SG112978A1 - Apparatus method for control, pumping and abatement for vacuum process chambers - Google Patents

Apparatus method for control, pumping and abatement for vacuum process chambers

Info

Publication number
SG112978A1
SG112978A1 SG200407451A SG200407451A SG112978A1 SG 112978 A1 SG112978 A1 SG 112978A1 SG 200407451 A SG200407451 A SG 200407451A SG 200407451 A SG200407451 A SG 200407451A SG 112978 A1 SG112978 A1 SG 112978A1
Authority
SG
Singapore
Prior art keywords
abatement
pumping
control
process chambers
vacuum process
Prior art date
Application number
SG200407451A
Other languages
English (en)
Inventor
M Bailey Christopher
S Boger Michael
Original Assignee
Boc Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34592545&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG112978(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Boc Group Inc filed Critical Boc Group Inc
Publication of SG112978A1 publication Critical patent/SG112978A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00Axial-flow pumps
    • F04D19/02Multi-stage pumps
    • F04D19/04Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00Pumping installations or systems
    • F04D25/16Combinations of two or more pumps ; Producing two or more separate gas flows
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
SG200407451A 2003-12-31 2004-11-22 Apparatus method for control, pumping and abatement for vacuum process chambers SG112978A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/750,309 US7278831B2 (en) 2003-12-31 2003-12-31 Apparatus and method for control, pumping and abatement for vacuum process chambers

Publications (1)

Publication Number Publication Date
SG112978A1 true SG112978A1 (en) 2005-07-28

Family

ID=34592545

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200407451A SG112978A1 (en) 2003-12-31 2004-11-22 Apparatus method for control, pumping and abatement for vacuum process chambers

Country Status (7)

