, in an electronic device mounted with a circuit board on which an electronic component is mounted, an impact may be applied due to dropping or the like, particularly depending on a small electronic device carried by a person. At this time, depending on the structure of the electronic device and the shape of the electronic component, the bonding between the electronic component and the circuit board cannot maintain the strength that can withstand the force generated at the time of impact by only the solder bonding. Destructive phenomenon occurs. Conventionally, in order to prevent this destruction phenomenon and maintain the bonding strength between the electronic component and the circuit board, a thermosetting adhesive containing a thermosetting resin is injected from the gap between the electronic component and the circuit board after the solder bonding. There was a method of maintaining mechanical strength by heating and thermosetting. However, it is difficult to spread the thermosetting adhesive evenly on the joint surface because of flux residue in the solder or because it is applied from the outside to the joint surface where the bump interval between the electronic component and the circuit board is narrow. there were. Moreover, the man-hour in the manufacturing process of an electronic device increased by adding the process of inject | pouring a thermosetting adhesive and the process of heating in order to thermoset the inject | poured thermosetting adhesive.

さらに、近年の電子機器の小型化に伴い電子部品のバンプの間隔が狭くなっていく傾向である。このバンプの間隔が狭くなっていくと、回路基板の対応する位置にはんだ印刷を行うことが困難若しくは不可能となり、将来的にこの工法は使用できなくなる方向である。   Furthermore, with the recent miniaturization of electronic devices, the distance between bumps of electronic components tends to become narrower. As the distance between the bumps becomes narrower, it becomes difficult or impossible to perform solder printing on the corresponding position of the circuit board, and this method will not be usable in the future.

そこで上記の課題を解決するために、電子部品と回路基板を接続する方法としては、回路基板の電子部品を装着する位置に熱硬化性接着剤を塗布し、はんだバンプを付けた電子部品をマウントし、リフローにて加熱してはんだ接合と熱硬化性接着剤の硬化を一括で行う、主にフリップチップの取り付けのために用いられている方法が提案されている（例えば、特許文献１参照）。   Therefore, in order to solve the above problems, as a method of connecting the electronic component and the circuit board, a thermosetting adhesive is applied to the mounting position of the electronic component on the circuit board, and the electronic component with the solder bump is mounted. In addition, a method mainly used for attaching a flip chip has been proposed in which soldering and curing of the thermosetting adhesive are performed collectively by heating by reflow (see, for example, Patent Document 1). .

また、電子部品と回路基板を接続する他の方法としては、回路基板上の電子部品を接続する電気的終端部であるランドにはんだを印刷によって塗布し、突起状電極を形成した電子部品と基板との間に熱硬化性接着剤を塗布し、電子部品を基板に押し付けて突起状電極を食い込ませ、熱圧着ヘッドによって加熱してはんだ接合と熱硬化性接着剤を硬化させる方法が提案されている（例えば、特許文献２参照）。
特開平４−２８０４４３号公報（第６ページ、図１） 特開平１０−５６２５９号公報（第４ページ、図２） As another method for connecting an electronic component and a circuit board, an electronic component and a board on which a protruding electrode is formed by applying solder to a land, which is an electrical terminal for connecting the electronic component on the circuit board, by printing. A method is proposed in which a thermosetting adhesive is applied between the substrate, the electronic component is pressed against the substrate to bite the protruding electrode, and heated by a thermocompression bonding head to cure the solder joint and the thermosetting adhesive. (For example, refer to Patent Document 2).
JP-A-4-280443 (page 6, FIG. 1) Japanese Patent Laid-Open No. 10-56259 (page 4, FIG. 2)

しかしながら従来の熱硬化性接着剤を用いた電子部品の実装方法においては、電子部品を実装する基板に熱硬化性接着剤を塗布し、はんだバンプを取り付けた電子部品をマウントし、リフローによる加熱によってはんだ接合および熱硬化性接着剤の硬化を一括で行う際に、熱硬化性接着剤の構成や電子部品の大きさや種類等により、通常のリフローによる加熱だけでは加熱が不足し、熱硬化性接着剤の硬化が不完全になり機械的強度が不完全なものが発生するという問題があり、リフローによる加熱だけで熱硬化性接着剤を硬化させるよう、リフロー時間を長くしたり温度を高く設定すると、はんだが溶融し接合が完了する前に、熱硬化性接着剤が硬化し電子部品と回路基板間に皮膜を形成して、電子部品のはんだ接合による電気的接合ができないものが発生するという問題もあった。   However, in the conventional electronic component mounting method using a thermosetting adhesive, the thermosetting adhesive is applied to the substrate on which the electronic component is mounted, the electronic component with the solder bump attached is mounted, and heating by reflow is performed. When performing solder bonding and thermosetting adhesive curing all at once, depending on the composition of the thermosetting adhesive and the size and type of the electronic components, heating is not sufficient with normal reflow heating. There is a problem that the curing of the agent is incomplete and the mechanical strength is incomplete, so if the reflow time is set long or the temperature is set high so that the thermosetting adhesive is cured only by heating by reflow Before the solder is melted and bonding is completed, the thermosetting adhesive is cured and a film is formed between the electronic component and the circuit board. Nothing there is a problem that occurs.

また、はんだバンプを取り付けた電子部品と回路基板間に介在する熱硬化性接着剤によりマウント時の電子部品と基板との間の接触が不十分になることがあり、はんだ接合による電気的接合が不完全となる問題もあった。   In addition, the thermosetting adhesive interposed between the electronic component with the solder bumps and the circuit board may cause insufficient contact between the electronic component and the substrate during mounting. Some problems were incomplete.

