SG144799A1 - Probe for high frequency signal transmission and probe card using the same - Google Patents

Probe for high frequency signal transmission and probe card using the same

Info

Publication number
SG144799A1
SG144799A1 SG200718184-5A SG2007181845A SG144799A1 SG 144799 A1 SG144799 A1 SG 144799A1 SG 2007181845 A SG2007181845 A SG 2007181845A SG 144799 A1 SG144799 A1 SG 144799A1
Authority
SG
Singapore
Prior art keywords
probe
high frequency
frequency signal
signal transmission
same
Prior art date
Application number
SG200718184-5A
Other languages
English (en)
Inventor
Wei-Cheng Ku
Chia-Tai Chang
Chien-He Lin
Chih-Hao Ho
He-Huei Lin
Original Assignee
Mjc Probe Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mjc Probe Inc filed Critical Mjc Probe Inc
Publication of SG144799A1 publication Critical patent/SG144799A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SG200718184-5A 2007-01-08 2007-11-30 Probe for high frequency signal transmission and probe card using the same SG144799A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096100746A TW200829922A (en) 2007-01-08 2007-01-08 High frequency probe

Publications (1)

Publication Number Publication Date
SG144799A1 true SG144799A1 (en) 2008-08-28

Family

ID=39510088

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200718184-5A SG144799A1 (en) 2007-01-08 2007-11-30 Probe for high frequency signal transmission and probe card using the same

Country Status (7)

Country Link
US (2) US7791359B2 (https=)
JP (1) JP4759577B2 (https=)
KR (1) KR100959599B1 (https=)
DE (1) DE102008003534B4 (https=)
FR (1) FR2911190B1 (https=)
SG (1) SG144799A1 (https=)
TW (1) TW200829922A (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7683645B2 (en) * 2006-07-06 2010-03-23 Mpi Corporation High-frequency probe card and transmission line for high-frequency probe card
TW200829922A (en) * 2007-01-08 2008-07-16 Microelectonics Technology Inc High frequency probe
TWI447397B (zh) * 2010-05-17 2014-08-01 Star Techn Inc 探針卡
TWI397695B (zh) * 2010-06-10 2013-06-01 Allstron Inc 用於積體電路測試之探測裝置
WO2012057799A1 (en) * 2010-10-29 2012-05-03 Advantest (Singapore) Pte Ltd Tester having an application specific electronics module, and systems and methods that incorporate or use same
TWI482975B (zh) * 2011-05-27 2015-05-01 Mpi Corp Spring-type micro-high-frequency probe
WO2013006771A2 (en) 2011-07-06 2013-01-10 Celadon Systems, Inc. Test systems with a probe apparatus and index mechanism
CN103930982B (zh) * 2011-07-06 2016-07-06 塞莱敦体系股份有限公司 具有探针卡的测试设备及连接器机构
TWI444625B (zh) * 2012-03-20 2014-07-11 Mpi Corp High frequency probe card
JP5748709B2 (ja) * 2012-06-05 2015-07-15 三菱電機株式会社 プローブカード
TWI471570B (zh) * 2012-12-26 2015-02-01 Mpi Corp High frequency probe card
TWI512300B (zh) * 2013-07-15 2015-12-11 Mpi Corp Cantilever high frequency probe card
TW201504631A (zh) * 2013-07-23 2015-02-01 Mpi Corp 光電元件檢測用之高頻探針卡
JP6118710B2 (ja) * 2013-10-30 2017-04-19 日本電子材料株式会社 プローブカード
TWI522623B (zh) * 2013-12-13 2016-02-21 Mpi Corp Probe module (1)
TWI506280B (zh) * 2013-12-13 2015-11-01 Mpi Corp Probe module (2)
CN109001500B (zh) * 2018-08-21 2024-01-02 淮阴师范学院 一种内嵌电感的射频器件测试探针
CN111721976B (zh) * 2019-03-18 2023-04-28 台湾中华精测科技股份有限公司 探针卡装置及其导电探针
KR102088205B1 (ko) * 2019-08-30 2020-03-16 주식회사 프로이천 디스플레이 패널 검사용 프로브 핀

