JPH111082A - Ic card and manufacture of ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card of superior surface smoothness and flat and beautiful appearance, and also a manufacturing method thereof. SOLUTION: An IC card is of a three-layer laminate structure formed of an upper sheet 1, a core sheet 2 and a bottom sheet 3. The core sheet 2 is laminated on the bottom sheet 3, and the upper sheet 1 is laminated on the core sheet 2. A recessed section 4 is formed on the core sheet 2, and an IC module 5 is embedded on the recessed section 4. Fillers 6, 7 and 8 are filled respectively between the bottom sheet 3 and the core sheet 2 and also between the core sheet 2 and the upper sheet 1 and also between the IC module 5 and the recessed section 4, and the fillers 6, 7 and 8 are cured at the temperature of 60 deg.C or above to fix the bottom sheet 3 with the core sheet 2 and also the core sheet 2 with the upper sheet 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC card and a method for manufacturing an IC card.

[0002]

2. Description of the Related Art Conventionally, magnetic storage media such as floppy disks, cassette tapes, and the like have been widely used as external storage devices of electronic devices utilizing computers and computers. However, in recent years, a card-shaped or package-shaped storage medium provided with a semiconductor memory such as a RAM or a ROM has been used in order to reduce the size and ease of handling.

On the other hand, in a card-shaped storage medium such as a credit card, an ID card, and a cash card, an IC module including a semiconductor memory such as a microprocessor, a RAM, and a ROM is mounted on a card material instead of a magnetic card. IC cards are being developed. This type of IC card is classified into a contact type and a non-contact type, but in any case, it is excellent in that the information storage amount is very large and security is provided.

[0004] Among IC cards, a non-contact type IC card is physically contacted by being inserted into a machine such as a reading device or a writing device and exchanging radio waves in the medium and microwave bands. Data can be read and written without any data. Such a non-contact IC card is an IC card.
The module has a structure mounted in the card.
Since the IC module includes an IC chip, a battery, a memory, an antenna, and the like, it has a complicated shape.

[0005] As a method of manufacturing the above-mentioned non-contact type IC card, a heat lamination method and an injection molding method have been conventionally proposed. In the thermal lamination method, a hole for mounting an IC module on a resin sheet is punched out,
In this method, after mounting the IC module in the hole, the resin sheets are overlapped on the upper and lower sides of the resin sheet and heated and compressed to be integrated. On the other hand, the injection molding method is a method in which an IC module is fixed in a mold, the mold is closed, and then resin is injected into the mold cavity.

[0006]

However, in the heat laminating method, when heat compression is performed, the molding is performed due to the difference in the heat shrinkage ratio between the resin sheet and the metal such as the antenna and coil constituting the IC module. I on the surface of the card
Traces of the C module appear as irregularities. In addition, the card is bent by heating. There is also a problem that the label sheet on the card surface is deteriorated by heat.

Further, in the injection molding method, there is a possibility that the IC module fixed in the mold may be damaged by the pressure at the time of injecting the resin. In the case of performing injection compression, since the mold cavity is compressed, the compression may damage the IC module. In addition, cards manufactured by injection molding have problems that the card thickness is not uniform or the card is curved. Further, as in the case of the thermal lamination method, irregularities appear on the surface of the molded card due to the difference in the thermal shrinkage between the metal and the resin sheet.

The present invention has been made in consideration of the above circumstances, and has as its object to provide a flat and beautiful IC card having excellent surface smoothness and a method of manufacturing the same.

[0009]

In order to solve the above problems, an IC card according to the present invention comprises a bottom sheet, a core sheet overlaid on one surface of the bottom sheet and having a recess, An IC card including an IC module embedded in the concave portion, wherein the IC card has a laminated structure of an upper sheet stacked on a surface opposite to the surface of the bottom sheet and the surface stacked on the bottom sheet. A filler is filled between the core sheet and the core sheet and the upper sheet. In this configuration, since the filler is filled between the bottom sheet and the core sheet and between the core sheet and the upper sheet, irregularities generated on the card surface can be reduced. In addition, since the thickness of the card can be easily controlled by pressing the card from above and below, the thickness of the card to be manufactured can be made uniform.

[0010] The invention described in claim 2 is the same as the claim 1.
Wherein the curing shrinkage of the filler is 8% or less. In this configuration, the difference in shrinkage between the filler filled between the bottom sheet and the core sheet and between the core sheet and the top sheet, and the metal such as antennas and coils that make up the IC module , The unevenness generated on the card surface can be further reduced.

[0011] The invention according to claim 3 is based on claim 1.
Alternatively, in the IC card according to the second aspect, the above-mentioned filler cured at a temperature of 60 ° C. or less is filled. In this configuration, since the filler is not cured at a high temperature, deterioration of the upper sheet forming the card surface due to heat, twisting and bending of the card can be prevented. Also, since there is no need to heat the sheet at a high temperature during the manufacturing process, PVC (polyvinyl chloride), PET,
(Polyethylene terephthalate), ABS (acrylonitrile-butadiene-styrene copolymer), PC (polycarbonate), and sheets made of many materials such as paper can constitute a card.

