DE602007007198D1 - Akustischer einchip-mems-wandler und herstellungsverfahren - Google Patents

Akustischer einchip-mems-wandler und herstellungsverfahren

Info

Publication number
DE602007007198D1
DE602007007198D1 DE602007007198T DE602007007198T DE602007007198D1 DE 602007007198 D1 DE602007007198 D1 DE 602007007198D1 DE 602007007198 T DE602007007198 T DE 602007007198T DE 602007007198 T DE602007007198 T DE 602007007198T DE 602007007198 D1 DE602007007198 D1 DE 602007007198D1
Authority
DE
Germany
Prior art keywords
cavity
die
acoustic
back plate
diaphragm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007007198T
Other languages
English (en)
Inventor
Pirmin Rombach
Morten Berg Arnoldus
Morten Ginnerup
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epcos Pte Ltd
Original Assignee
Sonion Mems AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sonion Mems AS filed Critical Sonion Mems AS
Publication of DE602007007198D1 publication Critical patent/DE602007007198D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
DE602007007198T 2006-03-30 2007-03-29 Akustischer einchip-mems-wandler und herstellungsverfahren Active DE602007007198D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78755906P 2006-03-30 2006-03-30
PCT/DK2007/000157 WO2007112743A1 (en) 2006-03-30 2007-03-29 Single die mems acoustic transducer and manufacturing method

Publications (1)

Publication Number Publication Date
DE602007007198D1 true DE602007007198D1 (de) 2010-07-29

Family

ID=37432486

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007007198T Active DE602007007198D1 (de) 2006-03-30 2007-03-29 Akustischer einchip-mems-wandler und herstellungsverfahren

Country Status (8)

Country Link
US (1) US8188557B2 (de)
EP (1) EP2005789B1 (de)
JP (1) JP4966370B2 (de)
KR (1) KR101398667B1 (de)
CN (1) CN101427593B (de)
AT (1) ATE471635T1 (de)
DE (1) DE602007007198D1 (de)
WO (1) WO2007112743A1 (de)

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US10136226B2 (en) * 2012-12-18 2018-11-20 Tdk Corporation Top-port MEMS microphone and method of manufacturing the same
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US9758372B1 (en) * 2013-02-13 2017-09-12 Amkor Technology, Inc. MEMS package with MEMS die, magnet, and window substrate fabrication method and structure
CN104003348B (zh) * 2013-02-27 2018-02-02 应美盛股份有限公司 用于具有双层面结构层和声学端口的mems结构的方法
JP6237978B2 (ja) * 2013-03-13 2017-11-29 オムロン株式会社 静電容量型センサ、音響センサ及びマイクロフォン
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Also Published As

Publication number Publication date
US8188557B2 (en) 2012-05-29
JP2009531884A (ja) 2009-09-03
WO2007112743A1 (en) 2007-10-11
EP2005789A1 (de) 2008-12-24
KR20080109001A (ko) 2008-12-16
KR101398667B1 (ko) 2014-05-27
US20090169035A1 (en) 2009-07-02
CN101427593B (zh) 2012-09-19
ATE471635T1 (de) 2010-07-15
JP4966370B2 (ja) 2012-07-04
EP2005789B1 (de) 2010-06-16
CN101427593A (zh) 2009-05-06

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Legal Events

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8327 Change in the person/name/address of the patent owner

Owner name: EPCOS PTE LTD, SINGAPORE, SG