JPH1060232A - Module sealing agent for non-contact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject sealing agent exhibiting cured product characteristics of good bending resistance without breaking electronic parts such as module chips or coils, by providing a module packaging sealing material consisting of a specific cationic polymerization-based epoxy resin. SOLUTION: An IC module and antenna coil are sealed with a one-pack thermosetting cationic polymerization-based epoxy resin or one-pack UV-curable cationic polymerization-based epoxy resin with high flex resistance as a packaging sealing material, thus obtaining a sealed module core. The epoxy resin is pref. a glycidyl ether-type epoxy resin or alicyclic epoxy resin. This epoxy resin can be molded in a short time under low pressures, causing no deformation/breakage of the IC module, and affording a molded product good in surface smoothness.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module sealant used in a packaging process for a non-contact IC card module.

[0002]

2. Description of the Related Art Conventionally, when a non-contact IC card is produced, a method of narrowing a module into a sheet or embedding it in a concave portion without sealing the module is generally used. Epoxy resins, acid anhydride-curable epoxy resins, urethane resins or thermoplastic resins are used.

[0003]

However, if the module is sandwiched between cards without being sealed or embedded in a concave portion, it is difficult to fix the module, the reliability is low, and the smoothness of the appearance is poor. . Next, when the module is sealed with a conventional thermoplastic material, the chip, the coil, and the like are adversely affected by deformation due to high injection pressure. Further, when an attempt is made to seal the module using a thermosetting resin such as an ordinary amine, it is difficult to balance room temperature stability for short-time curing and bending properties required for a card.
An object of the present invention is to solve these problems and to use a one-part liquid sealing agent to prevent breakage of electronic components such as module chips and coils. An object of the present invention is to provide a module sealant for a card.

[0004]

Means for Solving the Problems The present inventors have conducted studies and researches for the preparation of IC cards, and as a result, have found that a one-pack type thermosetting epoxy resin having a high degree of flexibility is used as a sealing material for packages. I found it to be effective. The present invention has been made based on this.

Therefore, according to the present invention, (1) the package sealing material of the module is a one-part thermosetting type or UV.
A non-contact IC card module encapsulant, which is a curable cationic polymerization type epoxy resin. (2) In the above (1), the epoxy resin used for cationic polymerization is a glycidyl ether type epoxy such as bisphenol or novolak. A non-contact IC card module encapsulant characterized by being one of a resin and an alicyclic epoxy resin. (3) In the above (1) or (2), the epoxy resin can be folded, the surface can be smoothed, A non-contact IC card module encapsulant characterized by incorporating a filler such as a thermoplastic resin or a fiber for improving adhesion.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail. FIG. 1A is a diagram showing an appearance of a main part of a module core, wherein 1 is an IC module, 2 is an antenna coil, 3 is a module core, and 3 'is a sealed module core. FIG. 1B shows a state where the one shown in FIG. 1A is sealed with a one-component thermosetting or UV-curing cationic polymerization type epoxy resin.

As a specific example of the one-component thermosetting cationic polymerization type epoxy resin used here, an aromatic ammonium salt having hexafluorophosphate ion and hexafluoroantimonate ion as anions was used as a cationic polymerization catalyst. Epoxy resin compositions and the like can be mentioned. In order to actually obtain the module core 3 'sealed with the epoxy resin shown in FIG. 1B, a one-component cationic polymerization epoxy resin is poured into the IC module 1 and the antenna coil of FIG. 1A. At 100 ° C. or higher for crosslinking. The use of the one-component cationic polymerization type epoxy resin enables low-pressure molding in a short time. in this case,
As a molding method, a molding method such as injection molding or hot pressing is performed. As the module sealant, a one-part UV curable cationic polymerization type epoxy resin (a combination of the above cationic polymerization catalyst having a UV activity and an epoxy resin) may be used for short-time sealing by UV irradiation. Stop molding is possible.

FIG. 2 is for explaining the structure of the non-contact type IC card of the present invention. In this example, a holding sheet 41 having a hole formed so as to accommodate the module core 3 ′ is prepared, the module core 3 ′ is inserted into the hole, and this is sandwiched between resin sheets 51 and 52 from above and below.

As the resin sheet, PVC, PET or the like is used. The sandwiched sheet is fixed with an epoxy adhesive or the like.

[0010]

Next, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples. Parts here are by weight.

Example 1 Bisphenol A type epoxy resin AE as component (a)
R260 (manufactured by Asahi Ciba) 50 parts, (b) aliphatic cyclic epoxy resin ERL4299 as a flexible epoxy resin component
(UCC) 50 parts, LSAC4046 (manufactured by Asahi Ciba) 3 parts as a cationic polymerization initiator of the component (c), 3 parts of vinyl chloride-vinyl acetate copolymer resin as a flexible component,
A filler material and 10 parts of talc were kneaded to prepare a molding material.

Comparative Example 1 A molding material was prepared by kneading 100 parts of a bisphenol A epoxy resin, 150 parts of a polyol adduct of alkenyl anhydride, 5 parts of benzyldimethylamine as a curing accelerator, and 100 parts of talc.

Comparative Example 2 A molding material was prepared by kneading 100 parts of a bisphenol A type epoxy resin with 20 parts of an imidazole compound and 20 parts of talc as a latent curing agent.

These examples and comparative examples were cured as molded products of module cores under predetermined conditions. Table 1 shows the results.

[0015]

Table 1 Example 1 Comparative Example 1 Comparative Example 2成形 Molding conditions 150 ℃ / 1min 150 ℃ / 5min 120 ℃ / 5min Demolding time曲 げ Bending torsion (Note 1 ○ △ × ━━━━━━湿 Moisture resistance (Note 2 ○ ○ ○ 40 ℃ / 90% / 500Hr ━━━━━━ ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Storage stability 25 ℃ / 3month 25 ℃ / 1day 25 ℃ / 3month ━━━━━━ ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ (Note 1 Bending torsion test with a card conforming to JISX6301 and ISO10536 (Note 2 Wetness JISX6301 Test with cards compliant with ISO10536

[0016]

According to the first and second aspects of the present invention, the module encapsulant is one-part, has excellent stability near room temperature, and is rapidly and rapidly cured by heating or UV irradiation. In addition, since it is in a liquid state, low-pressure molding is possible, and a molded product having good surface smoothness without deformation or damage of the IC module can be obtained. In addition, since the epoxy cured product has a high bending property, an IC module core suitable for various bending tests can be provided. According to the third aspect of the present invention, the above effect is further enhanced.

[Brief description of the drawings]

FIG. 1A is a schematic view of a main part of a module core, and FIG. 1B is a view showing a state where the module core is fixed with a sealant.

FIG. 2 is a view showing a state in which a module core is fitted into a holding sheet having an opening, and both sides of the module core are sandwiched between resin sheets to form a card.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 IC module 2 Antenna coil 3 Module core (module core sealed with 3 'epoxy resin) 41 Holding sheet 51, 52 Resin sheet

Claims (3)

[Claims] 1. A non-contact IC card module encapsulant, wherein the module encapsulating material is a one-component thermosetting or UV-curing cationic polymerization epoxy resin. 2. The non-contact IC card according to claim 1, wherein the epoxy resin used for the cationic polymerization is any one of a glycidyl ether type epoxy resin such as bisphenol and novolak, and an alicyclic epoxy resin. Module sealant. 3. The non-contact IC according to claim 1, wherein a filler such as a thermoplastic resin or a fiber is mixed into the epoxy resin to improve bending property, surface smoothness, and adhesion.
Module sealant for cards.