Country Link
US (1) US7278831B2 (zh)
EP (1) EP1553303B2 (zh)
JP (1) JP4732750B2 (zh)
KR (1) KR101099854B1 (zh)
CN (1) CN1637283B (zh)
SG (1) SG112978A1 (zh)
TW (1) TWI377291B (zh)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050148199A1 (en) * 2003-12-31 2005-07-07 Frank Jansen Apparatus for atomic layer deposition
GB0406748D0 (en) * 2004-03-26 2004-04-28 Boc Group Plc Vacuum pump
GB0412623D0 (en) 2004-06-07 2004-07-07 Boc Group Plc Method controlling operation of a semiconductor processing system
US20060176928A1 (en) * 2005-02-08 2006-08-10 Tokyo Electron Limited Substrate processing apparatus, control method adopted in substrate processing apparatus and program
US7438534B2 (en) * 2005-10-07 2008-10-21 Edwards Vacuum, Inc. Wide range pressure control using turbo pump
KR100749739B1 (ko) * 2006-02-10 2007-08-16 삼성전자주식회사 반도체 제조장치
GB0605048D0 (en) * 2006-03-14 2006-04-26 Boc Group Plc Apparatus for treating a gas stream
EP1994458A2 (en) 2006-03-16 2008-11-26 Applied Materials, Inc. Methods and apparatus for improving operation of an electronic device manufacturing system
JP2007294673A (ja) * 2006-04-25 2007-11-08 Nikon Corp 露光装置
GB0617498D0 (en) 2006-09-06 2006-10-18 Boc Group Plc Method of pumping gas
KR100809852B1 (ko) * 2007-05-17 2008-03-04 (주)엘오티베큠 일체형 진공발생장치
JP5660888B2 (ja) * 2007-05-25 2015-01-28 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 除害システムの効率的な運転のための方法及び装置
CN101681398B (zh) * 2007-05-25 2016-08-10 应用材料公司 组装及操作电子器件制造系统的方法和设备
WO2008156687A1 (en) * 2007-06-15 2008-12-24 Applied Materials, Inc. Methods and systems for designing and validating operation of abatement systems
CN101835521A (zh) * 2007-10-26 2010-09-15 应用材料公司 利用改进燃料线路的用于智能减废的方法与设备
US20100264117A1 (en) * 2007-10-31 2010-10-21 Tohoku University Plasma processing system and plasma processing method
GB0724717D0 (en) * 2007-12-19 2008-01-30 Edwards Ltd Method of treating a gas stream
TWI492284B (zh) * 2010-12-22 2015-07-11 Ulvac Inc A vacuum venting device and a vacuum processing device, and a vacuum venting method
FR2984972A1 (fr) * 2011-12-26 2013-06-28 Adixen Vacuum Products Adaptateur pour pompes a vide et dispositif de pompage associe
JP5099573B1 (ja) * 2012-01-23 2012-12-19 有限会社スコットプランニング 複数の真空装置の省エネルギ−化を図る真空ポンプシステム
US9162209B2 (en) * 2012-03-01 2015-10-20 Novellus Systems, Inc. Sequential cascading of reaction volumes as a chemical reuse strategy
GB2508396B (en) * 2012-11-30 2015-10-07 Edwards Ltd Improvements in and relating to vacuum conduits
JP6368458B2 (ja) 2013-05-24 2018-08-01 株式会社荏原製作所 除害機能付真空ポンプ
CN103758733A (zh) * 2014-01-29 2014-04-30 储继国 大型中、高真空抽气机组及其抽气工艺
JP6441660B2 (ja) * 2014-03-17 2018-12-19 株式会社荏原製作所 除害機能付真空ポンプ
JP5808454B1 (ja) * 2014-04-25 2015-11-10 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
CN105047581A (zh) * 2014-04-25 2015-11-11 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法
GB2533933A (en) * 2015-01-06 2016-07-13 Edwards Ltd Improvements in or relating to vacuum pumping arrangements
GB2538962B (en) * 2015-06-01 2019-06-26 Edwards Ltd Vacuum pump
CN104964556A (zh) * 2015-06-25 2015-10-07 深圳市迪瑞达自动化有限公司 高真空烘烤装置及其方法
JP6391171B2 (ja) * 2015-09-07 2018-09-19 東芝メモリ株式会社 半導体製造システムおよびその運転方法
GB201620225D0 (en) * 2016-11-29 2017-01-11 Edwards Ltd Vacuum pumping arrangement
KR101971827B1 (ko) * 2018-04-17 2019-04-23 캐논 톡키 가부시키가이샤 진공 장치, 진공 시스템, 디바이스 제조 장치, 디바이스 제조 시스템 및 디바이스 제조 방법
US11077401B2 (en) 2018-05-16 2021-08-03 Highvac Corporation Separated gas stream point of use abatement device
KR102125367B1 (ko) * 2018-06-21 2020-06-22 주식회사 포스코 코크스 오븐 가스 처리 장치
KR102098312B1 (ko) 2018-07-27 2020-04-10 (주)아이솔루션 배출 효율 개선 구조의 공정 챔버 배출 장치
JP2020056373A (ja) * 2018-10-03 2020-04-09 株式会社荏原製作所 真空排気システム
GB2579360A (en) * 2018-11-28 2020-06-24 Edwards Ltd Multiple chamber vacuum exhaust system
GB2584603B (en) * 2019-04-11 2021-10-13 Edwards Ltd Vacuum chamber module
KR102329548B1 (ko) * 2019-10-17 2021-11-24 무진전자 주식회사 챔버 배기량 자동 조절 시스템
KR102424601B1 (ko) * 2021-02-04 2022-07-25 에스케이실트론 주식회사 웨이퍼 제조장치 및 상기 웨이퍼 제조장치의 운영방법
GB2610156A (en) * 2021-04-29 2023-03-01 Edwards Ltd Semiconductor processing system
KR102583557B1 (ko) * 2021-05-26 2023-10-10 세메스 주식회사 기판 처리 설비의 배기 장치 및 배기 방법
CN113606949A (zh) * 2021-07-29 2021-11-05 北京北方华创真空技术有限公司 多工位除气炉的抽真空系统

