SG157376A1 - Directional silicon condenser microphone having additional back chamber - Google Patents

Directional silicon condenser microphone having additional back chamber

Info

Publication number
SG157376A1
SG157376A1 SG200907430-3A SG2009074303A SG157376A1 SG 157376 A1 SG157376 A1 SG 157376A1 SG 2009074303 A SG2009074303 A SG 2009074303A SG 157376 A1 SG157376 A1 SG 157376A1
Authority
SG
Singapore
Prior art keywords
case
substrate
condenser microphone
additional back
back chamber
Prior art date
Application number
SG200907430-3A
Other languages
English (en)
Inventor
Chungdam Song
Original Assignee
Bse Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co Ltd filed Critical Bse Co Ltd
Publication of SG157376A1 publication Critical patent/SG157376A1/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
SG200907430-3A 2006-05-09 2006-08-07 Directional silicon condenser microphone having additional back chamber SG157376A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060041658A KR100722687B1 (ko) 2006-05-09 2006-05-09 부가적인 백 챔버를 갖는 지향성 실리콘 콘덴서 마이크로폰

Publications (1)

Publication Number Publication Date
SG157376A1 true SG157376A1 (en) 2009-12-29

Family

ID=38278476

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200907430-3A SG157376A1 (en) 2006-05-09 2006-08-07 Directional silicon condenser microphone having additional back chamber

Country Status (7)

Country Link
US (1) US7940944B2 (fr)
EP (2) EP2178312B1 (fr)
JP (2) JP4738481B2 (fr)
KR (1) KR100722687B1 (fr)
CN (1) CN201146600Y (fr)
SG (1) SG157376A1 (fr)
WO (1) WO2007129788A1 (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8705775B2 (en) 2007-04-25 2014-04-22 University Of Florida Research Foundation, Inc. Capacitive microphone with integrated cavity
KR100904285B1 (ko) * 2007-06-04 2009-06-25 주식회사 비에스이 콘덴서 마이크로폰
EP2094028B8 (fr) 2008-02-22 2017-03-29 TDK Corporation Ensemble de microphone miniature avec un anneau de scellage à souder
US8155366B2 (en) * 2009-05-15 2012-04-10 Mwm Acoustics, Llc Transducer package with interior support frame
JP2011082723A (ja) * 2009-10-06 2011-04-21 Hosiden Corp 単一指向性マイクロホン
KR101088400B1 (ko) * 2009-10-19 2011-12-01 주식회사 비에스이 부가적인 백 챔버를 갖는 실리콘 콘덴서 마이크로폰 및 그의 제조방법
TWI404428B (zh) * 2009-11-25 2013-08-01 Ind Tech Res Inst 聲學感測器
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
EP2416544B1 (fr) * 2010-08-06 2015-04-29 BlackBerry Limited Écran électromagnétique et chambre acoustique pour microphone dans un dispositif électronique mobile
KR101185456B1 (ko) 2010-11-22 2012-10-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9232302B2 (en) * 2011-05-31 2016-01-05 Apple Inc. Microphone assemblies with through-silicon vias
KR101276353B1 (ko) * 2011-12-09 2013-06-24 주식회사 비에스이 다기능 마이크로폰 조립체 및 그 제조방법
DE102012205640B4 (de) * 2012-01-05 2018-05-30 Continental Automotive Gmbh Füllstandsgeber
DE102012200757B4 (de) * 2012-01-05 2022-01-05 Vitesco Technologies GmbH Füllstandsgeber
US8687827B2 (en) * 2012-05-29 2014-04-01 Merry Electronics Co., Ltd. Micro-electro-mechanical system microphone chip with expanded back chamber
US9402118B2 (en) * 2012-07-27 2016-07-26 Knowles Electronics, Llc Housing and method to control solder creep on housing
US10136226B2 (en) * 2012-12-18 2018-11-20 Tdk Corporation Top-port MEMS microphone and method of manufacturing the same
US9006845B2 (en) * 2013-01-16 2015-04-14 Infineon Technologies, A.G. MEMS device with polymer layer, system of a MEMS device with a polymer layer, method of making a MEMS device with a polymer layer
KR101480615B1 (ko) * 2013-05-29 2015-01-08 현대자동차주식회사 지향성 마이크로폰 장치 및 그의 동작방법
CN103338415A (zh) * 2013-06-08 2013-10-02 歌尔声学股份有限公司 麦克风外壳与线路板固定的方法
KR101369464B1 (ko) 2013-06-27 2014-03-06 주식회사 비에스이 멤스 마이크로폰
CN203416415U (zh) * 2013-08-15 2014-01-29 山东共达电声股份有限公司 指向性mems传声器
CN105933837B (zh) * 2013-10-18 2019-02-15 张小友 一种mems传声器振动膜片
CN103686568B (zh) * 2013-12-23 2017-01-18 山东共达电声股份有限公司 一种指向性mems传声器及受音装置
KR101610145B1 (ko) 2014-11-28 2016-04-08 현대자동차 주식회사 마이크로폰 모듈 및 그 제어방법
JP6580356B2 (ja) * 2015-03-25 2019-09-25 株式会社プリモ 単一指向性ｍｅｍｓマイクロホン
US9924253B2 (en) * 2015-07-07 2018-03-20 Hyundai Motor Company Microphone sensor
KR101657651B1 (ko) * 2015-08-31 2016-09-19 주식회사 비에스이센서스 확장 백챔버 공간을 갖는 맴스 마이크로폰 패키지 및 그 제조방법
KR101657650B1 (ko) * 2015-08-31 2016-09-19 주식회사 비에스이센서스 맴스 마이크로폰 패키지 및 그 방법
KR101703628B1 (ko) 2015-09-25 2017-02-07 현대자동차 주식회사 마이크로폰 및 그 제조방법
US20170240418A1 (en) * 2016-02-18 2017-08-24 Knowles Electronics, Llc Low-cost miniature mems vibration sensor
US20180167723A1 (en) * 2016-12-10 2018-06-14 Aac Acoustic Technologies (Shenzhen) Co., Ltd. Microphone
US10595111B2 (en) * 2017-03-20 2020-03-17 Bose Corporation Earbud frame for acoustic driver and complimentary ear tip
DE102018207605B4 (de) * 2018-05-16 2023-12-28 Infineon Technologies Ag MEMS-Sensor, MEMS-Sensorsystem und Verfahren zum Herstellen eines MEMS-Sensorsystems
US10728674B2 (en) * 2018-08-27 2020-07-28 Solid State System Co., Ltd. Microphone package
US11051109B2 (en) * 2018-09-27 2021-06-29 Taiwan Semiconductor Manufacturing Company, Ltd. Dual back-plate and diaphragm microphone
KR102284961B1 (ko) * 2021-03-12 2021-08-03 스마트전자 주식회사 회로 보호 장치

