SG149824A1 - Cutter wheel, methods for scribing and breaking brittle material substrate using same, and method for manufacturing cutter wheel - Google Patents

Cutter wheel, methods for scribing and breaking brittle material substrate using same, and method for manufacturing cutter wheel

Info

Publication number
SG149824A1
SG149824A1 SG200900203-1A SG2009002031A SG149824A1 SG 149824 A1 SG149824 A1 SG 149824A1 SG 2009002031 A SG2009002031 A SG 2009002031A SG 149824 A1 SG149824 A1 SG 149824A1
Authority
SG
Singapore
Prior art keywords
cutter wheel
scribing
methods
same
material substrate
Prior art date
Application number
SG200900203-1A
Other languages
English (en)
Inventor
Kazuya Maekawa
Ryota Sakaguchi
Yoshitaka Miura
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34824510&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG149824(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of SG149824A1 publication Critical patent/SG149824A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • C03B33/107Wheel design, e.g. materials, construction, shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/46Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027Scoring tool holders; Driving mechanisms therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
SG200900203-1A 2004-02-02 2005-02-01 Cutter wheel, methods for scribing and breaking brittle material substrate using same, and method for manufacturing cutter wheel SG149824A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004059772 2004-02-02

Publications (1)

Publication Number Publication Date
SG149824A1 true SG149824A1 (en) 2009-02-27

Family

ID=34824510

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200900203-1A SG149824A1 (en) 2004-02-02 2005-02-01 Cutter wheel, methods for scribing and breaking brittle material substrate using same, and method for manufacturing cutter wheel

Country Status (8)

