JP2002294197A - Adhesive for laminating non-contact ic media - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an adhesive for laminating non-contact IC media which allows no curling of products, shows an excellent heat resistance and adhesion, has an excellent flexibility allowing no peeling off at bending or twisting when used on non-contact IC media and provides highly reliable non-contact IC media. SOLUTION: This adhesive is used for laminating, on a substrate having an IC chip-mounted antenna, other parts of the substrate or other substrates. The adhesive contains an epoxy compound, a hardener and a flexibility- imparting agent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC media bonding adhesive, and more particularly, to a non-contact type data transceiver (non-contact type IC card,
Tag, label, form, postcard, envelope, etc.) and other non-contact IC media.

[0002]

2. Description of the Related Art Conventionally, an information recording medium (RF-ID (Rad-ID) such as a non-contact type IC tag capable of recording and erasing data by transmitting and receiving data in a non-contact state.
ioFrequency IDentificatio
The contactless data transmitter / receiver used for the application n))
An antenna made of a conductive material is arranged on a base material, and an IC chip is mounted on the antenna. In the case of the antenna of this non-contact type data transmitting and receiving body, for example, it is formed by printing with a conductive paste,
For example, a connector provided with a connection terminal that pierces a terminal portion of an antenna located at a chip mounting portion of a base material to conduct electricity is employed.

A process for forming a conventional non-contact type IC medium will be described with reference to FIG. In the step (1), the antenna portion 4 is screen-printed and solidified and dried on a predetermined portion of the substrate 1 such as paper or polyester film using a conductive paste, or a metal is etched.
And a jumper portion 5 is formed. The jumper section 5 is for connecting A ′ and B ′ in a state where A and B of the jumper section 5 are insulated from the antenna section 4 in a later step.
(2) In the step, the insulating layer 6 is formed on the predetermined portion of the jumper portion 5 by printing an insulating ink or the like. In the step (3), after the insulating layer 6 is formed, a connection terminal (not shown) of the IC chip 7 is pierced into the terminal portion of the antenna portion 4 located at the chip mounting portion of the base material 1 to conduct electricity. The IC chip 7 is mounted. In step (4), an adhesive is applied to a predetermined portion of the surface of the substrate 1 by a coating method or the like to form an adhesive layer 3, or a heat-sealing film or a hot-melt adhesive is applied to the next step (5). The upper and lower substrates 1
It is arranged so that it can be sandwiched between. In the step (5), the base material portion on which the jumper portion 5 is formed is folded at the fold line 8 and overlapped, and then thermocompression bonded to bond the upper and lower base materials 1 to form a non-contact IC medium. .

[0004]

Conventionally, a hot-melt type adhesive has been used as an adhesive. However, when a hot-melt type adhesive is used, there is a problem that a product is curled and a thermoplastic resin is used. Therefore, there is a problem that the heat resistance is inferior. For this reason, a moisture-curable hot-melt type adhesive has been proposed. However, since it is a moisture-curable type, it takes a long time to cure, and there is a problem that the adhesive strength is inferior when the line speed is increased. Therefore, an object of the present invention is to solve the conventional problems, to prevent the product from curling, to be excellent in heat resistance and adhesiveness, and to be excellent in flexibility, so that the force such as bending and twisting when using non-contact type IC media is used. Does not peel off when added
An object of the present invention is to provide a non-contact IC media bonding adhesive which can provide a highly reliable non-contact IC media.

[0005]

According to the present invention, there is provided a non-contact type IC media bonding adhesive according to the present invention, which has been made in consideration of the above problems, and has a base material on which an antenna on which an IC chip is mounted is formed. An adhesive used for bonding another portion of the base material or another base material thereon, characterized by including an epoxy compound, a curing agent, and a flexibility-imparting agent.

According to a second aspect of the present invention, there is provided an adhesive according to the first aspect, wherein the flexibility-imparting agent is contained in an amount of 30 to 70% by mass based on the whole adhesive.

According to a third aspect of the present invention, there is provided the adhesive according to the first or second aspect, further comprising a curing accelerator.

According to a fourth aspect of the present invention, there is provided an adhesive according to any one of the first to third aspects, wherein a filler is included.

The non-contact type IC media bonding adhesive of the present invention containing an epoxy compound, a curing agent and a flexibility-imparting agent does not curl the product, is excellent in heat resistance and adhesiveness, and has high flexibility. Because it is excellent, it does not peel off even if force such as bending and twisting is applied when using non-contact type IC media,
A highly reliable non-contact type IC media can be provided.

