JP2013092928A - Radio ic tag manufacturing method, radio ic tag, and radio communication system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the shrinkage of, during cooling, a resin packed in a case and to thereby prevent warpage of a radio IC tag.SOLUTION: A radio IC tag manufacturing method includes a first step of arranging an IC tag main body 3 with an IC chip 42 and an antenna 43 in a case 2 which is opened on one side thereof and a second step of injecting coating resin 7 into the case 2 so as to cover the IC tag main body 3. The coating resin 7 has glass fiber blended.

Description

  The present invention relates to a wireless IC tag manufactured by arranging an IC tag main body in a casing and pouring resin into the casing, and a manufacturing method thereof.

  A wireless IC tag used in a wireless communication system includes an IC chip that stores data and an antenna that transmits and receives electromagnetic waves from a reader. When the antenna receives the electromagnetic wave, an electromotive force is generated by a resonance action, the IC chip is activated by the electromotive force, and information stored in the chip is transmitted from the antenna.

  Conventionally, as a wireless IC tag, an IC tag main body including an IC chip and an antenna is arranged in a housing with one side opened, and a thermoplastic resin is poured into the housing so that the IC tag main body is embedded in the resin. is there. For example, in the wireless IC tag of Patent Document 1, polyphenylene sulfide (PPS), acrylonitrile-butadiene-styrene copolymer (ABS), or the like is used as the thermoplastic resin filled in the casing.

JP-A-2005-332116

  However, since thermoplastic resins such as PPS resin and ABS resin shrink when cooled, when a high temperature thermoplastic resin is poured into the housing and cured, the housing and the IC tag body do not shrink and the filling resin In some cases, the wireless IC tag may be warped only by contraction.

  Therefore, the present invention provides a wireless IC tag that can prevent the occurrence of warpage by suppressing shrinkage during cooling of the resin filled in the housing, a method of manufacturing the same, and a wireless communication system using the wireless IC tag. It is to be.

Means for Solving the Problems and Effects of the Invention

  According to a first aspect of the present invention, there is provided a wireless IC tag manufacturing method comprising: a first step of disposing an IC tag body having an IC chip and an antenna in a housing having an open surface; and the housing so as to cover the IC tag body. And a second step of pouring the coating resin into the glass, wherein the coating resin is blended with glass fibers.

  According to this configuration, by blending the graph fiber with the coating resin, shrinkage when the coating resin filled in the casing cools can be suppressed, and as a result, the wireless IC tag can be prevented from warping.

  A method for manufacturing a wireless IC tag according to a second invention is characterized in that, in the first invention, the main component of the coating resin is polybutylene terephthalate.

  According to this configuration, the heat resistance of the wireless IC tag can be improved.

  According to a third aspect of the present invention, there is provided a wireless IC tag including a housing having an opening on one side, an IC chip and an antenna, and an IC tag body disposed in the housing, covering the IC tag body, and the IC tag body. And a coating resin filled in a gap between the inner surface of the casing and the coating resin is characterized by blending glass fibers.

  According to this configuration, the same effects as those of the first invention can be obtained.

  A wireless IC tag according to a fourth invention is characterized in that, in the third invention, the main component of the coating resin is polybutylene terephthalate.

  According to this configuration, the heat resistance of the wireless IC tag can be improved.

  A wireless IC tag according to a fifth invention is characterized in that, in the third or fourth invention, the main component of the casing is polyphenylene sulfide.

  According to this configuration, the heat resistance of the housing can be improved. Moreover, since the adhesiveness between polyphenylene sulfide and polybutylene terephthalate is high, the casing and the coating resin can be reliably bonded.

  According to a sixth aspect of the present invention, there is provided the wireless IC tag according to any one of the third to fifth aspects, wherein the IC tag main body is disposed on a bottom side of the casing and the casing of the substrate, and the IC chip and the antenna And an inlay having a base film provided with the substrate, wherein the substrate or the housing has a recess at a position facing the IC chip.

  According to this configuration, the concave portion is provided at the position facing the IC chip of the substrate or the housing, thereby preventing the portion where the inlay IC chip is provided from being pressed against the bottom surface of the housing by the injection pressure of the coating resin. it can. Therefore, breakage of the IC chip can be prevented.