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61278295A (ja) * 1985-06-04 1986-12-09 Matsushita Electric Ind Co Ltd 指向性ダイナミツクマイクロホンユニツト
JP2705803B2 (ja) * 1988-08-31 1998-01-28 那須 威仁 石綿屑回収固形化処理方法及び装置
JPH0263590U (fr) 1988-10-31 1990-05-11
JP2753896B2 (ja) * 1990-11-30 1998-05-20 東信電気 株式会社 圧力振動検出素子
JP3106026B2 (ja) 1993-02-23 2000-11-06 日本碍子株式会社 圧電／電歪アクチュエータ
JPH09199824A (ja) * 1995-11-16 1997-07-31 Matsushita Electric Ind Co Ltd プリント配線板とその実装体
JPH10213505A (ja) * 1997-01-28 1998-08-11 Tokin Corp 圧力センサ
JP3378197B2 (ja) 1998-05-11 2003-02-17 ホシデン株式会社 半導体エレクトレットコンデンサーマイクロホン
JP2000048952A (ja) 1998-07-30 2000-02-18 Tdk Corp 有機ｅｌ素子モジュール
JP3479464B2 (ja) * 1999-02-08 2003-12-15 ホシデン株式会社 単一指向性エレクトレットコンデンサマイクロホン
JP3287330B2 (ja) 1999-04-22 2002-06-04 日本電気株式会社 高周波回路のシールド構造
PL354000A1 (en) * 1999-09-06 2003-12-15 Sonionmems A/Ssonionmems A/S A pressure transducer
JP3805576B2 (ja) * 1999-09-14 2006-08-02 松下電器産業株式会社 振動変換器およびこの振動変換器を備えた加速度センサ
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
GB2386031B (en) * 2000-12-22 2004-08-18 Bruel & Kjaer Sound & Vibratio A highly stable micromachined capacitive transducer
AU2003221959A1 (en) * 2002-04-15 2003-11-03 Kevin S. Jones Single crystal silicon membranes for microelectromechanical applications
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
JP3829115B2 (ja) 2002-12-16 2006-10-04 佳樂電子股▲分▼有限公司 コンデンサーマイクロホン及びその製造方法
DE10303263B4 (de) 2003-01-28 2012-01-05 Infineon Technologies Ag Mikrophonanordnung
KR100543972B1 (ko) * 2003-02-08 2006-01-20 송기영 콘덴서 마이크로폰의 케이스 접합 구조 및 그의 제조 방법
US7466835B2 (en) * 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
KR100542177B1 (ko) * 2003-06-07 2006-01-11 주식회사 비에스이 단일지향성 콘덴서 마이크로폰
KR100549189B1 (ko) * 2003-07-29 2006-02-10 주식회사 비에스이 Ｓｍｄ가능한 일렉트렛 콘덴서 마이크로폰
KR200330089Y1 (ko) * 2003-07-29 2003-10-11 주식회사 비에스이 통합 베이스 및 이를 이용한 일렉트릿 콘덴서마이크로폰
US7466834B2 (en) 2004-03-09 2008-12-16 Panasonic Corporation Electret condenser microphone
JP4396975B2 (ja) * 2004-05-10 2010-01-13 学校法人日本大学 コンデンサ型音響変換装置及びその製造方法
KR100648398B1 (ko) 2005-07-07 2006-11-24 주식회사 비에스이 실리콘 콘덴서 마이크로폰의 패키징 구조 및 그 제조방법
US20070040231A1 (en) * 2005-08-16 2007-02-22 Harney Kieran P Partially etched leadframe packages having different top and bottom topologies
JP2007178221A (ja) 2005-12-27 2007-07-12 Yamaha Corp 半導体装置、その製造方法、及びスペーサの製造方法
US7436054B2 (en) * 2006-03-03 2008-10-14 Silicon Matrix, Pte. Ltd. MEMS microphone with a stacked PCB package and method of producing the same

Also Published As

Publication number Publication date
EP2178312B1 (fr) 2012-05-16
CN201146600Y (zh) 2008-11-05
US20090074222A1 (en) 2009-03-19
EP1875774A4 (fr) 2014-09-24
JP4837083B2 (ja) 2011-12-14
JP4738481B2 (ja) 2011-08-03
WO2007129788A1 (fr) 2007-11-15
JP2010104006A (ja) 2010-05-06
JP2008533951A (ja) 2008-08-21
KR100722687B1 (ko) 2007-05-30
EP1875774A1 (fr) 2008-01-09
EP2178312A1 (fr) 2010-04-21
US7940944B2 (en) 2011-05-10

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