Country Link
EP (2) EP1712339A4 (zh)
JP (4) JP5022602B2 (zh)
KR (7) KR101267832B1 (zh)
CN (4) CN102161219A (zh)
HK (1) HK1099925A1 (zh)
SG (1) SG149824A1 (zh)
TW (5) TWI466838B (zh)
WO (1) WO2005072926A1 (zh)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102161219A (zh) * 2004-02-02 2011-08-24 三星钻石工业股份有限公司 刀轮、使用其的脆性材料基板的划线方法及分割方法、刀轮的制造方法
TWI454433B (zh) * 2005-07-06 2014-10-01 Mitsuboshi Diamond Ind Co Ltd A scribing material for a brittle material and a method for manufacturing the same, a scribing method using a scribing wheel, a scribing device, and a scribing tool
JP5139852B2 (ja) * 2008-03-17 2013-02-06 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
CN102046346B (zh) * 2008-05-30 2014-04-09 三星钻石工业股份有限公司 脆性材料基板的倒角方法
KR20110013510A (ko) * 2008-06-05 2011-02-09 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이빙 휠과 스크라이브 방법, 및 세라믹 기판의 절단 방법
CN101745990A (zh) * 2008-12-01 2010-06-23 孙春雨 一种切割脆性材料的刀轮及其加工方法
TWI477375B (zh) * 2009-05-08 2015-03-21 Sun Chun Yu Cutting wheel of brittle material and its processing method
JP5438422B2 (ja) * 2009-07-31 2014-03-12 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法並びに加工装置
CN102050568B (zh) * 2009-10-29 2013-02-13 孙春雨 一种切割玻璃材料的刀轮及其加工方法
JP5174112B2 (ja) * 2010-09-28 2013-04-03 三星ダイヤモンド工業株式会社 スクライビングホイール
JP5174118B2 (ja) * 2010-10-08 2013-04-03 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
JP5365602B2 (ja) * 2010-10-08 2013-12-11 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
JP5156080B2 (ja) 2010-11-05 2013-03-06 三星ダイヤモンド工業株式会社 貼り合せ基板のスクライブ方法
WO2012093422A1 (ja) * 2011-01-07 2012-07-12 坂東機工株式会社 炭化珪素板のスクライブ方法及びスクライブ装置
JP5244202B2 (ja) * 2011-01-27 2013-07-24 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
JP5966564B2 (ja) * 2011-06-08 2016-08-10 三星ダイヤモンド工業株式会社 スクライビングホイール及びスクライブ方法
JP5479424B2 (ja) * 2011-09-30 2014-04-23 三星ダイヤモンド工業株式会社 脆性材料用スクライビングホイール、これを用いた脆性材料基板のスクライブ装置及びスクライブ工具
JP2013079170A (ja) * 2011-10-04 2013-05-02 Mitsuboshi Diamond Industrial Co Ltd スクライブ方法
TWI474983B (zh) * 2011-10-04 2015-03-01 Mitsuboshi Diamond Ind Co Ltd Scoring Method and Breaking Method of Mother Substrate
JP5867159B2 (ja) * 2012-02-27 2016-02-24 三星ダイヤモンド工業株式会社 セラミックス基板の割断方法
KR101719175B1 (ko) * 2012-03-08 2017-03-23 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이빙 휠 및 그의 제조 방법
JP2013184388A (ja) * 2012-03-08 2013-09-19 Mitsuboshi Diamond Industrial Co Ltd スクライビングホイール及びその製造方法
JP5998574B2 (ja) * 2012-03-29 2016-09-28 三星ダイヤモンド工業株式会社 スクライビングホイールの製造方法
JP2013233793A (ja) * 2012-04-13 2013-11-21 Mitsuboshi Diamond Industrial Co Ltd スクライビングホイール及びその製造方法
CN104507884A (zh) * 2012-07-27 2015-04-08 二和钻石工业股份有限公司 具有精密结构凹槽的划线轮
CN103864452B (zh) * 2012-12-10 2015-10-21 富泰华精密电子(郑州)有限公司 面板及其制造方法
JP5499150B2 (ja) * 2012-12-21 2014-05-21 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
KR101641652B1 (ko) 2013-02-12 2016-07-21 포리프라스틱 가부시키가이샤 홈붙이 수지 성형품
JP2015143174A (ja) * 2013-12-27 2015-08-06 AvanStrate株式会社 ガラス板の製造方法、シートガラスのスクライブ装置、及びガラス板の製造装置
JP5884852B2 (ja) * 2014-04-18 2016-03-15 坂東機工株式会社 炭化珪素板のスクライブ方法及びスクライブ装置
JP2016007739A (ja) * 2014-06-24 2016-01-18 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
KR20170039143A (ko) * 2014-08-04 2017-04-10 아사히 가라스 가부시키가이샤 무알칼리 유리판의 절단 방법, 디스플레이 패널의 절단 방법, 무알칼리 유리판의 제조 방법, 및 디스플레이 패널의 제조 방법
CN104609717B (zh) * 2014-12-08 2016-09-07 福州大学 一种手工切割玻璃瓶的简易方法
KR101667229B1 (ko) 2015-05-19 2016-10-28 주식회사 비츠로테크 전원절환개폐기의 구동부 구조
JP6234418B2 (ja) * 2015-10-28 2017-11-22 三星ダイヤモンド工業株式会社 スクライビングホイール
JP2016106046A (ja) * 2015-12-28 2016-06-16 三星ダイヤモンド工業株式会社 スクライビングホイールの製造方法
TW202039193A (zh) * 2016-02-26 2020-11-01 日商三星鑽石工業股份有限公司 脆性基板之分斷方法
JP6234534B2 (ja) * 2016-10-31 2017-11-22 三星ダイヤモンド工業株式会社 スクライビングホイール
JP2018086785A (ja) * 2016-11-29 2018-06-07 三星ダイヤモンド工業株式会社 スクライビングホイール及びそのスクライブ方法
JP6255467B2 (ja) * 2016-11-30 2017-12-27 三星ダイヤモンド工業株式会社 スクライビングホイールの製造方法
KR20180071649A (ko) * 2016-12-20 2018-06-28 현대자동차주식회사 연성 평면 케이블, 이를 포함하는 차량 및 연성 평면 케이블의 제조방법
JP6869527B2 (ja) * 2016-12-28 2021-05-12 三星ダイヤモンド工業株式会社 スクライビングホイール
JP6897950B2 (ja) * 2016-12-28 2021-07-07 三星ダイヤモンド工業株式会社 カッターホイール
JP6897951B2 (ja) * 2016-12-28 2021-07-07 三星ダイヤモンド工業株式会社 カッターホイール
CN107672065B (zh) * 2017-10-10 2019-04-05 新昌县群娇农业发展有限公司 硅片的裂片装置
CN110526563A (zh) * 2019-09-09 2019-12-03 东莞通华液晶有限公司 一种薄型液晶玻璃基板的切割裂片方法
JP2022038435A (ja) * 2020-08-26 2022-03-10 ファインテック株式会社 脆性材料基板用のスクライビングホイール及びその製造方法
CN113075908B (zh) * 2021-03-23 2022-04-19 王豪 数控雕铣加工宝玉石工艺品的方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53143622A (en) 1977-05-23 1978-12-14 Hitachi Ltd Cutting blade for glass material
JPS62158129A (ja) * 1985-12-27 1987-07-14 Kyocera Corp ガラス切断用ホイ−ルカツタ
JPH04224128A (ja) * 1990-12-20 1992-08-13 Idemitsu Petrochem Co Ltd ガラス切断用刃
JPH081486A (ja) 1994-06-15 1996-01-09 Taihei Mach Works Ltd 刃物の研削方法および装置
JP3074143B2 (ja) 1995-11-06 2000-08-07 三星ダイヤモンド工業株式会社 ガラスカッターホイール
TW308581B (zh) 1995-11-06 1997-06-21 Mitsuboshi Diamond Kogyo Kk
JPH09239647A (ja) * 1996-03-06 1997-09-16 Toyo Hamono Kk 長尺刃物の刃先仕上装置
JPH11116260A (ja) 1997-10-08 1999-04-27 Mitsuboshi Diamond Kogyo Kk ガラス加工装置
JP3055262U (ja) * 1998-06-24 1999-01-12 トーヨー産業株式会社 カッターホイール
JP3759317B2 (ja) * 1998-08-04 2006-03-22 トーヨー産業株式会社 ガラス切断専用のカッターホイール
JP2989602B1 (ja) * 1999-01-28 1999-12-13 三星ダイヤモンド工業株式会社 ガラスカッタホィ―ル
EP1179512B1 (en) * 2000-08-11 2011-12-28 Mitsuboshi Diamond Industrial Co., Ltd. Cutter wheel, apparatus and method for scribing brittle materials
EP1386891A4 (en) * 2001-04-02 2007-04-18 Mitsuboshi Diamond Ind Co Ltd CUTTING WHEEL, DEVICE AND METHOD WITH THE CUTTING WHEEL, METHOD FOR SHARING LAMINATED SUBSTRATE AND METHOD AND DEVICE FOR PRODUCING THE CUTTING WHEEL
JP3085312U (ja) * 2001-10-11 2002-04-26 トーヨー産業株式会社 カッターホイール
KR100506874B1 (ko) * 2003-03-17 2005-08-05 신한다이아몬드공업 주식회사 피시디 탬프 커터 및 그 제조방법
JP2005001941A (ja) * 2003-06-12 2005-01-06 Thk Co Ltd ダイヤモンドホイール及びスクライブ装置
CN102161219A (zh) * 2004-02-02 2011-08-24 三星钻石工业股份有限公司 刀轮、使用其的脆性材料基板的划线方法及分割方法、刀轮的制造方法

