SG143242A1 - Imagine sensor package and forming method of the same - Google Patents
Imagine sensor package and forming method of the sameInfo
- Publication number
- SG143242A1 SG143242A1 SG200718519-2A SG2007185192A SG143242A1 SG 143242 A1 SG143242 A1 SG 143242A1 SG 2007185192 A SG2007185192 A SG 2007185192A SG 143242 A1 SG143242 A1 SG 143242A1
- Authority
- SG
- Singapore
- Prior art keywords
- sensor package
- forming method
- substrate
- same
- molding material
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000012778 molding material Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/608,266 US20080136012A1 (en) | 2006-12-08 | 2006-12-08 | Imagine sensor package and forming method of the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG143242A1 true SG143242A1 (en) | 2008-06-27 |
Family
ID=39497005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200718519-2A SG143242A1 (en) | 2006-12-08 | 2007-12-10 | Imagine sensor package and forming method of the same |
Country Status (7)
Country | Link |
---|---|
US (2) | US20080136012A1 (ko) |
JP (1) | JP2008205429A (ko) |
KR (1) | KR20080053240A (ko) |
CN (1) | CN101197384A (ko) |
DE (1) | DE102007059159A1 (ko) |
SG (1) | SG143242A1 (ko) |
TW (1) | TW200826271A (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7886609B2 (en) * | 2009-05-06 | 2011-02-15 | Freescale Semiconductor, Inc. | Pressure sensor package |
US8659105B2 (en) | 2009-11-26 | 2014-02-25 | Kyocera Corporation | Wiring substrate, imaging device and imaging device module |
WO2012002378A1 (ja) * | 2010-06-28 | 2012-01-05 | 京セラ株式会社 | 配線基板および撮像装置ならびに撮像装置モジュール |
US8604576B2 (en) * | 2011-07-19 | 2013-12-10 | Opitz, Inc. | Low stress cavity package for back side illuminated image sensor, and method of making same |
KR102055563B1 (ko) | 2012-12-06 | 2019-12-13 | 삼성전자주식회사 | 이미지 센서 패키지 |
TWI544611B (zh) * | 2013-04-01 | 2016-08-01 | 財團法人工業技術研究院 | 背照式光感測元件封裝體 |
CN104576552A (zh) * | 2013-10-15 | 2015-04-29 | 林登炎 | 芯片封装结构及制程 |
WO2016090586A1 (zh) * | 2014-12-11 | 2016-06-16 | 李林涛 | Pcb板工艺边框结构 |
KR101689703B1 (ko) * | 2015-01-23 | 2016-12-27 | 옵토팩 주식회사 | 포토 센서 패키지 모듈 |
CN116579354A (zh) * | 2016-09-14 | 2023-08-11 | 手持产品公司 | 堆叠式pcb可回流焊解码器模块 |
EP3418941B1 (en) * | 2016-11-07 | 2021-08-18 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint recognition module and fingerprint recognition chip packaging structure |
CN109698208B (zh) * | 2017-10-20 | 2023-06-30 | 新加坡有限公司 | 图像传感器的封装方法、图像传感器封装结构和镜头模组 |
CN111602473A (zh) * | 2018-01-15 | 2020-08-28 | Pi-克瑞斯托株式会社 | 柔性基板、电子器件、电子器件的制造方法 |
CN109585575A (zh) * | 2018-11-28 | 2019-04-05 | 深圳市兴森快捷电路科技股份有限公司 | 一种基于陶瓷载板的光电电路封装装置 |
US20210314468A1 (en) * | 2020-04-03 | 2021-10-07 | Facebook Technologies, Llc | Small Camera with Molding Compound |
CN112549431B (zh) * | 2020-11-13 | 2023-07-21 | 深圳先进技术研究院 | 一种用于液体产生装置中的嵌套结构的制备方法 |
CN113423173B (zh) * | 2021-05-29 | 2023-09-29 | 华为技术有限公司 | 电子元件封装体、电子元件封装组件及电子设备 |
CN113705757B (zh) * | 2021-08-30 | 2022-05-31 | 杭州中芯微科技有限公司 | 一种rfid用滤波器基板处理装置 |
CN217983318U (zh) * | 2022-09-14 | 2022-12-06 | 北京市九州风神科技股份有限公司 | 芯片封装的辅助结构 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5168126A (en) * | 1989-08-25 | 1992-12-01 | Kyocera Corporation | Container package for semiconductor element |
EP0515849A3 (en) * | 1991-04-27 | 1993-05-19 | Kanegafuchi Chemical Industry Co., Ltd. | Image sensor |
DE69320113T2 (de) * | 1992-05-22 | 1999-03-11 | Matsushita Electronics Corp., Kadoma, Osaka | Festkörper-Bildsensor und Verfahren zu seiner Herstellung |
US5625232A (en) * | 1994-07-15 | 1997-04-29 | Texas Instruments Incorporated | Reliability of metal leads in high speed LSI semiconductors using dummy vias |
US6490161B1 (en) * | 2002-01-08 | 2002-12-03 | International Business Machines Corporation | Peripheral land grid array package with improved thermal performance |