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146083A (en) * 1980-04-14 1981-11-13 Hitachi Ltd Vacuum exhaust system
JPS60170234A (ja) * 1984-02-15 1985-09-03 Semiconductor Energy Lab Co Ltd 気相反応装置および気相反応被膜作製方法
US4725204A (en) * 1986-11-05 1988-02-16 Pennwalt Corporation Vacuum manifold pumping system
JPH07107388B2 (ja) * 1987-12-16 1995-11-15 株式会社日立製作所 複数真空容器の排気方法
DE4213763B4 (de) * 1992-04-27 2004-11-25 Unaxis Deutschland Holding Gmbh Verfahren zum Evakuieren einer Vakuumkammer und einer Hochvakuumkammer sowie Hochvakuumanlage zu seiner Durchführung
JPH08321448A (ja) 1995-05-25 1996-12-03 Tadahiro Omi 真空排気装置、半導体製造装置及び真空処理方法
DE19700406A1 (de) * 1997-01-09 1998-07-16 Leybold Ag Verfahren zum Betreiben einer Vakuum-Beschichtungsanlage und Vakuum-Beschichtungsanlage zu seiner Durchführung
JP3227105B2 (ja) * 1997-03-24 2001-11-12 株式会社荏原製作所 真空排気システム
US5944049A (en) * 1997-07-15 1999-08-31 Applied Materials, Inc. Apparatus and method for regulating a pressure in a chamber
US6206970B1 (en) 1997-09-03 2001-03-27 Micron Technology, Inc. Semiconductor wafer processor, semiconductor processor gas filtering system and semiconductor processing methods
JP3217034B2 (ja) * 1997-11-14 2001-10-09 株式会社日立製作所 過弗化物の処理方法及びその処理装置
US6261524B1 (en) 1999-01-12 2001-07-17 Advanced Technology Materials, Inc. Advanced apparatus for abatement of gaseous pollutants
US7077159B1 (en) 1998-12-23 2006-07-18 Applied Materials, Inc. Processing apparatus having integrated pumping system
DE60015003T2 (de) 1999-04-07 2005-06-02 Alcatel Druckregelvorrichtung für eine Vakuumkammer, und eine mit einer solchen Vorrichtung versehenen Vakuumpumpeinheit
US6361706B1 (en) 1999-08-13 2002-03-26 Philips Electronics North America Corp. Method for reducing the amount of perfluorocompound gas contained in exhaust emissions from plasma processing
WO2001032297A2 (en) * 1999-11-01 2001-05-10 Moore Robert E Modular chemical treatment system
US6576573B2 (en) 2001-02-09 2003-06-10 Advanced Technology Materials, Inc. Atmospheric pressure plasma enhanced abatement of semiconductor process effluent species
DE10150015A1 (de) * 2001-10-11 2003-04-17 Leybold Vakuum Gmbh Mehrkammeranlage zur Behandlung von Gegenständen unter Vakuum, Verfahren zur Evakuierung dieser Anlage und Evakuierungssystem dafür
JP2003117344A (ja) * 2001-10-12 2003-04-22 Seiko Epson Corp 除害装置用h2o供給機構及びプラズマ除害方法
JP4365059B2 (ja) * 2001-10-31 2009-11-18 株式会社アルバック 真空排気装置の運転方法
US7021903B2 (en) * 2003-12-31 2006-04-04 The Boc Group, Inc. Fore-line preconditioning for vacuum pumps

Also Published As

Publication number Publication date
EP1553303A3 (en) 2009-12-30
EP1553303B1 (en) 2013-08-28
JP4732750B2 (ja) 2011-07-27
US20050147509A1 (en) 2005-07-07
KR20050071354A (ko) 2005-07-07
JP2005207419A (ja) 2005-08-04
TW200532108A (en) 2005-10-01
CN1637283B (zh) 2010-05-26
EP1553303B2 (en) 2020-02-26
KR101099854B1 (ko) 2011-12-28
EP1553303A2 (en) 2005-07-13
TWI377291B (en) 2012-11-21
CN1637283A (zh) 2005-07-13
US7278831B2 (en) 2007-10-09

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