The invention described in claim 4 is the first invention.
4. The IC card according to claim 3, wherein the filler is an ultraviolet curing anaerobic adhesive. With this configuration, the card can be manufactured by irradiating ultraviolet rays with a mercury lamp or the like to cure the filler in a short time.

The invention described in claim 5 is the first invention.
4. The IC card according to claim 3, wherein the filler is an epoxy resin.

[0014] The invention according to claim 6 is the first invention.
6. The method for manufacturing an IC card according to claim 5, wherein the filler is applied on one surface of the bottom sheet, and the one surface of the core portion sheet having the recess is provided. And mounting the IC module in the recess, applying the filler on the other surface of the core sheet, and bonding one surface of the upper sheet thereon to form an IC. It is characterized by molding a card. According to this method, breakage of the IC module during manufacturing can be reduced.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. (1) Configuration of IC Card First, FIG. 1 shows a configuration of an IC card according to an embodiment of the present invention. As shown in FIG. 1, the IC card has a three-layer structure of an upper sheet 1, a core sheet 2, and a bottom sheet 3. The core sheet 2 is overlaid on the bottom sheet 3, and the upper sheet 1 is overlaid on the core sheet 2.

The upper sheet 1, the core sheet 2 and the bottom sheet 3 are made of PVC (polyvinyl chloride),
PET (polyethylene terephthalate), ABS (acrylonitrile-butadiene-styrene copolymer), PC
Many materials such as (polycarbonate) and paper can be used.

Here, necessary printing is performed on the upper surface of the upper sheet 1 by an offset printing method or the like. The core sheet 2 is thicker than the upper sheet 1 and the bottom sheet 3. The core sheet 2 has a recess 4 formed therein.
Is buried. The IC module 5 includes an IC chip,
It is composed of a battery, a memory, an antenna and the like.

Spacers 6, 7 are filled between the bottom sheet 3 and the core sheet 2 and between the core sheet 2 and the upper sheet 1, respectively. And the filler 6,
The bottom sheet 3 and the core sheet 2 and the core sheet 2 and the upper sheet 1 are fixed by curing the base sheet 7. Further, between the IC module 5 and the concave portion 4,
The IC module 5 is embedded in the core part sheet 2 by being filled with the filling material 8 and being cured. Fillers 6, 7, and 8 may have a small curing shrinkage (8%
The following) should be used.

(2) Method for Manufacturing IC Card Next, a method for manufacturing the above-described IC card will be described.
As shown in FIG. 2, the filler 6 is uniformly applied to the upper surface of the bottom sheet 3. Then, as shown in FIG. 3, the core sheet 2 in which the recess 4 is formed by punching is bonded onto the applied filler 6. After that, the IC module 5
Is embedded in the recess 4, and a space agent 8 is filled between the IC module 5 and the recess 4. Then, as shown in FIG. 1, a filler 7 is uniformly applied to the upper surface of the core part sheet 2 and the upper part of the IC module 5, and then the upper sheet 1 is bonded.

Thereafter, the fillers 6, 7, and 8 are cured at a room temperature of 60 ° C. or less. Then, after printing is performed on the upper surface of the upper sheet 1 by an offset printing method or the like, the card is punched into a card shape by a card punching machine. Thus, an IC card is manufactured.

(3) Effect In the structure of the IC card, the space between the bottom sheet 3 and the core sheet 2, the space between the core sheet 2 and the upper sheet 1, and the space between the IC module 5 and the recess 4 are provided. Agents 6, 7, 8
Are filled, the metal such as the antenna and the coil constituting the IC module 5 and the upper sheet 1,
Irregularities on the card surface due to the difference in the heat shrinkage between the core sheet 2 and the bottom sheet 3 can be reduced. In addition, since the thickness of the card can be easily controlled by pressing the card from above and below, the thickness of the card to be manufactured can be made uniform.

Further, since the curing shrinkage of the fillers 6, 7, 8 is small, the heat of the upper sheet 1, the core sheet 2 and the bottom sheet 3 and the metal such as the antenna and the coil constituting the IC module 5 are not increased. Irregularities on the card surface due to differences in shrinkage can be further reduced. In addition, the fillers 6, 7, 8 are 60
Since the curing is performed at room temperature or lower, the produced card does not bend, and the upper sheet 1 serving as a label on the surface of the card does not deteriorate.

Further, since the upper sheet 1, the core sheet 2 and the bottom sheet 3 have a laminated structure fixed by the fillers 6, 7, the airtightness is higher than that of the conventional card, and the mechanical properties are higher. Excellent strength and durability.

Further, according to the above-described manufacturing method, since excessive force is not applied to the IC module 5, there is little possibility that the IC module 5 is damaged, and the yield is much better than that of injection molding. . In addition, the fillers 6, 7, 8
Cured at room temperature of 0 ° C or less, PVC, PE
An IC card can be manufactured using many materials such as T, ABS, PC, and paper as a sheet material.