さらに、電子部品を実装する基板のランドにはんだを印刷により塗布し、突起状電極を形成した電子部品と基板との間に熱硬化性接着剤を塗布し、電子部品を基板に熱圧着ヘッドによって加熱しながら押し付けて、はんだ接合と熱硬化性接着剤の硬化を行う方法においては、熱圧着による熱だけで熱硬化性接着剤の硬化を行うので、熱圧着する電子部品の大きさ等によって熱圧着による周囲に伝わる熱が大きくなってしまう。この熱によって、隣接する部品を実装する位置に塗布されたはんだが溶ける、又は先に実装された部品がはんだが溶けて位置がずれてしまう等の悪影響が出てしまい、熱圧着を行う電子部品の実装位置に隣接する部品を配置することができないという問題があった。   Furthermore, solder is applied to the lands of the board on which the electronic component is mounted by printing, a thermosetting adhesive is applied between the electronic component on which the protruding electrode is formed and the board, and the electronic component is applied to the board by a thermocompression bonding head. In the method of pressing while heating and soldering and curing the thermosetting adhesive, the thermosetting adhesive is cured only by heat from thermocompression bonding. The heat transmitted to the surroundings due to the crimping will increase. This heat causes adverse effects such as melting the solder applied to the position where the adjacent component is mounted, or shifting the position of the previously mounted component due to the solder melting. There is a problem that it is not possible to place a component adjacent to the mounting position.

本発明は、従来の課題を解決するためになされたものであり、電気的接合の安定性を確保し、電子部品と基板の間の熱硬化性接着剤を硬化させ回路基板と電子部品の機械的な接合強度を向上することができ、かつ熱圧着の熱により周辺部品に悪影響を与えない熱硬化性接着剤による電子部品の実装方法及び電子部品を実装した回路基板を提供することを目的とする。   The present invention has been made to solve the conventional problems, and ensures the stability of electrical joining, cures the thermosetting adhesive between the electronic component and the substrate, and makes the machine for the circuit board and the electronic component. An object of the present invention is to provide a method of mounting an electronic component with a thermosetting adhesive that can improve the general bonding strength and does not adversely affect peripheral components due to heat of thermocompression bonding, and a circuit board on which the electronic component is mounted. To do.

前記従来の課題を解決するため、本発明の熱硬化性接着剤による電子部品の実装方法は、回路基板の電子部品を実装する位置に熱硬化性の樹脂を含む熱硬化性接着剤を塗布し、熱硬化性接着剤を塗布した電子部品を実装する位置にはんだバンプを取り付けた電子部品をマウントし、回路基板と電子部品を熱圧着により接触又ははんだ接合による電気的接合を行い且つ熱硬化性接着剤を初期状態若しくは硬化の状態が存在する半硬化状態にすることを行い、次に、リフローによる加熱により電子部品のはんだ接合による電気的接合を行い且つ熱硬化性接着剤の硬化を行うものである。   In order to solve the above-described conventional problems, the electronic component mounting method using the thermosetting adhesive according to the present invention applies a thermosetting adhesive containing a thermosetting resin to a position on the circuit board where the electronic component is mounted. Mount the electronic component with solder bumps on the position where the electronic component coated with thermosetting adhesive is mounted, and contact the circuit board with the electronic component by thermocompression or make electrical connection by soldering and thermosetting The adhesive is made into an initial state or a semi-cured state in which there is a cured state, and then electrical bonding is performed by soldering of electronic components by heating by reflow and curing of the thermosetting adhesive is performed. It is.

本構成によって、熱硬化性接着剤による電子部品を実装する際に、熱圧着による加熱とリフローによる加熱により、熱硬化性接着剤を完全に硬化させることにより基板と電子部品の機械的な接合強度を向上し、且つ圧着による接触とはんだ接合による電気的な接合を確実に行うことができる。   With this configuration, when mounting electronic components using thermosetting adhesive, the mechanical bonding strength between the board and electronic components is achieved by completely curing the thermosetting adhesive by heating by thermocompression bonding and heating by reflow. In addition, it is possible to reliably perform contact by pressure bonding and electrical bonding by solder bonding.

また、本発明の熱硬化性接着剤による電子部品の実装方法は、基板の電子部品を実装する位置に熱硬化性接着剤を塗布し、他の電子部品を実装する位置のランドにはんだを印刷し、熱硬化性接着剤を塗布した電子部品を実装する位置にはんだバンプを取り付けた電子部品をマウントし、回路基板とはんだバンプを取り付けた電子部品を熱圧着により接触又ははんだ接合による電気的接合を行い且つ熱硬化性接着剤を初期状態若しくは硬化の状態が存在する半硬化状態にすることを行い、他の電子部品をはんだを印刷した位置にマウントし、リフローによる加熱によってはんだバンプを取り付けた電子部品及び他の電子部品と回路基板とのはんだ接合による電気的接合を行い且つ熱硬化性接着剤の硬化を行うものである。   In the electronic component mounting method using the thermosetting adhesive according to the present invention, the thermosetting adhesive is applied to the position where the electronic component is mounted on the substrate, and the solder is printed on the land where the other electronic component is mounted. Then, mount the electronic component with the solder bumps on the mounting position of the electronic component to which the thermosetting adhesive is applied, and connect the electronic components with the circuit board and the solder bumps by thermocompression or electrical bonding by soldering And making the thermosetting adhesive into an initial state or a semi-cured state where a cured state exists, mounting other electronic components on the position where the solder is printed, and attaching solder bumps by heating by reflow The electronic component and other electronic components and the circuit board are electrically connected by soldering and the thermosetting adhesive is cured.