  A wireless communication system according to a seventh aspect is characterized by using the wireless IC tag according to any one of the third to sixth aspects.

It is sectional drawing of the radio | wireless IC tag which concerns on embodiment of this invention. It is the top view which looked at the board | substrate from the inlay side. It is a figure which shows a part of manufacturing process of a wireless IC tag. It is sectional drawing of the radio | wireless IC tag which concerns on other embodiment of this invention. It is sectional drawing of the radio | wireless IC tag which concerns on other embodiment of this invention. It is sectional drawing of the radio | wireless IC tag which concerns on other embodiment of this invention. It is sectional drawing of the radio | wireless IC tag which concerns on other embodiment of this invention.

Embodiments of the present invention will be described below.
As shown in FIG. 1, the wireless IC tag 1 according to the present embodiment includes a rectangular parallelepiped housing 2 having an opening on one surface, an IC tag main body 3 and a coating resin 7 disposed in the housing 2. For example, the wireless IC tag 1 is attached to the article 100 and wirelessly communicates with a reader (not shown). A wireless communication system is configured by the wireless IC tag 1 and the reader.

  The casing 2 is formed mainly of a synthetic resin having high heat resistance such as polyphenylene sulfide (PPS) or polybutylene terephthalate (PBT). The casing 2 may contain 10 to 40% of glass fiber (GF). Although not shown, a screw hole for fixing the wireless IC tag 1 to the article 100 with a screw is formed in the side wall portion of the housing 2.

  The IC tag body 3 is a rectangular plate member. The IC tag main body 3 includes a substrate 5 and an inlay (inlet) 4 attached to the substrate 5 via an adhesive layer 6. The IC tag body 3 is disposed in the housing 2 such that the inlay 4 faces the bottom surface 2a of the housing 2.

  The inlay 4 includes a base film 41 and an IC chip 42 and an antenna 43 provided on one side of the base film 41. The surface of the inlay 4 on the antenna 43 side is bonded to the substrate 5 via the adhesive layer 6, and the base film 41 is in contact with the bottom surface 2 a of the housing 2.

  The base film 41 is formed of a synthetic resin having electrical insulation properties such as polyethylene terephthalate (PET), and the thickness thereof is substantially constant.

  The antenna 43 is a dipole antenna, and is formed of a conductive material such as copper, for example. The antenna 43 is formed on the surface of the base film 41 by wiring, vapor deposition, etching, screen printing, or the like.

  As shown in FIG. 2, the IC chip 42 is provided at the center of the base film 41 and is electrically connected to the antenna 43. Since FIG. 2 is a plan view of the substrate 5, the IC chip 42 does not appear originally, but is shown for explanation. The diameter of the IC chip 42 is, for example, 400 to 1000 μm. Further, the thickness of the IC chip 42 is larger than the thickness of the antenna 43. Therefore, when the base film 41 is in contact with the bottom surface 2a of the housing 2, the central portion of the inlay 4 (the portion where the IC chip 42 is provided) protrudes on the opposite side (substrate 5 side) from the bottom surface 2a.

  The adhesive layer 6 covers the IC chip 42 and the antenna 43, and covers a portion of the base film 41 where the IC chip 42 or the antenna 43 is not provided. The adhesive layer 6 is made of, for example, an acrylic adhesive and has electrical insulation.

  The substrate 5 is a rectangular plate-like member, and is composed of a laminated body of an auxiliary antenna layer 51, a spacer layer 52, and a ground layer 53. The adhesive layer 6 and the inlay 4 are disposed on the auxiliary antenna layer 51 side of the substrate 5. The thickness of the substrate 5 is, for example, 0.5 to 5 mm.

  The spacer layer 52 is made of an electrically insulating material. Specifically, for example, a synthetic resin such as thermosetting polyphenylene ether (PPE), epoxy, silicone, fluorine, phenol or the like may be used as a main component, and glass cloth may be impregnated with resin. It may be kneaded. A circular recess 52a is formed at the center of the spacer layer 52 (specifically, the position facing the IC chip 42 via the adhesive layer 6). The diameter of the recess 52a is larger than that of the IC chip 42, and is preferably 2 to 5 mm, for example. The depth of the recess 52a is equal to or greater than the thickness of the IC chip and is preferably equal to or greater than 0.2 mm. The shape of the recess 52a is not limited to a circular shape.

