SG143242A1 - Imagine sensor package and forming method of the same - Google Patents

Imagine sensor package and forming method of the same

Info

Publication number
SG143242A1
SG143242A1 SG200718519-2A SG2007185192A SG143242A1 SG 143242 A1 SG143242 A1 SG 143242A1 SG 2007185192 A SG2007185192 A SG 2007185192A SG 143242 A1 SG143242 A1 SG 143242A1
Authority
SG
Singapore
Prior art keywords
sensor package
forming method
substrate
same
molding material
Prior art date
Application number
SG200718519-2A
Other languages
English (en)
Inventor
Wen-Kun Yang
Jui-Hsien Chang
Original Assignee
Advanced Chip Eng Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Chip Eng Tech Inc filed Critical Advanced Chip Eng Tech Inc
Publication of SG143242A1 publication Critical patent/SG143242A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
SG200718519-2A 2006-12-08 2007-12-10 Imagine sensor package and forming method of the same SG143242A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/608,266 US20080136012A1 (en) 2006-12-08 2006-12-08 Imagine sensor package and forming method of the same

Publications (1)

Publication Number Publication Date
SG143242A1 true SG143242A1 (en) 2008-06-27

Family

ID=39497005

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200718519-2A SG143242A1 (en) 2006-12-08 2007-12-10 Imagine sensor package and forming method of the same

Country Status (7)

Country Link
US (2) US20080136012A1 (ko)
JP (1) JP2008205429A (ko)
KR (1) KR20080053240A (ko)
CN (1) CN101197384A (ko)
DE (1) DE102007059159A1 (ko)
SG (1) SG143242A1 (ko)
TW (1) TW200826271A (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7886609B2 (en) * 2009-05-06 2011-02-15 Freescale Semiconductor, Inc. Pressure sensor package
US8659105B2 (en) 2009-11-26 2014-02-25 Kyocera Corporation Wiring substrate, imaging device and imaging device module
WO2012002378A1 (ja) * 2010-06-28 2012-01-05 京セラ株式会社 配線基板および撮像装置ならびに撮像装置モジュール
US8604576B2 (en) * 2011-07-19 2013-12-10 Opitz, Inc. Low stress cavity package for back side illuminated image sensor, and method of making same
KR102055563B1 (ko) 2012-12-06 2019-12-13 삼성전자주식회사 이미지 센서 패키지
TWI544611B (zh) * 2013-04-01 2016-08-01 財團法人工業技術研究院 背照式光感測元件封裝體
CN104576552A (zh) * 2013-10-15 2015-04-29 林登炎 芯片封装结构及制程
WO2016090586A1 (zh) * 2014-12-11 2016-06-16 李林涛 Pcb板工艺边框结构
KR101689703B1 (ko) * 2015-01-23 2016-12-27 옵토팩 주식회사 포토 센서 패키지 모듈
CN116579354A (zh) * 2016-09-14 2023-08-11 手持产品公司 堆叠式pcb可回流焊解码器模块
EP3418941B1 (en) * 2016-11-07 2021-08-18 Shenzhen Goodix Technology Co., Ltd. Fingerprint recognition module and fingerprint recognition chip packaging structure
CN109698208B (zh) * 2017-10-20 2023-06-30 新加坡有限公司 图像传感器的封装方法、图像传感器封装结构和镜头模组
CN111602473A (zh) * 2018-01-15 2020-08-28 Pi-克瑞斯托株式会社 柔性基板、电子器件、电子器件的制造方法
CN109585575A (zh) * 2018-11-28 2019-04-05 深圳市兴森快捷电路科技股份有限公司 一种基于陶瓷载板的光电电路封装装置
US20210314468A1 (en) * 2020-04-03 2021-10-07 Facebook Technologies, Llc Small Camera with Molding Compound
CN112549431B (zh) * 2020-11-13 2023-07-21 深圳先进技术研究院 一种用于液体产生装置中的嵌套结构的制备方法
CN113423173B (zh) * 2021-05-29 2023-09-29 华为技术有限公司 电子元件封装体、电子元件封装组件及电子设备
CN113705757B (zh) * 2021-08-30 2022-05-31 杭州中芯微科技有限公司 一种rfid用滤波器基板处理装置
CN217983318U (zh) * 2022-09-14 2022-12-06 北京市九州风神科技股份有限公司 芯片封装的辅助结构

Family Cites Families (13)

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US5168126A (en) * 1989-08-25 1992-12-01 Kyocera Corporation Container package for semiconductor element
EP0515849A3 (en) * 1991-04-27 1993-05-19 Kanegafuchi Chemical Industry Co., Ltd. Image sensor
DE69320113T2 (de) * 1992-05-22 1999-03-11 Matsushita Electronics Corp., Kadoma, Osaka Festkörper-Bildsensor und Verfahren zu seiner Herstellung
US5625232A (en) * 1994-07-15 1997-04-29 Texas Instruments Incorporated Reliability of metal leads in high speed LSI semiconductors using dummy vias
US6490161B1 (en) * 2002-01-08 2002-12-03 International Business Machines Corporation Peripheral land grid array package with improved thermal performance
US20040038442A1 (en) * 2002-08-26 2004-02-26 Kinsman Larry D. Optically interactive device packages and methods of assembly
JP3990347B2 (ja) * 2003-12-04 2007-10-10 ローム株式会社 半導体チップおよびその製造方法、ならびに半導体装置
JP4307284B2 (ja) * 2004-02-17 2009-08-05 三洋電機株式会社 半導体装置の製造方法
US7061106B2 (en) * 2004-04-28 2006-06-13 Advanced Chip Engineering Technology Inc. Structure of image sensor module and a method for manufacturing of wafer level package
JP4271625B2 (ja) * 2004-06-30 2009-06-03 株式会社フジクラ 半導体パッケージ及びその製造方法
US7288757B2 (en) * 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
JP4951989B2 (ja) * 2006-02-09 2012-06-13 富士通セミコンダクター株式会社 半導体装置
US7531443B2 (en) * 2006-12-08 2009-05-12 Micron Technology, Inc. Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors

Also Published As

Publication number Publication date
KR20080053240A (ko) 2008-06-12
US7863105B2 (en) 2011-01-04
CN101197384A (zh) 2008-06-11
TW200826271A (en) 2008-06-16
US20080136012A1 (en) 2008-06-12
JP2008205429A (ja) 2008-09-04
US20080206918A1 (en) 2008-08-28
DE102007059159A1 (de) 2008-08-21

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