本構成によって、熱硬化性接着剤による電子部品を実装する際に、熱圧着による加熱とリフローによる加熱を組み合わせて対応することにより熱硬化性接着剤を硬化するための熱圧着時の加熱を抑えることで、隣接する他の電子部品と他の電子部品を実装する位置のはんだに対して熱による悪影響を与えることなく、熱硬化性接着剤を完全に硬化させることができる。この事によって隣接する部品に悪影響を与えることなく、回路基板と電子部品の機械的な接合強度を向上し、且つ圧着による接触とはんだバンプを取り付けた電子部品のはんだ接合による電気的な接合を確実に行うことができる。   With this configuration, when mounting electronic components using thermosetting adhesives, heat during thermocompression bonding for curing thermosetting adhesives can be suppressed by combining heating by thermocompression bonding and heating by reflow. Thus, the thermosetting adhesive can be completely cured without adversely affecting the other adjacent electronic components and the solder at the position where the other electronic components are mounted. This improves the mechanical joint strength between the circuit board and the electronic component without adversely affecting adjacent components, and ensures the electrical connection by the contact by crimping and the solder joint of the electronic component to which the solder bump is attached. Can be done.

さらに、本発明においては、基板に対してはんだバンプを取り付けた電子部品を実装する位置にはんだ印刷は行わず、電子部品に取り付けたはんだバンプだけで電気的接合を行うことにより、狭ピッチ化によるはんだ印刷の困難さを考慮する必要がないので、狭ピッチの電子部品の実装にも対応が可能である。   Further, in the present invention, the solder printing is not performed at the position where the electronic component having the solder bump attached to the substrate is mounted, and the electrical bonding is performed only by the solder bump attached to the electronic component, thereby reducing the pitch. Since it is not necessary to consider the difficulty of solder printing, it is possible to support mounting of electronic components with a narrow pitch.

本発明によれば、回路基板に熱硬化性接着剤を塗布し、接着剤を塗布した位置にはんだバンプを取り付けた電子部品をマウントし、電子部品と回路基板を熱圧着することにより接触又は電気的な接合を行い、且つ接着剤を少なくとも部分的には硬化させ、その後リフローにより接触を強化し又は電気的な接合を行い且つ接着剤を硬化させる実装方法により、狭ピッチのバンプを有する電子部品の確実な接合が可能で且つ樹脂の硬化により回路基板と電子部品の機械的強度保つことが可能であり、実装の安定性と信頼性を高めることができ、さらに熱圧着を行うバンプを有する電子部品に隣接する位置に他の電子部品の実装も可能であり高密度実装にも対応できる。   According to the present invention, a thermosetting adhesive is applied to a circuit board, an electronic component having a solder bump attached is mounted at a position where the adhesive is applied, and the electronic component and the circuit board are contacted or electrically bonded by thermocompression bonding. Electronic component having a narrow pitch bump by a mounting method in which the adhesive is bonded and the adhesive is at least partially cured, and then the contact is strengthened by reflow or electrical bonding is performed and the adhesive is cured It is possible to maintain the mechanical strength of the circuit board and the electronic component by curing the resin, to improve the stability and reliability of the mounting, and to further provide an electronic device having a bump for performing thermocompression bonding. Other electronic components can be mounted at positions adjacent to the components, and high-density mounting can be handled.

以下に本発明を実施するための最良の形態の熱硬化性接着剤による電子部品の実装方法について、図面を用いて説明する。   Hereinafter, a method for mounting an electronic component using a thermosetting adhesive according to the best mode for carrying out the present invention will be described with reference to the drawings.

（実施の形態１）
図１に本発明の実施の形態１の回路基板にはんだバンプを取り付けた電子部品を実装する工程の断面図を示す。図１（ａ）において、回路基板１１は回路基板のランド１２を有し、電子部品１４は端子に取り付けたはんだバンプ１５を有する。電子部品１４が回路基板１１に取り付けられると、ランド１２とはんだバンプ１５とを電気的に接続する構成である。はんだバンプ１５は電子部品１４の実装する面に複数配列されており、ランド１２もはんだバンプ１５に対応した位置に回路基板１１上に複数配置されており、図１では７個表示している。また、熱硬化性樹脂を含む熱硬化性接着剤１３は、回路基板１１の電子部品１４の取り付ける位置に塗布される。なお、回路基板１１上のランド１２に対してはんだ印刷は行わない。これによって、本発明の実装方法を実施するにあたって、電子部品１４の各ランド１２に対応する各はんだバンプ１５間の間隔（ピッチ）が狭くなっても、はんだ印刷を行わないのでが狭ピッチの困難さに伴う制限がなくなる。 (Embodiment 1)
FIG. 1 shows a cross-sectional view of a process of mounting an electronic component having solder bumps attached to a circuit board according to Embodiment 1 of the present invention. In FIG. 1A, a circuit board 11 has lands 12 of the circuit board, and an electronic component 14 has solder bumps 15 attached to terminals. When the electronic component 14 is attached to the circuit board 11, the land 12 and the solder bump 15 are electrically connected. A plurality of solder bumps 15 are arranged on the mounting surface of the electronic component 14, and a plurality of lands 12 are also arranged on the circuit board 11 at positions corresponding to the solder bumps 15, and seven are shown in FIG. 1. A thermosetting adhesive 13 containing a thermosetting resin is applied to a position where the electronic component 14 of the circuit board 11 is attached. Note that solder printing is not performed on the lands 12 on the circuit board 11. As a result, when implementing the mounting method of the present invention, even if the interval (pitch) between the solder bumps 15 corresponding to each land 12 of the electronic component 14 is narrow, solder printing is not performed, but it is difficult to narrow the pitch. There are no restrictions.

図１（ｂ）に、本発明の実施の形態１の熱圧着中の回路基板とはんだバンプを取り付けた電子部品の断面図を示す。図１（ｂ）の熱圧着ヘッド１６は、電子部品１４を加熱しながら押し付けて、回路基板１１と熱圧着する工程に用いるものである。   FIG. 1B shows a cross-sectional view of an electronic component attached with a circuit board and solder bumps during thermocompression bonding according to Embodiment 1 of the present invention. The thermocompression bonding head 16 shown in FIG. 1B is used in a process of pressing the electronic component 14 while heating and thermocompression bonding with the circuit board 11.