[0010]

Embodiments of the present invention will be described below in detail. The epoxy compound used in the present invention is not particularly limited as long as it has two or more epoxy groups in one molecule and becomes an epoxy compound which is cured to be a resin, and a known epoxy compound can be used.

Specific examples of the epoxy compound used in the present invention include, for example, bisphenol A type epoxy compound,
Bisphenol F epoxy compound, tetrabromobisphenol A epoxy compound, phenol novolak epoxy compound, cresol novolak epoxy compound, glycidyl ester epoxy compound, alicyclic epoxy compound, hydantoin epoxy compound, etc. Mixtures and the like can be mentioned.

In the present invention, a reactive diluent may be added. As the reactive diluent, an epoxy compound having one or two or more epoxy groups in one molecule and having a relatively low viscosity at room temperature can be preferably used. Depending on the purpose, other than the epoxy group, other polymerizable functional groups may be used. It may have a group, for example, an alkenyl group such as a vinyl group or an allyl group, or an unsaturated carboxylic acid residue such as a (meth) acryloyl group.

As the curing agent used in the present invention, a phenol resin, an acid anhydride, an amine compound or the like can be used. Examples of the phenol resin include, but are not limited to, a phenol novolak resin, a cresol novolak resin, a naphthol-modified phenol resin, a dicyclopentadiene-modified phenol resin, and a para-xylene-modified phenol resin.

The mixing ratio of the epoxy compound and the phenol resin as the curing agent is preferably such that the OH equivalent in the phenol resin is 0.3 to 1.5 equivalents per 1 equivalent of the epoxy group in the epoxy compound, ~ 1.2 equivalents are more preferred.

Examples of the acid anhydride include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhymic anhydride, dodecenylsuccinic anhydride and the like. Is exemplified.

The mixing ratio of the epoxy compound and the acid anhydride is as follows:
The acid anhydride equivalent is preferably 0.6 to 1.0 per equivalent of epoxy group in the epoxy compound.

Examples of the amine compound include, but are not limited to, modified polyamines such as aliphatic polyamines, aromatic amines, polyaminoamides, polyaminoimides, polyaminoesters, and polyaminoureas. Tertiary amine compounds, imidazole compounds, hydrazide compounds, dicyandiamide compounds, and melamine compounds can also be used.

The compounding ratio of the epoxy compound and the amine compound is preferably such that the amine equivalent is 0.6 to 1.0 per equivalent of epoxy group in the epoxy compound.

Specific examples of the flexibility-imparting agent used in the present invention include, for example, polyester-based flexibility-imparting agents, acrylic-based flexibility-imparting agents, urethane-based flexibility-imparting agents, and polyvinyl acetate-based flexibility-imparting agents. Examples include a flexibility imparting agent, a thermoplastic elastomer flexibility imparting agent, a natural rubber flexibility imparting agent, a synthetic rubber flexibility imparting agent, and a mixture of two or more thereof. Any of these can be used, but among them, polyester polyol, polyvinyl alkyl ether and a mixture of two or more thereof are preferably used because of their large effect.

The amount of the flexibility-imparting agent used in the present invention in the adhesive depends on the type of the flexibility-imparting agent, but can improve the adhesive strength and impart flexibility and flexibility. The range is not particularly limited as long as it is within the range, but is preferably set in the range of 30 to 70% by mass based on the entire adhesive.
If the amount is less than 30% by mass, flexibility and flexibility may not be imparted. If the amount exceeds 70% by mass, the adhesive strength may be reduced.

In the present invention, in order to accelerate the curing,
Further, a curing accelerator can be blended. Examples of the curing accelerator include, but are not particularly limited to, for example, imidazole-based, tertiary amine-based, phosphorus compounds, and the like, which can be used as curing accelerators for epoxy compounds. It can be selected and used depending on the curing conditions. These can be used alone or in combination of two or more. The amount of the curing accelerator is preferably set to 0.5 to 2.0% by mass based on the entire adhesive.

In the present invention, further fillers can be blended. Examples of the filler include inorganic fine particles, organic fine particles, and a mixture of both.

