SG114574A1 - Two layer lto backside seal for a wafer - Google Patents

Two layer lto backside seal for a wafer

Info

Publication number
SG114574A1
SG114574A1 SG200205833A SG200205833A SG114574A1 SG 114574 A1 SG114574 A1 SG 114574A1 SG 200205833 A SG200205833 A SG 200205833A SG 200205833 A SG200205833 A SG 200205833A SG 114574 A1 SG114574 A1 SG 114574A1
Authority
SG
Singapore
Prior art keywords
wafer
backside seal
layer lto
lto backside
layer
Prior art date
Application number
SG200205833A
Other languages
English (en)
Inventor
Jin Xing Li
Boon Koon Ow
Original Assignee
Siltronic Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Singapore Pte Ltd filed Critical Siltronic Singapore Pte Ltd
Priority to SG200205833A priority Critical patent/SG114574A1/en
Priority to JP2004538947A priority patent/JP4755421B2/ja
Priority to US10/528,765 priority patent/US8007914B2/en
Priority to CNB038228084A priority patent/CN100409407C/zh
Priority to EP03748059A priority patent/EP1543545B1/en
Priority to DE60310100T priority patent/DE60310100T2/de
Priority to KR1020047019006A priority patent/KR100713112B1/ko
Priority to PCT/EP2003/010410 priority patent/WO2004030060A1/en
Priority to TW092126259A priority patent/TWI228783B/zh
Publication of SG114574A1 publication Critical patent/SG114574A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/2205—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities from the substrate during epitaxy, e.g. autodoping; Preventing or using autodoping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
    • H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Formation Of Insulating Films (AREA)
  • Chemical Vapour Deposition (AREA)
SG200205833A 2002-09-25 2002-09-25 Two layer lto backside seal for a wafer SG114574A1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
SG200205833A SG114574A1 (en) 2002-09-25 2002-09-25 Two layer lto backside seal for a wafer
JP2004538947A JP4755421B2 (ja) 2002-09-25 2003-09-18 ウェハ用二層ｌｔｏ背面シール
US10/528,765 US8007914B2 (en) 2002-09-25 2003-09-18 Two layer LTO temperature oxide backside seal for a wafer
CNB038228084A CN100409407C (zh) 2002-09-25 2003-09-18 用于晶圆的两层lto背面密封
EP03748059A EP1543545B1 (en) 2002-09-25 2003-09-18 Wafer having a two layer low temperature oxide backside seal and method of manufacturing the same
DE60310100T DE60310100T2 (de) 2002-09-25 2003-09-18 Scheibe mit einer rückseitendichtung aus zweischicht-niedrigtemperatur-oxyd und verfahren zu ihrer herstellung
KR1020047019006A KR100713112B1 (ko) 2002-09-25 2003-09-18 2층 배면 실-포함 웨이퍼 및, 웨이퍼 상의 2층 lto 배면 실 형성 방법
PCT/EP2003/010410 WO2004030060A1 (en) 2002-09-25 2003-09-18 Two layer lto temperature oxide backside seal for a wafer
TW092126259A TWI228783B (en) 2002-09-25 2003-09-23 Two layer LTO backside seal for a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200205833A SG114574A1 (en) 2002-09-25 2002-09-25 Two layer lto backside seal for a wafer

Publications (1)

Publication Number Publication Date
SG114574A1 true SG114574A1 (en) 2005-09-28

Family

ID=32041147

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200205833A SG114574A1 (en) 2002-09-25 2002-09-25 Two layer lto backside seal for a wafer

Country Status (9)

