SG150489A1 - Method and apparatus for robot calibrations with a calibrating device - Google Patents
Method and apparatus for robot calibrations with a calibrating deviceInfo
- Publication number
- SG150489A1 SG150489A1 SG200806407-3A SG2008064073A SG150489A1 SG 150489 A1 SG150489 A1 SG 150489A1 SG 2008064073 A SG2008064073 A SG 2008064073A SG 150489 A1 SG150489 A1 SG 150489A1
- Authority
- SG
- Singapore
- Prior art keywords
- calibrating device
- target
- calibrations
- robot
- method includes
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
- G01B21/042—Calibration or calibration artifacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37278—Optical waveguide, fiberoptic sensor
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37608—Center and diameter of hole, wafer, object
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/39—Robotics, robotics to robotics hand
- G05B2219/39047—Calibration plate mounted on robot, plate comprises sensors for measuring target
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/39—Robotics, robotics to robotics hand
- G05B2219/39056—On line relative position error and orientation error calibration
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US96912307P | 2007-08-30 | 2007-08-30 | |
US12/198,076 US8224607B2 (en) | 2007-08-30 | 2008-08-25 | Method and apparatus for robot calibrations with a calibrating device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG150489A1 true SG150489A1 (en) | 2009-03-30 |
Family
ID=40408733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200806407-3A SG150489A1 (en) | 2007-08-30 | 2008-08-29 | Method and apparatus for robot calibrations with a calibrating device |
Country Status (7)
Country | Link |
---|---|
US (2) | US8224607B2 (ja) |
JP (1) | JP2009061585A (ja) |
KR (1) | KR20090023314A (ja) |
CN (1) | CN101537617A (ja) |
SG (1) | SG150489A1 (ja) |
TW (1) | TW200918264A (ja) |
WO (1) | WO2009032204A1 (ja) |
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US7085622B2 (en) | 2002-04-19 | 2006-08-01 | Applied Material, Inc. | Vision system |
JP4501103B2 (ja) | 2003-10-17 | 2010-07-14 | 株式会社安川電機 | 半導体ウェハ搬送ロボットのキャリブレーション方法およびそれを備えた半導体ウェハ搬送ロボット、ウェハ搬送装置 |
US7107125B2 (en) | 2003-10-29 | 2006-09-12 | Applied Materials, Inc. | Method and apparatus for monitoring the position of a semiconductor processing robot |
US7319920B2 (en) | 2003-11-10 | 2008-01-15 | Applied Materials, Inc. | Method and apparatus for self-calibration of a substrate handling robot |
US20050137751A1 (en) * | 2003-12-05 | 2005-06-23 | Cox Damon K. | Auto-diagnostic method and apparatus |
US20060218680A1 (en) | 2005-03-28 | 2006-09-28 | Bailey Andrew D Iii | Apparatus for servicing a plasma processing system with a robot |
US7962192B2 (en) | 2005-09-30 | 2011-06-14 | Restoration Robotics, Inc. | Systems and methods for aligning a tool with a desired location or object |
-
2008
- 2008-08-25 US US12/198,076 patent/US8224607B2/en active Active
- 2008-08-28 WO PCT/US2008/010262 patent/WO2009032204A1/en active Application Filing
- 2008-08-29 TW TW097133220A patent/TW200918264A/zh unknown
- 2008-08-29 JP JP2008221120A patent/JP2009061585A/ja not_active Withdrawn
- 2008-08-29 CN CNA2008101714889A patent/CN101537617A/zh active Pending
- 2008-08-29 SG SG200806407-3A patent/SG150489A1/en unknown
- 2008-09-01 KR KR1020080085952A patent/KR20090023314A/ko not_active Application Discontinuation
-
2012
- 2012-06-14 US US13/523,751 patent/US8688398B2/en active Active
Also Published As
Publication number | Publication date |
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US8224607B2 (en) | 2012-07-17 |
WO2009032204A1 (en) | 2009-03-12 |
JP2009061585A (ja) | 2009-03-26 |
CN101537617A (zh) | 2009-09-23 |
KR20090023314A (ko) | 2009-03-04 |
US20090062959A1 (en) | 2009-03-05 |
TW200918264A (en) | 2009-05-01 |
US20120271590A1 (en) | 2012-10-25 |
US8688398B2 (en) | 2014-04-01 |
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