SG139650A1 - Lithographic apparatus, aberration correction device and device manufacturing method - Google Patents

Lithographic apparatus, aberration correction device and device manufacturing method

Info

Publication number
SG139650A1
SG139650A1 SG200705084-2A SG2007050842A SG139650A1 SG 139650 A1 SG139650 A1 SG 139650A1 SG 2007050842 A SG2007050842 A SG 2007050842A SG 139650 A1 SG139650 A1 SG 139650A1
Authority
SG
Singapore
Prior art keywords
aberration correction
correction device
lithographic apparatus
describable
elements
Prior art date
Application number
SG200705084-2A
Other languages
English (en)
Inventor
Tammo Uitterdijk
Laurentius Catrinus Jorritsma
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG139650A1 publication Critical patent/SG139650A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Lenses (AREA)
SG200705084-2A 2006-07-18 2007-07-06 Lithographic apparatus, aberration correction device and device manufacturing method SG139650A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/488,172 US7372633B2 (en) 2006-07-18 2006-07-18 Lithographic apparatus, aberration correction device and device manufacturing method

Publications (1)

Publication Number Publication Date
SG139650A1 true SG139650A1 (en) 2008-02-29

Family

ID=38510377

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200705084-2A SG139650A1 (en) 2006-07-18 2007-07-06 Lithographic apparatus, aberration correction device and device manufacturing method

Country Status (7)

Country Link
US (2) US7372633B2 (ko)
EP (1) EP1881373A1 (ko)
JP (1) JP4536088B2 (ko)
KR (1) KR100873972B1 (ko)
CN (1) CN101109909B (ko)
SG (1) SG139650A1 (ko)
TW (1) TWI361958B (ko)

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NL1036905A1 (nl) * 2008-06-03 2009-12-04 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
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DE102008043243A1 (de) * 2008-10-28 2009-10-29 Carl Zeiss Smt Ag Projektionsobjektiv für die Mikrolithographie sowie Verfahren zum Verbessern der Abbildungseigenschaften eines Projektionsobjektivs
NL2003806A (en) * 2008-12-15 2010-06-16 Asml Netherlands Bv Method for a lithographic apparatus.
JP5312058B2 (ja) * 2009-01-19 2013-10-09 キヤノン株式会社 投影光学系、露光装置及びデバイス製造方法
KR101675380B1 (ko) 2010-02-19 2016-11-14 삼성전자주식회사 오버레이 보정방법 및 그를 이용한 반도체 제조방법
CN102236260B (zh) * 2010-04-27 2013-05-22 上海微电子装备有限公司 一种波像差校正系统与方法
JP6012628B2 (ja) 2011-01-20 2016-10-25 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィのための投影露光ツールを作動させる方法
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US8625078B2 (en) * 2011-04-06 2014-01-07 Nanya Technology Corp. Illumination design for lens heating mitigation
US8736814B2 (en) * 2011-06-13 2014-05-27 Micron Technology, Inc. Lithography wave-front control system and method
CN102368114A (zh) * 2011-11-15 2012-03-07 中国科学院西安光学精密机械研究所 基于波像差检测的光学系统面形补偿装调方法
US9940427B2 (en) * 2012-02-09 2018-04-10 Asml Netherlands B.V. Lens heating aware source mask optimization for advanced lithography
US10133184B2 (en) 2012-04-25 2018-11-20 Nikon Corporation Using customized lens pupil optimization to enhance lithographic imaging in a source-mask optimization scheme
JP6410406B2 (ja) * 2012-11-16 2018-10-24 キヤノン株式会社 投影光学系、露光装置および物品の製造方法
JP2014120682A (ja) * 2012-12-18 2014-06-30 Canon Inc 露光装置、露光方法及びデバイス製造方法
DE102013204572A1 (de) * 2013-03-15 2014-09-18 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage mit hochflexiblem Manipulator
WO2014203961A1 (ja) 2013-06-21 2014-12-24 Hoya株式会社 マスクブランク用基板、マスクブランク、転写用マスク及びこれらの製造方法並びに半導体デバイスの製造方法
CN103322942A (zh) * 2013-07-15 2013-09-25 中国科学院光电技术研究所 基于波像差的光学系统各光学件面形的检测方法
JP6381210B2 (ja) * 2013-12-27 2018-08-29 キヤノン株式会社 光学素子ユニット、回転方向の相対位置の調整方法、露光装置、物品の製造方法
US10248027B2 (en) * 2014-01-12 2019-04-02 Asml Netherlands B.V. Projection system
JP6422307B2 (ja) 2014-11-05 2018-11-14 キヤノン株式会社 露光方法、露光装置、および物品の製造方法
US10078272B2 (en) * 2014-12-02 2018-09-18 Asml Netherlands B.V. Lithographic method and apparatus
US20170363952A1 (en) 2014-12-19 2017-12-21 Hoya Corporation Mask blank substrate, mask blank, and methods for manufacturing them, method for manufacturing transfer mask, and method for manufacturing semiconductor device
JP6730850B2 (ja) * 2016-06-01 2020-07-29 キヤノン株式会社 露光条件の決定方法、プログラム、情報処理装置、露光装置、および物品製造方法
JP6971637B2 (ja) * 2016-06-29 2021-11-24 キヤノン株式会社 アタッチメント光学系、撮像光学系、および、撮像装置
JP6744984B2 (ja) * 2016-08-11 2020-08-19 エーエスエムエル ホールディング エヌ．ブイ． 波面の可変コレクタ
JP6445501B2 (ja) * 2016-09-20 2018-12-26 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィのための投影露光ツールを作動させる方法
CN106405869B (zh) * 2016-12-14 2019-06-14 北京耐德佳显示技术有限公司 可调节焦距的透镜组
NL2021608A (en) * 2017-09-20 2019-03-26 Asml Netherlands Bv Control system for a lithographic apparatus
US10809624B2 (en) 2018-10-18 2020-10-20 Samsung Electronics Co., Ltd. Extreme ultraviolet exposure apparatus and method, and method of manufacturing semiconductor device by using the exposure method
JP2019070812A (ja) * 2018-11-29 2019-05-09 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィのための投影露光ツールを作動させる方法
JP7178932B2 (ja) * 2019-03-12 2022-11-28 キヤノン株式会社 露光装置、および物品製造方法
KR20240055798A (ko) * 2021-09-01 2024-04-29 코닝 인코포레이티드 변형 가능 렌즈 플레이트를 사용한 배율 조정 가능 투사 시스템

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EP1347501A4 (en) * 2000-12-22 2006-06-21 Nikon Corp WAVE FRONT ABERRATION MEASURING INSTRUMENT, WAVE FRONT ABERRATION MEASUREMENT METHOD, EXPOSURE APPARATUS, AND METHOD FOR MANUFACTURING MICRODISPOSITIVE DEVICE
DE10140608A1 (de) * 2001-08-18 2003-03-06 Zeiss Carl Vorrichtung zur Justage eines optischen Elements
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Also Published As

Publication number Publication date
CN101109909B (zh) 2011-05-11
KR20080008248A (ko) 2008-01-23
EP1881373A1 (en) 2008-01-23
JP4536088B2 (ja) 2010-09-01
US7538952B2 (en) 2009-05-26
JP2008028388A (ja) 2008-02-07
US7372633B2 (en) 2008-05-13
TW200811608A (en) 2008-03-01
KR100873972B1 (ko) 2008-12-17
TWI361958B (en) 2012-04-11
CN101109909A (zh) 2008-01-23
US20080024874A1 (en) 2008-01-31
US20080212183A1 (en) 2008-09-04

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