SG11202108874QA - Gas distribution plate with high aspect ratio holes and a high hole density - Google Patents

Gas distribution plate with high aspect ratio holes and a high hole density

Info

Publication number
SG11202108874QA
SG11202108874QA SG11202108874QA SG11202108874QA SG 11202108874Q A SG11202108874Q A SG 11202108874QA SG 11202108874Q A SG11202108874Q A SG 11202108874QA SG 11202108874Q A SG11202108874Q A SG 11202108874QA
Authority
SG
Singapore
Prior art keywords
aspect ratio
gas distribution
distribution plate
hole density
ratio holes
Prior art date
Application number
Other languages
English (en)
Inventor
Sumit Agarwal
Sanjeev Baluja
Chad Peterson
Michael R Rice
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11202108874QA publication Critical patent/SG11202108874QA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45565Shower nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • C23C16/45544Atomic layer deposition [ALD] characterized by the apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
SG11202108874Q 2019-03-27 2020-02-27 Gas distribution plate with high aspect ratio holes and a high hole density SG11202108874QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962824369P 2019-03-27 2019-03-27
PCT/US2020/020070 WO2020197684A1 (en) 2019-03-27 2020-02-27 Gas distribution plate with high aspect ratio holes and a high hole density

Publications (1)

Publication Number Publication Date
SG11202108874QA true SG11202108874QA (en) 2021-10-28

Family

ID=72607016

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202108874Q SG11202108874QA (en) 2019-03-27 2020-02-27 Gas distribution plate with high aspect ratio holes and a high hole density

Country Status (7)

Country Link
US (2) US11332827B2 (https=)
JP (1) JP7781639B2 (https=)
KR (1) KR102865277B1 (https=)
CN (1) CN113508191B (https=)
SG (1) SG11202108874QA (https=)
TW (1) TWI832986B (https=)
WO (1) WO2020197684A1 (https=)

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Also Published As

Publication number Publication date
US11332827B2 (en) 2022-05-17
KR102865277B1 (ko) 2025-09-25
WO2020197684A1 (en) 2020-10-01
TWI832986B (zh) 2024-02-21
CN113508191B (zh) 2024-06-11
TW202039088A (zh) 2020-11-01
JP7781639B2 (ja) 2025-12-08
KR20210133302A (ko) 2021-11-05
US20220380898A1 (en) 2022-12-01
CN113508191A (zh) 2021-10-15
JP2022527694A (ja) 2022-06-03
US20200308703A1 (en) 2020-10-01

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