図１（ｂ）において、電子部品１４は、熱硬化性接着剤１３を塗布した回路基板１１上の取り付け位置にマウントされる。次に、熱圧着ヘッド１６によって電子部品１４と回路基板１１との熱圧着を行う。熱圧着を行うことによって、電子部品１４のはんだバンプ１５と回路基板１１のランド１２の間に介在する熱硬化性樹脂を押し出しながら、圧着による接触と加熱による少なくとも部分的なはんだ接合による電気的な接合が行われる。また同時に、熱圧着による加熱によって、熱硬化性接着剤１３は初期のまま硬化が進んでいない状態若しくは部分的に硬化が進んだ状態の双方を含む半硬化の状態となる。熱圧着の工程の後は、回路基板１１と電子部品１４はリフローにより加熱が行われる。   In FIG. 1B, the electronic component 14 is mounted at an attachment position on the circuit board 11 to which the thermosetting adhesive 13 is applied. Next, the thermocompression bonding head 16 performs thermocompression bonding between the electronic component 14 and the circuit board 11. By performing thermocompression bonding, the thermosetting resin interposed between the solder bumps 15 of the electronic component 14 and the lands 12 of the circuit board 11 is extruded, and electrical contact is performed by at least partial soldering by contact and heating by crimping. Joining is performed. At the same time, due to heating by thermocompression bonding, the thermosetting adhesive 13 is in a semi-cured state including both a state where the curing is not progressing in the initial state or a state where the curing is partially progressed. After the thermocompression bonding process, the circuit board 11 and the electronic component 14 are heated by reflow.

図１（ｃ）に本発明の実施の形態１の熱圧着とリフローを行った後の回路基板とはんだバンプを取り付けた電子部品の断面図を示す。図１（ｃ）において、図１（ｂ）の熱圧着の後に行ったリフローによる加熱によって、熱硬化性接着剤１３は硬化状態に達する。同時に、回路基板１１のランド１２と電子部品１４のはんだバンプ１５は、図１（ｂ）の熱圧着による接触と部分的なはんだ接合の状態から、リフローによる加熱によってはんだ接合がなされ電気的に接合している状態となる。   FIG. 1C is a cross-sectional view of an electronic component to which a circuit board and solder bumps are attached after thermocompression bonding and reflow according to Embodiment 1 of the present invention. In FIG.1 (c), the thermosetting adhesive 13 reaches a hardening state by the heating by the reflow performed after the thermocompression bonding of FIG.1 (b). At the same time, the lands 12 of the circuit board 11 and the solder bumps 15 of the electronic component 14 are electrically joined by soldering by reflow heating from the contact state and the partial solder joint state shown in FIG. It will be in the state.

本発明の実施の形態１の熱硬化性接着剤による電子部品の実装方法によれば、熱硬化性接着剤は、熱圧着とリフローによる２度の加熱によって確実に硬化状態に達し、アンダーフィルとして回路基板と電子部品との機械的強度を保つことができる。この際の熱硬化性接着剤の硬化は熱圧着とリフローの２度の加熱によって行っているので、このリフローに関しては、接着剤の加熱の為に温度と時間を大きく変更する必要は無い。また、電子部品のはんだバンプと回路基板のランドとの接合についても、圧着による接触と２度の加熱によるはんだ接合によって、電気的に確実に接続することができる。   According to the electronic component mounting method using the thermosetting adhesive according to the first embodiment of the present invention, the thermosetting adhesive surely reaches the cured state by heating twice by thermocompression bonding and reflow, and as an underfill The mechanical strength between the circuit board and the electronic component can be maintained. Since the thermosetting adhesive at this time is cured by two heating steps of thermocompression bonding and reflow, it is not necessary to largely change the temperature and time for heating the adhesive. Also, the solder bumps of the electronic components and the lands of the circuit board can be electrically and reliably connected by contact by crimping and soldering by heating twice.

なお、上記の実施の形態１の説明では、電子部品のはんだバンプと回路基板のランドとの接合ははんだ接合によって電気的に確実な接続と熱硬化性樹脂による機械的強度の向上を行ったが、接合の強度が要求されない電子機器においては、熱硬化性接着剤の硬化によるはんだバンプと回路基板の接触の補強による電気的な接続のみでも十分である。   In the description of the first embodiment, the solder bumps of the electronic component and the lands of the circuit board are joined to each other by an electrically reliable connection and an improvement in mechanical strength by the thermosetting resin. In an electronic device that does not require bonding strength, electrical connection by reinforcing the contact between the solder bump and the circuit board by curing the thermosetting adhesive is sufficient.

また同様に、電子部品のはんだバンプと回路基板のランドとの接合は、熱圧着により熱硬化性接着剤による接触と少なくとも部分的なはんだ接合を行い、リフローによって確実な電気的接合を図ったが、熱圧着では確実に接触のみを行い、リフローによって電気的接合を行うことも可能である。   Similarly, the solder bumps of the electronic parts and the lands of the circuit board are joined by thermocompression bonding and at least partial solder joining by thermocompression bonding, and reliable electrical joining is achieved by reflow. In thermocompression bonding, only contact can be performed reliably, and electrical joining can be performed by reflow.

（実施の形態２）
次に実施の形態２について説明する。本発明の実施の形態２では、はんだバンプを取り付けた電子部品と他の電子部品を同時に回路基板に実装を行う方法について説明する。実施の形態２では、はんだバンプを取り付けた電子部品を熱圧着する際に熱圧着による加熱が、隣接する他の電子部品を実装するために印刷されるはんだ等に対して悪影響を受けない程度に留める点に特徴がある。 (Embodiment 2)
Next, a second embodiment will be described. In the second embodiment of the present invention, a method of simultaneously mounting an electronic component with solder bumps and another electronic component on a circuit board will be described. In the second embodiment, when thermocompression bonding is performed on an electronic component to which a solder bump is attached, heating by thermocompression is not adversely affected by solder or the like printed for mounting other adjacent electronic components. There is a feature in the point to stop.