Specific examples of the inorganic fine particles include, for example,
With silica fine particles, Mizukasil P-526, P-80
1, P-527, P-603, P832, P-73, P
-78A, P-78F, P-87, P-705, P-7
07, P-707D (manufactured by Mizusawa Chemical), Nipsil
E200, E220, SS-10F, SS-15, SS
-50 (manufactured by Nippon Silica Industry Co., Ltd.), SYLYSIA73
0, 310 (manufactured by Fuji Silysia Chemical Ltd.) such as Brilliant-15, Brill
lient-S15, Unibur-70, PZ, P
X, Tunex E, Vigot-10, Vigoto-
15, Unifant-15FR, Brilliant
-1500, Homocal D, Gerton 50 (manufactured by Shiraishi Industry Co., Ltd.), and the like. Sulfo calcium aluminate fine particles include Satin White SW, SW-B, and SW-BL (manufactured by Shiraishi Industry Co., Ltd.). AL-41
G, AL-41, AL-42, AL-43, AL-4
4, AL-41E, AL-42E, AL-M41, AL
-M42, AL-M43, AL-M44, AL-S4
3, AM-21, AM-22, AM-25, AM-27
(Manufactured by Sumitomo Chemical Co., Ltd.), aluminum oxide C (manufactured by Nippon Aerosil Co., Ltd.), and titanium dioxide fine particles include titanium dioxide T805 and P25 (manufactured by Nippon Aerosil Co., Ltd.).

Specific examples of the organic fine particles include, for example,
Polytetrafluoroethylene resin (Mitsui DuPont Fluorochemicals, Teflon 30J), vinylidene hexafluoride resin (Daikin Neoflon CTFE), ethylene trifluoride chloride resin (Daikin Neoflon VDF), hexafluoropropylene resin (Daikin Neoflon FEP) ),
Examples thereof include a fluorinated ethylene-propylene copolymer resin (Teflon 120J, manufactured by Du Pont-Mitsui Fluorochemicals Co., Ltd.), various types of starch-based fine particles, fine acrylic resin, fine methacrylic resin, and the like. These fine particles may be used alone or in combination of two or more.

The amount of the filler used in the present invention is not particularly limited, but is preferably in the range of 30 to 85% by mass based on the whole adhesive.

In the present invention, if necessary, a solvent, a flame retardant such as a bromine compound or a phosphorus compound, a silicone polymer or an antifoaming agent containing the same, a coloring agent such as carbon black or an organic pigment, a coupling agent, Thickeners, thixotropic agents, suspending agents, antioxidants, dispersants and the like may be added. The amount of these additives is 35% by mass of the entire adhesive.
The following is preferred.

The adhesive of the present invention is produced by, for example, uniformly mixing the above-mentioned components with a stirrer such as a homogenizer and then dispersing the mixture evenly with a kneader such as a three-roll or kneader. It is not limited to this method.

The base material used in the present invention includes woven or nonwoven fabrics of inorganic fibers such as ceramics, glass, glass fibers, alumina fibers and the like, organic fibers such as polyester fibers and polyamide fibers, mats and papers, and thermosetting materials. In addition to composite materials with thermoplastic resins or thermoplastic resins, polyethylene, polypropylene, polyethylene terephthalate, polyimide, acrylonitrile-butadiene-styrene copolymer, polyvinyl chloride, plastics represented by silicone, etc., and polyamide-based Resin base material, ethylene / vinyl alcohol copolymer base material,
Plastic substrates such as polyvinyl alcohol-based resin substrates, polyvinylidene chloride-based resin substrates, polystyrene-based resin substrates, polycarbonate-based resin substrates, and polyethersulfone-based resin substrates, or matte treatment, corona discharge treatment, It can be selected from known ones such as those subjected to a surface treatment such as a plasma treatment, an ultraviolet irradiation treatment, an electron beam irradiation treatment, a flame plasma treatment and an ozone treatment, or various easy adhesion treatments.

The adhesive of the present invention is particularly suitable for substrates such as a polyester film and a polyimide film among these substrates, and can be preferably used.

The adhesive of the present invention can be applied to or applied to an IC chip by a known method such as a dispense method, a screen printing method, a spray method, a die coating method, and an air knife method.

In the present invention, in order to further improve the properties of the adhesive after curing, or to secure the leveling property,
Oven heating, hot air blowing, hot plate contact, as long as the base material does not significantly deteriorate such as coloring, heat shrinkage, softening, carbonization, etc., to maintain or remove the solvent if a solvent is used Heat treatment can be used in combination with irradiation of infrared rays or microwaves.

The IC chip used in the present invention is RF-I
Any known non-contact type IC media such as D can be used, and the pattern of the antenna unit 2 can be arbitrarily designed correspondingly.