  The auxiliary antenna layer 51 and the ground layer 53 are made of a conductive material such as copper, for example, and have a thickness of 1 to 100 μm. As shown in FIG. 2, a hole 51 a is formed in the central portion (position corresponding to the IC chip 42) of the auxiliary antenna layer 51. The hole 51 a is larger than the recess 52 a provided in the spacer layer 52. A notch may be provided instead of the hole 51a.

  The substrate 5 has a deterioration in communication characteristics even when the component 100 includes a material that interferes with wireless communication (for example, a conductive material such as metal, a dielectric material such as paper or glass, or a magnetic material). It has a function to prevent. Specifically, the ground layer 53 can suppress the influence of communication obstructions such as metal. In addition, the auxiliary antenna layer 51 is configured to resonate with electromagnetic waves having a communication frequency. By providing the hole 51a at a position corresponding to the IC chip 42 of the auxiliary antenna layer 51, a current is generated at the edge of the hole 51a. Since a flow and a magnetic field are generated, the antenna 43 is arranged so as to cross the hole 51a, so that an induced current is generated in the antenna 43 and the IC chip 42 is activated. Therefore, wireless communication by the auxiliary antenna 43 becomes possible, and as a result, the communicable distance of the wireless IC tag 1 can be extended.

  The coating resin 7 covers the IC tag main body 3 and is filled in a gap between the IC tag main body 3 and the inner surface of the housing 2. The main component of the coating resin 7 is polybutylene terephthalate (PBT), and 10 to 40% of glass fiber is blended.

  Next, the manufacturing process of the wireless IC tag 1 will be described.

  The auxiliary antenna layer 51 and the ground layer 53 are pasted on both surfaces of the spacer layer 52 in which the concave portions 52a are formed to form the substrate 5, and the inlay 4 is formed on the surface of the substrate 5 on the auxiliary antenna layer 51 side via the adhesive layer 6. The IC tag body 3 is created by attaching. Next, as shown in FIG. 3 (a), the IC tag main body 3 is arranged inside the housing 2 made by injection molding or the like, and becomes the coating resin 7 as shown in FIG. 3 (b). A high temperature resin material is injected toward the surface of the substrate 5 at a high pressure and poured into the housing 2. And as shown in FIG.3 (c), after filling the coating resin 7 to the opening edge of the housing 2, it cools and the coating resin 7 is hardened.

  According to the wireless IC tag 1 of the present embodiment, by incorporating the graph fiber into the coating resin 7, the shrinkage when the coating resin 7 filled in the housing 2 cools can be suppressed. As a result, the wireless IC tag 1 Warpage can be prevented from occurring.

  When a PPS resin is used as the filling resin, gas is generated from the PPS resin during the molding process, and a gap is generated inside. Therefore, the gas in the gap expands in a high temperature environment, and the wireless IC tag is deformed. There is a case. In addition, when an ABS resin is used as the filling resin, the heat resistance temperature of the ABS resin is as low as 70 to 100 ° C., so that it may be deformed by heat in a high temperature environment. On the other hand, in this embodiment, since the main component of the coating resin 7 is polybutylene terephthalate (PBT), the heat resistance of the wireless IC tag 1 can be improved.

  Moreover, the heat resistance of the housing 2 can be improved by using polyphenylene sulfide (PPS) as the main component of the housing 2. Moreover, since the adhesiveness between PPS and PBT is high, the casing 2 and the coating resin 7 can be reliably bonded.

  Further, in the manufacturing process of the wireless IC tag 1, when the coating resin 7 is injected into the housing 2 toward the surface of the substrate 5, an injection pressure is applied to the substrate 5. Therefore, when the substrate 52 is not provided with the recess 52a, the portion of the inlay 4 where the IC chip 42 is provided may be pressed against the bottom surface 2a of the housing 2 by the injection pressure, and the IC chip 42 may be damaged. . On the other hand, in this embodiment, since the recess 52a is provided at a position facing the IC chip 42 of the substrate 5, the portion of the inlay 4 where the IC chip 42 of the inlay 4 is provided by the injection pressure of the coating resin 7 It can be prevented from being pressed against the bottom surface 2a. Therefore, damage to the IC chip 42 can be prevented.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications can be made as long as they are described in the claims.

