SG185251A1 - Wafer bow metrology arrangements and methodsthereof - Google Patents

Wafer bow metrology arrangements and methodsthereof Download PDF

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Publication number
SG185251A1
SG185251A1 SG2012070876A SG2012070876A SG185251A1 SG 185251 A1 SG185251 A1 SG 185251A1 SG 2012070876 A SG2012070876 A SG 2012070876A SG 2012070876 A SG2012070876 A SG 2012070876A SG 185251 A1 SG185251 A1 SG 185251A1
Authority
SG
Singapore
Prior art keywords
wafer
sensors
measurement data
arrangement
bow
Prior art date
Application number
SG2012070876A
Other languages
English (en)
Inventor
Andrew D Bailey Iii
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG185251A1 publication Critical patent/SG185251A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/20—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring contours or curvatures, e.g. determining profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
SG2012070876A 2007-09-28 2008-09-29 Wafer bow metrology arrangements and methodsthereof SG185251A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US97614907P 2007-09-28 2007-09-28

Publications (1)

Publication Number Publication Date
SG185251A1 true SG185251A1 (en) 2012-11-29

Family

ID=40506681

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012070876A SG185251A1 (en) 2007-09-28 2008-09-29 Wafer bow metrology arrangements and methodsthereof

Country Status (7)

Country Link
US (2) US8225683B2 (zh)
JP (1) JP5543352B2 (zh)
KR (1) KR20100063786A (zh)
CN (1) CN101919038B (zh)
SG (1) SG185251A1 (zh)
TW (1) TWI448660B (zh)
WO (1) WO2009042997A2 (zh)

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JP2015119066A (ja) * 2013-12-19 2015-06-25 株式会社安川電機 検出システムおよび検出方法
US20160341544A1 (en) * 2013-12-22 2016-11-24 Applied Materials, Inc. Monitoring system for deposition and method of operation thereof
CN103745942B (zh) * 2013-12-31 2016-10-05 株洲南车时代电气股份有限公司 判断功率半导体模块基板拱度的装置及其方法
CN104279936B (zh) * 2014-09-15 2017-02-15 深圳中兴创新材料技术有限公司 一种用于电池隔膜弧度测试的装置
US9818633B2 (en) 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
US9673071B2 (en) 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
US9870935B2 (en) 2014-12-19 2018-01-16 Applied Materials, Inc. Monitoring system for deposition and method of operation thereof
JP6357187B2 (ja) * 2016-03-31 2018-07-11 キヤノン株式会社 搬送装置、リソグラフィ装置、および物品の製造方法
GB201615114D0 (en) * 2016-09-06 2016-10-19 Spts Technologies Ltd A Method and system of monitoring and controlling deformation of a wafer substrate
US10068787B2 (en) * 2016-12-30 2018-09-04 Sunpower Corporation Bowing semiconductor wafers
JP6717267B2 (ja) * 2017-07-10 2020-07-01 株式会社Sumco シリコンウェーハの製造方法
CN107560559B (zh) * 2017-07-24 2019-05-24 四川大学 一种棱柱状管道轴向弯扭形变测量计算方法
CN107607080B (zh) * 2017-07-24 2019-05-28 四川大学 一种棱柱状管道横截面形变测量计算方法
US10796940B2 (en) * 2018-11-05 2020-10-06 Lam Research Corporation Enhanced automatic wafer centering system and techniques for same
US11437262B2 (en) 2018-12-12 2022-09-06 Applied Materials, Inc Wafer de-chucking detection and arcing prevention
WO2020154708A1 (en) * 2019-01-25 2020-07-30 Lam Research Corporation Integrated wafer bow measurements
JP7319162B2 (ja) * 2019-10-02 2023-08-01 株式会社荏原製作所 搬送異常予測システム
JP2022043556A (ja) * 2020-09-04 2022-03-16 川崎重工業株式会社 ロボット及び基板形状異常検査方法
JP6902215B1 (ja) * 2020-12-14 2021-07-14 日新イオン機器株式会社 イオン注入装置
CN115812247A (zh) * 2021-05-03 2023-03-17 朗姆研究公司 晶片状态检测
US12123699B1 (en) * 2024-04-11 2024-10-22 Wuxi Xivi Science And Technology Co., Ltd. System and method for detecting thickness and bow of large-sized wafers

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Also Published As

Publication number Publication date
US20120283865A1 (en) 2012-11-08
WO2009042997A4 (en) 2009-09-03
WO2009042997A2 (en) 2009-04-02
US8225683B2 (en) 2012-07-24
JP2011504290A (ja) 2011-02-03
TW200942769A (en) 2009-10-16
KR20100063786A (ko) 2010-06-11
JP5543352B2 (ja) 2014-07-09
WO2009042997A3 (en) 2009-07-16
CN101919038A (zh) 2010-12-15
CN101919038B (zh) 2012-10-03
TWI448660B (zh) 2014-08-11
US9123582B2 (en) 2015-09-01
US20090084169A1 (en) 2009-04-02

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