SG150421A1 - Method of forming thin film metal conductive lines - Google Patents

Method of forming thin film metal conductive lines

Info

Publication number
SG150421A1
SG150421A1 SG200718898-0A SG2007188980A SG150421A1 SG 150421 A1 SG150421 A1 SG 150421A1 SG 2007188980 A SG2007188980 A SG 2007188980A SG 150421 A1 SG150421 A1 SG 150421A1
Authority
SG
Singapore
Prior art keywords
layer
forming
metal conductive
thin film
conductive lines
Prior art date
Application number
SG200718898-0A
Other languages
English (en)
Inventor
Sang-Hee Kim
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of SG150421A1 publication Critical patent/SG150421A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/007—Electroplating using magnetic fields, e.g. magnets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
SG200718898-0A 2007-08-31 2007-12-19 Method of forming thin film metal conductive lines SG150421A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070088543A KR20090022877A (ko) 2007-08-31 2007-08-31 박막 금속 전도선의 제조 방법

Publications (1)

Publication Number Publication Date
SG150421A1 true SG150421A1 (en) 2009-03-30

Family

ID=40407963

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200718898-0A SG150421A1 (en) 2007-08-31 2007-12-19 Method of forming thin film metal conductive lines

Country Status (6)

Country Link
US (1) US20090061175A1 (zh)
JP (1) JP2009060072A (zh)
KR (1) KR20090022877A (zh)
CN (1) CN101378033B (zh)
SG (1) SG150421A1 (zh)
TW (1) TWI374503B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010140725A1 (ko) * 2009-06-05 2010-12-09 (주)탑엔지니어링 박막 금속 전도선의 형성 방법
JP5231340B2 (ja) * 2009-06-11 2013-07-10 新光電気工業株式会社 配線基板の製造方法
TW201103384A (en) * 2009-07-03 2011-01-16 Tripod Technology Corp Method of fabricating circuit board with etched thin film resistors
US9797057B2 (en) * 2009-08-24 2017-10-24 Empire Technology Development Llc Magnetic electro-plating
CN102373492A (zh) * 2010-08-13 2012-03-14 北大方正集团有限公司 电路板表面进行选择性电镀的方法和电路板
TWI418275B (zh) * 2011-01-05 2013-12-01 Chunghwa Prec Test Tech Co Ltd 電路板線路導電結構之製造方法
CN102392247B (zh) * 2011-10-26 2013-11-06 首都航天机械公司 一种扩散焊接用零件中间局部区域电镀方法
CN103165569A (zh) * 2011-12-19 2013-06-19 同欣电子工业股份有限公司 一种半导体气密封装结构及其制造方法
CN102759638B (zh) * 2012-07-27 2015-04-15 上海华力微电子有限公司 一种利用原子力纳米探针测试金属层的方法
KR101720300B1 (ko) * 2015-07-21 2017-03-28 주식회사 오킨스전자 접촉성이 개선된 범프를 포함하는 테스트 소켓용 ｍｅｍｓ 필름
DE102017106055B4 (de) * 2017-03-21 2021-04-08 Tdk Corporation Trägersubstrat für stressempflindliches Bauelement und Verfahren zur Herstellung
CN106887390A (zh) * 2017-04-06 2017-06-23 京东方科技集团股份有限公司 一种电极制作方法、薄膜晶体管、阵列基板及显示面板
TWI669994B (zh) * 2017-12-04 2019-08-21 希華晶體科技股份有限公司 Method for manufacturing miniaturized circuit and its products
CN110493969A (zh) * 2019-08-19 2019-11-22 江苏上达电子有限公司 一种防止二次蚀刻导致线路侧蚀的方法
CN111834466A (zh) * 2020-07-22 2020-10-27 Oppo广东移动通信有限公司 薄膜晶体管及其制造方法、阵列基板、显示面板及设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513933A (ja) * 1991-07-02 1993-01-22 Fujitsu Ltd プリント配線板の導体パターン及びその形成方法
JP2680234B2 (ja) * 1992-11-12 1997-11-19 株式会社日立製作所 配線パターン形成方法
JPH0782034B2 (ja) * 1993-05-20 1995-09-06 フレッシュクエストコーポレーション プローブカード
JPH08204312A (ja) * 1995-01-31 1996-08-09 Matsushita Electric Works Ltd チップオンボード基板の製造方法
JPH08330710A (ja) * 1995-06-05 1996-12-13 Nippon Paint Co Ltd プリント配線板電極部の金属めっき加工方法
JP2001023932A (ja) * 1999-07-07 2001-01-26 Nec Corp 半導体素子製造方法及び製造装置
DE10040935C2 (de) * 2000-08-19 2003-05-15 Adelwitz Technologie Zentrum G Verfahren zur galvanischen Beschichtung von Hochtemperatur-Supraleitern mit Cu-Verbindungen
JP3690975B2 (ja) * 2000-10-10 2005-08-31 独立行政法人科学技術振興機構 有機メッキ方法及び有機メッキ製品
JP4560201B2 (ja) * 2000-11-10 2010-10-13 日本エレクトロプレイテイング・エンジニヤース株式会社 カップ式めっき装置
JP4131385B2 (ja) * 2001-10-29 2008-08-13 日立金属株式会社 希土類系永久磁石の製造方法
JP4467341B2 (ja) * 2004-03-18 2010-05-26 京セラ株式会社 多層配線基板の製造方法
KR100645630B1 (ko) * 2005-09-16 2006-11-14 삼성전기주식회사 주기적 방향성을 갖는 자기장을 이용한 인쇄회로기판의전해 도금방법

Also Published As

Publication number Publication date
CN101378033A (zh) 2009-03-04
CN101378033B (zh) 2011-08-10
TWI374503B (en) 2012-10-11
JP2009060072A (ja) 2009-03-19
TW200910460A (en) 2009-03-01
KR20090022877A (ko) 2009-03-04
US20090061175A1 (en) 2009-03-05

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