SG166712A1 - Circuit apparatus including removable bond pad extensions - Google Patents
Circuit apparatus including removable bond pad extensionsInfo
- Publication number
- SG166712A1 SG166712A1 SG200905697-9A SG2009056979A SG166712A1 SG 166712 A1 SG166712 A1 SG 166712A1 SG 2009056979 A SG2009056979 A SG 2009056979A SG 166712 A1 SG166712 A1 SG 166712A1
- Authority
- SG
- Singapore
- Prior art keywords
- bond pad
- extension test
- electrical circuit
- pad
- test pad
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Tests Of Electronic Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/463,718 US7724023B1 (en) | 2009-05-11 | 2009-05-11 | Circuit apparatus including removable bond pad extension |
Publications (1)
Publication Number | Publication Date |
---|---|
SG166712A1 true SG166712A1 (en) | 2010-12-29 |
Family
ID=42184277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200905697-9A SG166712A1 (en) | 2009-05-11 | 2009-08-26 | Circuit apparatus including removable bond pad extensions |
Country Status (8)
Country | Link |
---|---|
US (1) | US7724023B1 (ko) |
EP (1) | EP2251703B1 (ko) |
JP (1) | JP5676868B2 (ko) |
KR (1) | KR101420174B1 (ko) |
CN (1) | CN101887089A (ko) |
AT (1) | ATE543102T1 (ko) |
SG (1) | SG166712A1 (ko) |
TW (1) | TWI401440B (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI498574B (zh) | 2011-05-05 | 2015-09-01 | Mstar Semiconductor Inc | 積體電路晶片及其測試方法 |
US9846192B2 (en) * | 2015-02-25 | 2017-12-19 | Nxp B.V. | Switched probe contact |
US10529438B2 (en) * | 2018-04-17 | 2020-01-07 | Nanya Technology Corporation | DRAM and method of designing the same |
EP3742486A1 (en) * | 2019-05-21 | 2020-11-25 | Infineon Technologies AG | Circuit including configuration terminal and method |
US11295995B2 (en) * | 2019-09-17 | 2022-04-05 | International Business Machines Corporation | Testing SRAM structures |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59174769A (ja) * | 1983-03-25 | 1984-10-03 | Hitachi Ltd | コントロ−ルセンタの自動試験装置 |
JPS63178538A (ja) * | 1987-01-20 | 1988-07-22 | Nec Corp | 半導体集積回路装置 |
DE4233765A1 (de) * | 1992-09-23 | 1994-03-24 | Abb Metrawatt Gmbh | Elektrisches Meß- und Prüfgerät zur Erfassung von Prüfdaten entsprechend einem Prüfprotokoll, insbesondere nach DIN VDE 0100 und DIN VDE 0701 |
WO1995023341A1 (en) * | 1994-02-23 | 1995-08-31 | Everett Charles Technologies, Inc. | Translator fixture with module for expanding test points |
US5783868A (en) | 1996-09-20 | 1998-07-21 | Integrated Device Technology, Inc. | Extended bond pads with a plurality of perforations |
KR100305032B1 (ko) * | 1999-06-22 | 2001-11-01 | 윤종용 | 반도체 메모리 장치 |
DE10029835C1 (de) * | 2000-06-16 | 2001-10-25 | Infineon Technologies Ag | Integrierte Schaltung mit Testbetrieb und Testanordnung zum Testen einer integrierten Schaltung |
TW498476B (en) * | 2001-08-30 | 2002-08-11 | Macronix Int Co Ltd | Synchronization test method and circuit for the segment of memory |
JP3963259B2 (ja) | 2002-03-15 | 2007-08-22 | スパンション インク | 半導体装置 |
JP2004061299A (ja) * | 2002-07-29 | 2004-02-26 | Renesas Technology Corp | 半導体装置 |
JP4913329B2 (ja) * | 2004-02-09 | 2012-04-11 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US8045353B2 (en) | 2005-12-30 | 2011-10-25 | Stmicroelectronics Pvt. Ltd. | Integrated circuit capable of operating at different supply voltages |
JP4751766B2 (ja) | 2006-05-18 | 2011-08-17 | 富士通セミコンダクター株式会社 | 半導体装置 |
JP4958653B2 (ja) * | 2007-06-21 | 2012-06-20 | 三菱電機株式会社 | インバータ試験装置 |
-
2009
- 2009-05-11 US US12/463,718 patent/US7724023B1/en not_active Expired - Fee Related
- 2009-07-23 TW TW098124922A patent/TWI401440B/zh not_active IP Right Cessation
- 2009-08-24 CN CN2009101666199A patent/CN101887089A/zh active Pending
- 2009-08-26 SG SG200905697-9A patent/SG166712A1/en unknown
- 2009-09-11 KR KR1020090085791A patent/KR101420174B1/ko not_active IP Right Cessation
- 2009-10-09 JP JP2009234710A patent/JP5676868B2/ja not_active Expired - Fee Related
-
2010
- 2010-03-15 EP EP10156481A patent/EP2251703B1/en not_active Not-in-force
- 2010-03-15 AT AT10156481T patent/ATE543102T1/de active
Also Published As
Publication number | Publication date |
---|---|
ATE543102T1 (de) | 2012-02-15 |
US7724023B1 (en) | 2010-05-25 |
JP5676868B2 (ja) | 2015-02-25 |
KR101420174B1 (ko) | 2014-07-17 |
TW201040542A (en) | 2010-11-16 |
CN101887089A (zh) | 2010-11-17 |
EP2251703B1 (en) | 2012-01-25 |
JP2010261931A (ja) | 2010-11-18 |
KR20100122042A (ko) | 2010-11-19 |
TWI401440B (zh) | 2013-07-11 |
EP2251703A1 (en) | 2010-11-17 |
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