Also Published As

Publication number Publication date
TWI466838B (zh) 2015-01-01
KR101213018B1 (ko) 2012-12-18
CN102161218B (zh) 2015-03-25
KR20060122926A (ko) 2006-11-30
CN101774754B (zh) 2015-11-25
TWI435853B (zh) 2014-05-01
JP5695134B2 (ja) 2015-04-01
JP2011213589A (ja) 2011-10-27
JP2013199131A (ja) 2013-10-03
KR20120068976A (ko) 2012-06-27
KR20120068975A (ko) 2012-06-27
KR20100028659A (ko) 2010-03-12
TWI440613B (zh) 2014-06-11
EP1712339A1 (en) 2006-10-18
TW201144244A (en) 2011-12-16
KR101203903B1 (ko) 2012-11-23
HK1099925A1 (en) 2007-08-31
CN102161218A (zh) 2011-08-24
KR20120108060A (ko) 2012-10-04
CN1914014B (zh) 2011-04-06
JP2011207760A (ja) 2011-10-20
TWI532694B (zh) 2016-05-11
TW200536796A (en) 2005-11-16
KR101185753B1 (ko) 2012-09-26
EP1712339A4 (en) 2010-03-24
JPWO2005072926A1 (ja) 2007-09-13
TW201425247A (zh) 2014-07-01
TW201141800A (en) 2011-12-01
CN1914014A (zh) 2007-02-14
EP2851172A1 (en) 2015-03-25
JP5185412B2 (ja) 2013-04-17
TW201206853A (en) 2012-02-16
KR101267832B1 (ko) 2013-05-27
CN102161219A (zh) 2011-08-24
KR101213020B1 (ko) 2012-12-18
KR20120121922A (ko) 2012-11-06
WO2005072926A1 (ja) 2005-08-11
CN101774754A (zh) 2010-07-14
JP5022602B2 (ja) 2012-09-12
TWI435852B (zh) 2014-05-01
JP5452547B2 (ja) 2014-03-26
KR20110074940A (ko) 2011-07-04

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