図２に本発明の実施の形態２の基板に実装する前の回路基板とはんだバンプを取り付けた電子部品の断面図を示す。図２（ａ）において、回路基板２０は電子部品１４を装着するためのランド１２と他の電子部品を実装するためのランド２１を有し、電子部品１４は取り付けたはんだバンプ１５を有する。ランド１２は電子部品１４のはんだバンプ１５と接続用であり図１と同様に７個表示している。熱硬化性接着剤１３は、回路基板２０の電子部品１４を取り付ける位置に塗布される。また、図１と同様に電子部品１４を取り付けるランド１２にはんだ印刷は行わず、電子部品１４のはんだバンプ１５でランド１２との電気的接続を行う。ランド２１には、他の電子部品を実装するためにはんだ２２が印刷される。また、ランド２１とはんだ２２は図２中に４個表示している。   FIG. 2 shows a cross-sectional view of an electronic component to which a circuit board and solder bumps are mounted before being mounted on the board of Embodiment 2 of the present invention. In FIG. 2A, a circuit board 20 has a land 12 for mounting the electronic component 14 and a land 21 for mounting another electronic component, and the electronic component 14 has a solder bump 15 attached thereto. The lands 12 are for connection with the solder bumps 15 of the electronic component 14 and are displayed in the same manner as in FIG. The thermosetting adhesive 13 is applied to a position where the electronic component 14 of the circuit board 20 is attached. Similarly to FIG. 1, solder printing is not performed on the land 12 to which the electronic component 14 is attached, and electrical connection with the land 12 is performed by the solder bump 15 of the electronic component 14. A solder 22 is printed on the land 21 in order to mount another electronic component. Further, four lands 21 and solders 22 are shown in FIG.

図２（ｂ）に、本発明の実施の形態２の熱圧着中の回路基板とはんだバンプを取り付けた電子部品の断面図を示す。図２（ｂ）の熱圧着ヘッド１６は、図１（ｂ）と同様に、電子部品１４を加熱しながら押し付けて、回路基板２０と熱圧着する工程に用いるものである。   FIG. 2B shows a cross-sectional view of an electronic component to which a circuit board and solder bumps are attached during thermocompression bonding according to Embodiment 2 of the present invention. The thermocompression bonding head 16 shown in FIG. 2B is used in a process of pressing the electronic component 14 while heating and thermocompression bonding with the circuit board 20 as in FIG. 1B.

図２（ｂ）において、図１（ｂ）と同様に電子部品１４は、熱硬化性接着剤１３を塗布した回路基板２０上の取り付け位置にマウントされる。次に、熱圧着ヘッド１６によって電子部品１４と回路基板２０との熱圧着を行う。この熱圧着による加熱は、電子部品１４の実装位置に隣接する他の電子部品を実装するために印刷されたはんだ２２が、熱により悪影響、例えばはんだ２２が溶けてしまう等を受けないレベルに留める。熱圧着を行うことによって、電子部品１４のはんだバンプ１５と回路基板２０のランド１２は、圧着による接触と加熱による少なくとも部分的なはんだ接合による電気的な接合が行われる。また同時に、熱圧着による加熱によって、熱硬化性接着剤１３は初期のまま硬化が進んでいない状態若しくは硬化が進んだ状態の双方を含む半硬化の状態に達する。熱圧着の工程の後、他の電子部品を実装する回路基板２０上の取り付ける位置にマウントし、回路基板２０と電子部品１４と他の電子部品はリフローにより加熱が行われる。   2B, the electronic component 14 is mounted at an attachment position on the circuit board 20 to which the thermosetting adhesive 13 is applied, as in FIG. 1B. Next, the thermocompression bonding head 16 performs thermocompression bonding between the electronic component 14 and the circuit board 20. The heating by the thermocompression bonding is kept at a level at which the solder 22 printed for mounting another electronic component adjacent to the mounting position of the electronic component 14 is not affected by heat, for example, the solder 22 is melted. . By performing thermocompression bonding, the solder bumps 15 of the electronic component 14 and the lands 12 of the circuit board 20 are contacted by crimping and electrically joined by at least partial soldering by heating. At the same time, the thermosetting adhesive 13 reaches a semi-cured state including both a state where the curing is not progressing in an initial state or a state where the curing is proceeded by heating by thermocompression bonding. After the thermocompression bonding process, the electronic circuit board 20 is mounted at a mounting position on the circuit board 20 on which another electronic component is mounted, and the circuit board 20, the electronic component 14, and the other electronic component are heated by reflow.

図２（ｃ）に本発明の実施の形態２の熱圧着とリフローを行った後の回路基板とはんだバンプを取り付けた電子部品と他の電子部品の断面図を示す。図２（ｃ）において、図２（ｂ）の熱圧着の後に行ったリフローによる加熱によって、熱硬化性接着剤１３は硬化状態に達する。同時に、回路基板２０のランド１２と電子部品１４のはんだバンプ１５は、図２（ｂ）の熱圧着による接触と部分的なはんだ接合の状態から、リフローによる加熱によってはんだ接合がなされて電気的に接合した状態となる。また、他の電子部品２４、特に電子部品１４と隣接する他の電子部品２３とランド２１も同様に熱圧着によってはんだは悪影響を受けていないので、リフローによる加熱によって正常にはんだ接合がなされ、電気的に接合した状態となる。   FIG. 2C shows a cross-sectional view of the circuit board and the electronic component to which the solder bump is attached after the thermocompression bonding and reflow according to the second embodiment of the present invention, and other electronic components. In FIG.2 (c), the thermosetting adhesive 13 reaches a hardening state by the heating by the reflow performed after the thermocompression bonding of FIG.2 (b). At the same time, the lands 12 of the circuit board 20 and the solder bumps 15 of the electronic component 14 are electrically joined by soldering by reflow heating from the contact state and the partial solder joint state shown in FIG. Joined state. Similarly, the other electronic components 24, particularly the other electronic components 23 adjacent to the electronic component 14 and the land 21 are not adversely affected by the soldering by thermocompression bonding. Will be joined together.