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2918164B2 (ja) * 1989-01-10 1999-07-12 富士通株式会社 プローブカード
JPH048973U (https=) * 1990-05-14 1992-01-27
JPH0436239U (https=) * 1990-07-20 1992-03-26
US5264788A (en) 1992-06-12 1993-11-23 Cascade Microtech, Inc. Adjustable strap implemented return line for a probe station
US5382898A (en) 1992-09-21 1995-01-17 Cerprobe Corporation High density probe card for testing electrical circuits
US5594358A (en) * 1993-09-02 1997-01-14 Matsushita Electric Industrial Co., Ltd. Radio frequency probe and probe card including a signal needle and grounding needle coupled to a microstrip transmission line
CN1036945C (zh) 1994-03-15 1998-01-07 吉林大学 共面集成电路芯片微波探针
JPH09218222A (ja) * 1996-02-08 1997-08-19 Advantest Corp プローブカード
US6603322B1 (en) * 1996-12-12 2003-08-05 Ggb Industries, Inc. Probe card for high speed testing
JPH11108955A (ja) * 1997-09-30 1999-04-23 Mitsubishi Electric Corp ウエハプローバー
US6298312B1 (en) * 1998-07-22 2001-10-02 Taiwan Semiconductor Manufacturing Company, Ltd. Method of determining the tip angle of a probe card needle
JP2001091543A (ja) * 1999-09-27 2001-04-06 Hitachi Ltd 半導体検査装置
US6727716B1 (en) * 2002-12-16 2004-04-27 Newport Fab, Llc Probe card and probe needle for high frequency testing
JP2004309257A (ja) * 2003-04-04 2004-11-04 Micronics Japan Co Ltd プローブカード
CN2715341Y (zh) 2004-07-09 2005-08-03 威盛电子股份有限公司 探针卡
KR100711292B1 (ko) * 2005-04-14 2007-04-25 한국과학기술원 프로브 카드 및 그 제조방법
TWI279548B (en) * 2005-08-04 2007-04-21 Mjc Probe Inc High frequency cantilever type probe card
TWI274161B (en) * 2005-08-29 2007-02-21 Mjc Probe Inc Electrical contact device of probe card
US7683645B2 (en) * 2006-07-06 2010-03-23 Mpi Corporation High-frequency probe card and transmission line for high-frequency probe card
US7368928B2 (en) * 2006-08-29 2008-05-06 Mjc Probe Incorporation Vertical type high frequency probe card
KR100795909B1 (ko) 2006-12-12 2008-01-21 삼성전자주식회사 반도체 검사 장치의 프로브 카드
KR100806379B1 (ko) 2006-12-22 2008-02-27 세크론 주식회사 프로브 및 이를 포함하는 프로브 카드
TW200829922A (en) 2007-01-08 2008-07-16 Microelectonics Technology Inc High frequency probe
US7724009B2 (en) * 2007-02-09 2010-05-25 Mpi Corporation Method of making high-frequency probe, probe card using the high-frequency probe
US7595651B2 (en) * 2007-02-13 2009-09-29 Mpi Corporation Cantilever-type probe card for high frequency application
TWI367329B (en) * 2008-06-19 2012-07-01 King Yuan Electronics Co Ltd Probe card assembly

Also Published As

Publication number Publication date
FR2911190B1 (fr) 2014-08-08
US20080164900A1 (en) 2008-07-10
DE102008003534B4 (de) 2013-05-29
TWI322890B (https=) 2010-04-01
US8106673B2 (en) 2012-01-31
JP2008170441A (ja) 2008-07-24
JP4759577B2 (ja) 2011-08-31
TW200829922A (en) 2008-07-16
KR100959599B1 (ko) 2010-05-27
DE102008003534A1 (de) 2008-07-17
US7791359B2 (en) 2010-09-07
FR2911190A1 (fr) 2008-07-11
KR20080065235A (ko) 2008-07-11
US20100253378A1 (en) 2010-10-07

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