In order to securely connect and fix the IC chip and the antenna unit, wire bonding or a known thermosetting adhesive is used. As the thermosetting adhesive, specifically, ACF (Anisotropic Conductive) is used.
fiveFilm (anisotropic conductive film)), ACP
(Anisotropic ConductivePas
te (anisotropic conductive paste)) or an NCF (Non-Conductive).
Film (insulating film)), recently NC
An insulating adhesive substance (adhesive substance containing no conductive substance) such as P (Non-Conductive Paste) or a double-sided tape can be used, and a dispensing method, a printing method, a spraying method, etc. can be used for application. Can be used. Among these, ACP or N
It is preferable to perform the dispensing method or the printing method using CP.

The connection terminals of the IC chip used in the present invention may be formed with bumps by metal electroplating, studs, electroless metal plating, or fixing of conductive resin, if necessary.

When mounting the IC chip, energy such as heat, light, electromagnetic waves such as high frequency waves, or ultrasonic waves may be applied as necessary, depending on the adhesive and the adhesive.

After the mounting of the IC chip, post-curing may be performed to sufficiently fix the IC chip.

The description of the above embodiment is for the purpose of explaining the present invention, and does not limit the invention described in the claims or reduce the scope of the invention. Further, the configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims.

[0038]

The present invention will be described in more detail with reference to the following Examples and Comparative Examples, but the present invention is not limited to these Examples. (Examples 1 to 9) Epoxy adhesive A having the following composition
Alternatively, B and a flexibility imparting agent A (POLYOL030
5, an adhesive of the present invention was prepared by blending a flexibility-imparting agent B (Lutner A-50, manufactured by BASF, polyvinyl ethyl ether) at a ratio shown in Table 1 with a polyester polyol manufactured by Dow Chemical Company.

According to the process shown in FIG. 1, a predetermined portion of the surface of the polyester film substrate 1 is screen-printed using a conductive paste and solidified and dried to form the antenna portion 4 and the jumper portion 5. After the insulating layer 6 is formed by printing insulating ink on the portion, the IC chip 7 is attached to the terminal portion of the antenna portion 4 located at the chip mounting portion of the base 1
The IC chip 7 was mounted by piercing a connection terminal (not shown). Then, after applying the adhesive of the present invention to a predetermined portion of the surface of the base material 1 by a coating method to form an adhesive layer 3, the base material portion on which the jumper portion 5 is formed is folded at the fold line 8 and overlapped. Paste together, 150
Non-contact IC media RF-
ID was manufactured.

Composition of epoxy adhesive A: Epicoat 828 (100 parts by mass of bisphenol type epoxy compound manufactured by Yuka Shell Epoxy Co., Ltd.) Curing agent [phthalic anhydride] 80 parts by mass Filler (silica powder) 200 parts by mass Curing acceleration Agent (2-heptadecylimidazole) 6 parts by mass

Composition of epoxy adhesive B: Epicoat 828 (100 parts by mass of bisphenol type epoxy compound manufactured by Yuka Shell Epoxy Co., Ltd.) Curing agent [Tamanol 758 (Novolac phenolic resin manufactured by Arakawa Chemical Industry Co., Ltd.)] 60 parts by mass [ Phthalic anhydride] 80 parts by mass Filler (silica powder) 250 parts by mass Curing accelerator (2-heptadecyl imidazole) 6 parts by mass

Table 1 shows the results of the curl test, the φ70 bending test, and the heat resistance test performed on the non-contact IC medium RF-ID manufactured as described above.

(Curl test): Non-contact IC media RF
After the ID was allowed to stand on a flat surface at normal temperature and normal pressure for a long time, the presence or absence of curl was observed. ：: no curl, △: curl was observed to some extent, but there was no problem in practical use. X: curl was large and could not be used practically.

(Φ70 bending test): After the non-contact IC medium RF-ID was wound around a round bar having a diameter of 70 mm, it was loosened immediately and observed for peeling. ：: no peeling at all, Δ: partial peeling was observed but no problem in practical use, x: peeling was observed and practically unusable.

(Heat resistance test): Non-contact IC media RF
-Appearance was observed after treating the ID for 500 hours in a 150 ° C. oven, and then a communication test was performed. ：: No problem at all, Δ: Partial peeling was observed but no problem in practical use, ×: Peeling was observed and practically unusable.

Comparative Example 1 A non-contact IC medium RF-ID was manufactured in the same manner as in Examples 1 to 9 except that a hot melt adhesive was used, and a curl test, a φ70 bending test and a heat resistance test were performed. The results are shown in Table 1.

Comparative Example 2 A non-contact IC medium RF-ID was manufactured in the same manner as in Examples 1 to 9 except that only the epoxy adhesive A was used, and a curl test, a φ70 bending test and a heat resistance test were performed. The results are shown in Table 1.