本発明の実施の形態２の熱硬化性接着剤による電子部品の実装方法によれば、熱硬化性接着剤は熱圧着とリフローによる２度の加熱によって確実に硬化状態に達し、アンダーフィルとして回路基板と電子部品との機械的強度を保つことができる。また、電子部品のはんだバンプと回路基板のランドとの接合についても、圧着による接触と熱圧着とリフローによる２度の加熱によるはんだ接合によって、電気的に確実に接続することができる。さらに、２度の加熱に分けて熱硬化性接着剤の硬化を行うことで熱圧着時の回路基板に伝わる熱を抑えることが可能となり、熱圧着を行う熱硬化性接着剤を用いる電子部品に隣接する位置に、他の電子部品も実装することができる。   According to the method for mounting an electronic component using the thermosetting adhesive according to the second embodiment of the present invention, the thermosetting adhesive surely reaches a cured state by heating twice by thermocompression bonding and reflow, and the circuit is used as an underfill. The mechanical strength between the substrate and the electronic component can be maintained. In addition, the solder bumps of the electronic components and the lands of the circuit board can be electrically and reliably connected by contact by pressure bonding and solder bonding by heating twice by thermocompression bonding and reflow. Furthermore, it is possible to suppress the heat transmitted to the circuit board at the time of thermocompression bonding by curing the thermosetting adhesive in two heating steps, and to an electronic component using a thermosetting adhesive that performs thermocompression bonding. Other electronic components can also be mounted at adjacent positions.

本発明の熱硬化性接着剤による電子部品の実装方法によれば、熱圧着とリフローの複数の方法を組み合わせ有効に活用することによって、小型狭ピッチ部品による高密度で且つ機械的強度を保つ実装を行うことが可能であり、携帯電話のような小型で且つ機械的強度が要求される小型電子機器における実装において有用である。   According to the mounting method of the electronic component by the thermosetting adhesive of the present invention, by using a combination of a plurality of methods of thermocompression bonding and reflow, it is possible to mount with high density and mechanical strength by a small narrow pitch component. And is useful in mounting in a small electronic device that is small and requires mechanical strength, such as a cellular phone.

本発明の実施の形態１の回路基板にはんだバンプを取り付けた電子部品を実装する工程の断面図Sectional drawing of the process of mounting the electronic component which attached the solder bump to the circuit board of Embodiment 1 of this invention 本発明の実施の形態２の回路基板にはんだバンプを取り付けた電子部品を実装する工程の断面図Sectional drawing of the process of mounting the electronic component which attached the solder bump to the circuit board of Embodiment 2 of this invention

符号の説明Explanation of symbols

１１ 回路基板
１２ ランド
１３ 熱硬化性接着剤
１４ 電子部品
１５ はんだバンプ
１６ 熱圧着ヘッド
２０ 回路基板
２１ ランド
２２ はんだ
２３、２４ 電子部品

DESCRIPTION OF SYMBOLS 11 Circuit board 12 Land 13 Thermosetting adhesive 14 Electronic component 15 Solder bump 16 Thermocompression-bonding head 20 Circuit board 21 Land 22 Solder 23, 24 Electronic component

Claims (11)