When PVC is used as the sheet material, the above-mentioned IC card can be produced at low cost. Further, PVC is excellent in terms of decoration, and can easily perform embossing on a card surface, pasting of a magnetic stripe, transfer by a card printer, pasting of a hologram, and the like.

[0026]

Next, an example of an actual trial production will be described. (1) Example 1 In Example 1, a white rigid vinyl chloride sheet having a thickness of 100 μm was used as the bottom sheet 3, and 1 to 5 μm on the upper surface thereof.
A thick epoxy resin (viscosity 10000 cP (25 ° C.), cure shrinkage 4%) was uniformly applied as a filler 6. Then, a white rigid vinyl chloride sheet having a thickness of 540 μm and having a concave portion 4 having a diameter of 16 mm was formed as a core sheet 2 by a punching machine. Thereafter, a non-contact type IC module having a diameter of 15 mm (IC chip area 1 mm ² , coil 50
Turn winding) is embedded in the recess 4 as the IC module 5,
The concave portion 4 was filled with an epoxy resin as a filler 8. Then, an epoxy resin was uniformly applied as a filler 7 on the upper surface of the core sheet 2 and the upper part of the IC module 5, and a white hard vinyl chloride sheet was adhered thereon as the upper sheet 1.

In this state, pressure (30 kgf / c
m ² ), sandwich the plate with a stainless steel plate, and
The epoxy resin was cured by heating for more than an hour. Thereafter, post printing was performed on the entire surface of the card with a thickness of 0.5 μm by an offset method. Then, it was punched into a card shape by a card punching machine to produce an IC card. In this manner, a high-quality IC card having a good appearance was produced without the traces of the IC module appearing as irregularities on the card surface.

(2) Example 2 In Example 2, the bottom sheet 3 was 100 μm thick.
Was used, and a UV curable anaerobic adhesive (viscosity 5000 cP, cure shrinkage 7%) having a thickness of 1 to 5 μm was uniformly applied as a filling material 6 on the upper surface thereof. Then, a white rigid vinyl chloride sheet having a thickness of 540 μm and having a concave portion 4 having a diameter of 16 mm was formed as a core sheet 2 by a punching machine. Thereafter, a non-contact type IC module having a diameter of 15 mm (IC chip area 1 mm ² , winding of a coil 50 turns) is embedded in the recess 4 as an IC module 5, and an ultraviolet curing anaerobic adhesive is used as a filling material 8 in the recess 4. Was filled. Then, an ultraviolet curable anaerobic adhesive was uniformly applied as a filler 7 on the upper surface of the core sheet 2 and the upper part of the IC module 5, and a transparent polyethylene terephthalate sheet was adhered thereon as the upper sheet 1.

In this state, the pressure (30 kgf / c
After adding m ² ), ultraviolet rays were irradiated for 10 seconds with a mercury lamp to cure the ultraviolet-curable anaerobic adhesive. Thereafter, a vinyl chloride / vinyl acetate copolymer resin of 1 to 3 μm was applied as an image receiving layer on the card surface, and post-printing was performed on the entire surface of the card with a thickness of 0.5 μm by an offset method. Then, it was punched into a card shape by a card punching machine to produce an IC card. In this manner, a high-quality IC card having a good external appearance was produced without leaving any traces of the IC module as irregularities on the card surface.

[0030]

As described above, according to the present invention,
It is possible to provide a flat and beautiful IC card which has little unevenness on the card surface, has excellent flatness and smoothness.

[Brief description of the drawings]

FIG. 1 is a side sectional view of an IC card according to an embodiment of the present invention.

FIG. 2 is a side sectional view showing a process of manufacturing the IC card and showing a state in which a filler is applied on a bottom sheet.

FIG. 3 is a side sectional view showing a process of manufacturing the IC card, and showing a state in which a core sheet on which an IC module is mounted is attached to the state of FIG. 2;

[Explanation of symbols]

1 top sheet, 2 core sheet, 3 bottom sheet
4 recess, 5 IC module, 6 filler, 7 filler, 8 filler

Claims (6)

[Claims] 1. A bottom sheet, a core sheet overlaid on one surface of the bottom sheet and having a concave portion, and a core sheet overlaid on a surface of the core sheet opposite to the surface overlaid on the bottom sheet. An IC card having an IC module buried in the concave portion, wherein the IC card has a laminated structure with an upper sheet formed between the bottom sheet and the core sheet and between the core sheet and the upper sheet. An IC card characterized by being filled with a filler. 2. The IC card according to claim 1, wherein the curing shrinkage of the filler is 8% or less. 3. The IC card according to claim 1, wherein the filler is filled with the filler cured at a temperature of 60 ° C. or lower. 4. The IC card according to claim 1, wherein the filler is an ultraviolet-curable anaerobic adhesive. 5. The IC card according to claim 1, wherein the filler is an epoxy resin. 6. The method for manufacturing an IC card according to claim 1, further comprising applying the filler on one surface of the bottom sheet and having the recess. After bonding one surface of the core portion sheet and mounting the IC module in the concave portion, applying the filler on the other surface of the core portion sheet,
A method of manufacturing an IC card, wherein an IC card is formed by laminating one surface of the upper sheet thereon.