SG184259A1 - Mold release film - Google Patents

Mold release film Download PDF

Info

Publication number
SG184259A1
SG184259A1 SG2012071155A SG2012071155A SG184259A1 SG 184259 A1 SG184259 A1 SG 184259A1 SG 2012071155 A SG2012071155 A SG 2012071155A SG 2012071155 A SG2012071155 A SG 2012071155A SG 184259 A1 SG184259 A1 SG 184259A1
Authority
SG
Singapore
Prior art keywords
mold release
film
poly
release layer
layer
Prior art date
Application number
SG2012071155A
Other languages
English (en)
Inventor
Hirohito Taniguchi
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010080324A external-priority patent/JP2011212848A/ja
Priority claimed from JP2010102577A external-priority patent/JP5652743B2/ja
Priority claimed from JP2010161488A external-priority patent/JP2012021109A/ja
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG184259A1 publication Critical patent/SG184259A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
SG2012071155A 2010-03-31 2011-03-30 Mold release film SG184259A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010080324A JP2011212848A (ja) 2010-03-31 2010-03-31 離型フィルム
JP2010102577A JP5652743B2 (ja) 2010-04-27 2010-04-27 離型フィルム
JP2010161488A JP2012021109A (ja) 2010-07-16 2010-07-16 離型フィルム
PCT/JP2011/001910 WO2011122023A1 (ja) 2010-03-31 2011-03-30 離型フィルム

Publications (1)

Publication Number Publication Date
SG184259A1 true SG184259A1 (en) 2012-10-30

Family

ID=44711778

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012071155A SG184259A1 (en) 2010-03-31 2011-03-30 Mold release film

Country Status (5)

Country Link
KR (1) KR20130018237A (ja)
CN (2) CN102821956A (ja)
SG (1) SG184259A1 (ja)
TW (1) TWI494219B (ja)
WO (1) WO2011122023A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5832480B2 (ja) * 2012-10-19 2015-12-16 三井化学東セロ株式会社 離型フィルム
WO2014178151A1 (ja) * 2013-04-30 2014-11-06 住友ベークライト株式会社 離型フィルムおよび離型フィルムの使用方法
JP5874768B2 (ja) * 2013-04-30 2016-03-02 住友ベークライト株式会社 離型フィルムおよび離型フィルムの使用方法
JP5874774B2 (ja) * 2013-06-06 2016-03-02 住友ベークライト株式会社 離型フィルムおよび離型フィルムの使用方法
KR20160028452A (ko) 2013-07-01 2016-03-11 가부시키가이샤 가네카 사출 성형성이 우수한 고열전도성 열가소성 수지 조성물
CN103434231B (zh) * 2013-07-19 2016-04-13 胡宇翔 一种印刷电路板成型用离型膜及其制造方法
CN110997319B (zh) * 2017-07-24 2022-09-09 东丽株式会社
WO2024075700A1 (ja) * 2022-10-07 2024-04-11 積水化学工業株式会社 離型フィルム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006148081A (ja) * 2004-10-19 2006-06-08 Sumitomo Bakelite Co Ltd 離型フィルムおよび回路基板の製造方法
JP4826196B2 (ja) * 2005-10-05 2011-11-30 住友ベークライト株式会社 離型フィルムおよび回路基板の製造方法

Also Published As

Publication number Publication date
KR20130018237A (ko) 2013-02-20
TW201202035A (en) 2012-01-16
WO2011122023A1 (ja) 2011-10-06
TWI494219B (zh) 2015-08-01
CN102821956A (zh) 2012-12-12
CN104842621A (zh) 2015-08-19

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