Country Link
US (1) US8007914B2 (ja)
EP (1) EP1543545B1 (ja)
JP (1) JP4755421B2 (ja)
KR (1) KR100713112B1 (ja)
CN (1) CN100409407C (ja)
DE (1) DE60310100T2 (ja)
SG (1) SG114574A1 (ja)
TW (1) TWI228783B (ja)
WO (1) WO2004030060A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114380326A (zh) * 2022-01-11 2022-04-22 辽宁石油化工大学 一种含氧缺陷钛酸锂锌负极材料及其制备方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2251897B1 (en) * 2009-05-13 2016-01-06 Siltronic AG A method for producing a wafer comprising a silicon single crystal substrate having a front and a back side and a layer of SiGe deposited on the front side
DE102010006725B4 (de) * 2010-02-03 2016-03-03 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe aus Silizium mit einer epitaktisch abgeschiedenen Schicht
US8846500B2 (en) * 2010-12-13 2014-09-30 Semiconductor Components Industries, Llc Method of forming a gettering structure having reduced warpage and gettering a semiconductor wafer therewith
CN106611787A (zh) * 2015-10-26 2017-05-03 联华电子股份有限公司 半导体结构及其制作方法
CN109216156B (zh) * 2017-07-04 2020-12-15 上海新昇半导体科技有限公司 一种背面密封晶片的方法
CN109216212A (zh) * 2017-07-04 2019-01-15 上海新昇半导体科技有限公司 背面密封晶片的方法
CN109216157A (zh) * 2017-07-04 2019-01-15 上海新昇半导体科技有限公司 晶片背面密封的方法
CN109216155A (zh) * 2017-07-04 2019-01-15 上海新昇半导体科技有限公司 一种晶片背面密封的方法
CN111681945A (zh) * 2020-05-11 2020-09-18 中环领先半导体材料有限公司 一种多晶背封改善大直径半导体硅片几何参数的工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769104A (en) * 1970-03-27 1973-10-30 Hitachi Ltd Method of preventing autodoping during the epitaxial growth of compound semiconductors from the vapor phase
US4446194A (en) * 1982-06-21 1984-05-01 Motorola, Inc. Dual layer passivation
US5296385A (en) * 1991-12-31 1994-03-22 Texas Instruments Incorporated Conditioning of semiconductor wafers for uniform and repeatable rapid thermal processing
US5562770A (en) * 1994-11-22 1996-10-08 International Business Machines Corporation Semiconductor manufacturing process for low dislocation defects
EP0798765A2 (en) * 1996-03-28 1997-10-01 Shin-Etsu Handotai Company Limited Method of manufacturing a semiconductor wafer comprising a dopant evaporation preventive film on one main surface and an epitaxial layer on the other main surface

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02246117A (ja) * 1989-03-17 1990-10-01 Mitsubishi Electric Corp 薄膜形成方法
US5234851A (en) * 1989-09-05 1993-08-10 General Electric Company Small cell, low contact assistance rugged power field effect devices and method of fabrication
JPH03284848A (ja) * 1990-03-30 1991-12-16 Kyushu Electron Metal Co Ltd シリコンウェーハ
JPH1074770A (ja) 1996-08-01 1998-03-17 Siemens Ag ドープされたシリコン基板
JP3454033B2 (ja) * 1996-08-19 2003-10-06 信越半導体株式会社 シリコンウェーハおよびその製造方法
JPH10223640A (ja) * 1997-02-12 1998-08-21 Nec Corp 半導体基板およびその製造方法
US6149987A (en) 1998-04-07 2000-11-21 Applied Materials, Inc. Method for depositing low dielectric constant oxide films
US20020076917A1 (en) * 1999-12-20 2002-06-20 Edward P Barth Dual damascene interconnect structure using low stress flourosilicate insulator with copper conductors
US6440840B1 (en) * 2002-01-25 2002-08-27 Taiwan Semiconductor Manufactoring Company Damascene process to eliminate copper defects during chemical-mechanical polishing (CMP) for making electrical interconnections on integrated circuits

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769104A (en) * 1970-03-27 1973-10-30 Hitachi Ltd Method of preventing autodoping during the epitaxial growth of compound semiconductors from the vapor phase
US4446194A (en) * 1982-06-21 1984-05-01 Motorola, Inc. Dual layer passivation
US5296385A (en) * 1991-12-31 1994-03-22 Texas Instruments Incorporated Conditioning of semiconductor wafers for uniform and repeatable rapid thermal processing
US5562770A (en) * 1994-11-22 1996-10-08 International Business Machines Corporation Semiconductor manufacturing process for low dislocation defects
EP0798765A2 (en) * 1996-03-28 1997-10-01 Shin-Etsu Handotai Company Limited Method of manufacturing a semiconductor wafer comprising a dopant evaporation preventive film on one main surface and an epitaxial layer on the other main surface

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114380326A (zh) * 2022-01-11 2022-04-22 辽宁石油化工大学 一种含氧缺陷钛酸锂锌负极材料及其制备方法
CN114380326B (zh) * 2022-01-11 2023-05-09 辽宁石油化工大学 一种含氧缺陷钛酸锂锌负极材料及其制备方法

Also Published As

Publication number Publication date
EP1543545B1 (en) 2006-11-29
CN100409407C (zh) 2008-08-06
EP1543545A1 (en) 2005-06-22
TW200408017A (en) 2004-05-16
DE60310100T2 (de) 2007-05-16
TWI228783B (en) 2005-03-01
JP2006500778A (ja) 2006-01-05
CN1685478A (zh) 2005-10-19
US8007914B2 (en) 2011-08-30
WO2004030060A1 (en) 2004-04-08
US20070065671A1 (en) 2007-03-22
KR20050004865A (ko) 2005-01-12
JP4755421B2 (ja) 2011-08-24
KR100713112B1 (ko) 2007-05-02
DE60310100D1 (de) 2007-01-11

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