回路基板に熱硬化性接着剤を塗布し、前記接着剤を塗布した位置にはんだバンプを含む電子部品をマウントし、前記回路基板と前記電子部品を熱圧着し、前記熱圧着によって前記電子部品と前記回路基板を接触させ、同時に前記接着剤を少なくとも部分的に硬化させ、その後リフローにより前記電子部品と前記回路基板を電気的接合させ、同時に前記接着剤を硬化させる電子部品の実装方法。 A thermosetting adhesive is applied to a circuit board, an electronic component including a solder bump is mounted at a position where the adhesive is applied, the circuit board and the electronic component are thermocompression bonded, and the electronic component is bonded to the circuit board by the thermocompression bonding. A method of mounting an electronic component, wherein the circuit board is brought into contact, the adhesive is at least partially cured at the same time, and then the electronic component and the circuit board are electrically joined by reflow, and the adhesive is cured at the same time. 回路基板に熱硬化性接着剤を塗布し、前記接着剤を塗布した位置にはんだバンプを含む電子部品をマウントし、前記回路基板と前記電子部品を熱圧着し、前記熱圧着によって前記電子部品と前記回路基板を接触に加えて少なくとも部分的に電気的接合させ、同時に前記接着剤を少なくとも部分的には硬化させ、その後リフローにより前記電子部品と前記回路基板を電気的接合させ、同時に前記接着剤を硬化させる電子部品の実装方法。 A thermosetting adhesive is applied to a circuit board, an electronic component including a solder bump is mounted at a position where the adhesive is applied, the circuit board and the electronic component are thermocompression bonded, and the electronic component is bonded to the circuit board by the thermocompression bonding. In addition to contacting, the circuit board is at least partially electrically bonded, and at the same time, the adhesive is at least partially cured, and then the electronic component and the circuit board are electrically bonded by reflow, and the adhesive is simultaneously bonded. Mounting method of electronic parts to cure 回路基板に熱硬化性接着剤を塗布し、前記接着剤を塗布した位置にはんだバンプを含む電子部品をマウントし、前記はんだバンプを含む電子部品とは別の他の電子部品を取り付ける位置にはんだを塗布し、前記回路基板と前記はんだバンプを含む電子部品を熱圧着し、前記熱圧着によって前記はんだバンプを含む電子部品と前記回路基板を接触させ、同時に前記接着剤を少なくとも部分的には硬化させ、前記はんだを塗布した位置に前記他の電子部品をマウントし、その後リフローにより前記回路基板と前記はんだバンプを含む電子部品及び前記他の電子部品を電気的接合させ、同時に前記接着剤を硬化させる電子部品の実装方法。 A thermosetting adhesive is applied to the circuit board, an electronic component including a solder bump is mounted at a position where the adhesive is applied, and a solder is mounted at a position where another electronic component different from the electronic component including the solder bump is attached. The electronic component including the circuit board and the solder bump is thermocompression-bonded, and the electronic component including the solder bump and the circuit board are contacted by the thermocompression, and at the same time, the adhesive is at least partially cured. And mounting the other electronic component at the position where the solder is applied, and then electrically bonding the circuit board, the electronic component including the solder bump and the other electronic component by reflow, and simultaneously curing the adhesive. How to mount electronic components. 回路基板に熱硬化性接着剤を塗布し、前記接着剤を塗布した位置にはんだバンプを含む電子部品をマウントし、前記はんだバンプを含む電子部品とは別の他の電子部品を取り付ける所定の位置にはんだを塗布し、前記回路基板と前記はんだバンプを含む電子部品を熱圧着し、前記熱圧着によって前記はんだバンプを含む電子部品と前記回路基板を接触に加えて少なくとも部分的に電気的接合させ、同時に前記接着剤を少なくとも部分的には硬化させ、前記はんだを塗布した位置に前記他の電子部品をマウントし、その後リフローにより前記回路基板と前記はんだバンプを含む電子部品及び前記他の電子部品を電気的接合させ、同時に前記接着剤を硬化させる電子部品の実装方法。 A predetermined position where a thermosetting adhesive is applied to a circuit board, an electronic component including a solder bump is mounted at a position where the adhesive is applied, and another electronic component different from the electronic component including the solder bump is mounted The electronic component including the solder bump is applied to the circuit board and the electronic component including the solder bump by thermocompression bonding, and the electronic component including the solder bump and the circuit board are at least partially electrically bonded by the thermocompression bonding. At the same time, the adhesive is at least partially cured, the other electronic component is mounted at the position where the solder is applied, and then the electronic component including the circuit board and the solder bump and the other electronic component by reflow A method of mounting an electronic component in which the adhesive is cured at the same time. 回路基板に熱硬化性接着剤を塗布し、前記接着剤を塗布した位置にはんだバンプを含む電子部品をマウントし、前記回路基板と前記電子部品を熱圧着し、前記熱圧着によって前記電子部品と前記回路基板を接触させ、同時に前記接着剤を少なくとも部分的に硬化させ、その後リフローにより前記接着剤を硬化させ前記電子部品と前記回路基板の接触を補強する電子部品の実装方法。 A thermosetting adhesive is applied to a circuit board, an electronic component including a solder bump is mounted at a position where the adhesive is applied, the circuit board and the electronic component are thermocompression bonded, and the electronic component is bonded to the circuit board by the thermocompression bonding. A method of mounting an electronic component, wherein the circuit board is brought into contact with the adhesive and the adhesive is cured at least partially, and then the adhesive is cured by reflow to reinforce contact between the electronic component and the circuit board. 回路基板に熱硬化性接着剤を塗布し、前記接着剤を塗布した位置にはんだバンプを含む電子部品をマウントし、前記回路基板と前記電子部品を熱圧着し、前記熱圧着によって前記電子部品と前記回路基板を接触させ、同時に前記接着剤を少なくとも部分的に硬化させ、その後リフローにより前記電子部品と前記回路基板を電気的接合させ、同時に前記接着剤を硬化させた電子部品を実装した回路基板。 A thermosetting adhesive is applied to a circuit board, an electronic component including a solder bump is mounted at a position where the adhesive is applied, the circuit board and the electronic component are thermocompression bonded, and the electronic component is bonded to the circuit board by the thermocompression bonding. A circuit board on which the circuit board is brought into contact, and at the same time, the adhesive is at least partially cured, and then the electronic component and the circuit board are electrically joined by reflow, and at the same time, the electronic component on which the adhesive is cured is mounted. . 回路基板に熱硬化性接着剤を塗布し、前記接着剤を塗布した位置にはんだバンプを含む電子部品をマウントし、前記回路基板と前記電子部品を熱圧着し、前記熱圧着によって前記電子部品と前記回路基板を接触に加えて少なくとも部分的に電気的接合させ、同時に前記接着剤を少なくとも部分的には硬化させ、その後リフローにより前記電子部品と前記回路基板を電気的接合させ、同時に前記接着剤を硬化させた電子部品を実装した回路基板。 A thermosetting adhesive is applied to a circuit board, an electronic component including a solder bump is mounted at a position where the adhesive is applied, the circuit board and the electronic component are thermocompression bonded, and the electronic component is bonded to the circuit board by the thermocompression bonding. In addition to contacting, the circuit board is at least partially electrically bonded, and at the same time, the adhesive is at least partially cured, and then the electronic component and the circuit board are electrically bonded by reflow, and the adhesive is simultaneously bonded. Circuit board on which hardened electronic components are mounted. 回路基板に熱硬化性接着剤を塗布し、前記接着剤を塗布した位置にはんだバンプを含む電子部品をマウントし、前記はんだバンプを含む電子部品とは別の他の電子部品を取り付ける位置にはんだを塗布し、前記回路基板と前記はんだバンプを含む電子部品を熱圧着し、熱圧着によって前記はんだバンプを含む電子部品と前記回路基板を接触させ、同時に前記接着剤を少なくとも部分的には硬化状態とし、前記はんだを塗布した位置に前記他の電子部品をマウントし、その後リフローにより前記回路基板と前記はんだバンプを含む電子部品及び前記他の電子部品を電気的接合させ、同時に前記接着剤を硬化させた電子部品を実装した回路基板。 A thermosetting adhesive is applied to the circuit board, an electronic component including a solder bump is mounted at a position where the adhesive is applied, and a solder is mounted at a position where another electronic component different from the electronic component including the solder bump is attached. The circuit board and the electronic component including the solder bump are thermocompression-bonded, the electronic component including the solder bump and the circuit board are brought into contact by thermocompression, and at the same time, the adhesive is at least partially cured. And mounting the other electronic component at the position where the solder is applied, and then electrically bonding the circuit board and the electronic component including the solder bump and the other electronic component by reflow, and simultaneously curing the adhesive. A circuit board on which electronic components are mounted. 回路基板に熱硬化性接着剤を塗布し、前記接着剤を塗布した位置にはんだバンプを含む電子部品をマウントし、前記はんだバンプを含む電子部品とは別の他の電子部品を取り付ける位置にはんだを塗布し、前記回路基板と前記はんだバンプを含む電子部品を熱圧着し、前記熱圧着によって前記はんだバンプを含む電子部品と前記回路基板を接触に加えて少なくとも部分的に電気的接合させ、同時に前記接着剤を少なくとも部分的には硬化状態とし、前記はんだを塗布した位置に前記他の電子部品をマウントし、その後リフローにより前記回路基板と前記はんだバンプを含む電子部品及び前記他の電子部品を電気的接合させ、同時に前記接着剤を硬化させた電子部品を実装した回路基板。 A thermosetting adhesive is applied to the circuit board, an electronic component including a solder bump is mounted at a position where the adhesive is applied, and a solder is mounted at a position where another electronic component different from the electronic component including the solder bump is attached. The electronic component including the circuit board and the solder bump is thermocompression bonded, and the electronic component including the solder bump and the circuit board are at least partially electrically joined in addition to the contact by the thermocompression, The adhesive is at least partially cured, the other electronic component is mounted at a position where the solder is applied, and then the electronic component including the circuit board and the solder bump and the other electronic component are reflowed. A circuit board on which an electronic component that is electrically bonded and simultaneously hardened with the adhesive is mounted. 回路基板に熱硬化性接着剤を塗布し、前記接着剤を塗布した位置にはんだバンプを含む電子部品をマウントし、前記回路基板と前記電子部品を熱圧着し、前記熱圧着によって前記電子部品と前記回路基板を接触させ、同時に前記接着剤を少なくとも部分的に硬化させ、その後リフローにより前記接着剤を硬化させ前記電子部品と前記回路基板の接触を補強した電子部品を実装した回路基板。 A thermosetting adhesive is applied to a circuit board, an electronic component including a solder bump is mounted at a position where the adhesive is applied, the circuit board and the electronic component are thermocompression bonded, and the electronic component is bonded to the circuit board by the thermocompression bonding. A circuit board on which an electronic component in which the circuit board is brought into contact and at the same time the adhesive is at least partially cured and then the adhesive is cured by reflow to reinforce the contact between the electronic component and the circuit board is mounted. 請求項６から１０いずれかに記載の電子部品を実装した回路基板を搭載した電子機器。

