SG191491A1 - High-strength copper alloy plate excellent in oxide film adhesiveness - Google Patents
High-strength copper alloy plate excellent in oxide film adhesiveness Download PDFInfo
- Publication number
- SG191491A1 SG191491A1 SG2012087532A SG2012087532A SG191491A1 SG 191491 A1 SG191491 A1 SG 191491A1 SG 2012087532 A SG2012087532 A SG 2012087532A SG 2012087532 A SG2012087532 A SG 2012087532A SG 191491 A1 SG191491 A1 SG 191491A1
- Authority
- SG
- Singapore
- Prior art keywords
- copper alloy
- alloy plate
- oxide film
- strength
- film adhesiveness
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 119
- 239000013078 crystal Substances 0.000 claims abstract description 40
- 238000004458 analytical method Methods 0.000 claims abstract description 32
- 238000001887 electron backscatter diffraction Methods 0.000 claims abstract description 14
- 239000012535 impurity Substances 0.000 claims abstract description 10
- 229910052742 iron Inorganic materials 0.000 claims abstract description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000004140 cleaning Methods 0.000 claims description 76
- 239000003513 alkali Substances 0.000 claims description 38
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910017824 Cu—Fe—P Inorganic materials 0.000 abstract description 8
- 238000000137 annealing Methods 0.000 description 62
- 230000014759 maintenance of location Effects 0.000 description 33
- 230000000052 comparative effect Effects 0.000 description 25
- 150000001875 compounds Chemical class 0.000 description 19
- 238000000034 method Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 18
- 238000005498 polishing Methods 0.000 description 18
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 14
- 239000010731 rolling oil Substances 0.000 description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- 239000006104 solid solution Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 238000005097 cold rolling Methods 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000012298 atmosphere Substances 0.000 description 7
- 239000002585 base Substances 0.000 description 7
- 230000006872 improvement Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- WWSJZGAPAVMETJ-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-3-ethoxypyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C(=NN(C=1)CC(=O)N1CC2=C(CC1)NN=N2)OCC WWSJZGAPAVMETJ-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 238000009864 tensile test Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CONKBQPVFMXDOV-QHCPKHFHSA-N 6-[(5S)-5-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-2-oxo-1,3-oxazolidin-3-yl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C[C@H]1CN(C(O1)=O)C1=CC2=C(NC(O2)=O)C=C1 CONKBQPVFMXDOV-QHCPKHFHSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 229910052776 Thorium Inorganic materials 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 229910052790 beryllium Inorganic materials 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- VWVRASTUFJRTHW-UHFFFAOYSA-N 2-[3-(azetidin-3-yloxy)-4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]pyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound O=C(CN1C=C(C(OC2CNC2)=N1)C1=CN=C(NC2CC3=C(C2)C=CC=C3)N=C1)N1CCC2=C(C1)N=NN2 VWVRASTUFJRTHW-UHFFFAOYSA-N 0.000 description 1
- JQMFQLVAJGZSQS-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-N-(2-oxo-3H-1,3-benzoxazol-6-yl)acetamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)NC1=CC2=C(NC(O2)=O)C=C1 JQMFQLVAJGZSQS-UHFFFAOYSA-N 0.000 description 1
- WTFUTSCZYYCBAY-SXBRIOAWSA-N 6-[(E)-C-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-N-hydroxycarbonimidoyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C/C(=N/O)/C1=CC2=C(NC(O2)=O)C=C1 WTFUTSCZYYCBAY-SXBRIOAWSA-N 0.000 description 1
