SG117514A1 - Integrated circuit wafer packaging system and method - Google Patents

Integrated circuit wafer packaging system and method

Info

Publication number
SG117514A1
SG117514A1 SG200407625A SG200407625A SG117514A1 SG 117514 A1 SG117514 A1 SG 117514A1 SG 200407625 A SG200407625 A SG 200407625A SG 200407625 A SG200407625 A SG 200407625A SG 117514 A1 SG117514 A1 SG 117514A1
Authority
SG
Singapore
Prior art keywords
integrated circuit
packaging system
circuit wafer
wafer packaging
integrated
Prior art date
Application number
SG200407625A
Other languages
English (en)
Inventor
Ray G Brooks
Timothy W Brooks
Original Assignee
Convey Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Convey Inc filed Critical Convey Inc
Publication of SG117514A1 publication Critical patent/SG117514A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/832—Semiconductor wafer boat

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Buffer Packaging (AREA)
  • Packages (AREA)
SG200407625A 2004-06-03 2004-12-22 Integrated circuit wafer packaging system and method SG117514A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/859,720 US7578392B2 (en) 2003-06-06 2004-06-03 Integrated circuit wafer packaging system and method

Publications (1)

Publication Number Publication Date
SG117514A1 true SG117514A1 (en) 2005-12-29

Family

ID=34933336

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200407625A SG117514A1 (en) 2004-06-03 2004-12-22 Integrated circuit wafer packaging system and method

Country Status (7)

Country Link
US (1) US7578392B2 (ko)
EP (1) EP1603156A3 (ko)
JP (1) JP2005347734A (ko)
KR (1) KR20050115201A (ko)
CN (1) CN1704321A (ko)
SG (1) SG117514A1 (ko)
TW (1) TW200540079A (ko)

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US8109390B2 (en) 2009-08-26 2012-02-07 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with overlapping wall structure
US8556079B2 (en) * 2009-08-26 2013-10-15 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with adjustable inside diameter
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US9677985B2 (en) * 2014-05-13 2017-06-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for inspecting filtering cartridge
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TW201632899A (zh) * 2015-03-11 2016-09-16 All Ring Tech Co Ltd 電子元件分類料盒防落料受損方法及裝置
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USD824602S1 (en) 2015-07-31 2018-07-31 Purina Animal Nutrition Llc Animal feed tub and cover
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USD906765S1 (en) * 2018-07-02 2021-01-05 Blue Ab Bottle
CN109292280B (zh) * 2018-09-11 2021-01-26 京东方科技集团股份有限公司 用于装载薄膜的盒和装载薄膜的方法
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JP7278482B2 (ja) * 2019-10-07 2023-05-19 ピンク ゲーエムベーハー テルモジステーメ 電子アセンブリを接続するためのシステム及び方法
CN111864052B (zh) * 2019-10-18 2024-05-28 辽宁省交通高等专科学校 一种压电式力传感器晶组成型装置及封装方法
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Also Published As

Publication number Publication date
JP2005347734A (ja) 2005-12-15
US20050269241A1 (en) 2005-12-08
CN1704321A (zh) 2005-12-07
EP1603156A2 (en) 2005-12-07
US7578392B2 (en) 2009-08-25
US20080185315A9 (en) 2008-08-07
KR20050115201A (ko) 2005-12-07
TW200540079A (en) 2005-12-16
EP1603156A3 (en) 2006-03-08

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