US20040038442A1 (en) * | 2002-08-26 | 2004-02-26 | Kinsman Larry D. | Optically interactive device packages and methods of assembly |
JP3990347B2 (ja) * | 2003-12-04 | 2007-10-10 | ローム株式会社 | 半導体チップおよびその製造方法、ならびに半導体装置 |
JP4307284B2 (ja) * | 2004-02-17 | 2009-08-05 | 三洋電機株式会社 | 半導体装置の製造方法 |
US7061106B2 (en) * | 2004-04-28 | 2006-06-13 | Advanced Chip Engineering Technology Inc. | Structure of image sensor module and a method for manufacturing of wafer level package |
JP4271625B2 (ja) * | 2004-06-30 | 2009-06-03 | 株式会社フジクラ | 半導体パッケージ及びその製造方法 |
US7288757B2 (en) * | 2005-09-01 | 2007-10-30 | Micron Technology, Inc. | Microelectronic imaging devices and associated methods for attaching transmissive elements |
JP4951989B2 (ja) * | 2006-02-09 | 2012-06-13 | 富士通セミコンダクター株式会社 | 半導体装置 |
US7531443B2 (en) * | 2006-12-08 | 2009-05-12 | Micron Technology, Inc. | Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors |
-
2006
- 2006-12-08 US US11/608,266 patent/US20080136012A1/en not_active Abandoned
-
2007
- 2007-11-12 TW TW096142760A patent/TW200826271A/zh unknown
- 2007-12-06 DE DE102007059159A patent/DE102007059159A1/de not_active Withdrawn
- 2007-12-07 CN CNA2007101865333A patent/CN101197384A/zh active Pending
- 2007-12-07 JP JP2007316498A patent/JP2008205429A/ja not_active Withdrawn
- 2007-12-10 KR KR1020070127721A patent/KR20080053240A/ko not_active Application Discontinuation
- 2007-12-10 SG SG200718519-2A patent/SG143242A1/en unknown
-
2008
- 2008-05-08 US US12/117,087 patent/US7863105B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20080053240A (ko) | 2008-06-12 |
US7863105B2 (en) | 2011-01-04 |
CN101197384A (zh) | 2008-06-11 |
TW200826271A (en) | 2008-06-16 |
US20080136012A1 (en) | 2008-06-12 |
JP2008205429A (ja) | 2008-09-04 |
US20080206918A1 (en) | 2008-08-28 |
DE102007059159A1 (de) | 2008-08-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG143242A1 (en) | Imagine sensor package and forming method of the same | |
SG144891A1 (en) | Image sensor package with die receiving opening and method of the same | |
SG148130A1 (en) | Cmos image sensor chip scale package with die receiving through-hole and method of the same | |
SG144128A1 (en) | Semiconductor image device package with die receiving through-hole and method of the same | |
SG135032A1 (en) | Structure of image sensor module and method for manufacturing of wafer level package | |
SG143236A1 (en) | Multi-chips package and method of forming the same | |
SG143208A1 (en) | Image sensor module | |
WO2007145778A3 (en) | Mems device and method of fabricating the same | |
TW200802652A (en) | Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device | |
SG148133A1 (en) | Cmos image sensor chip scale package with die receiving opening and method of the same | |
SG148985A1 (en) | Image sensor package utilizing a removable protection film and method of making the same | |
SG144119A1 (en) | Rf module package | |
TW200607028A (en) | Image sensor module packaging structure and method thereof | |
WO2008093586A1 (ja) | 樹脂封止型半導体装置およびその製造方法 | |
TW200725709A (en) | Semiconductor apparatus and making method thereof | |
TW200642019A (en) | Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device | |
TW200711017A (en) | Bonding pad on IC substrate and method for making the same | |
TW200737376A (en) | Chip package and fabricating method thereof | |
WO2008078655A1 (ja) | 半導体装置 | |
TW200737506A (en) | Semiconductor device and manufacturing method of the same | |
TW200637017A (en) | Image sensor module package | |
SG170099A1 (en) | Integrated circuit package system with warp-free chip | |
SG148987A1 (en) | Inter-connecting structure for semiconductor device package and method of the same | |
TW200743191A (en) | Chip structure and fabricating process thereof | |
MY137824A (en) | Semiconductor device |