- 235000009581 Balanites aegyptiaca Nutrition 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001941 electron spectroscopy Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011270676A JP5700834B2 (ja) | 2011-12-09 | 2011-12-09 | 酸化膜密着性に優れた高強度銅合金板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG191491A1 true SG191491A1 (en) | 2013-07-31 |
Family
ID=48464682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012087532A SG191491A1 (en) | 2011-12-09 | 2012-11-28 | High-strength copper alloy plate excellent in oxide film adhesiveness |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20130149189A1 (zh) |
| JP (1) | JP5700834B2 (zh) |
| KR (1) | KR20130065615A (zh) |
| CN (1) | CN103160703A (zh) |
| DE (1) | DE102012022794B4 (zh) |
| SG (1) | SG191491A1 (zh) |
| TW (1) | TWI500782B (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6246502B2 (ja) * | 2013-06-13 | 2017-12-13 | Ｊｘ金属株式会社 | 導電性及び曲げたわみ係数に優れる銅合金板 |
| JP5851000B1 (ja) * | 2014-08-22 | 2016-02-03 | 株式会社神戸製鋼所 | Ｌｅｄのリードフレーム用銅合金板条 |
| CN105609156A (zh) * | 2016-02-01 | 2016-05-25 | 安徽华峰电缆集团有限公司 | 一种镓合金高性能电缆 |
| JP6860435B2 (ja) * | 2017-06-29 | 2021-04-14 | 福田金属箔粉工業株式会社 | 粉末冶金用銅系合金粉末及び該銅系合金粉末からなる焼結体 |
| DE102017007138B3 (de) * | 2017-07-27 | 2018-09-27 | Wieland-Werke Ag | Drahtmaterial, Netz und Zuchtkäfig für Aquakultur |
| WO2019181924A1 (ja) * | 2018-03-23 | 2019-09-26 | 古河電気工業株式会社 | リードフレーム材およびその製造方法、ならびにそれを用いた半導体パッケージ |
| CN113106288A (zh) * | 2021-04-07 | 2021-07-13 | 太原晋西春雷铜业有限公司 | 一种制备具有优良抗软化性能kfc异型带坯的方法 |
| CN113969364B (zh) * | 2021-09-10 | 2022-05-03 | 中南大学 | 一种高强度高导电铜铌系合金及其制备方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3720941B2 (ja) * | 1997-03-10 | 2005-11-30 | 株式会社神戸製鋼所 | 酸化被膜密着性に優れるリードフレーム用銅合金材 |
| JP3729662B2 (ja) * | 1998-09-28 | 2005-12-21 | 株式会社神戸製鋼所 | 高強度・高導電性銅合金板 |
| JP2000328157A (ja) * | 1999-05-13 | 2000-11-28 | Kobe Steel Ltd | 曲げ加工性が優れた銅合金板 |
| JP3766051B2 (ja) * | 2002-09-03 | 2006-04-12 | 株式会社神戸製鋼所 | 耐熱性に優れた銅合金およびその製造方法 |
| JP4041803B2 (ja) * | 2004-01-23 | 2008-02-06 | 株式会社神戸製鋼所 | 高強度高導電率銅合金 |
| US8715431B2 (en) * | 2004-08-17 | 2014-05-06 | Kobe Steel, Ltd. | Copper alloy plate for electric and electronic parts having bending workability |
| JP4168077B2 (ja) * | 2006-07-21 | 2008-10-22 | 株式会社神戸製鋼所 | 酸化膜密着性に優れた電気電子部品用銅合金板 |
| EP2339039B8 (en) * | 2006-07-21 | 2016-12-07 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy sheet for electric and electronic part |
| ATE518968T1 (de) * | 2006-10-02 | 2011-08-15 | Kobe Steel Ltd | Kupferlegierungsplatte für elektrische und elektronische bauteile |
| JP4197718B2 (ja) * | 2006-11-17 | 2008-12-17 | 株式会社神戸製鋼所 | 酸化膜密着性に優れた高強度銅合金板 |
| US7928541B2 (en) * | 2008-03-07 | 2011-04-19 | Kobe Steel, Ltd. | Copper alloy sheet and QFN package |
| JP5468423B2 (ja) * | 2010-03-10 | 2014-04-09 | 株式会社神戸製鋼所 | 高強度高耐熱性銅合金材 |
| JP5067817B2 (ja) * | 2010-05-27 | 2012-11-07 | 三菱伸銅株式会社 | 導電性及び耐熱性に優れたＣｕ−Ｆｅ−Ｐ系銅合金板及びその製造方法 |
-
2011
- 2011-12-09 JP JP2011270676A patent/JP5700834B2/ja active Active
-
2012
- 2012-11-20 US US13/681,747 patent/US20130149189A1/en not_active Abandoned
- 2012-11-21 DE DE102012022794.9A patent/DE102012022794B4/de active Active
- 2012-11-28 SG SG2012087532A patent/SG191491A1/en unknown
- 2012-12-03 CN CN2012105090363A patent/CN103160703A/zh active Pending
- 2012-12-04 TW TW101145453A patent/TWI500782B/zh active
- 2012-12-07 KR KR1020120141864A patent/KR20130065615A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JP5700834B2 (ja) | 2015-04-15 |
| TWI500782B (zh) | 2015-09-21 |
| KR20130065615A (ko) | 2013-06-19 |
| DE102012022794B4 (de) | 2017-09-14 |
| TW201331391A (zh) | 2013-08-01 |
| JP2013122070A (ja) | 2013-06-20 |
| CN103160703A (zh) | 2013-06-19 |
| DE102012022794A1 (de) | 2013-06-13 |
| US20130149189A1 (en) | 2013-06-13 |
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