Comparative Example 3 A non-contact IC medium RF-ID was manufactured in the same manner as in Examples 1 to 9 except that only the epoxy adhesive B was used, and a curl test, a φ70 bending test and a heat resistance test were performed. The results are shown in Table 1.

[0049]

[Table 1]

From Table 1, it can be seen that the non-contact IC media RF-ID of Examples 1 to 9 are all excellent in the results of the curl test, φ70 bending test and heat resistance test. On the other hand, the non-contact IC media RF-ID of Comparative Examples 1 to 3
It can be seen that no good results were obtained in the curl test, φ70 bending test and heat resistance test.

Next, another substrate is attached to the substrate on which the antenna portion on which the IC chip is mounted is formed, and the non-contact type
The example which manufactures C media RF-ID is shown. As shown in FIG. 2, an antenna portion 4 having a terminal portion 4 is formed on a predetermined portion of the surface of the base material 1A by screen printing using a conductive paste, and solidified and dried. The IC chip 7 is mounted by piercing a connection terminal (not shown) to conduct electricity, or the IC chip 7 is mounted on the terminal portion 4A using an interposer method, and the inlet sheet 9 is first produced. Then, as shown in FIG. 2, another base material 1B is bonded onto the inlet sheet 9 using the adhesive 3A of the present invention (for example, the adhesive used in the third embodiment), and the temperature of 150 ° C. And heat-curing for 30 minutes to produce a non-contact IC medium RF-ID. This non-contact I
C Media RF-ID was excellent in all of the results of the curl test, φ70 bending test and heat resistance test.

[0052]

According to the first aspect of the present invention, there is provided an adhesive for bonding non-contact type IC media on a substrate on which an antenna having an IC chip mounted thereon is formed. It is an adhesive used for bonding materials, and contains an epoxy compound, a curing agent and a flexibility-imparting agent, so that the product does not curl, and has excellent heat resistance and adhesiveness.
Since it is excellent in flexibility, it does not peel off even when a force such as bending or twisting is applied when using the non-contact type IC media, and it has a remarkable effect that a highly reliable non-contact type IC media can be provided.

The adhesive according to the second aspect of the present invention is the adhesive according to the first aspect, wherein the flexibility-imparting agent is contained in an amount of 30 to 70% by mass based on the entire adhesive. The adhesive has the same effect as the adhesive described, and also has a remarkable effect that the flexibility can be improved without impairing the adhesive strength to the base material.

Since the adhesive according to the third aspect of the present invention contains a curing accelerator, it has the same effect as the adhesive according to the first aspect, and can promote the curing of the adhesive. It has a remarkable effect.

Since the adhesive according to the fourth aspect of the present invention contains a filler, it has the same effect as the adhesive according to the first aspect, as well as improving the hardness and rigidity, increasing the amount, and the like. It has a remarkable effect that it can be performed.

[Brief description of the drawings]

FIGS. 1 (1) to (5) are explanatory views for explaining steps of manufacturing a non-contact type IC medium.

FIG. 2 is a non-contact type IC manufactured by bonding another base material on a base material on which an antenna portion on which an IC chip is mounted is formed.
FIG. 3 is an explanatory sectional view of a medium RF-ID.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 1A, 1B Base material 3 Adhesive layer 3A adhesive 4 Antenna part 4A Terminal part 5 Jumper part 6 Insulating layer 7 IC chip 8 Fold line 9 Inlet sheet

 ──────────────────────────────────────────────────続 き Continued from the front page F term (reference) 2C005 MA19 MB06 NA09 RA22 4J040 CA012 DE002 DF002 EC001 EC041 EC061 EC071 EC091 EC161 ED002 EF002 HA136 HA306 HB05 HB31 HB35 HB47 HC02 HC06 HC15 HC24 KA17 KA42 LA06 LA08 MA04 MA05 A10 MA10 BA05 BB09 CA01 CA02 CA03 CA23

Claims (4)

[Claims] 1. An adhesive used for bonding another part of the base material or another base material on a base material on which an antenna on which an IC chip is mounted is formed, comprising: an epoxy compound; a curing agent; An adhesive for bonding non-contact IC media, comprising a flexibility-imparting agent. 2. The method according to claim 1, wherein the flexibility-imparting agent is contained in the adhesive in an amount of 30%.
The adhesive according to claim 1, wherein the adhesive is contained in an amount of from 70 to 70% by mass. 3. The adhesive according to claim 1, further comprising a curing accelerator. 4. The adhesive according to claim 1, further comprising a filler.