  In the above embodiment, the main component of the coating resin 7 is PBT, but a resin other than PBT may be used.

  The inlay 4 is not limited to the configuration of the above embodiment. For example, the antenna 43 may be configured on both sides of the base film 41.

  In the above embodiment, the inlay 4 in which the antenna 43 and the IC chip 42 are provided on one side of the base film 41 is attached to the substrate 5 by the adhesive layer 6. As long as the insulator layer is disposed, the structure is not limited to the structure of the above embodiment.

  A second spacer layer formed of an electrically insulating material may be disposed between the auxiliary antenna layer 51 and the adhesive layer 6. In this case, for example, as shown in FIGS. 4 and 5, a hole 208 a (or a recess) may be provided in the center of the second spacer layer 208. The spacer layer positioned between the auxiliary antenna layer 51 and the ground layer 53 may be a spacer layer 52 provided with a recess 52a as shown in FIG. 4, or provided with a recess as shown in FIG. The spacer layer 252 may be omitted. 4 and 5, the laminate of the second spacer layer 208, the auxiliary antenna layer 51, the spacer layers 52 and 252 and the ground layer 53 constitutes the “substrate provided with a recess” in the present invention.

  When the second spacer layer is disposed, for example, as shown in FIG. 6, the recess 52 a may be provided only in the spacer layer 52 without providing a hole or a recess in the second spacer layer 308. In FIG. 6, the laminated body of the auxiliary antenna layer 51, the spacer layer 52, and the ground layer 53 constitutes the “substrate provided with a recess” in the present invention. When no hole is provided in the second spacer layer 308, the portion of the inlay 4 where the IC chip 42 is provided is sandwiched between the second spacer layer 308 and the bottom surface 2a of the housing 2, but the second spacer layer 308 is Since the spacer layer 52 is thinner and less rigid, the injection pressure applied to the IC chip 42 can be reduced than when the recess 52a is not provided in the spacer layer 52.

  In the above embodiment, the concave portion 52a is provided in the substrate 5. However, as shown in FIG. 7, for example, a position facing the IC chip 42 on the bottom surface of the housing 402 without providing the concave portion in the substrate 405 (spacer layer 452). A recess 402b may be provided on the surface. Even in this case, similarly to the above embodiment, the portion of the inlay 4 on which the IC chip 42 is provided can be prevented from being pressed against the bottom surface of the housing 402 by the injection pressure of the coating resin 7. Can be prevented from being damaged.

DESCRIPTION OF SYMBOLS 1 Wireless IC tag 2, 402 Housing 2a Bottom surface 3 IC tag main body 4 Inlay 5, 405 Substrate 6 Adhesive layer 7 Covering resin 41 Base film 42 IC chip 43 Antenna 51 Auxiliary antenna layers 52, 252 and 452 Spacer layer 52a Recess 53 Ground layer 208, 308 Second spacer layer 208a Hole 402b Recess

Claims (7)

A first step of disposing an IC tag body having an IC chip and an antenna in a housing having an open surface;
A second step of pouring a coating resin into the housing so as to cover the IC tag body,
The method of manufacturing a wireless IC tag, wherein the coating resin is blended with glass fiber.   2. The method of manufacturing a wireless IC tag according to claim 1, wherein a main component of the coating resin is polybutylene terephthalate. A housing with one side open,
An IC tag body having an IC chip and an antenna, and disposed in the housing;
Covering the IC tag main body, and provided with a coating resin filled in a gap between the IC tag main body and the inner surface of the housing,
The wireless IC tag, wherein the coating resin contains glass fiber.   4. The wireless IC tag according to claim 3, wherein a main component of the coating resin is polybutylene terephthalate.   The wireless IC tag according to claim 3 or 4, wherein a main component of the casing is polyphenylene sulfide. The IC tag body is
A substrate,
An inlay having a base film provided on the bottom surface side of the housing of the substrate and provided with the IC chip and the antenna;
The wireless IC tag according to any one of claims 3 to 5, wherein the substrate or the housing has a recess at a position facing the IC chip.   A wireless communication system using the wireless IC tag according to claim 3.

Images