The electronic device carrying the circuit board which mounted the electronic component in any one of Claim 6 to 10.

JP2005070680A 2005-03-14 2005-03-14 Method for mounting electronic component, circuit board having electronic component mounted thereon, and electronic equipment having circuit board mounted thereon Pending JP2008135410A (en)

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WO2011089862A1 (en) * 2010-01-22 2011-07-28 ソニーケミカル＆インフォメーションデバイス株式会社 Mounted body production method and mounting device
US10910339B2 (en) 2018-08-20 2021-02-02 Samsung Electronics Co., Ltd. Flip chip bonding method
KR20210014200A (en) * 2018-06-22 2021-02-08 인듐 코포레이션 Prevents failure of post reflow interconnects in VIPPO solder joints through the use of adhesive materials
CN113056113A (en) * 2020-07-31 2021-06-29 广州立景创新科技有限公司 Method for manufacturing electronic component module

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JP2016162985A (en) * 2015-03-05 2016-09-05 ルネサスエレクトロニクス株式会社 Semiconductor device manufacturing method

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JP2836604B2 (en) * 1996-10-17 1998-12-14 日本電気株式会社 Thermocompression bonding apparatus and method
JP2005026577A (en) * 2003-07-04 2005-01-27 Matsushita Electric Ind Co Ltd Mounting method of electronic component
JP2005038913A (en) * 2003-07-16 2005-02-10 Matsushita Electric Ind Co Ltd Packaging method of electronic component

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WO2011089862A1 (en) * 2010-01-22 2011-07-28 ソニーケミカル＆インフォメーションデバイス株式会社 Mounted body production method and mounting device
KR20210014200A (en) * 2018-06-22 2021-02-08 인듐 코포레이션 Prevents failure of post reflow interconnects in VIPPO solder joints through the use of adhesive materials
KR102329367B1 (en) * 2018-06-22 2021-11-22 인듐 코포레이션 Prevention of Post Reflow Interconnect Failure of VIPPO Solder Joints by Utilization of Adhesive Materials
US10910339B2 (en) 2018-08-20 2021-02-02 Samsung Electronics Co., Ltd. Flip chip bonding method
CN113056113A (en) * 2020-07-31 2021-06-29 广州立景创新科技有限公司 Method for manufacturing electronic component module

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