SG114489A1 - Process to manufacture tight tolerance embedded elements for printed circuit boards - Google Patents

Process to manufacture tight tolerance embedded elements for printed circuit boards

Info

Publication number
SG114489A1
SG114489A1 SG200102999A SG200102999A SG114489A1 SG 114489 A1 SG114489 A1 SG 114489A1 SG 200102999 A SG200102999 A SG 200102999A SG 200102999 A SG200102999 A SG 200102999A SG 114489 A1 SG114489 A1 SG 114489A1
Authority
SG
Singapore
Prior art keywords
printed circuit
circuit boards
tight tolerance
embedded elements
manufacture
Prior art date
Application number
SG200102999A
Other languages
English (en)
Inventor
A Andresakis John
Original Assignee
Oak Mitsui Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oak Mitsui Inc filed Critical Oak Mitsui Inc
Publication of SG114489A1 publication Critical patent/SG114489A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SG200102999A 2000-05-25 2001-05-18 Process to manufacture tight tolerance embedded elements for printed circuit boards SG114489A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/578,424 US6606792B1 (en) 2000-05-25 2000-05-25 Process to manufacturing tight tolerance embedded elements for printed circuit boards

Publications (1)

Publication Number Publication Date
SG114489A1 true SG114489A1 (en) 2005-09-28

Family

ID=24312824

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200102999A SG114489A1 (en) 2000-05-25 2001-05-18 Process to manufacture tight tolerance embedded elements for printed circuit boards

Country Status (9)

Country Link
US (1) US6606792B1 (zh)
EP (1) EP1161123A3 (zh)
JP (1) JP4591987B2 (zh)
KR (1) KR100777994B1 (zh)
CN (1) CN1203735C (zh)
CA (1) CA2345829C (zh)
MY (1) MY127243A (zh)
SG (1) SG114489A1 (zh)
TW (1) TW511429B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1990833A3 (en) * 2000-02-25 2010-09-29 Ibiden Co., Ltd. Multilayer printed circuit board and multilayer printed circuit board manufacturing method
EP1321980A4 (en) * 2000-09-25 2007-04-04 Ibiden Co Ltd SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
US6767445B2 (en) * 2002-10-16 2004-07-27 Peter Kukanskis Method for the manufacture of printed circuit boards with integral plated resistors
TW200418716A (en) * 2003-03-21 2004-10-01 Hon Hai Prec Ind Co Ltd A cavity and the method for fabricating the same
US8134084B2 (en) 2006-06-30 2012-03-13 Shin-Etsu Polymer Co., Ltd. Noise-suppressing wiring-member and printed wiring board
US8240036B2 (en) * 2008-04-30 2012-08-14 Panasonic Corporation Method of producing a circuit board
JP2009143233A (ja) * 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
CN108058373B (zh) 2011-04-17 2021-03-16 斯特拉塔西斯有限公司 用于对象的增材制造的系统和方法
JP2013113939A (ja) * 2011-11-25 2013-06-10 Dainippon Printing Co Ltd ３次元表示用パターン配向膜用原版の製造方法
US9407117B2 (en) * 2012-04-12 2016-08-02 Eastman Kodak Company Shaped electrical conductor
CN104360443A (zh) * 2014-11-14 2015-02-18 四川飞阳科技有限公司 一种刻蚀方法
US10285283B2 (en) 2016-06-03 2019-05-07 International Business Machines Corporation Heating of printed circuit board core during laminate cure
CN107466157A (zh) * 2017-06-20 2017-12-12 深圳崇达多层线路板有限公司 一种埋阻板及使用该埋阻板制作印制线路板的方法
CN107333393A (zh) * 2017-07-19 2017-11-07 深圳崇达多层线路板有限公司 一种埋阻板材的制作方法
CN109819582A (zh) * 2017-11-22 2019-05-28 奇酷互联网络科技（深圳）有限公司 电路板、电量监测电路、电路板制作方法及电子设备
CN109963406B (zh) * 2017-12-25 2021-10-19 宏启胜精密电子(秦皇岛)有限公司 具内埋电阻的柔性电路板及其制作方法
CN110099511A (zh) * 2018-01-30 2019-08-06 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法
CN117677081B (zh) * 2023-10-09 2024-08-02 四川泰瑞创通讯技术股份有限公司 Pcb板和pcb板的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4926292A (en) * 1989-08-09 1990-05-15 Avantek, Inc. Broadband printed spiral
EP0955642A2 (en) * 1998-04-29 1999-11-10 Morton International, Inc. Formation of thin films resistors

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US4075420A (en) * 1975-08-28 1978-02-21 Burroughs Corporation Cover layer for flexible circuits
JPS5469768A (en) 1977-11-14 1979-06-05 Nitto Electric Ind Co Printing circuit substrate with resistance
DE3041777A1 (de) * 1980-11-05 1982-06-09 Siemens AG, 1000 Berlin und 8000 München Verfahren zur serienmaessigen herstellung von elektrischen folienschaltungen
US5069628A (en) * 1990-03-13 1991-12-03 Hughes Aircraft Company Flexible electrical cable connector with double sided dots
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
US5274912A (en) * 1992-09-01 1994-01-04 Rogers Corporation Method of manufacturing a multilayer circuit board
JP3756580B2 (ja) * 1995-11-07 2006-03-15 セイコープレシジョン株式会社 多層基板の製造方法及びその製造装置
US5942314A (en) 1997-04-17 1999-08-24 Mitsui Mining & Smelting Co., Ltd. Ultrasonic welding of copper foil
US6171921B1 (en) * 1998-06-05 2001-01-09 Motorola, Inc. Method for forming a thick-film resistor and thick-film resistor formed thereby
US6247229B1 (en) * 1999-08-25 2001-06-19 Ankor Technology, Inc. Method of forming an integrated circuit device package using a plastic tape as a base
US6356455B1 (en) * 1999-09-23 2002-03-12 Morton International, Inc. Thin integral resistor/capacitor/inductor package, method of manufacture
US6212078B1 (en) * 1999-10-27 2001-04-03 Microcoating Technologies Nanolaminated thin film circuitry materials

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4926292A (en) * 1989-08-09 1990-05-15 Avantek, Inc. Broadband printed spiral
EP0955642A2 (en) * 1998-04-29 1999-11-10 Morton International, Inc. Formation of thin films resistors

Also Published As

Publication number Publication date
CN1203735C (zh) 2005-05-25
CA2345829A1 (en) 2001-11-25
CN1335742A (zh) 2002-02-13
EP1161123A2 (en) 2001-12-05
TW511429B (en) 2002-11-21
MY127243A (en) 2006-11-30
JP4591987B2 (ja) 2010-12-01
CA2345829C (en) 2009-08-11
KR100777994B1 (ko) 2007-11-21
US6606792B1 (en) 2003-08-19
EP1161123A3 (en) 2004-07-28
KR20010107703A (ko) 2001-12-07
JP2002055462A (ja) 2002-02-20

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